JP7233954B2 - Evaporation mask - Google Patents

Description

The present invention relates to a vapor deposition mask for forming pixels of an organic EL display device or the like by vapor deposition.

An organic EL display device forms an organic layer, which is a light-emitting material, by vapor deposition for each pixel. The pixel pitch is small, and therefore the size of the light emitter composed of the organic EL layer in each pixel formed by vapor deposition is also small. Along with this, both the pitch and the size of the holes in the vapor deposition mask are very small. Therefore, the precision of the deposition mask is important.

A vapor deposition mask is composed of a mask foil portion in which a large number of holes for vapor deposition on pixels are formed, and a support frame for supporting the mask foil. In Patent Document 1, in order to reduce the distortion of the support frame and improve the dimensional accuracy, the support frame is composed of two pieces, an upper frame and a lower frame, and the upper frame and the lower frame are bonded with an adhesive. It is stated that the configuration

JP 2017-210633 A

The vapor deposition mask in the present invention corresponds to the pixels of the display area of the organic EL display device, and is composed of a foil-shaped mask having a large number of holes formed therein, a support frame for supporting the foil-shaped mask, and a foil-shaped mask. In the present specification, a foil-like mask having a large number of holes is hereinafter simply referred to as a mask, and an assembly of a mask and a support frame is referred to as a vapor deposition mask.

The pixel pitch of the organic EL display device is very small, and the diameter of the mask hole corresponding to each pixel is also very small. Therefore, the thickness of the mask in which the holes are formed must also be very small. Also, the mask should be planarized along the substrate to be deposited. In order to maintain the flatness of the mask, it is necessary to apply external tension to the mask by the support frame. At this time, an inward tension is applied to the support frame as a reaction.

In order to improve dimensional accuracy and prevent distortion of the frame itself, the support frame has a two-piece structure consisting of an upper frame and a lower frame, and the upper frame and the lower frame are bonded together with an adhesive. At this time, tension on the support frame as a reaction from the mask is applied mainly to the upper frame.

As a result, a shearing force is applied to the adhesive layer bonding the upper frame and the lower frame, causing the upper frame and the lower frame to be displaced from each other in the plane direction. The shift between the upper frame and the lower frame due to such a shear force has a significant effect on the deposition accuracy of the deposition mask.

An object of the present invention is to prevent the displacement of the upper frame and the lower frame due to a shearing force, maintain the dimensional accuracy of the vapor deposition mask, and thereby enable the manufacture of an organic EL display device of excellent quality.

The present invention overcomes the above problems, and main specific means are as follows.

(1) A vapor deposition mask used in the manufacture of a display device, the vapor deposition mask comprising a mask for forming a vapor deposition on pixels and a support frame for supporting the mask, the support frame comprising: It is composed of an upper plate, a lower plate, and an adhesive material for adhering the upper plate and the lower plate, and when a shearing force is applied between the upper plate and the lower plate, the upper A deposition mask, comprising a stopper for preventing the plate and the lower plate from being displaced from each other.

(2) A vapor deposition mask used in the manufacture of a display device, the vapor deposition mask comprising a mask for forming a vapor deposition on pixels and a support frame for supporting the mask, wherein the support frame comprises: It is composed of an upper plate, a lower plate, and an adhesive material for adhering the upper plate and the lower plate, and convex portions are formed on one surface of the upper plate at a predetermined pitch, and one surface of the lower plate. , recesses are formed at the predetermined pitch, and the protrusions and the recesses are fitted to each other.

1 is a plan view of an organic EL display device; FIG. 1 is a plan view showing a pixel configuration of an organic EL display device; FIG. FIG. 4 is a cross-sectional view showing the relationship between a substrate and a vapor deposition mask in a display area; It is sectional drawing which shows the outline|summary of a vapor deposition apparatus. It is a detailed drawing of a vapor deposition mask. It is sectional drawing which shows the state which formed the mask in the vapor deposition mask. It is a sectional view of a support frame. FIG. 4 is a cross-sectional view showing a state in which a support frame and a mask are temporarily attached; FIG. 4 is a cross-sectional view showing a state in which a mask and a support frame are joined by a joining member formed by plating; FIG. 4 is a cross-sectional view showing a state in which the base material is separated from the mask; It is sectional drawing which shows the manufacturing process of a support frame. It is a top view of a vapor deposition mask. FIG. 9 is a cross-sectional view taken along the line AA of FIG. 8; FIG. 4 is a cross-sectional view of the support frame in a state where tension is applied to the upper plate of the support frame; BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows the outline of this invention. It is a top view which shows the outline of this invention. FIG. 4 is a cross-sectional view showing a manufacturing process of Embodiment 1 of Example 1; 13B is a cross-sectional view showing a step following FIG. 13A; FIG. 1 is a cross-sectional view showing Embodiment 1 of Example 1. FIG. FIG. 4 is a cross-sectional view showing a manufacturing process of Embodiment 2 of Example 1; 14B is a cross-sectional view showing a step following FIG. 14A; FIG. FIG. 14C is a cross-sectional view showing a step following FIG. 14B; FIG. 10 is a cross-sectional view showing the configuration of Embodiment 1 of Example 2; FIG. 10 is a cross-sectional view showing a manufacturing process of Embodiment 1 of Example 2; 15B is a cross-sectional view showing a step following FIG. 15A; FIG. FIG. 15C is a cross-sectional view showing a step following FIG. 15B; FIG. 15C is a cross-sectional view showing a step following FIG. 15C; FIG. 10 is a cross-sectional view showing the configuration of Embodiment 1 of Example 2; FIG. 10 is a cross-sectional view showing a manufacturing process of Embodiment 2 of Example 2; 16B is a cross-sectional view showing a step following FIG. 16A; FIG. FIG. 16B is a cross-sectional view showing a step following FIG. 16B; FIG. 10 is a cross-sectional view showing the configuration of Embodiment 2 of Example 2; FIG. 10 is a cross-sectional view showing a manufacturing process of Embodiment 3 of Example 2; 17B is a cross-sectional view showing a step following FIG. 17A; FIG. FIG. 17C is a cross-sectional view showing a step following FIG. 17B; FIG. 17C is a cross-sectional view showing a step following FIG. 17C; FIG. 17C is a cross-sectional view showing a step following FIG. 17D; FIG. 11 is a cross-sectional view showing the configuration of Embodiment 3 of Example 2; FIG. 10 is a cross-sectional view showing a manufacturing process of Embodiment 1 of Example 3; 18B is a cross-sectional view showing a step following FIG. 18A; FIG. FIG. 18B is a cross-sectional view showing a step following FIG. 18B; FIG. 18C is a cross-sectional view showing a step following FIG. 18C; FIG. 10 is a cross-sectional view showing the configuration of Embodiment 1 of Example 3; FIG. 10 is a plan view showing the configuration of Embodiment 1 of Example 3; FIG. 11 is a plan view showing another example of the configuration of the first embodiment of the third example; FIG. 10 is a cross-sectional view showing a manufacturing process of Embodiment 2 of Example 3; 19B is a cross-sectional view showing a step following FIG. 19A; FIG. FIG. 19C is a cross-sectional view showing a step following FIG. 19B; FIG. 19B is a cross-sectional view showing a step following FIG. 19C; FIG. 19C is a cross-sectional view showing a step following FIG. 19D; FIG. 11 is a cross-sectional view showing the configuration of Embodiment 2 of Example 3; FIG. 11 is a plan view showing the configuration of Embodiment 2 of Example 3; FIG. 12 is a plan view showing another example of the configuration of Embodiment 2 of Example 3; FIG. 11 is a cross-sectional view showing a manufacturing process of Embodiment 1 of Example 4; FIG. 20B is a cross-sectional view showing a step following FIG. 20A; FIG. 20C is a cross-sectional view showing a step following FIG. 20B; 20D is a cross-sectional view showing a step following FIG. 20C; FIG. FIG. 20C is a cross-sectional view showing a step following FIG. 20D; FIG. 11 is a cross-sectional view showing the final step of Embodiment 1 of Example 4; FIG. 11 is a plan view showing the configuration of Embodiment 1 of Example 4; FIG. 11 is a cross-sectional view showing a manufacturing process of Embodiment 2 of Example 4; FIG. 21B is a cross-sectional view showing a step following FIG. 21A; FIG. 21B is a cross-sectional view showing a step following FIG. 21B; FIG. 21C is a cross-sectional view showing a step following FIG. 21C; FIG. 21C is a cross-sectional view showing a step following FIG. 21D; FIG. 12 is a cross-sectional view showing the configuration of Embodiment 2 of Example 4; FIG. 11 is a cross-sectional view showing a manufacturing process of Embodiment 1 of Example 5; FIG. 11 is a cross-sectional view showing the configuration of Embodiment 1 of Example 5; FIG. 11 is a diagram showing an example of a convex portion and a concave portion in Example 5; FIG. 14 is a diagram showing another example of the convex portion and the concave portion in Example 5; FIG. 14 is a plan view showing still another example of the convex portion and the concave portion in Example 5; FIG. 14 is a plan view showing still another example of the convex portion and the concave portion in Example 5; FIG. 14 is a plan view showing still another example of the convex portion and the concave portion in Example 5; FIG. 12 is a cross-sectional view showing a manufacturing process of Embodiment 2 of Example 5; FIG. 12 is a cross-sectional view showing the configuration of Embodiment 2 of Example 5; FIG. 10 is a cross-sectional view showing a manufacturing process of Embodiment 3 of Example 5; FIG. 12 is a cross-sectional view showing the configuration of Embodiment 3 of Example 5;

