JP2020132939A - Vapor deposition mask - Google Patents

Abstract

To provide a vapor deposition mask in which illuminant is evaporated on a pixel in high accuracy in production of a display device.SOLUTION: A vapor deposition mask used in production of the display device includes a mask 50 for forming evaporation object on the pixel; and a support frame 60 for supporting the mask 50, the support frame 60 including an upper plate 61, a lower plate 62 and an adhesive 63 for bonding the upper plate 61 and the lower plate 62, and when sheer force is applied between the upper plate 61 and the lower plate 62, a stopper 100 for preventing the upper 61 and the lower plate 62 from being shifted from each other, in a main surface direction of the support frame 60.SELECTED DRAWING: Figure 11

Description

The present invention relates to a thin-film deposition mask when pixels of an organic EL display device or the like are formed by thin-film deposition.

In the organic EL display device, an organic layer, which is a light emitting material, is formed by vapor deposition for each pixel. The pixel pitch is small, and therefore the size of the illuminant composed of the organic EL layer in each pixel formed by vapor deposition is also small. Along with this, the hole pitch and the hole size in the vapor deposition mask are very small. Therefore, the accuracy of the vapor deposition mask is important.

The thin-film deposition mask is composed of a portion of the mask foil in which a large number of holes for vapor deposition are formed in the pixel, and a support frame for pointing to the mask foil. In Patent Document 1, in order to reduce the distortion of the support frame and improve the dimensional accuracy, the support frame is composed of two pieces, an upper frame and a lower frame, and the upper frame and the lower frame are bonded with an adhesive. It is described that it is configured.

JP-A-2017-210633

The vapor deposition mask in the present invention is composed of a foil-shaped mask in which a large number of holes are formed, a support frame for supporting the foil-shaped mask, and a foil-shaped mask corresponding to pixels in the display area of the organic EL display device. Hereinafter, in the present specification, a foil-shaped mask having a large number of holes formed is simply referred to as a mask, and an assembly of the mask and a support frame is referred to as a thin-film mask.

The pixel pitch of the organic EL display device is very small, and the diameter of the mask hole corresponding to each pixel is also very small. Therefore, the thickness of the mask on which the holes are formed also needs to be very small. In addition, the mask needs to be flattened along the substrate to be deposited. In order to maintain the flatness of the mask, it is necessary to apply tension to the outside of the mask by the support frame. At this time, an inward tension is applied to the support frame as a reaction.

In order to improve the dimensional accuracy and prevent the frame itself from being distorted, the support frame has a two-piece structure of an upper frame and a lower frame, and a structure in which the upper frame and the lower frame are bonded with an adhesive is used. At this time, the tension on the support frame as a reaction from the mask is mainly applied to the upper frame.

Then, a shearing force is applied to the adhesive layer that adheres the upper frame and the lower frame, and a phenomenon occurs in which the upper frame and the lower frame are displaced from each other in the plane direction. The deviation between the upper frame and the lower frame due to such a shearing force has an important effect on the vapor deposition accuracy of the thin film deposition mask.

The present invention is to prevent the upper frame and the lower frame from being displaced due to shearing force, maintain the dimensional accuracy of the vapor deposition mask, and thereby enable the production of an organic EL display device of excellent quality.

The present invention overcomes the above problems, and the main specific means are as follows.

(1) A thin-film deposition mask used in the manufacture of a display device, wherein the thin-film deposition mask is composed of a mask for forming a vapor-deposited substance on pixels and a support frame for supporting the mask. It is composed of an upper plate and a lower plate, and an adhesive material that adheres the upper plate and the lower plate, and when a shearing force is applied between the upper plate and the lower plate, the upper plate is oriented in the main surface direction of the support frame. A thin-film mask characterized by having a stopper for preventing the plate and the lower plate from shifting from each other.

(2) A thin-film deposition mask used in the manufacture of a display device, wherein the thin-film deposition mask is composed of a mask for forming a vapor-deposited substance on pixels and a support frame for supporting the mask. It is composed of an upper plate and a lower plate, and an adhesive material that adheres the upper plate and the lower plate, and convex portions are formed on one surface of the upper plate at a predetermined pitch, and one surface of the lower plate is formed. The vapor deposition mask is characterized in that concave portions are formed at a predetermined pitch, and the convex portions and the concave portions are fitted together.

It is a top view of the organic EL display device. It is a top view which shows the pixel structure of an organic EL display device. It is sectional drawing which shows the relationship between the substrate and the vapor deposition mask in a display area. It is sectional drawing which shows the outline of the vapor deposition apparatus. It is a detailed view of the vapor deposition mask. It is sectional drawing which shows the state which formed the mask in the vapor deposition mask. It is sectional drawing of the support frame. It is sectional drawing which shows the state which the support frame and the mask are temporarily attached. It is sectional drawing which shows the state which joined the mask and the support frame by the joining member formed by plating. It is sectional drawing which shows the state which the base material was peeled off from a mask. It is sectional drawing which shows the manufacturing process of a support frame. It is a top view of the vapor deposition mask. 8 is a cross-sectional view taken along the line AA of FIG. It is sectional drawing of the support frame in a state where tension is applied to the upper plate of a support frame. It is sectional drawing which shows the outline of this invention. It is a top view which shows the outline of this invention. It is sectional drawing which shows the manufacturing process of Embodiment 1 of Example 1. FIG. It is sectional drawing which shows the process which follows FIG. 13A. It is sectional drawing which shows Embodiment 1 of Example 1. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 2 of Example 1. FIG. It is sectional drawing which shows the process which follows FIG. 14A. It is sectional drawing which shows the process which follows FIG. 14B. It is sectional drawing which shows the Embodiment 1 composition of Example 2. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 1 of Example 2. FIG. It is sectional drawing which shows the process which follows FIG. 15A. It is sectional drawing which shows the process which follows FIG. 15B. It is sectional drawing which shows the process which follows FIG. 15C. It is sectional drawing which shows the structure of Embodiment 1 of Example 2. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 2 of Example 2. FIG. It is sectional drawing which shows the process which follows FIG. 16A. It is sectional drawing which shows the process which follows FIG. 16B. It is sectional drawing which shows the structure of Embodiment 2 of Example 2. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 3 of Example 2. FIG. It is sectional drawing which shows the process which follows FIG. 17A. It is sectional drawing which shows the process which follows FIG. 17B. It is sectional drawing which shows the process which follows FIG. 17C. It is sectional drawing which shows the process which follows FIG. 17D. It is sectional drawing which shows the structure of Embodiment 3 of Example 2. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 1 of Example 3. FIG. It is sectional drawing which shows the process which follows FIG. 18A. It is sectional drawing which shows the process which follows FIG. 18B. It is sectional drawing which shows the process following FIG. 18C. It is sectional drawing which shows the structure of Embodiment 1 of Example 3. FIG. It is a top view which shows the structure of Embodiment 1 of Example 3. FIG. It is a top view which shows the structure of another example of Embodiment 1 of Example 3. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 2 of Example 3. FIG. It is sectional drawing which shows the process which follows FIG. 19A. It is sectional drawing which shows the process which follows FIG. 19B. It is sectional drawing which shows the process which follows FIG. 19C. It is sectional drawing which shows the process which follows FIG. 19D. It is sectional drawing which shows the structure of Embodiment 2 of Example 3. FIG. It is a top view which shows the structure of Embodiment 2 of Example 3. FIG. It is a top view which shows the structure of another example of Embodiment 2 of Example 3. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 1 of Example 4. FIG. It is sectional drawing which shows the process which follows FIG. 20A. It is sectional drawing which shows the process which follows FIG. 20B. It is sectional drawing which shows the process following FIG. 20C. It is sectional drawing which shows the process which follows FIG. 20D. It is sectional drawing which shows the final process of Embodiment 1 of Example 4. FIG. It is a top view which shows the structure of Embodiment 1 of Example 4. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 2 of Example 4. FIG. It is sectional drawing which shows the process which follows FIG. 21A. It is sectional drawing which shows the process which follows FIG. 21B. It is sectional drawing which shows the process which follows FIG. 21C. It is sectional drawing which shows the process which follows FIG. 21D. It is sectional drawing which shows the structure of Embodiment 2 of Example 4. FIG. It is sectional drawing which shows the manufacturing process of Embodiment 1 of Example 5. It is sectional drawing which shows the structure of Embodiment 1 of Example 5. It is a figure which shows the example of the convex part and the concave part in Example 5. It is a figure which shows the other example of the convex part and the concave part in Example 5. FIG. 5 is a plan view showing still another example of the convex portion and the concave portion in the fifth embodiment. FIG. 5 is a plan view showing still another example of the convex portion and the concave portion in the fifth embodiment. FIG. 5 is a plan view showing still another example of the convex portion and the concave portion in the fifth embodiment. It is sectional drawing which shows the manufacturing process of Embodiment 2 of Example 5. It is sectional drawing which shows the structure of Embodiment 2 of Example 5. It is sectional drawing which shows the manufacturing process of Embodiment 3 of Example 5. It is sectional drawing which shows the structure of Embodiment 3 of Example 5.

