JP7319919B2 - 耐熱性mdo熱収縮フィルム - Google Patents
耐熱性mdo熱収縮フィルム Download PDFInfo
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- JP7319919B2 JP7319919B2 JP2019528128A JP2019528128A JP7319919B2 JP 7319919 B2 JP7319919 B2 JP 7319919B2 JP 2019528128 A JP2019528128 A JP 2019528128A JP 2019528128 A JP2019528128 A JP 2019528128A JP 7319919 B2 JP7319919 B2 JP 7319919B2
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- 229920006300 shrink film Polymers 0.000 title claims description 24
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- 150000002009 diols Chemical class 0.000 claims description 69
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- CVMXOLXLYCAVNU-UHFFFAOYSA-N 5-methylheptane-1,3-diol Chemical compound CCC(C)CC(O)CCO CVMXOLXLYCAVNU-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
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- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
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- 239000004793 Polystyrene Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
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- 230000004048 modification Effects 0.000 description 2
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- 239000000178 monomer Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- IVDFJHOHABJVEH-UHFFFAOYSA-N pinacol Chemical compound CC(C)(O)C(C)(C)O IVDFJHOHABJVEH-UHFFFAOYSA-N 0.000 description 2
- -1 polyoxytetramethylene Polymers 0.000 description 2
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- 239000002994 raw material Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- CYVMBANVYOZFIG-ZCFIWIBFSA-N (2r)-2-ethylbutane-1,4-diol Chemical compound CC[C@@H](CO)CCO CYVMBANVYOZFIG-ZCFIWIBFSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- FQXGHZNSUOHCLO-UHFFFAOYSA-N 2,2,4,4-tetramethyl-1,3-cyclobutanediol Chemical compound CC1(C)C(O)C(C)(C)C1O FQXGHZNSUOHCLO-UHFFFAOYSA-N 0.000 description 1
- VDSSCEGRDWUQAP-UHFFFAOYSA-N 2,2-dipropylpropane-1,3-diol Chemical compound CCCC(CO)(CO)CCC VDSSCEGRDWUQAP-UHFFFAOYSA-N 0.000 description 1
- ZABMGUITRPYVRH-UHFFFAOYSA-N 2,3,4-trimethylpentane-1,5-diol Chemical compound OCC(C)C(C)C(C)CO ZABMGUITRPYVRH-UHFFFAOYSA-N 0.000 description 1
- SKQUTIPQJKQFRA-UHFFFAOYSA-N 2,3-dimethylbutane-1,4-diol Chemical compound OCC(C)C(C)CO SKQUTIPQJKQFRA-UHFFFAOYSA-N 0.000 description 1
- KHVMKJQZHRKYEV-UHFFFAOYSA-N 2,4-dimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)CO KHVMKJQZHRKYEV-UHFFFAOYSA-N 0.000 description 1
- LIBOYZGDGVDKKH-UHFFFAOYSA-N 2-(8-methylnonyl)butanedioic acid Chemical compound CC(C)CCCCCCCC(C(O)=O)CC(O)=O LIBOYZGDGVDKKH-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
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- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