FIG. 1 is a plan view of an organic EL display device. In FIG. 1, a display area 10 for displaying an image is formed on a TFT substrate 40 made of glass or polyimide resin. A frame area 21 is arranged around the display area 10 . In the frame area 21, current supply lines for supplying current to the pixels 14, the scanning line driving circuit 20, and the like are arranged. In the display area 10, scanning lines 11 extend in the horizontal direction (x direction) and are arranged in the vertical direction (y direction). Also, the video signal lines 12 and the power lines 13 extend in the vertical direction and are arranged in the horizontal direction. A region surrounded by the scanning lines 11, the video signal lines 12, and the power supply lines 13 constitutes the pixels 14, and the pixels 14 include an organic EL layer that emits light, a driving transistor formed of a TFT, and a switching transistor. , etc. are formed.

A terminal area 30 is formed on one side of the substrate 40 . A driver IC 31 is mounted on the terminal area 30 to drive the video signal lines 12, and a flexible wiring board 32 is connected to supply power and signals to the organic EL display device.

FIG. 2 is a plan view of the display area of the organic EL display device. In FIG. 2, a red pixel having a red light emitter R, a green pixel having a green light emitter G, or a blue pixel having a blue light emitter B is formed in a portion corresponding to the pixel 14 in FIG. Alternatively, the emitters are in a delta arrangement. The red light emitter R, green light emitter G, and blue light emitter B are formed of different organic EL materials and are deposited separately. Therefore, three vapor deposition masks are required for the pixel configuration as shown in FIG.

In FIG. 2, the planar shape of each light emitter is a circle, and each light emitter is arranged in a delta arrangement. Possible. Also, the arrangement of the light emitters is not limited to delta, but may be rhombus, parallelogram, stripe arrangement, or the like.
In FIG. 2, the diameter d1 of the emitter is, for example, 15 μm to 20 μm. The pixel pitch pp is, for example, 30 μm to 40 μm. In this case, the diameter of the mask is the same as the diameter of the emitter. On the other hand, since the holes in the mask are formed for each light emitter, the pitch pm of the holes in the mask is 50 μm to 67 μm. The interval between different colors arranged next to each other, that is, the alignment margin of the vapor deposition mask, is required to be about 10 μm to 30 μm. and this distance is preferably small.

FIG. 3 is a cross-sectional view showing the state of a mask 50 and a substrate 40 for vapor deposition of an organic EL material that will be one of three color emitters. In FIG. 3, the vapor deposition substrate 40, ie, the thickness ts of the TFT substrate 40 is, for example, 0.5 mm. On the other hand, in order to set the diameter d1 of the light emitter to 15 μm to 20 μm, the mask 50 is similarly formed with a hole having a hole diameter d1. The organic EL material is deposited on the surface of the substrate 40 exposed through the holes provided in the mask 50 . In order to vapor-deposit the organic EL material just enough in the area of the hole diameter d1, the plate thickness tm of the mask 50 needs to be as thin as about 5 μm to 10 μm. If the thickness of the mask 50 is large, it becomes a shield against the organic EL material to be deposited from an oblique direction, and so-called "vignetting" occurs, resulting in poor deposition.

In order to obtain a high-definition pixel configuration as shown in FIG. 2, the mask 50 and vapor deposition substrate 40 must be in close contact with each other, as shown in FIG. For this purpose, it is necessary to apply tension to the mask 50 to keep it flat. Note that arrows 80 in FIG. 3 indicate evaporated organic EL materials. Although not shown, a magnet may be placed so as to face the opposite side of the substrate 40 with respect to the mask 50, and the mask 50 may be brought into close contact with the substrate 40 by magnetic force.

FIG. 4 is a schematic sectional view showing the state of vacuum deposition. In the vacuum chamber 1000 of FIG. 4, the vapor deposition material 80 is evaporated toward the substrate 40 from the vapor deposition source 900 . A luminescent material is vapor-deposited on the substrate 40 through a mask 50 of a vapor deposition mask. Two deposition sources 90 are used in FIG. 4 in order to make the deposited film thickness uniform. The number of vapor deposition sources 90 is increased or decreased as necessary in order to make the vapor deposited film uniform.