FIG. 1 is a plan view of an organic EL display device. In FIG. 1, a display region 10 for displaying an image is formed on a TFT substrate 40 made of glass or polyimide resin. A frame area 21 is arranged around the display area 10. In the frame region 21, a current supply line for supplying a current to the pixel 14, a scanning line drive circuit 20, and the like are arranged. Scanning lines 11 extend in the horizontal direction (x direction) and are arranged in the vertical direction (y direction) in the display area 10. Further, the video signal lines 12 and the power supply lines 13 extend in the vertical direction and are arranged in the horizontal direction. The area surrounded by the scanning line 11, the video signal line 12, and the power supply line 13 is the pixel 14, and the pixel 14 contains an organic EL layer that emits light, a drive transistor formed by a TFT, and a switching transistor. , Etc. are formed.

A terminal region 30 is formed on one side of the substrate 40. A driver IC 31 is mounted in the terminal area 30 to drive the video signal line 12, and a flexible wiring board 32 is connected to supply a power supply and a signal to the organic EL display device.

FIG. 2 is a plan view of a display area of the organic EL display device. In FIG. 2, a red pixel having a red light emitting body R, a green pixel having a green light emitting body G, or a blue pixel having a blue light emitting body B is formed in a portion corresponding to the pixel 14 of FIG. Alternatively, the illuminants have a delta arrangement. Since the red illuminant R, the green illuminant G, and the blue illuminant B are each composed of different organic EL materials, they are vapor-deposited separately. Therefore, three thin-film deposition masks are required to have the pixel configuration as shown in FIG.

In FIG. 2, the planar shape of each illuminant is a circle, and each illuminant is arranged in a delta. This is an example, and the planar shape of the illuminant may be a square, a rectangle, a stripe, or the like. It is possible. Further, the arrangement of the illuminant is not limited to the delta, and may be a rhombus, a parallelogram, a stripe arrangement, or the like.
In FIG. 2, the diameter d1 of the illuminant is, for example, 15 μm to 20 μm. The pixel pitch pp is, for example, 30 μm to 40 μm. In this case, the diameter of the mask is the same as the diameter of the illuminant. On the other hand, since the holes of the mask are formed for each illuminant, the pitch pm of the holes of the mask is 50 μm to 67 μm. The distance between different colors arranged next to each other, that is, the alignment margin of the vapor deposition mask, is required to be about 10 μm to 30 μm, but in consideration of enlarging the light emitting area of each pixel and increasing the definition of the display area. It is preferable that this distance is small.

FIG. 3 is a cross-sectional view showing a state of a mask 50 and a substrate 40 for depositing an organic EL material which is one of three color issuers. In FIG. 3, the thickness ts of the vapor deposition substrate 40, that is, the TFT substrate 40 is, for example, 0.5 mm. On the other hand, in order to make the diameter d1 of the light emitting body 15 μm to 20 μm, a hole having a hole diameter d1 is similarly formed in the mask 50. The organic EL material is deposited on the surface of the substrate 40 exposed from the holes provided in the mask 50. In order for the organic EL material to be deposited in the region of the pore diameter d1 without excess or deficiency, the plate thickness tm of the mask 50 needs to be as thin as about 5 μm to 10 μm. If the plate thickness of the mask 50 is thick, it becomes a shield against the organic EL material that is going to be deposited from an oblique direction, so-called "eclipse" occurs, and vapor deposition is poor.

In order to obtain a high-definition pixel configuration as shown in FIG. 2, it is necessary that the mask 50 and the vapor-deposited substrate 40 are in close contact with each other as shown in FIG. For this purpose, it is necessary to apply tension to the mask 50 to keep the mask 50 flat. The arrow 80 in FIG. 3 is an evaporation of the organic EL material. Although not shown, a magnet may be arranged so as to face the mask 50 on the opposite side of the substrate 40, and the mask 50 may be brought into close contact with the substrate 40 by magnetic force.

FIG. 4 is a schematic cross-sectional view showing a state of vacuum vapor deposition. In the vacuum chamber 1000 of FIG. 4, the vapor deposition material 80 evaporates from the vapor deposition source 900 toward the substrate 40. A light emitting material is vapor-deposited on the substrate 40 via the mask 50 of the vapor deposition mask. In order to make the vapor deposition film thickness uniform, two thin film deposition sources 90 are used in FIG. The number of the vapor deposition sources 90 is increased or decreased as necessary in order to make the vapor deposition film uniform.

The vapor deposition mask is obtained by joining a foil-shaped mask 50 and a support frame 60 with a joining member 70. The support frame 60 has a structure in which the upper plate 61 and the lower plate 62 are bonded by an adhesive 63. The support frame 60 and the mask 50 are joined by a plating joining member 70. The mask 50 is tensioned by the support frame 60 so that the thin mask 50 does not bend. As a reaction to this, an inward tension is generated in the support frame 60, and a shear stress is generated in the adhesive 63 that adheres the upper plate 61 and the lower plate 62.