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- MWCBGWLCXSUTHK-UHFFFAOYSA-N 2-methylbutane-1,4-diol Chemical compound OCC(C)CCO MWCBGWLCXSUTHK-UHFFFAOYSA-N 0.000 description 1
- AAAWJUMVTPNRDT-UHFFFAOYSA-N 2-methylpentane-1,5-diol Chemical compound OCC(C)CCCO AAAWJUMVTPNRDT-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004146 Propane-1,2-diol Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
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- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
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- 229940011182 cobalt acetate Drugs 0.000 description 1
- TZWGXFOSKIHUPW-UHFFFAOYSA-L cobalt(2+);propanoate Chemical compound [Co+2].CCC([O-])=O.CCC([O-])=O TZWGXFOSKIHUPW-UHFFFAOYSA-L 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical class OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
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- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
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- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical class C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
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- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- XRVCFZPJAHWYTB-UHFFFAOYSA-N prenderol Chemical compound CCC(CC)(CO)CO XRVCFZPJAHWYTB-UHFFFAOYSA-N 0.000 description 1
- 229950006800 prenderol Drugs 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
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Description
本出願は、2016年11月24日付の韓国特許出願第10-2016-0157612号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール(CHDM)48mol%、イソソルバイド(ISB)15mol%、残りはエチレングリコール(EG)が共重合されたポリエステル樹脂を3kgのバッチ反応器で混合しながら、温度を徐々に約260℃まで昇温しながら反応させた。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール48mol%、イソソルバイド38mol%、残りはエチレングリコールを反応させたことを除いては、実施例1と同一の方式で熱収縮フィルムを製造した。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール50mol%、イソソルバイド22mol%、ジエチレングリコール3mol%、残りはエチレングリコールを反応させたことを除いては、実施例1と同一の方式で熱収縮フィルムを製造した。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール48mol%、イソソルバイド10mol%、残りはエチレングリコールを反応させたことを除いては、実施例1と同一の方式で熱収縮フィルムを製造した。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール45mol%、イソソルバイド53mol%、ジエチレングリコール1.5mol%、残りはエチレングリコールを反応させたことを除いては、実施例1と同一の方式で熱収縮フィルムを製造した。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール48mol%、イソソルバイド8mol%、残りはエチレングリコールを反応させたことを除いては、実施例1と同一の方式で熱収縮フィルムを製造した。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール30mol%、ジエチレングリコール2mol%、残りはエチレングリコールを反応させたことを除いては、実施例1と同一の方式で熱収縮フィルムを製造した。
テレフタル酸100mol%を基準に、全体ジオール成分の総量に対して1,4-シクロヘキサンジメタノール15mol%、イソソルバイド17mol%、残りはエチレングリコールを反応させたことを除いては、実施例1と同一の方式で熱収縮フィルムを製造した。
実施例1と同じ組成を適用し、数平均分子量が低い低粘度の共重合ポリエステル樹脂を製造して熱収縮フィルムを製造した。
実施例1~5および比較例1~4により製造された共重合ポリエステル樹脂および熱収縮フィルムについて次のような方法で物性評価を行った。