The vapor deposition mask is obtained by joining a foil-shaped mask 50 and a support frame 60 with a joining member 70 . The support frame 60 has a configuration in which an upper plate 61 and a lower plate 62 are adhered with an adhesive 63 . The support frame 60 and the mask 50 are joined by a joining member 70 made of plating. The mask 50 is tensioned by a support frame 60 so that the thin mask 50 does not bend. As a reaction to this, an inward tension is generated in the support frame 60, and shear stress is generated in the adhesive 63 that bonds the upper plate 61 and the lower plate 62 together.

FIG. 5 is a detailed view of the vapor deposition mask 5. FIG. In FIG. 5, the upper side is a plan view, and the lower side is a sectional view. Since it is inefficient to manufacture organic EL display devices individually, a large number of organic EL display panels are formed on a large substrate. Therefore, the vapor deposition mask 5 is also adapted to this large substrate.

In FIG. 5, the vapor deposition mask 5 is divided into four sections by a support frame 60, and a mask 50 exists for each section. Each mask 50 corresponds to 16 organic EL display devices. Therefore, 64 organic EL display devices are formed by the vapor deposition mask 50 of FIG. In addition, although the vapor deposition mask 5 is divided into four in FIG. 5, this is an example, and the number of divisions is not limited to four.

Each mask 50 is composed of an aperture region 51 having a large number of holes corresponding to each pixel in the display region of the organic EL display device and a peripheral region 52 having no holes. The mask 50 is, for example, Ni or Ni alloy with a thickness of several μm to ten and several μm, and is formed by plating.

The support frame 60 is formed by bonding an upper plate 61 and a lower plate 62 with an adhesive 63 . One of the reasons why the support frame 60 has a two-layer structure is that when a plate material is formed by rollers, it is easier to obtain accurate dimensions if a thin plate is used because the number of rollers increases. Another reason is to prevent distortion of the laminated support frame by compensating for the strain inherent in the plates by the two plates.

The upper plate 61 and the lower plate 62 are made of, for example, an invar material having a thickness of about 0.5 mm. Invar material is an alloy of iron and nickel and has a very low coefficient of thermal expansion. A support frame 60 formed of an upper plate 61, a lower plate 62, and an adhesive material 63 and a mask 50 are joined by a joining member 70 made of plating. Tension is applied to the completed mask 50 by the support frame 60 to prevent the mask 50 from bending.

6A-6E are cross-sectional views showing a process for forming the deposition mask shown in FIG. FIG. 6A is a cross-sectional view showing a state in which a mask 50 is formed by plating. A metal plate with a smooth plane is prepared and used as the base material 90, and the mask 50 is formed on the base material 90. FIG. That is, a foil is formed by forming a photoresist 91 for patterning on a base material 90 and growing plating at predetermined locations. In FIG. 6A, the photoresist 91 is formed only on the outline of the mask 50, but the photoresist is formed to form the holes in the opening regions, and the openings of the mask 50 are filled with holes for vapor deposition of the pixel portion. can be formed simultaneously.

6B is a cross-sectional view of a support frame 60 formed separately from the mask 50. FIG. The support frame 60 is formed by bonding an upper plate 61 and a lower plate 62 made of Invar material having a thickness of 0.5 mm with an adhesive 63, for example. The thickness of the adhesive 63 is, for example, 15 μm. Since the plate material is provided in a rolled form as a stretched material, it may remain warped in the arc direction. In such a case, the two plates can be stuck together with the front and back sides reversed to offset the warpage and ensure flatness. The processing of the support frame 50 may be cutting or etching.

FIG. 6C is a cross-sectional view showing a state in which the support frame 60 is temporarily adhered to the base material 90 on which the mask 50 is formed. As the temporary adhesive 92 used for temporary adhesion, it is preferable to use a material that facilitates peeling of the base material 90 in a later step.

FIG. 6D shows the structure of FIG. 6C, in order to connect the mask 50 and the support frame 60, by forming a photoresist 91 and then growing plating to form a connection member 70 between the mask 50 and the support frame 60. FIG. 3 is a cross-sectional view showing a state in which In FIG. 6D, the joint member 70 is formed by plating by covering with a photoresist 91 a portion other than the portion to be plated as the joint member 70 .

In FIG. 6D, the resist 91 is formed on the support frame 60 except for the portion where the joining member 70 is formed by plating. Not limited to this, the entire surface of the support frame 60 may be plated. However, in this case, when the entire surface of the support frame 60 is plated, the support frame 60 may be deformed by the stress of the plating film, so care must be taken.

FIG. 6E is a cross-sectional view showing a state in which the base material 90 made of metal is peeled off from the vapor deposition mask 5 after the photoresist 91 is peeled off. Thus, the vapor deposition mask 5 is completed. When the mask 50 is formed on the base material 90 by plating, stress is generated in the mask 50. When the base material 90 is peeled off from the vapor deposition mask 5, this stress acts in the direction in which the mask 50 contracts and supports it. Frame 60 will support mask 50 against shrinkage. In other words, the support frame 60 causes the mask 50 to be pulled outwardly. This tension keeps the mask 50 flat.

7A and 7B are cross-sectional views showing a method of manufacturing the support frame 60. FIG. The support frame 60 is formed by pasting together an upper plate 61 and a lower plate 62 with an adhesive 63 . Since the plate material for the upper plate 61 and the lower plate 62 is provided in a rolled form as a stretched material, the warp in the arc direction remains. Therefore, as shown in FIG. 7, two plates are stuck together with the front and back sides reversed to ensure flatness.

The vapor deposition mask 5 in the present invention is as shown in FIG. 5, but a simplified drawing will be used in the following description for easy understanding. FIG. 8 is a plan view of the vapor deposition mask 5 in the following description. In FIG. 8, only one section in FIG. 5 is described. That is, one mask 50 is formed within the support frame 60 . 9 is a cross-sectional view taken along line AA of FIG. 8. FIG. As shown in FIG. 5, the mask 50 and the support frame 60 are joined by a joining member 70 by plating in the actual vapor deposition mask 5, but in FIG. is joined to the upper plate 61 of the Hereinafter, the cross section of the vapor deposition mask 5 in the description of the present invention will be made with reference to FIG. Even when the joint member 70 shown in FIG. 5 exists, the tension from the mask 50 to the support frame 60 is mainly generated in the upper plate 61, as in FIG.

FIG. 10 is a cross-sectional view showing the problem solved by the present invention. A tension is applied to the mask 50 to keep it flat. On the other hand, the support frame 60 is tensioned inward as a reaction, and shear stress is generated in the adhesive 63 that adheres the upper plate 61 and the lower plate 62, and the upper plate 61 and the lower plate 62 are separated. It deviates in the plane direction. As a result, the positions of the holes in the mask 50 are moved.