FIG. 5 is a detailed view of the vapor deposition mask 5. In FIG. 5, the upper side is a plan view and the lower side is a cross-sectional view. Since the organic EL display device is inefficient if manufactured individually, a large number of organic EL display panels are formed on a large substrate. Therefore, the thin-film deposition mask 5 also corresponds to this large substrate.

In FIG. 5, the vapor deposition mask 5 is divided into four by a support frame 60, and a mask 50 exists in each division. Each mask 50 corresponds to 16 organic EL display devices. Therefore, the vapor deposition mask 50 of FIG. 5 forms 64 organic EL display devices. In FIG. 5, the vapor deposition mask 5 is divided into four sections, but this is an example, and the number of sections is not limited to four.

Each mask 50 is composed of an opening region 51 in which a large number of holes are formed corresponding to each pixel in the display region of the organic EL display device, and a peripheral region 52 in which no holes exist. The mask 50 is, for example, Ni or a Ni alloy having a thickness of several μm to more than ten μm, and is formed by plating.

The support frame 60 is formed by bonding the upper plate 61 and the lower plate 62 with an adhesive 63. One of the reasons why the support frame 60 has a two-layer structure is that when the plate material is formed by the rollers, it is easier to accurately measure the dimensions because the number of rollers increases when the thin plate is used. Another reason is to prevent the stacked support frames from being distorted by canceling the strain inherent in the plate material with the two plate materials.

The upper plate 61 and the lower plate 62 are formed of, for example, an invar material having a thickness of about 0.5 mm. The Invar material is an alloy of iron and nickel and has a very small coefficient of thermal expansion. The support frame 60 formed of the upper plate 61, the lower plate 62, and the adhesive 63 and the mask 50 are joined by a joining member 70 by plating. Tension is applied to the completed mask 50 by the support frame 60 to prevent the mask 50 from bending.

6A to 6E are cross-sectional views showing a process for forming the vapor deposition mask shown in FIG. FIG. 6A is a cross-sectional view showing a state in which the mask 50 is formed by plating. A metal plate having a smooth flat surface is prepared, and this is used as a base material 90, and a mask 50 is formed on the base material 90. That is, a photoresist 91 for patterning is formed on the base material 90, and a foil is formed by growing plating at a predetermined position. In FIG. 6A, the photoresist 91 is formed only in the outer shape of the mask 50, but a photoresist is formed to form a hole in the opening region, and a hole for vapor deposition of a pixel portion is formed in the opening of the mask 50. Can also be formed at the same time.

FIG. 6B is a cross-sectional view of a support frame 60 formed separately from the mask 50. In the support frame 60, for example, an upper plate 61 and a lower plate 62 made of an Invar material having a thickness of 0.5 mm are bonded together by an adhesive material 63. The thickness of the adhesive 63 is, for example, 15 μm. Since the plate material is provided in the form of a roll as a stretched material, warpage in the arc direction may remain. In such a case, the two plates can be stuck upside down to offset the warp and ensure flatness. The processing of the support frame 50 may be cutting or etching.

FIG. 6C is a cross-sectional view showing a state in which the support frame 60 is temporarily bonded to the base material 90 on which the mask 50 is formed. As the temporary adhesive material 92 used for temporary bonding, it is preferable to use a material that facilitates peeling of the base material 90 in a later step.

In FIG. 6D, in order to join the mask 50 and the support frame 60, a photoresist 91 is formed on the structure of FIG. 6C, and then plating is grown to form a connecting member 70 between the mask 50 and the support frame 60. It is sectional drawing which shows the state which was made. In FIG. 6D, the portion other than the portion where the plating is formed as the joining member 70 is covered with the photoresist 91, and the joining member 70 is formed by plating.

In FIG. 6D, the resist 91 is formed in the support frame 60 except for the portion where the joining member 70 is formed by plating. Not limited to this, the entire surface of the support frame 60 may be plated. However, in this case, care must be taken because the support frame 60 may be deformed due to the stress of the plating film by plating the entire surface of the support frame 60.

FIG. 6E is a cross-sectional view showing a state in which the base metal 90 made of metal is peeled off from the vapor deposition mask 5 after the photoresist 91 is peeled off. This completes the vapor deposition mask 5. When the mask 50 is formed on the base material 90 by plating, a stress is generated in the mask 50, and when the base material 90 is peeled from the vapor deposition mask 5, the mask 50 works in a contracting direction to support it. The frame 60 will support the mask 50 against shrinkage. In other words, the mask 50 is subjected to tension that is pulled outward by the support frame 60. The flatness of the mask 50 is maintained by this tension.

FIG. 7 is a cross-sectional view showing a method of manufacturing the support frame 60. The support frame 60 is formed by bonding the upper plate 61 and the lower plate 62 with an adhesive 63. Since the plate material for the upper plate 61 and the lower plate 62 is provided as a stretched material in a roll shape, warpage in the arc direction remains. Therefore, as shown in FIG. 7, two plates are attached upside down to ensure flatness.

The vapor deposition mask 5 in the present invention is as shown in FIG. 5, but in the following description, a simplified drawing will be used for the sake of clarity. FIG. 8 is a plan view of the vapor deposition mask 5 in the following description. In FIG. 8, only one section in FIG. 5 is shown. That is, one mask 50 is formed in the support frame 60. FIG. 9 is a cross-sectional view taken along the line AA of FIG. In the actual vapor deposition mask 5, as shown in FIG. 5, the mask 50 and the support frame 60 are joined by a joining member 70 by plating, but in FIG. 9, the joining member 70 is omitted, and the mask 50 is the support frame 70. It is joined to the upper plate 61. Hereinafter, the cross section of the vapor deposition mask 5 in the description of the present invention will be performed with reference to FIG. It should be noted that even when the joining member 70 as shown in FIG. 5 is present, the tension from the mask 50 to the support frame 60 is mainly generated in the upper plate 61, which is the same as in FIG.

FIG. 10 is a cross-sectional view showing a problem solved by the present invention. Tension is applied to the mask 50 in order to maintain flatness. On the other hand, as a reaction to the support frame 60, tension is applied to the inside, which causes shear stress to be generated in the adhesive material 63 that adheres the upper plate 61 and the lower plate 62, so that the upper plate 61 and the lower plate 62 are separated from each other. It shifts in the plane direction. Then, as a result, the position of the hole of the mask 50 moves.

That is, since both the substrate 40 and the lower plate 62 of the vapor deposition mask 5 are fixed to the vapor deposition apparatus, as a result, the opening in the mask 50 joined to the upper plate 61 of the support frame 60 is displaced with respect to the substrate 40. As described with reference to FIG. 2 and the like, in the organic EL display device, the pixel pitch is very small. Therefore, when the deviation as shown in FIG. 10 occurs, the position of the light emitting body in the pixel, that is, the organic EL layer is displaced. It has a significant impact on display quality.

In the configuration of the present invention, as shown in FIG. 11, the support frame 60 is provided with a stopper 100 for preventing the upper plate 61 and the lower plate 62 from slipping, whereby even if the upper plate 61 and the lower plate 62 are separated from each other. Even when shear stress due to tension is applied, the upper plate 61 and the lower plate 62 are prevented from shifting, and the position of the organic EL layer as a light emitting body is prevented from shifting.

