JP7515327B2 - 基板離脱方法及びプラズマ処理装置 - Google Patents
基板離脱方法及びプラズマ処理装置 Download PDFInfo
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- JP7515327B2 JP7515327B2 JP2020120189A JP2020120189A JP7515327B2 JP 7515327 B2 JP7515327 B2 JP 7515327B2 JP 2020120189 A JP2020120189 A JP 2020120189A JP 2020120189 A JP2020120189 A JP 2020120189A JP 7515327 B2 JP7515327 B2 JP 7515327B2
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020120189A JP7515327B2 (ja) | 2020-07-13 | 2020-07-13 | 基板離脱方法及びプラズマ処理装置 |
| KR1020210086345A KR102616554B1 (ko) | 2020-07-13 | 2021-07-01 | 기판 이탈 방법 및 플라즈마 처리 장치 |
| TW110124478A TW202209487A (zh) | 2020-07-13 | 2021-07-02 | 基板脫離方法及電漿處理裝置 |
| CN202110762462.7A CN113936986B (zh) | 2020-07-13 | 2021-07-06 | 基板脱离方法和等离子体处理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020120189A JP7515327B2 (ja) | 2020-07-13 | 2020-07-13 | 基板離脱方法及びプラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022024265A JP2022024265A (ja) | 2022-02-09 |
| JP7515327B2 true JP7515327B2 (ja) | 2024-07-12 |
Family
ID=79274312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020120189A Active JP7515327B2 (ja) | 2020-07-13 | 2020-07-13 | 基板離脱方法及びプラズマ処理装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7515327B2 (zh) |
| KR (1) | KR102616554B1 (zh) |
| CN (1) | CN113936986B (zh) |
| TW (1) | TW202209487A (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117836912A (zh) * | 2022-08-03 | 2024-04-05 | 株式会社日立高新技术 | 晶片处理方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014056928A (ja) | 2012-09-12 | 2014-03-27 | Tokyo Electron Ltd | 離脱制御方法及びプラズマ処理装置 |
| JP2015225890A (ja) | 2014-05-26 | 2015-12-14 | パナソニックＩｐマネジメント株式会社 | プラズマ処理装置及び方法 |
| JP2018006392A (ja) | 2016-06-28 | 2018-01-11 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2018186179A (ja) | 2017-04-25 | 2018-11-22 | 東京エレクトロン株式会社 | 基板処理装置及び基板取り外し方法 |
| WO2020026549A1 (ja) | 2018-07-30 | 2020-02-06 | アルバックテクノ株式会社 | 基板リフト装置及び基板搬送方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100319468B1 (ko) * | 1995-06-30 | 2002-04-22 | 히가시 데쓰로 | 플라즈마 처리 방법 |
| US5818682A (en) * | 1996-08-13 | 1998-10-06 | Applied Materials, Inc. | Method and apparatus for optimizing a dechucking period used to dechuck a workpiece from an electrostatic chuck |
| JP2002134489A (ja) | 2000-10-25 | 2002-05-10 | Tokyo Electron Ltd | 基板除電方法、気相堆積装置、半導体装置の製造方法 |
| JP2002270682A (ja) * | 2001-03-13 | 2002-09-20 | Toshiba Corp | 静電チャック装置および半導体処理装置ならびに半導体製造装置および半導体処理方法 |
| JP4790458B2 (ja) * | 2006-03-22 | 2011-10-12 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP4922705B2 (ja) * | 2006-09-15 | 2012-04-25 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法および装置 |
| JP2010040822A (ja) * | 2008-08-06 | 2010-02-18 | Tokyo Electron Ltd | 静電吸着装置の除電処理方法、基板処理装置、及び記憶媒体 |
| JP5973840B2 (ja) * | 2011-12-20 | 2016-08-23 | 東京エレクトロン株式会社 | 離脱制御方法及びプラズマ処理装置 |
| JP6013740B2 (ja) * | 2012-02-03 | 2016-10-25 | 東京エレクトロン株式会社 | 離脱制御方法及びプラズマ処理装置の制御装置 |
| CN104576280B (zh) * | 2013-10-23 | 2017-10-20 | 中微半导体设备(上海)有限公司 | 等离子体处理腔室及其去夹持装置和方法 |
| JP6401901B2 (ja) | 2013-11-13 | 2018-10-10 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP6496579B2 (ja) * | 2015-03-17 | 2019-04-03 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP2017216346A (ja) * | 2016-05-31 | 2017-12-07 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法及び記憶媒体 |
| JP6967944B2 (ja) * | 2017-11-17 | 2021-11-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR102014610B1 (ko) * | 2017-12-27 | 2019-08-26 | 캐논 톡키 가부시키가이샤 | 정전척, 성막 장치, 기판 흡착/박리 방법, 성막 방법, 및 전자 디바이스의 제조 방법 |
-
2020
- 2020-07-13 JP JP2020120189A patent/JP7515327B2/ja active Active
-
2021
- 2021-07-01 KR KR1020210086345A patent/KR102616554B1/ko active IP Right Grant
- 2021-07-02 TW TW110124478A patent/TW202209487A/zh unknown
- 2021-07-06 CN CN202110762462.7A patent/CN113936986B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014056928A (ja) | 2012-09-12 | 2014-03-27 | Tokyo Electron Ltd | 離脱制御方法及びプラズマ処理装置 |
| JP2015225890A (ja) | 2014-05-26 | 2015-12-14 | パナソニックＩｐマネジメント株式会社 | プラズマ処理装置及び方法 |
| JP2018006392A (ja) | 2016-06-28 | 2018-01-11 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2018186179A (ja) | 2017-04-25 | 2018-11-22 | 東京エレクトロン株式会社 | 基板処理装置及び基板取り外し方法 |
| WO2020026549A1 (ja) | 2018-07-30 | 2020-02-06 | アルバックテクノ株式会社 | 基板リフト装置及び基板搬送方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113936986A (zh) | 2022-01-14 |
| JP2022024265A (ja) | 2022-02-09 |
| KR102616554B1 (ko) | 2023-12-20 |
| CN113936986B (zh) | 2024-08-23 |
| KR20220008223A (ko) | 2022-01-20 |
| TW202209487A (zh) | 2022-03-01 |
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