That is, both the substrate 40 and the lower plate 62 of the vapor deposition mask 5 are fixed to the vapor deposition apparatus, and as a result, the opening of the mask 50 joined to the upper plate 61 of the support frame 60 is shifted with respect to the substrate 40 . As described with reference to FIG. 2 and the like, in the organic EL display device, the pixel pitch is very small. Therefore, if a deviation such as that shown in FIG. Significant impact on display quality.

In the configuration of the present invention, as shown in FIG. 11, the support frame 60 is provided with a stopper 100 that prevents the upper plate 61 and the lower plate 62 from being displaced. To prevent displacement between the upper plate 61 and the lower plate 62 even when shear stress due to tension is applied, and to prevent displacement of the position of the organic EL layer as a light emitter.

FIG. 12 is a plan view of the vapor deposition mask 5 showing the configuration for this purpose. In FIG. 12, outside the mask 50, stoppers 100 for fixing the upper plate 61 and the lower plate 62 of the support frame 60 are formed on the long sides, short sides, and corners. Note that the planar position of the stopper 100 is not limited to that shown in FIG. The following examples illustrate various stopper 100 configurations.

In Example 1, a punching tool 110 with a sharp tip, such as an ice pick, an awl, or an awl, is used to punch through the upper plate 61 and the lower plate 62, thereby deforming the upper plate 61 at the punched portion. This prevents the upper plate 61 and the lower plate 62 from being displaced in the plane direction.
(Embodiment 1)
13A to 13C are diagrams showing Embodiment 1 in Example 1. FIG. 13A shows a state in which the support frame 60 is sandwiched between a lower rigid body (mounting table) 115 having a hole and an upper rigid body (holding table) 114, and the punching tool 110 is applied to the support frame 60. FIG. FIG. 4 is a diagram showing; 13A is a plan view showing the hitting points 111 of the punching tool 110 arranged on the support frame 60. FIG.

FIG. 13B shows a state in which the punching tool 110 penetrates the upper plate 61 and the lower plate 62 of the support frame 60. The upper drawing is a cross-sectional view, and the lower drawing is a plan view. As shown in the cross-sectional view of FIG. 13B, when the support frame 60 is punched out, burrs 113 are generated on the upper plate 61 and the lower plate 62. The burrs 113 prevent the upper plate 61 and the lower plate 62 from being displaced from each other. It is something to do. In the lower plan view of FIG. 13B, 112 is a through hole, and 1121 is a portion where the support frame 60 is deformed so as to generate burrs.

13C is a cross-sectional view showing the state of burrs 113 formed in through hole 112. FIG. The formed holes 112 are, for example, circular. Therefore, the upper plate 61 and the lower plate 62 of the support frame 60 are restrained from moving in any plane direction.
(Embodiment 2)
14A to 14D are cross-sectional views showing Embodiment 2 of Example 1. FIG. In Embodiment 1, as shown in FIG. 13C, burrs 113 are produced as protrusions on the back side of the support frame 60 punched out by the punching tool 110 . Such projecting burrs 113 may become an obstacle in a vapor deposition apparatus or the like. Embodiment 2 is a countermeasure for this problem.

14A, the support frame 60 is sandwiched between a lower rigid body 115 having a hole and an upper rigid body 114, and an end mill 116 for end milling the lower plate 62 is applied. It is a cross-sectional view showing the. A hole is formed only in the bottom plate 62 by the end mill 116 .

FIG. 14B is a cross-sectional view showing a state in which the support frame 60 is placed on the portion of the lower rigid body 115 with a small diameter after the hole is formed in the lower plate 62, and the punching tool 110 is pressed against the upper plate 61 side. FIG. 14C is a cross-sectional view showing a state in which the upper plate 61 is punched out by the punching tool 110. FIG. At this time, since a hole is formed in advance in the lower plate 62 and the diameter of the lower rigid body 115 is small, the burr 113 of the upper plate 61 does not protrude below the lower plate 62. It comes into contact with the end of the lower plate 62 .

FIG. 14D is a cross-sectional view of the support frame 60 after processing. In FIG. 14D, the punched burrs 113 of the upper plate 61 are in contact with the end face of the lower plate 62 without protruding beyond the lower surface of the lower plate 62 . The burrs 113 of the upper plate 61 prevent the lower plate 62 and the upper plate 61 from shifting in the plane direction. Also, the burr 113 does not protrude below the lower surface of the lower plate 62 .

In the second embodiment, the upper plate 61 and the lower plate 62 of the support frame 60 are prevented from being displaced by driving pins into through holes formed in the upper plate 61 and the lower plate 62 .
(Embodiment 1)
15A to 15E are cross-sectional views showing Embodiment 1 of Example 2. FIG. FIG. 15A shows a state in which a reamer 117 is applied to the upper plate 61 to form through holes in the upper plate 61 and the lower plate 62 . An opening is formed in a portion corresponding to the reamer 117 in the lower rigid body 115 on which the support frame 60 is placed.

FIG. 15B shows a support frame 60 with through holes formed in it placed on a lower rigid body 115 with no holes formed in it, and an upper plate 60 mounted on the top plate to form holes to accommodate the heads of the driven pins. 6 is a sectional view showing a state in which an end mill 116 is in contact with 61; FIG. FIG. 15C is a cross-sectional view showing a state in which the portion corresponding to the head of the pin is bored by the end mill 116. FIG.

FIG. 15D is a sectional view showing a state in which the pins 120 are inserted into the holes of the upper plate 61 and the lower plate 62 thus formed. In order to eliminate the misalignment of the upper plate 61 and the lower plate 62 in the plane direction, the relationship between the main body of the pin 120 and the through holes of the upper plate 61 and the lower plate 62 is not "clearance fit" but "interference fit". Better.

15E is a cross-sectional view showing a state in which the pins 120 are inserted into the holes formed in the upper plate 61 and the lower plate 62. FIG. Pins 120 are completely housed in upper plate 61 and lower plate 62 by reaming and end milling. In FIG. 15E, the pin 120 can prevent the upper plate 61 and the lower plate 62 from slipping in the support frame 60. In FIG. In addition, reproducibility is excellent as compared with the case where the upper plate 61 and the lower plate 62 are prevented from being displaced by the burr 113 as in the first embodiment.
(Embodiment 2)
16A to 16D are cross-sectional views showing Embodiment 2 of Example 2. FIG. Embodiment 2 differs from Embodiment 1 in that the pins used are parallel pins 121 as shown in FIG. 16C. In the case of the parallel pin 121, since the pin has no head, the end mill processing used in the first embodiment is unnecessary.

FIG. 16A is a cross-sectional view showing a state in which a reamer 117 is applied onto a lower rigid body 115 having a hole. FIG. 16B is a cross-sectional view showing a state in which the support frame 60 with through holes formed by the reamer 117 is placed on the lower rigid body 115 having no holes. 16C is a cross-sectional view showing a state in which the parallel pins 121 are inserted into the through holes of the support frame 60. FIG. In this case as well, in order to eliminate the displacement of the upper plate 61 and the lower plate 62 in the plane direction, the relationship between the parallel pins 121 and the through holes of the upper plate 61 and the lower plate 62 should be not a "gap fit" but a "tight fit". "Fitting" is better.