FIG. 12 is a plan view of the vapor deposition mask 5 showing a configuration for this purpose. In FIG. 12, on the outside of the mask 50, stoppers 100 for fixing the upper plate 61 and the lower plate 62 of the support frame 60 are formed on the long side, the short side, and the corner portion. The planar position of the stopper 100 is not limited to FIG. 12, and the position may be selected according to the properties of the stopper 100. The examples shown below show the configurations of various stoppers 100.

In the first embodiment, the upper plate 61 and the lower plate 62 are punched through the upper plate 61 and the lower plate 62 with a sharp punching tool 110 such as an ice pick, an awl, or a drill, and the upper plate 61 is deformed at the punched portion. This is to prevent the upper plate 61 and the lower plate 62 from being displaced in the plane direction.
(Embodiment 1)
13A to 13C are diagrams showing the first embodiment in the first embodiment. The upper sectional view of FIG. 13A shows a state in which the support frame 60 is sandwiched between the lower rigid body (mounting table) 115 having a hole and the upper rigid body (holding table) 114, and the punching tool 110 is applied to the support frame 60. It is a figure which shows. The lower view of 13A is a plan view showing the hitting points 111 of the punching tool 110 arranged on the support frame 60.

FIG. 13B shows a state in which the upper plate 61 and the lower plate 62 of the support frame 60 are penetrated by the punching tool 110, the upper view is a cross-sectional view, and the lower view is a plan view. As shown in the cross-sectional view of FIG. 13B, when the support frame 60 is punched out, burrs 113 are generated on the upper plate 61 and the lower plate 62, and the burrs 113 prevent the upper plate 61 and the lower plate 62 from being displaced from each other. It is something to do. In the lower plan view of FIG. 13B, 112 is a through hole, and 1121 is a portion where the support frame 60 is deformed so as to generate burrs.

FIG. 13C is a cross-sectional view showing a state of the burr 113 formed in the through hole 112. The hole 112 formed is, for example, circular. Therefore, the upper plate 61 and the lower plate 62 in the support frame 60 are suppressed from moving in any direction in the plane direction.
(Embodiment 2)
14A to 14D are cross-sectional views showing a second embodiment of the first embodiment. In the first embodiment, as shown in FIG. 13C, burrs 113 are formed as protrusions on the back side of the support frame 60 punched by the punching tool 110. In a vapor deposition apparatus or the like, such a protruding burr 113 may be an obstacle. The second embodiment is a countermeasure against this problem.

In the upper sectional view of FIG. 14A, the support frame 60 is sandwiched between the lower rigid body 115 having a hole and the upper rigid body 114, and an end mill 116 for performing end milling on the lower plate 62 is applied. It is sectional drawing which shows. A hole is formed only in the lower plate 62 by the end mill 116.

FIG. 14B is a cross-sectional view showing a state in which a support frame 60 is arranged in a portion of the lower rigid body 115 having a small diameter after a hole is formed in the lower plate 62, and the punching tool 110 is applied to the upper plate 61 side. FIG. 14C is a cross-sectional view showing a state in which the upper plate 61 is punched out by the punching tool 110. At this time, since holes are formed in the lower plate 62 in advance and the diameter of the lower rigid body 115 is small, the burr 113 of the upper plate 61 does not protrude below the lower plate 62. It will come into contact with the end of the lower plate 62.

FIG. 14D is a cross-sectional view of the support frame 60 after processing. In FIG. 14D, the burrs 113 of the punched upper plate 61 do not protrude from the lower surface of the lower plate 62 and are in contact with the end surface of the lower plate 62. The burr 113 of the upper plate 61 prevents the lower plate 62 and the upper plate 61 from being displaced in the plane direction. Further, the burr 113 does not protrude below the lower surface of the lower plate 62.

In the second embodiment, the upper plate 61 and the lower plate 62 are prevented from being displaced from each other by driving a pin into the through holes formed in the upper plate 61 and the lower plate 62 of the support frame 60.
(Embodiment 1)
15A to 15E are cross-sectional views showing the first embodiment of the second embodiment. FIG. 15A shows a state in which the reamer 117 is applied to the upper plate 61 in order to form through holes in the upper plate 61 and the lower plate 62. The lower rigid body 115 on which the support frame 60 is placed has an opening formed in a portion corresponding to the reamer 117.

In FIG. 15B, a support frame 60 having a through hole is placed on a lower rigid body 115 having no opening, and an upper plate is formed to form a hole for accommodating a pin head to be driven. It is sectional drawing which shows the state which the end mill 116 is in contact with 61. FIG. 15C is a cross-sectional view showing a state in which a hole is formed in a portion corresponding to the head of the pin by the end mill 116.

FIG. 15D is a cross-sectional view showing a state in which the pin 120 is inserted into the holes of the upper plate 61 and the lower plate 62 thus formed. In order to eliminate the deviation between the upper plate 61 and the lower plate 62 in the plane direction, the relationship between the main body of the pin 120 and the through hole between the upper plate 61 and the lower plate 62 is not "gap fitting" but "tight fitting". Better.

FIG. 15E is a cross-sectional view showing a state in which the pin 120 is inserted into the holes formed in the upper plate 61 and the lower plate 62. By reamer processing and end milling, the pin 120 is completely housed in the upper plate 61 and the lower plate 62. In FIG. 15E, the pin 120 can prevent the upper plate 61 and the lower plate 62 from being displaced from each other in the support frame 60. Further, the reproducibility is excellent as compared with the case where the burr 113 prevents the upper plate 61 and the lower plate 62 from being displaced as in the first embodiment.
(Embodiment 2)
16A to 16D are cross-sectional views showing a second embodiment of the second embodiment. The difference between the second embodiment and the first embodiment is that the pin used is a parallel pin 121 as shown in FIG. 16C. In the case of the parallel pin 121, since the pin has no head, the end milling as used in the first embodiment is unnecessary.

FIG. 16A is a cross-sectional view showing a state in which the reamer 117 is applied onto the lower rigid body 115 having a hole. FIG. 16B is a cross-sectional view showing a state in which a support frame 60 having a through hole formed by a reamer 117 is placed on a lower rigid body 115 having no hole. FIG. 16C is a cross-sectional view showing a state in which the parallel pin 121 is inserted into the through hole of the support frame 60. In this case as well, in order to eliminate the deviation between the upper plate 61 and the lower plate 62 in the plane direction, the relationship between the parallel pin 121 and the through hole between the upper plate 61 and the lower plate 62 is not "gap fitting" but "tightening". "Fit" is better.