ECA 600、Jeol(600MHz、H-NMR)機器を用いてFourier-Transform(for higher resolution and faster scanning)モードで測定した。このとき、試料前処理方法は、ペレット(pellet)試料量約15mgをNMR tube(quartz、NMR inactive)に入れ、クロロホルム(chloroform)約0.7mLを入れて溶解させて、分析時に使用した。
Tosoh機器を用いて約150度で約15分間O-クロロフェノール(O-CP、o-Chlorophenol):CHCl3=1:3溶媒で前処理した後、Shodex LF804カラム(2ea)を用いて測定した(温度:約40℃、Flow rate:約0.7mL/min、溶媒量:約12mL、試料量:約0.03g)。
ASTM E 1164規格でKonica minolta(CM-3600A)社の設備を用いて測定した。ここで、CM-A99(20mm)の石英ホルダーにChipを入れてAbsolute、10degree、HunterD65のCol-L/Col-bの値である。
ティーエイインスツルメント(TA instrument)社のMettler Toledoの示差走査熱量計(Differential Scanning Calorimetry)を用いて測定した。
Mitutoyo社のデジタルバーニヤキャリパーを用いて延伸したMDOフィルムの厚さを測定した。
陽刻印刷の温度は約62℃~約65℃の範囲であり、高温充填の飲み物の温度が約60℃~約70℃であるため、平均約65℃の条件でMD延伸フィルムの変形率を確認して耐熱度を評価した。
10cm×10cmの正方形に裁断し、下記表に記載されている温度約75℃または約100℃で約15秒~約30秒間水槽(waterbath)に入れて熱収縮させた後、試料の延伸方向(MD)の長さ変化を測定して下記の計算式1により算出した。
熱収縮率(%)=100×(収縮前の長さ-収縮後の長さ)/(収縮前の長さ)
実施例1~5により製造された共重合ポリエステル樹脂および熱収縮フィルムに対する物性測定結果は下記表1に示す。
Claims (8)
- テレフタル酸を含む酸成分とジオール成分が共重合されて、前記酸成分から誘導された酸部分およびジオール成分から誘導されたジオール部分が繰り返される構造を有する18,000g/mol以上の数平均分子量を有する共重合ポリエステル樹脂からなり、
前記酸成分としてテレフタル酸100mol%を含み、
前記ジオール成分としてイソソルバイド3.5mol%~35mol%、1,4-シクロヘキサンジメタノール25mol%~55mol%、ネオペンチルグリコール、エチレングリコール、ジエチレングリコールのうちの1種以上を残部として含み、
前記イソソルバイド(ISB)と前記1,4-シクロヘキサンジメタノール(CHDM)のモル比を基準にした含有量比(ISB/CHDM)は0.1~2.5であり、
収縮開始温度が70℃以上であり、75℃での最大熱収縮率が5%未満であり、95~100℃での最大熱収縮率が30%~65%である、耐熱性MDO熱収縮フィルム。 - 前記ジオール成分としてイソソルバイド6mol%~33mol%、1,4-シクロヘキサンジメタノール45mol%~50mol%、ジエチレングリコール1.2mol%~5mol%、およびエチレングリコール18mol%~44.6mol%を含む、請求項1に記載の耐熱性MDO熱収縮フィルム。
- 前記フィルムの全体厚さが10~60μmである、請求項1に記載の耐熱性MDO熱収縮フィルム。
- テレフタル酸を含む酸成分とジオール成分が共重合されて、前記酸成分から誘導された酸部分およびジオール成分から誘導されたジオール部分が繰り返される構造を有する18,000g/mol以上の数平均分子量を有する共重合ポリエステル樹脂からなり、
前記酸成分としてテレフタル酸100mol%を含み、
前記ジオール成分としてイソソルバイド6mol%~33mol%、1,4-シクロヘキサンジメタノール45mol%~50mol%、ジエチレングリコール1.2mol%~5mol%、およびエチレングリコール18mol%~44.6mol%を含み、
前記イソソルバイド(ISB)と前記1,4-シクロヘキサンジメタノール(CHDM)のモル比を基準にした含有量比(ISB/CHDM)は0.1~2.5であり、
全体厚さが10~60μmであり、収縮開始温度が70℃以上であり、75℃での最大熱収縮率が5%未満であり、95~100℃での最大熱収縮率が30%~65%である、耐熱性MDOフィルム。 - 基材層と、
前記基材層の上面および下面のうち少なくとも1面にスキン層とを含み、
前記基材層およびスキン層は、テレフタル酸を含む酸成分とジオール成分が共重合されて、前記酸成分から誘導された酸部分およびジオール成分から誘導されたジオール部分が繰り返される構造を有する18,000g/mol以上の数平均分子量を有する共重合ポリエステル樹脂からなり、
前記酸成分としてテレフタル酸100mol%を含み、
前記ジオール成分としてイソソルバイド6mol%~33mol%、1,4-シクロヘキサンジメタノール45mol%~50mol%、ジエチレングリコール1.2mol%~5mol%、およびエチレングリコール18mol%~44.6mol%を含み、
前記イソソルバイド(ISB)と前記1,4-シクロヘキサンジメタノール(CHDM)のモル比を基準にした含有量比(ISB/CHDM)は0.1~2.5であり、
収縮開始温度が70℃以上であり、75℃での最大熱収縮率が5%未満であり、95~100℃での最大熱収縮率が30%~65%である、MDO耐熱熱収縮性多層フィルム。 - 前記スキン層は、加工助剤、静電印加剤、紫外線吸収剤、熱安定剤、帯電防止剤、顔料、難燃剤、増粘剤、およびアンチブロッキング剤からなる群より選択された添加剤1種以上をさらに含む、請求項5に記載のMDO耐熱熱収縮性多層フィルム。
- 前記スキン層は、加工助剤、静電印加剤、紫外線吸収剤、熱安定剤、帯電防止剤、顔料、難燃剤、増粘剤、およびアンチブロッキング剤からなる群より選択された添加剤1種以上をさらに含むコーティング層をさらに含む、請求項5に記載のMDO耐熱熱収縮性多層フィルム。
- 請求項1乃至3のいずれか1項に記載の耐熱性MDO熱収縮フィルムからなるラベルを含む、容器。
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