FIG. 16D is a cross-sectional view showing a state in which the parallel pins 121 are inserted into the through holes of the support frame 60 by hammering. Since the second embodiment does not require end milling, the process can be simplified compared to the first embodiment.
(Embodiment 3)
17A to 17D are cross-sectional views showing Embodiment 3 of Example 2. FIG. Embodiment 3 differs from Embodiment 1 in that the pins used are hollow pins 122 as shown in FIG. 17D. The external shape of the pin 122 is similar to the pin 120 of the first embodiment. Therefore, the through holes formed in the support frame 115 and the holes formed in the upper plate 61 by the end mill 116 are the same as in the first embodiment, and the machining processes shown in FIGS. 15A, 15B, and 15C in 1.

17D differs from FIG. 15D in that the length of pin 122 used in FIG. 17D is longer than the length of pin 120 used in FIG. 15D. 17D, a hole is formed in the lower rigid body 115 on which the support frame 60 is placed, and the tip of the pin 122 protrudes below the lower surface of the lower plate 62 in this portion.

FIG. 17E is a cross-sectional view showing a state in which the support frame 60 is turned over and the hollow portion of the pin 122 is hit with a tool (strike rod) 123 on the lower rigid body 115 having no holes. Thereby, the tip of the hollow pin 122 is crushed and the hollow pin 122 is fixed.

FIG. 17F is a cross-sectional view showing a state in which hollow pin 122 is fixed by crushing the tip of hollow pin 122 . As shown in FIG. 17F , the crushed portion of the tip of the hollow pin 122 protrudes downward from the lower surface of the lower plate 62 . In the vapor deposition apparatus, the structure shown in FIG. 17F can be used as long as the vapor deposition mask 5 may have projections on either surface.

In the third embodiment, the lower plate 62 is made smaller than the upper plate 61 in the planar shape, and a material capable of strongly adhering to the lower plate 62 and the upper plate 61 is applied to the end portion of the upper plate 61 . And by forming it on the end side surface of the lower plate 62, the upper plate 61 and the lower plate 62 are prevented from being displaced in the plane direction.
(Embodiment 1)
18A to 18E are cross-sectional views showing Embodiment 1 of Example 3. FIG. FIG. 18A is a cross-sectional view showing a state in which the upper plate 61 and the lower plate 62 are placed on the lower rigid body 115 upside down. As shown in FIG. 18, the size of the lower plate 62 is smaller than the size of the upper plate 61, and the upper plate 61 protrudes outward from the lower plate 62 at the end.

FIG. 18B shows a state in which a modeled object 133 is stacked on the edge of the top plate 61 using a three-dimensional printer. 130 indicates the nozzles of the three-dimensional printer. The modeled object 133 formed in this manner is a material having a property of being more strongly adhered to the upper plate 61 and the lower plate 62 than the adhesive 63 after being subjected to heat treatment, ultraviolet irradiation, or the like, for example. . FIG. 18C is a cross section showing a state in which the three-dimensional printer finishes stacking the modeled object 133 . In this state, for example, heat treatment is applied or ultraviolet irradiation is performed to solidify the modeled object 133 and strongly bond the modeled object 133 to the upper plate 61 and the lower plate 62 . A barbell mark 135 in FIG. 18C etc. indicates that the layered product 133 is strongly adhered to the upper plate 61 and the lower plate 62 .

FIG. 18D is a cross-sectional view showing a state in which the modeled object 133 is polished using the polishing tool 132 to flatten the plane and side surfaces of the support frame 60 . FIG. 18E is a cross-sectional view of the support frame 60 after processing. In FIGS. 18A to 18D, the upper plate 61 and the lower plate 62 are machined upside down, but in FIG. 18E, the upper plate 61 and the lower plate 62 are reversed. .

FIG. 18F is a back plan view when the support frame 60 is viewed from the back. The lower plate 62 has a smaller outer shape than the upper plate 61 over the entire circumference. If it is disadvantageous in terms of time and cost to form the laminate-molded article 131 on the entire periphery with a three-dimensional printer, the laminate-molded article 131 is discretely formed on the outer side of the lower plate 62 as shown in FIG. 18F. can do Of course, if the conditions permit, the laminate-molded article 131 may be formed over the entire outer circumference of the lower plate 62 .

FIG. 18G shows an example in which the laminate-molded article 131 is formed on the inner peripheral side of the support frame 60 . Since FIG. 18G is a plan view of the back surface, only the lower plate 62 is visible. When the width of the lower plate 62 is smaller than that of the upper plate 61 on the entire inner circumference, the laminate-molded article 113 is formed on the entire inner circumference of the lower plate 62 .
(Embodiment 2)
19A to 19E are cross-sectional views showing Embodiment 2 of Example 3. FIG. Embodiment 2 differs from Embodiment 1 in that, in the support frame 60, the sizes of the lower plate 62 and the upper plate 61 are initially the same, and the end of the lower plate 62 is removed by an end mill. This secures a space for forming a modeled object 131 by a three-dimensional printer.

FIG. 19A shows a state in which the support frame 60 having the upper plate 61 and the lower plate 62 of the same size is placed upside down on the lower rigid body 115, and the end of the lower plate 62 is partially removed. is a cross-sectional view showing a state in which an end mill 116 is applied for the purpose. Note that the support frame 60 in FIGS. 19A to 19E is placed on the lower rigid body 115 in an upside down state.

FIG. 19B is a cross-sectional view showing a state in which the edge of the lower plate 62 has been removed by the end mill 116. FIG. FIG. 19C is a cross-sectional view showing a state in which a laminate-molded article 133 is formed on the end of the upper plate 61 by a three-dimensional printer. 130 indicates the nozzles of the three-dimensional printer. FIG. 19C is similar to the configuration described in FIG. 18B. 19D corresponds to FIG. 18C of the first embodiment, and FIG. 19E corresponds to FIG. 18D of the first embodiment. 19F is a cross-sectional view showing the support frame 60 after processing, and corresponds to FIG. 18E of the first embodiment.

A plan view of the support frame 60 in the second embodiment differs from that in the first embodiment. That is, in Embodiment 2, the edge of the lower plate 62 is removed by the end mill 116, so the plane of the removed portion is usually circular. 19G is a back plan view of the support frame 60 in Embodiment 2. FIG. In FIG. 19G, the hole formed by the end mill 116 at the end of the lower plate 62 is filled with the layered article 133 formed by the three-dimensional printer. Since the holes are formed with an end mill, the holes and the laminate-molded article 133 are discretely formed on the outer periphery.

19H is a back plan view of another example of the support frame 60 according to Embodiment 2. FIG. In FIG. 19H, a hole is formed in the inner peripheral edge of the lower plate 62 by an end mill 116, and the hole is filled with a layered product 133 formed by a three-dimensional printer. Also in FIG. 19H, since the holes are formed by the end mill 116, the holes and the laminate-molded article 133 are formed discretely on the inner periphery.