FIG. 16D is a cross-sectional view showing a state in which the parallel pin 121 is inserted into the through hole of the support frame 60 by striking. The second embodiment can simplify the process as compared with the first embodiment because the end milling is not required.
(Embodiment 3)
17A to 17D are cross-sectional views showing a third embodiment of the second embodiment. The difference between the third embodiment and the first embodiment is that the pin used is a hollow pin 122 as shown in FIG. 17D. The outer shape of the pin 122 is similar to that of the pin 120 of the first embodiment. Therefore, the through holes formed in the support frame 115 and the holes formed in the upper plate 61 by the end mill 116 are the same as those in the first embodiment, and the machining processes shown in FIGS. 17A, 17B, and 17C in the third embodiment are the same as those in the first embodiment. It is the same as FIG. 15A, FIG. 15B, and FIG. 15C in FIG.

The difference between FIG. 17D and FIG. 15D is that the length of the pin 122 used in FIG. 17D is longer than the length of the pin 120 used in FIG. 15D. In FIG. 17D, a hole is formed in the lower rigid body 115 on which the support frame 60 is placed, in which the tip of the pin 122 projects downward from the lower surface of the lower plate 62.

FIG. 17E is a cross-sectional view showing a state in which the support frame 60 is turned over and the hollow portion of the pin 122 is hit by the tool (strike rod) 123 on the lower rigid body 115 having no hole. As a result, the tip of the hollow pin 122 is crushed and the hollow pin 122 is fixed.

FIG. 17F is a cross-sectional view showing a state in which the tip of the hollow pin 122 is crushed and the hollow pin 122 is fixed. As shown in FIG. 17F, the crushed portion of the tip of the hollow pin 122 protrudes downward from the lower surface of the lower plate 62. In the thin-film deposition apparatus, the configuration shown in FIG. 17F can be used as long as the configuration allows protrusions to be present on any surface of the vapor deposition mask 5.

In the third embodiment, in the planar shape, the lower plate 62 is made smaller than the upper plate 61, and a material capable of strongly adhering the lower plate 62 and the upper plate 61 to the end portion is provided on the lower end portion of the upper plate 61. And by forming it on the end side surface of the lower plate 62, the upper plate 61 and the lower plate 62 are prevented from being displaced in the plane direction.
(Embodiment 1)
18A to 18E are cross-sectional views showing the first embodiment of the third embodiment. FIG. 18A is a cross-sectional view showing a state in which the upper plate 61 and the lower plate 62 are placed upside down on the lower rigid body 115. As shown in FIG. 18, the size of the lower plate 62 is smaller than the size of the upper plate 61, and the upper plate 61 protrudes outward from the lower plate 62 at the end portion.

FIG. 18B shows a state in which the modeled object 133 is laminated on the end portion of the upper plate 61 using a three-dimensional printer. Reference numeral 130 denotes a nozzle of a three-dimensional printer. The modeled object 133 formed in this manner is a material having a property of strongly adhering to the upper plate 61 and the lower plate 62 and the adhesive 63 or more after, for example, heat treatment or ultraviolet irradiation. .. FIG. 18C is a cross section showing a state in which the modeled objects 133 have been laminated by the three-dimensional printer. In this state, for example, heat treatment is applied or ultraviolet irradiation is performed to solidify the modeled object 133, and the modeled object 133 is strongly adhered to the upper plate 61 and the lower plate 62. The barbell mark 135 in FIG. 18C and the like indicates that the laminated model 133 is strongly adhered to the upper plate 61 and the lower plate 62.

FIG. 18D is a cross-sectional view showing a state in which the modeled object 133 is polished by using the polishing tool 132 to flatten the plane and side surfaces of the support frame 60. FIG. 18E is a cross-sectional view of the support frame 60 after processing. 18A to 18D show that the upper plate 61 and the lower plate 62 are processed upside down, but FIG. 18E shows the upper plate 61 and the lower plate 62 in a state where the vertical relationship is restored. ..

FIG. 18F is a plan view of the back surface when the support frame 60 is viewed from the back surface. The lower plate 62 has a smaller outer shape than the upper plate 61 over the entire circumference. When it is disadvantageous in terms of time and cost to form the laminated model 131 on the entire circumference with a three-dimensional printer, the laminated model 131 is discretely formed on the outside of the lower plate 62 as shown in FIG. 18F. Can be done. Of course, if conditions permit, the laminated model 131 may be formed over the entire outer periphery of the lower plate 62.

FIG. 18G is an example in which the laminated model 131 is formed on the inner peripheral side of the support frame 60. Since FIG. 18G is a back plan view, only the lower plate 62 is visible. When the lower plate 62 has a width smaller than that of the upper plate 61 on the entire inner circumference, the laminated model 113 is formed on the entire inner circumference of the lower plate 62.
(Embodiment 2)
19A to 19E are cross-sectional views showing a second embodiment of the third embodiment. The difference between the second embodiment and the first embodiment is that in the support frame 60, the sizes of the lower plate 62 and the upper plate 61 are initially made the same, and the end portion of the lower plate 62 is removed by an end mill. This is to secure a space for forming the modeled object 131 by the three-dimensional printer.

In FIG. 19A, a part of the end portion of the lower plate 62 is removed in a state where the support frame 60 having the same size as the upper plate 61 and the lower plate 62 is arranged upside down on the lower rigid body 115. Therefore, it is sectional drawing which shows the state which the end mill 116 is applied. The support frame 60 in FIGS. 19A to 19E is placed upside down on the lower rigid body 115.

FIG. 19B is a cross-sectional view showing a state in which the end portion of the lower plate 62 is cut off by the end mill 116. FIG. 19C is a cross-sectional view showing a state in which the laminated model 133 is formed at the end of the upper plate 61 by a three-dimensional printer. Reference numeral 130 denotes a nozzle of a three-dimensional printer. FIG. 19C is similar to the configuration described with reference to FIG. 18B. FIG. 19D corresponds to FIG. 18C of the first embodiment, and FIG. 19E corresponds to FIG. 18D of the first embodiment. 19F is a cross-sectional view showing the support frame 60 after processing, and corresponds to FIG. 18E of the first embodiment.

The plan view of the support frame 60 in the second embodiment is different from that of the first embodiment. That is, in the second embodiment, since the end portion of the lower plate 62 is removed by the end mill 116, the plane of the removed portion is usually a circle. FIG. 19G is a back plan view of the support frame 60 according to the second embodiment. In FIG. 19G, the hole formed by the end mill 116 formed at the end of the lower plate 62 is filled with the laminated model 133 formed by the three-dimensional printer. Since the holes are formed by the end mill, the holes and the laminated model 133 are formed discretely on the outer circumference.

FIG. 19H is a back plan view of another example of the support frame 60 in the second embodiment. In FIG. 19H, a hole is formed at the inner peripheral end of the lower plate 62 by an end mill 116, and the hole is filled with a laminated model 133 formed by a three-dimensional printer. Also in FIG. 19H, since the holes are formed by the end mill 116, the holes and the laminated model 133 are formed discretely on the inner circumference.

In addition, in FIG. 19G, FIG. 19H, etc., since the removal portion formed on the lower plate 62 is formed by the end mill 116, it is a circular hole. However, by using a tool other than the end mill 116, it is possible to change the planar shape of the removed portion of the end portion of the lower plate 62 to a shape other than a circle.

The fourth embodiment is an example in which the upper plate 61 and the lower plate 62 are fixed by plating at the end portion of the support frame 60 in order to eliminate the deviation between the upper plate 61 and the lower plate 62.
(Embodiment 1)
20A to 20F are cross-sectional views showing the first embodiment of the fourth embodiment, and FIG. 20G is a plan view of the support frame 60 according to the fourth embodiment. The upper view of FIG. 20A is a cross-sectional view of the support frame 60 before the processing of the present embodiment, and the lower view is an adhesive material for adhering the upper plate 61 and the lower plate 62 of the support frame 60. It is sectional drawing of the solvent tank 141 containing the solvent 140 which dissolves 63. The end of one side of the support frame 60 is immersed in this solvent.

FIG. 20B is a cross-sectional view showing a state in which one end of the support frame 60 is immersed in the solvent 140. In FIG. 20B, the circles in the portion where the support frame 60 is immersed in the solvent 140 indicate the process in which the adhesive 63 is dissolved in the solvent 140. FIG. 20C is a cross-sectional view showing a state in which the adhesive 63 in the range immersed in the solvent 140 has been removed.

In the present embodiment, the plating is configured to form plating on the end faces of the upper plate 61 and the lower plate 62, and between the upper plate 61 and the lower plate 62 at the end portions. The upper view of FIG. 20D is a cross-sectional view showing a state in which the masking tape 142 is attached so that plating is not formed on the main surfaces of the upper plate 61 and the lower plate 62 before plating. The lower view of FIG. 20 is a cross-sectional view showing a state in which the plating solution 143 is contained in the plating tank 145.

FIG. 20E is a cross-sectional view showing a state in which the end portion of the support frame 60 is immersed in the plating solution 143. In FIG. 20E, the upper plate 61 and the lower plate 62, which are in contact with the plating solution 143, are plated. FIG. 20F is a cross-sectional view showing a state in which the support frame 60 in a state where the plating 144 is applied between the upper plate 61 and the lower plate 62 and the side surface of the end portion is taken out from the plating tank 145 at the end portion. As shown on the upper side of FIG. 20F, the plating 144 fills the space between the lower plate 62 and the upper plate 61 to firmly bond the upper plate 61 and the lower plate 62, and the upper plate 61 and the lower plate 62 due to shearing force. It is possible to prevent deviation. Incidentally, the plating thickness between the upper plate 61 and the lower plate 62 is the same as that of the adhesive 63, and is 15 μm to 20 μm.

The steps shown in FIGS. 20A to 20F are applied not only to one side of the support frame 60 but also to four sides of the support frame 60. FIG. 20G is a plan view showing a state in which the support frame 60 is plated 144 according to the present embodiment. As shown in FIG. 20G, the plating 144 is applied to the entire outer end of the four sides of the support frame 60, and can cope with a shearing force in any direction. The dotted line in FIG. 20G indicates that the plating is formed between the upper plate 61 and the lower plate 62 at the end of the support frame 60.
(Embodiment 2)
21A to 21E are cross-sectional views showing a second embodiment of the fourth embodiment. FIG. 21A is a cross-sectional view showing a state in which the end portion of the support frame 60 is immersed in the solvent 140 to dissolve the adhesive 63, and corresponds to FIG. 20B in the first embodiment. In the support frame 60, the distance between the upper plate 61 and the lower plate 62 tends to increase in the range where the adhesive 63 is removed. FIG. 21B is a cross-sectional view showing a state in which the distance between the upper plate 61 and the lower plate 62 is large at the end of the support frame 60. Then, even if the upper plate 61 and the lower plate 62 are plated 144, the upper plate 61 and the lower plate 62 are not joined by the plating 144.

FIG. 21C is a cross-sectional view showing a state in which the clamp 146 prevents the distance between the upper plate 61 and the lower plate 62 from widening in order to prevent this. In the upper view of FIG. 21C, the masking tape 142 is attached to the support frame 60 from which the adhesive 63 has been removed at the end, and then the clamp 146 suppresses the expansion of the distance between the upper plate 61 and the lower plate 62. , The upper plate 61 and the lower plate 62 are plated with a uniform thickness. The clamp 146 may be formed on the entire side of the support frame 60, or may be formed discretely. In this state, it is immersed in the plating solution 143 shown in FIG. 21C.

FIG. 21D is a cross-sectional view showing a state in which the clamped support frame 60 is immersed in the plating solution 143 to apply plating 144. FIG. 21D is a cross-sectional view showing a state in which the support frame 60 whose end is plated in this manner is taken out from the plating solution 143. 21E is a cross-sectional view of the support frame 60 showing a state in which the clamp 146 and the masking tape 142 are removed. The plan view of the support frame 60 in the second embodiment formed in this way is the same as that in FIG. 20G in the first embodiment.

As described above, in the support frame 60 according to the present embodiment, the upper plate 61 and the lower plate 62 can be reliably adhered to each other by plating 144 at the end portion, so that the displacement due to the shearing force can be reliably prevented. You can.

The support frame 60 of the fifth embodiment has a cross-sectional structure different from that of the first to fourth embodiments. In the support frame 60 of the fifth embodiment, an upper plate 61 having a convex portion 611 and a concave portion 612 on one side and a lower plate 62 having a convex portion 621 and a concave portion 622 on one side are prepared, and one of the upper plate 61 and the lower plate 62. The upper plate 61 and the lower plate 62 are bonded together by fitting the convex portion of the upper plate 61 or the other concave portion of the upper plate 61 or the lower plate 62. In the support frame 60 formed in this way, even if a shearing force is generated in the direction parallel to the main surface due to the convex portions and concave portions that mesh with each other, the upper plate 61 and the lower plate 62 do not shift.
(Embodiment 1)
FIG. 22 is a cross-sectional view showing a method of manufacturing the support frame 60 according to the first embodiment of the fifth embodiment. In FIG. 22, an upper plate 61 having a convex portion 611 and a concave portion 612 formed on one side and a lower plate 62 having a convex portion 621 and a concave portion 622 formed on one side are prepared. Such a plate material can be manufactured by pressing or machining. In FIG. 22, the upper plate 61 and the lower plate 62 are bonded to each other by a roller with the uneven surfaces facing each other. At the time of bonding, the adhesive liquid 152 is applied from the nozzle 153 to the adhesive surface so that the upper plate 61 and the lower plate 62 are not separated by a force in the direction perpendicular to the main surface of the support frame 60.

When the upper plate 61 and the lower plate 62 are bonded together, the roller 150 fits one convex portion of the upper plate 61 or the lower plate 62 with the other concave portion of the upper plate 61 or the lower plate 62, so that the upper plate 61 and the lower plate 62 are bonded to each other. Even if a shearing force is applied between the upper plate 61 and the lower plate 62, the upper plate 61 and the lower plate 62 do not deviate from each other in the main surface direction. Further, since the convex portion and the concave portion are fitted while being crushed by the roller 150, it is possible to prevent the deviation due to the manufacturing tolerance of the convex portion and the concave portion.