In addition, in FIGS. 19G, 19H, etc., since the removed portion formed on the lower plate 62 is formed by the end mill 116, it is a circular hole. However, by using a tool other than the end mill 116, it is possible to make the planar shape of the removed portion of the end of the lower plate 62 a shape other than a circle.

A fourth embodiment is an example in which the upper plate 61 and the lower plate 62 of the support frame 60 are fixed by plating at the end portions in order to eliminate the displacement between the upper plate 61 and the lower plate 62 .
(Embodiment 1)
20A to 20F are cross-sectional views showing Embodiment 1 of Example 4, and FIG. 20G is a plan view of a support frame 60 according to Example 4. FIG. 20A is a cross-sectional view of the support frame 60 before being subjected to the treatment of this embodiment, and the lower view is an adhesive material that bonds the upper plate 61 and the lower plate 62 of the support frame 60. 63 is a cross-sectional view of a solvent bath 141 containing a solvent 140 that dissolves 63. FIG. The end of one side of the support frame 60 is immersed in this solvent.

FIG. 20B is a cross-sectional view showing a state in which the end of one side of the support frame 60 is immersed in the solvent 140. FIG. In FIG. 20B , the circular mark at the portion where the support frame 60 is immersed in the solvent 140 indicates the intermediate process in which the adhesive 63 is dissolved in the solvent 140 . FIG. 20C is a cross-sectional view showing a state in which the adhesive material 63 in the range immersed in the solvent 140 is removed.

In this embodiment, plating is performed by forming plating between the end surfaces of the upper plate 61 and the lower plate 62 and between the upper plate 61 and the lower plate 62 at the end portions. The upper view of FIG. 20D is a cross-sectional view showing a state in which masking tape 142 is attached so that plating is not formed on the main surfaces of upper plate 61 and lower plate 62 before plating. 20 is a cross-sectional view showing a state in which the plating solution 143 is contained in the plating bath 145. The bottom view of FIG.

20E is a cross-sectional view showing a state in which the end portion of the support frame 60 is immersed in the plating solution 143. FIG. In FIG. 20E, the upper plate 61 and the lower plate 62 in contact with the plating solution 143 are plated. FIG. 20F is a cross-sectional view showing a state in which the support frame 60 is taken out from the plating tank 145 with the plating 144 applied to the ends between the upper plate 61 and the lower plate 62 and the side faces of the ends. As shown in the upper side of FIG. 20F, the plating 144 fills the gap between the lower plate 62 and the upper plate 61 to strongly bond the upper plate 61 and the lower plate 62 together, so that the upper plate 61 and the lower plate 62 are separated by shear force. Displacement can be prevented. Incidentally, the plating thickness between the upper plate 61 and the lower plate 62 is the same thickness as the adhesive 63 and is 15 μm to 20 μm.

The steps shown in FIGS. 20A to 20F are applied not only to one side of the support frame 60 but also to four sides of the support frame 60 . FIG. 20G is a plan view showing a state in which the support frame 60 is plated 144 according to this embodiment. As shown in FIG. 20G, the plating 144 is applied to the entire outer ends of the four sides of the support frame 60 so that it can withstand shearing forces in any direction. 20G indicates that the plating is formed between the upper plate 61 and the lower plate 62 at the end of the support frame 60. As shown in FIG.
(Embodiment 2)
21A to 21E are cross-sectional views showing Embodiment 2 of Example 4. FIG. 21A is a cross-sectional view showing a state in which the end portion of the support frame 60 is immersed in the solvent 140 to dissolve the adhesive 63, and corresponds to FIG. 20B in Embodiment 1. FIG. In the support frame 60, the gap between the upper plate 61 and the lower plate 62 tends to increase in the range where the adhesive 63 is removed. 21B is a cross-sectional view showing a state in which the distance between the upper plate 61 and the lower plate 62 is increased at the end of the support frame 60. FIG. As a result, even if the plating 144 is applied to the upper plate 61 and the lower plate 62 , the upper plate 61 and the lower plate 62 are not joined by the plating 144 .

FIG. 21C is a cross-sectional view showing a state in which a clamp 146 is used to prevent the gap between the upper plate 61 and the lower plate 62 from widening before plating in order to prevent this. 21C, the masking tape 142 is attached to the support frame 60 from which the adhesive 63 has been removed at the end, and then the gap between the upper plate 61 and the lower plate 62 is suppressed by the clamp 146. , the upper plate 61 and the lower plate 62 are plated with a uniform thickness. The clamps 146 may be formed along the entire side of the support frame 60, or may be formed discretely. In this state, it is immersed in the plating solution 143 shown in FIG. 21C.

FIG. 21D is a cross-sectional view showing a state in which the clamped support frame 60 is immersed in a plating solution 143 and plated 144. FIG. FIG. 21D is a cross-sectional view showing a state in which the support frame 60 with its edges plated in this manner is removed from the plating solution 143. As shown in FIG. 21E is a cross-sectional view of the support frame 60 with the clamp 146 and the masking tape 142 removed. A plan view of the support frame 60 in the second embodiment thus formed is the same as FIG. 20G in the first embodiment.

As described above, the support frame 60 according to the present embodiment can reliably bond the upper plate 61 and the lower plate 62 with the plating 144 at the end portions, so that displacement caused by shearing force can be reliably prevented. I can.

The support frame 60 of Example 5 differs from those of Examples 1 to 4 in cross-sectional structure. In the support frame 60 of Example 5, an upper plate 61 having a convex portion 611 and a concave portion 612 on one side and a lower plate 62 having a convex portion 621 and a concave portion 622 on one side are prepared. The upper plate 61 and the lower plate 62 are bonded together by fitting the convex portion of the upper plate 61 or the lower plate 62 with the concave portion of the other. In the support frame 60 formed in this manner, the upper plate 61 and the lower plate 62 are not displaced even if a shearing force is generated in the direction parallel to the main surface due to the protrusions and recesses that are fitted to each other.
(Embodiment 1)
FIG. 22 is a cross-sectional view showing a method of manufacturing the support frame 60 according to Embodiment 1 of Example 5. FIG. In FIG. 22, an upper plate 61 having a convex portion 611 and a concave portion 612 formed on one side and a lower plate 62 having a convex portion 621 and a concave portion 622 formed on one side are prepared. Such a plate material can be manufactured by pressing or machining. In FIG. 22, an upper plate 61 and a lower plate 62 are pasted together by rollers with their uneven surfaces facing each other. In order to prevent the upper plate 61 and the lower plate 62 from peeling off due to the force perpendicular to the main surface of the support frame 60, the adhesive liquid 152 is applied from the nozzle 153 to the bonding surface.