FIG. 23 is a cross-sectional view of the support frame manufactured in this way. In FIG. 23, since the convex portion of the upper plate 61 and the concave portion of the lower plate are fitted and combined, the upper plate 61 and the lower plate 62 do not shift even if a shearing force is applied. Further, since the adhesive material exists between the upper plate 61 and the lower plate 62, the upper plate 61 and the lower plate 62 do not peel off even if a force is applied in the direction perpendicular to the main surface.

FIG. 24 is a diagram showing a state of surfaces in which convex portions and concave portions are formed on the upper plate 61 and the lower plate 62. The left side of FIG. 24 is the upper plate 61, and the right side is the lower plate 62. In the figure on the left side of FIG. 24, convex portions 611 are formed on the upper plate 61 at a predetermined pitch. The upper side is a plan view, and the lower side is a BB sectional view thereof. In the drawing on the left side of FIG. 24, the convex portions 611 are formed in an island shape and arranged in a matrix shape. The planar shape of each convex portion 611 is round in FIG. 24, but may be square or rectangular.

In the figure on the right side of FIG. 24, the lower plate 62 is formed with a concave portion 622 at a portion corresponding to the convex portion 611 of the upper plate 61. The upper side of the right side view of FIG. 24 is a plan view, and the lower side is a CC sectional view thereof. The concave portions 622 of the lower plate 62 are formed at the same pitch as the convex portions 611 in the upper plate 61, and the planar shape of each concave portion 622 is the same as the convex portion 611 in the upper plate 61. In FIG. 24, by fitting and bonding the convex portion 611 of the upper plate 61 and the concave portion 622 of the lower plate 62, the support frame 60 is provided so that the upper 61 plate and the lower plate 62 do not shift even when a shearing force is applied. Can be manufactured.

FIG. 25 is a diagram showing another example of the state of the surface on which the concave portions and the convex portions of the upper plate 61 and the lower plate 62 are formed. The left side of FIG. 24 is the upper plate 61, and the right side is the lower plate 62. In the figure on the left side of FIG. 24, convex portions 611 are formed on the upper plate 61 at a predetermined pitch. The upper side is a plan view, and the lower side is a DD sectional view thereof.

In the figure on the right side of FIG. 25, convex portions 621 are formed on the lower plate 62 at a predetermined pitch, similarly to the upper plate 61. The upper side is a plan view, and the lower side is a sectional view thereof. That is, the lower plate 62 and the upper plate 61 are the same. When the upper plate 61 and the lower plate 62 are bonded together, the convex portion 611 of the upper plate 61 is fitted with the concave portion indicated by the dotted circle of the lower plate 62. In the lower plate 62, the space between the four convex portions 621 constitutes the concave portion 622.

In FIG. 25, the effect is the same as in FIG. 24. In the configuration of FIG. 24, the upper plate 61 and the lower plate 62 need to be formed in separate steps, but in the configuration of FIG. 25, the upper plate 61 and the lower plate 62 can be formed at the same time. Therefore, the manufacturing cost can be reduced.

FIG. 26 is a plan view showing another example of the convex portion and the concave portion formed on the upper plate 61 and the lower plate 62 of the support frame 60. In FIG. 26, convex portions 611 are formed in a stripe shape in the vertical direction (y direction) and formed at a predetermined pitch in the horizontal direction (x direction) on one surface of the upper plate 61. A concave portion 612 is formed between the convex portion 611 and the convex portion 611. In the embodiments shown in FIGS. 26 to 28, since the upper plate 61 and the lower plate 62 have the same shape, only the upper plate 61 is shown.

In FIG. 26, by setting the pitch pp of the convex portion 611 and the width w of the convex portion 611 to w = p / 2, the convex portion 611 and the concave portion 612 having the same width are formed at the same pitch. With such a configuration, the upper plate 61 and the lower plate 62 can be formed at the same time. The support frame 60 can be formed by fitting the convex portions and the concave portions of the upper plate 61 and the lower plate 62 formed in this manner. It should be noted that spraying the adhesive liquid 152 when fitting the upper plate 61 and the lower plate 62 is the same as described in FIG. 22.

In the support frame 60 formed in this way, the upper plate 61 and the lower plate 62 do not shift with respect to the shearing force applied in the lateral direction (x direction in FIG. 26). On the other hand, the shearing force applied in the vertical direction (y direction in FIG. 26) is also effective to some extent because the adhesive area is increased by the unevenness formed on the upper plate 61 and the lower plate 62. However, it is not sufficient for the shearing force applied in the vertical direction.

FIG. 27 is a plan view showing another example of the convex portion 611 and the concave portion 612 formed on the upper plate 61 and the lower plate 62 of the support frame 60. In FIG. 27, convex portions 611 extend diagonally in a striped shape on one surface of the upper plate 61, and are formed at a predetermined pitch in the direction perpendicular to the convex portions 611. A concave portion 612 is formed between the convex portion 611 and the convex portion 611. The configuration of FIG. 27 is the same as that of FIG. 26 except that the convex portion 611 is formed in a diagonal stripe shape.

In the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 according to the configuration of FIG. 27, the shearing force in the horizontal direction (x direction in FIG. 27) and the vertical direction (y direction in FIG. 27) is dispersed. Therefore, the deviation between the upper plate 61 and the lower plate 62 is unlikely to occur in either the x direction or the y direction. However, when the shearing force in the x-direction or the y-direction is very large, a slight deviation may occur between the upper plate 61 and the lower plate 62.

FIG. 28 is a plan view showing another example of the convex portion and the concave portion formed on the upper plate and the lower plate of the support frame 60. In FIG. 28, convex portions 611 are formed in a zigzag shape in the vertical direction on one surface of the upper plate 61, and are arranged at a predetermined pitch in the direction perpendicular to the convex portions 611. A concave portion 612 is formed between the convex portion 611 and the convex portion 611. The configuration of FIG. 28 is the same as that of FIG. 26 except that the convex portion 61 is formed in a zigzag shape.

In the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 according to the configuration of FIG. 28, the shearing force in the horizontal direction (x direction in FIG. 28) and the vertical direction (y direction in FIG. 28) is dispersed. Therefore, the displacement between the upper plate and the lower plate is unlikely to occur in either the x direction or the y direction. In particular, when the zigzag angle is 45 degrees, the shearing force applied in the x-direction or the y-direction is canceled out in the vertical and horizontal directions and becomes zero. Therefore, even if a large shearing force is generated, the upper plate 61 and the lower plate 62 do not shift.

The configuration of FIGS. 26-28 is advantageous in terms of manufacturing cost because the upper plate 61 and the lower plate 62 can be made of the same member.
(Embodiment 2)
FIG. 29 is a cross-sectional view showing a manufacturing process of the configuration of the second embodiment of the fifth embodiment. FIG. 29 is the same as FIG. 22 of the first embodiment except that the cross section of the convex portion 611 of the upper plate 61 and the cross section of the convex portion 621 of the lower plate 62 are polygonal. The convex portions 611 and 621 as shown in FIG. 29 can also be formed by pressing or machining. The plan shape of the upper plate 61 or the lower plate 62 in the second embodiment is the same as that described with reference to FIGS. 24 to 28.

FIG. 30 is a cross-sectional view of the support frame 60 according to the second embodiment. By fitting the convex portion 611 of the upper plate 61 and the concave portion 621 of the lower plate 62, the upper plate 61 and the lower plate 62 do not shift even if tension is applied from the mask 50 to the support frame 60. By the way, although the second embodiment shows the case where the cross section is a polygon, the cross section is not limited to the triangle, and the same applies to the case where the curvature R is formed at the apex of the triangle, or the trapezoid. Is.
(Embodiment 3)
FIG. 31 is a cross-sectional view showing a manufacturing process of the configuration of the third embodiment of the fifth embodiment. The third embodiment is different from the first embodiment in that the convex portion 65 is formed on the upper plate 61 and the convex portion 66 is formed on the lower plate 62 by a three-dimensional printer. It is the same as that described with reference to FIG. 22 in the first embodiment except that the convex portions 65 and 66 are formed by the three-dimensional printer. FIG. 32 is a cross-sectional view of the support frame according to the third embodiment. It is the same as that described with reference to FIG. 23 in the first embodiment except that the protrusions 65 and 66 are formed by the three-dimensional prelinter.

The plan shape of the upper plate 61 or the lower plate 62 in the third embodiment is the same as that described with reference to FIGS. 24 to 28. For example, it is relatively difficult to form the convex portion 611 so that the planar shape is zigzag as shown in FIG. 28 by machining, but it can be easily formed by a three-dimensional printer.

In the above examples, the case where the organic EL display device is manufactured by using the vapor deposition mask has been described. However, the present invention is not limited to this, and can be used as a vapor deposition mask when high-definition pitch vapor deposition is required in display devices other than organic EL display devices.

5 ... vapor deposition mask, 10 ... display area, 11 ... scanning line, 12 ... video signal line, 13 ... power supply line, 14 ... pixel, 14 ... pixel, 14 ... pixel, 14 ... pixel, 20 ... scanning line drive circuit, 21 ... Frame area, 30 ... Terminal area, 31 ... Driver IC, 32 ... Flexible wiring board, 40 ... Board, 50 ... Mask, 51 ... Opening area, 52 ... Peripheral area, 60 ... Support frame, 61 ... Top plate, 62 ... Lower plate, 63 ... Adhesive, 65 ... Convex part by 3D printer, 66 ... Convex part by 3D printer, 70 ... Joining member, 80 ... Evaporate, 90 ... Base material, 91 ... Resist, 92 ... Temporary fixing adhesion Material, 100 ... Stopper, 110 ... Punching tool, 111 ... Dot point, 112 ... Hole, 113 ... Burr, 114 ... Upper rigid body (mounting stand), 115 ... Lower rigid body (holding stand), 116 ... End mill, 117 ... Reamer, 120 ... Pin, 121 ... Parallel pin, 122 ... Hollow pin, 123 ... Strike rod, 130 ... 3D printer nozzle, 131 ... 3D model, 132 ... Polishing tool, 133 ... Discharge, 135 ... Shows strong adhesion Mark, 140 ... Solvent, 141 ... Solvent tank, 142 ... Masking tape, 143 ... Plating liquid, 144 ... Plating, 145 ... Plating tank, 150 ... Roller, 152 ... Adhesive liquid, 153 ... Nozzle, 150 ... Common electrode, 151 ... Capacitive insulation film, 152 ... pixel electrode, 153 ... alignment film, 611 ... convex, 612 ... concave, 621 ... convex, 622 ... concave, 900 ... vapor deposition source, 1000 ... vacuum vapor deposition chamber, 1121 ... deformed part of support frame , B ... blue light emitter, G ... green light emitter, R ... red light emitter

Claims (20)

A thin-film mask used in the manufacture of display devices.
The vapor deposition mask is composed of a mask for forming a vapor deposition material on pixels and a support frame for supporting the mask.
The support frame is composed of an upper plate and a lower plate, and an adhesive material for adhering the upper plate and the lower plate.
A thin-film deposition characterized by having a stopper for preventing the upper plate and the lower plate from shifting from each other in the main surface direction of the support frame when a shearing force is applied between the upper plate and the lower plate. mask. A claim characterized in that the mask is in the form of a foil formed by plating, a large number of holes are formed corresponding to the pixels of the display device, and the mask and the support frame are joined by a joining member. Item 1. The vapor deposition mask according to item 1. The vapor deposition mask according to claim 2, wherein the joining member is formed by plating. The vapor deposition mask according to claim 1, wherein the stopper is composed of burrs formed by simultaneously punching the upper plate and the lower plate. The vapor deposition mask according to claim 1, wherein the stopper is composed of burrs formed by punching one of the upper plate and the lower plate. The vapor deposition mask according to claim 1, wherein the stopper is formed by inserting a pin into a hole penetrating the upper plate and the lower plate. The vapor deposition mask according to claim 6, wherein the pins are parallel pins. The vapor deposition mask according to claim 6, wherein the pin is a hollow pin. The vapor deposition mask according to claim 1, wherein the stopper is a model formed by a three-dimensional printer on one peripheral portion of the lower plate or the upper plate. The size of the upper plate or one of the upper plates in the plane direction is larger than the size of the upper plate or the other of the upper plates in the plane direction.
A model formed by a three-dimensional printer is formed on the upper plate or one end of the upper plate.
The vapor deposition mask according to claim 1, wherein the modeled object constitutes the stopper. The vapor deposition mask according to claim 1, wherein the stopper is formed of plating formed between the upper plate and the lower plate around the support frame. A thin-film mask used in the manufacture of display devices.
The vapor deposition mask is composed of a mask for forming a vapor deposition material on pixels and a support frame for supporting the mask.
The support frame is composed of an upper plate and a lower plate, and an adhesive material for adhering the upper plate and the lower plate.
A convex portion is formed on one surface of the upper plate at a predetermined pitch, a concave portion is formed on one surface of the lower plate at a predetermined pitch, and the convex portion and the concave portion are fitted together. A thin-film mask characterized by having a structure. The convex portions are formed in an island shape and are arranged in a matrix shape.
The vapor deposition mask according to claim 12, wherein the recesses are formed in an island shape and arranged in a matrix shape. The one surface of the upper plate and the one surface of the lower plate have the same shape.
The vapor deposition mask according to claim 13, wherein the concave portion of the lower plate is formed by a region sandwiched between convex portions formed on the lower plate. The vapor deposition mask according to claim 12, wherein the convex portion is formed in a striped shape. The vapor deposition mask according to claim 12, wherein the convex portion is formed in a striped shape, and the extending direction of the stripe is an oblique direction with respect to the side of the support frame. The vapor deposition mask according to claim 12, wherein the convex portion is formed in a zigzag shape when viewed in a plane. The vapor deposition mask according to claim 12, wherein the convex portion is formed by a three-dimensional printer. The vapor deposition mask according to claim 12, wherein the convex portion has a rectangular cross-sectional shape. The vapor deposition mask according to claim 12, wherein the convex portion has a triangular cross-sectional shape.

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