When the upper plate 61 and the lower plate 62 are pasted together, the projections of one of the upper plate 61 or the lower plate 62 and the recesses of the other of the upper plate 61 or the lower plate 62 are fitted by the rollers 150, so that Even if a shearing force is applied between the upper plate 61 and the lower plate 62, the upper plate 61 and the lower plate 62 are not displaced in the main surface direction. Further, since the projections and the recesses are fitted while being pressed by the rollers 150, it is possible to prevent misalignment of the projections and the recesses due to manufacturing tolerances.

FIG. 23 is a cross-sectional view of a support frame manufactured in this way. In FIG. 23, since the projections of the upper plate 61 and the recesses of the lower plate are fitted together, the upper plate 61 and the lower plate 62 do not shift even when a shearing force is applied. Further, since the adhesive is present between the upper plate 61 and the lower plate 62, the upper plate 61 and the lower plate 62 will not separate even if a force is applied in the direction perpendicular to the main surface.

FIG. 24 is a diagram showing the state of the surfaces of the upper plate 61 and the lower plate 62 on which the protrusions and recesses are formed. The left side of FIG. 24 is the upper plate 61 and the right side is the lower plate 62 . 24, convex portions 611 are formed on the upper plate 61 at a predetermined pitch. The upper side is a plan view, and the lower side is a cross-sectional view taken along the line BB. In the drawing on the left side of FIG. 24, the convex portions 611 are formed in an island shape and arranged in a matrix. Although the planar shape of each projection 611 is circular in FIG. 24, it may be square or rectangular.

24, the lower plate 62 is formed with recesses 622 at portions corresponding to the protrusions 611 of the upper plate 61. As shown in FIG. The upper side of the drawing on the right side of FIG. 24 is a plan view, and the lower side is a sectional view along the line CC. The concave portions 622 of the lower plate 62 are formed at the same pitch as the convex portions 611 of the upper plate 61 , and the planar shape of each concave portion 622 is the same as that of the convex portions 611 of the upper plate 61 . In FIG. 24, the support frame 60 in which the upper plate 61 and the lower plate 62 are not displaced even when a shearing force is applied is provided by fitting the convex portion 611 of the upper plate 61 and the concave portion 622 of the lower plate 62 and bonding them together. can be manufactured.

FIG. 25 is a diagram showing another example of the state of the surfaces of the upper plate 61 and the lower plate 62 on which the recesses and protrusions are formed. The left side of FIG. 24 is the upper plate 61 and the right side is the lower plate 62 . 24, convex portions 611 are formed on the upper plate 61 at a predetermined pitch. The upper side is a plan view, and the lower side is a DD cross-sectional view.

25, on the lower plate 62, similarly to the upper plate 61, convex portions 621 are formed at a predetermined pitch. The upper side is a plan view, and the lower side is a cross-sectional view taken along line EE. That is, the lower plate 62 and the upper plate 61 are the same. When the upper plate 61 and the lower plate 62 are attached together, the convex portion 611 of the upper plate 61 is fitted into the concave portion indicated by the dotted circle of the lower plate 62 . In the lower plate 62 , the spaces between the four projections 621 constitute the recesses 622 .

Also in FIG. 25, the effect is the same as in FIG. In the structure of FIG. 24, the upper plate 61 and the lower plate 62 need to be formed in separate processes, but in the structure of FIG. 25, the upper plate 61 and the lower plate 62 can be formed at the same time. Therefore, manufacturing costs can be reduced.

FIG. 26 is a plan view showing another example of protrusions and recesses formed on the upper plate 61 and the lower plate 62 of the support frame 60. FIG. In FIG. 26, on one surface of the upper plate 61, convex portions 611 are formed in stripes in the vertical direction (y direction) and formed at a predetermined pitch in the horizontal direction (x direction). A concave portion 612 is formed between the convex portions 611 and 611 . 26 to 28, the upper plate 61 and the lower plate 62 have the same shape, so only the upper plate 61 is shown.

In FIG. 26, by setting the pitch pp of the projections 611 and the width w of the projections 611 to w=p/2, the projections 611 and the recesses 612 having the same width are formed at the same pitch. With such a configuration, the upper plate 61 and the lower plate 62 can be formed at the same time. The support frame 60 can be formed by fitting the protrusions and recesses of the upper plate 61 and the lower plate 62 thus formed. In addition, when the upper plate 61 and the lower plate 62 are fitted together, the adhesive liquid 152 is sprayed in the same manner as explained with reference to FIG. 22 .

In the support frame 60 formed in this manner, the upper plate 61 and the lower plate 62 are not displaced against a shearing force applied in the horizontal direction (x direction in FIG. 26). On the other hand, the shear force applied in the vertical direction (the y direction in FIG. 26) is also effective to some extent because the unevenness formed on the upper plate 61 and the lower plate 62 increases the bonding area. However, it is not sufficient for longitudinally applied shear forces.

FIG. 27 is a plan view showing another example of the projections 611 and the recesses 612 formed on the upper plate 61 and the lower plate 62 of the support frame 60. FIG. In FIG. 27, on one surface of the upper plate 61, convex portions 611 extend obliquely in stripes and are formed at a predetermined pitch in the perpendicular direction. A concave portion 612 is formed between the convex portions 611 and 611 . The configuration of FIG. 27 is the same as that of FIG. 26 except that the protrusions 611 are formed in stripes in an oblique direction.

In the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 with the structure shown in FIG. Therefore, displacement between the upper plate 61 and the lower plate 62 is unlikely to occur in both the x direction and the y direction. However, if the shear force in the x-direction or the y-direction is very large, the upper plate 61 and the lower plate 62 may be slightly misaligned.

FIG. 28 is a plan view showing another example of protrusions and recesses formed on the upper and lower plates of the support frame 60. FIG. In FIG. 28, on one surface of the upper plate 61, convex portions 611 are formed in a zigzag shape in the vertical direction and arranged at a predetermined pitch in the direction perpendicular thereto. A concave portion 612 is formed between the convex portions 611 and 611 . The configuration of FIG. 28 is the same as that of FIG. 26 except that the convex portion 61 is formed in a zigzag shape.

In the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 with the structure shown in FIG. Therefore, displacement between the upper plate and the lower plate is unlikely to occur in both the x direction and the y direction. In particular, if the zigzag angle is 45 degrees, shear forces applied in the x-direction or the y-direction cancel each other and become zero. Therefore, even if a large shearing force occurs, the upper plate 61 and the lower plate 62 will not be displaced.

26 to 28, the upper plate 61 and the lower plate 62 can be made of the same member, which is advantageous in terms of manufacturing cost.
(Embodiment 2)
FIG. 29 is a cross-sectional view showing a manufacturing process of the configuration of Embodiment 2 of Example 5. FIG. 29 is the same as FIG. 22 of Embodiment 1 except that the cross section of the projection 611 of the upper plate 61 and the cross section of the projection 621 of the lower plate 62 are triangular. Protrusions 611 and 621 as shown in FIG. 29 can also be formed by pressing or machining. The planar shape of the upper plate 61 or the lower plate 62 in the second embodiment is the same as explained with reference to FIGS. 24 to 28. FIG.

FIG. 30 is a cross-sectional view of the support frame 60 in Embodiment 2. FIG. By fitting the convex portion 611 of the upper plate 61 and the concave portion 621 of the lower plate 62 together, even if tension is applied to the support frame 60 from the mask 50, the upper plate 61 and the lower plate 62 do not shift. By the way, the second embodiment shows a case where the cross section is triangular, but the cross section is not limited to a triangle, and may be a shape having a curvature R formed at the vertex of the triangle, or a trapezoid or the like. is.
(Embodiment 3)
FIG. 31 is a cross-sectional view showing a manufacturing process of the configuration of Embodiment 3 of Example 5. FIG. Embodiment 3 is different from Embodiment 1 in that a convex portion 65 is formed on an upper plate 61 and a convex portion 66 is formed on a lower plate 62 by a three-dimensional printer. The configuration is the same as that described with reference to FIG. 22 in Embodiment 1, except that the convex portions 65 and 66 are formed by a three-dimensional printer. 32 is a cross-sectional view of a support frame according to Embodiment 3. FIG. Except that the convex portions 65 and 66 are formed by a three-dimensional pre-printer, the configuration is the same as that described with reference to FIG. 23 in the first embodiment.

The planar shape of the upper plate 61 or the lower plate 62 in Embodiment 3 is the same as explained with reference to FIGS. For example, it is relatively difficult to form the convex portion 611 in a zigzag plane shape as shown in FIG. 28 by machining, but it can be easily formed by a three-dimensional printer.

In the above examples, the case of manufacturing an organic EL display device using a vapor deposition mask has been described. However, the present invention is not limited to this, and can be used as a deposition mask for display devices other than the organic EL display device when high-definition pitch deposition is required.

5 Deposition mask 10 Display area 11 Scanning line 12 Video signal line 13 Power supply line 14 Pixel 14 Pixel 14 Pixel 14 Pixel 20 Scanning line driving circuit 21 Frame area 30 Terminal area 31 Driver IC 32 Flexible wiring board 40 Substrate 50 Mask 51 Opening area 52 Peripheral area 60 Support frame 61 Upper plate 62 Lower plate 63 Adhesive 65 Convex portion by three-dimensional printer 66 Convex portion by three-dimensional printer 70 Joining member 80 Evaporated material 90 Base material 91 Resist 92 Temporary adhesion Material 100 Stopper 110 Punching tool 111 Riding point 112 Hole 113 Burr 114 Upper rigid body (mounting table) 115 Lower rigid body (holding table) 116 End mill 117 Reamer DESCRIPTION OF SYMBOLS 120... Pin 121... Parallel pin 122... Hollow pin 123... Hitting stick 130... Nozzle for three-dimensional printer 131... Three-dimensional modeled object 132... Polishing tool 133... Discharged material 135... Strong adhesion Mark 140 Solvent 141 Solvent bath 142 Masking tape 143 Plating solution 144 Plating 145 Plating bath 150 Roller 152 Adhesive 153 Nozzle 150 Common electrode 151 Capacitance insulating film 152 Pixel electrode 153 Alignment film 611 Convex portion 612 Concave portion 621 Convex portion 622 Concave portion 900 Vapor deposition source 1000 Vacuum vapor deposition chamber 1121 Deformed portion of support frame , B... blue light emitter, G... green light emitter, R... red light emitter

Claims (20)

A vapor deposition mask used in the manufacture of a display device,
The vapor deposition mask is composed of a mask for forming a vapor deposition on pixels and a support frame for supporting the mask,
The support frame is composed of an upper plate, a lower plate, and an adhesive that adheres the upper plate and the lower plate,
A vapor deposition characterized by comprising a stopper for preventing the upper plate and the lower plate from being displaced from each other in the main surface direction of the support frame when a shearing force is applied between the upper plate and the lower plate. mask. The mask is a foil formed by plating, and has a large number of holes corresponding to the pixels of the display device, and the mask and the support frame are joined by a joining member. Item 1. The vapor deposition mask according to item 1. 3. The vapor deposition mask according to claim 2, wherein the joining member is formed by plating. 2. A vapor deposition mask according to claim 1, wherein said stopper comprises a burr formed by simultaneously punching said upper plate and said lower plate. 2. A vapor deposition mask according to claim 1, wherein said stopper comprises a burr formed by punching one of said upper plate and said lower plate. 2. The vapor deposition mask according to claim 1, wherein said stopper is formed by inserting a pin into a hole passing through said upper plate and said lower plate. 7. A vapor deposition mask according to claim 6, wherein said pins are parallel pins. 7. A vapor deposition mask according to claim 6, wherein said pins are hollow pins. 2. The vapor deposition mask according to claim 1, wherein the stopper is a shaped object formed by a three-dimensional printer on the peripheral portion of one of the lower plate and the upper plate. the top plate or one of the top plates is larger than the top plate or the other top plate in the plane direction;
a modeled object formed by a three-dimensional printer is formed on the upper plate or the one end of the upper plate;
2. The vapor deposition mask according to claim 1, wherein the shaped object constitutes the stopper. 2. A vapor deposition mask according to claim 1, wherein said stopper is formed by plating between said upper plate and said lower plate around said support frame. A vapor deposition mask used in the manufacture of a display device,
The vapor deposition mask is composed of a mask for forming a vapor deposition on pixels and a support frame for supporting the mask,
The support frame is composed of an upper plate, a lower plate, and an adhesive that adheres the upper plate and the lower plate,
On one surface of the upper plate, convex portions are formed at a predetermined pitch, and on one surface of the lower plate, concave portions are formed at the predetermined pitch, and the convex portions and the concave portions are fitted to each other. A vapor deposition mask, characterized in that it has a configuration in which the The convex portions are formed in an island shape and arranged in a matrix,
13. The vapor deposition mask according to claim 12, wherein the concave portions are formed like islands and arranged in a matrix. The one surface of the upper plate and the one surface of the lower plate have the same shape,
14. The vapor deposition mask according to claim 13, wherein the concave portion of the lower plate is formed by a region sandwiched between convex portions formed on the lower plate. 13. The vapor deposition mask according to claim 12, wherein the projections are formed in stripes. 13. A vapor deposition mask according to claim 12, wherein said convex portion is formed in a stripe shape, and the extending direction of said stripe is oblique to the sides of said support frame. 13. The vapor deposition mask according to claim 12, wherein the projections are formed in a zigzag shape when viewed from above. 13. The vapor deposition mask according to claim 12, wherein the projections are formed by a three-dimensional printer. 13. The vapor deposition mask according to claim 12, wherein the cross-sectional shape of the projection is rectangular. 13. The vapor deposition mask according to claim 12, wherein the cross-sectional shape of said projections is triangular.

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