JP7122154B2 - Components for semiconductor manufacturing equipment - Google Patents

Description

The technology disclosed in this specification relates to parts for semiconductor manufacturing equipment.

For example, it holds an object (for example, a semiconductor wafer) as a part of a semiconductor manufacturing apparatus that constitutes a semiconductor manufacturing apparatus such as a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.). A heating device (also called a "susceptor") is known for heating to a predetermined processing temperature while heating.

Generally, the heating device has a holding member made of ceramics. The holding member is, for example, a plate member having one surface (hereinafter referred to as "holding surface") and a surface opposite to the holding surface (hereinafter referred to as "back surface"). A resistance heating element and a power receiving electrode electrically connected to the resistance heating element are arranged on the holding member. The power receiving electrode is exposed on the bottom surface of the recess formed in the back surface of the holding member, and is joined by brazing to a metal terminal member at least partially accommodated in the recess. When a voltage is applied to the resistance heating element from the power source via the terminal member and the power receiving electrode, the resistance heating element generates heat, thereby heating the object (for example, semiconductor wafer) held on the holding surface of the holding member. heated.

Conventionally, in order to reduce the residual stress in the brazed portion that joins the terminal member and the power receiving electrode and suppress the occurrence of cracks in the holding member due to the residual stress, the diameter of the portion of the terminal member on the power receiving electrode side is known (see Patent Document 1, for example).

JP-A-9-235166

However, the conventional technique described above does not sufficiently reduce the residual stress in the brazed portion, and there is a problem that it is not possible to effectively suppress the occurrence of cracks in the holding member due to the residual stress.

Note that such a problem is not limited to the heating device having the above-described structure, and the ceramic member having the concave portion, the electrode exposed on the bottom surface of the concave portion, and the columnar first portion accommodated in the concave portion. and a brazing portion for joining the electrode and the first portion of the terminal member.

This specification discloses a technology capable of solving the above-described problems.

The technology disclosed in this specification can be implemented, for example, in the following forms.

(1) A component for a semiconductor manufacturing apparatus disclosed in the present specification includes a ceramic member having a recess, an electrode exposed on the bottom surface of the recess, and a terminal member made of metal, which are accommodated in the recess. A component for a semiconductor manufacturing apparatus, comprising: a terminal member having a columnar first portion with a slanted column; and a brazing portion that joins the electrode and the first portion of the terminal member, wherein the In a cross section including the central axis of the first portion, a plurality of convex portions and a plurality of concave portions are formed alternately along the central axis direction on the outer peripheral surface of the first portion. In this component for a semiconductor manufacturing apparatus, in a cross section including the central axis of the first portion of the terminal member, the outer peripheral surface of the first portion has a plurality of protrusions and a plurality of recesses that are alternately arranged along the direction of the central axis. As such, the surface area of the first portion of the terminal member is relatively large. That is, the outer peripheral surface of the first portion of the terminal member can hold (accommodate) a relatively large amount of brazing material. Therefore, when the terminal member and the electrode are brazed, excessively supplied brazing material to ensure sufficient joint strength is prevented from moving a relatively long distance along the outer peripheral surface of the terminal member. As a result, the fillet of the braze has a proper shape and the residual stress in the braze is relatively small. Therefore, according to the present component for a semiconductor manufacturing apparatus, it is possible to effectively reduce the residual stress in the brazed portion while suppressing a decrease in the bonding strength between the terminal member and the electrode. It is possible to effectively suppress the occurrence of cracks in the ceramic member due to the residual stress in. Further, according to the component for a semiconductor manufacturing apparatus, since the surface area of the first portion of the terminal member can be made relatively large, the excess brazing material will not fill the gap between the side surface of the concave portion of the ceramic member and the terminal member. It is possible to suppress the cracks from entering (climbing up) and joining the two together, thereby suppressing the occurrence of cracks due to the difference in thermal expansion between the ceramic member and the terminal member.

(2) In the above component for a semiconductor manufacturing apparatus, the first portion of the terminal member includes a columnar opening side portion and a bottom surface side of the recess with respect to the opening side portion. and a columnar bottom side portion with a small diameter, and in the cross section including the central axis of the first portion of the terminal member, the plurality of projections and the plurality of recesses It is good also as a structure formed in the outer peripheral surface of a bottom face side part. According to this component for a semiconductor manufacturing apparatus, a large space is secured between the side surface of the recess formed in the ceramic member and the first portion of the terminal member. The brazing material can be prevented from moving a relatively long distance along the outer peripheral surface of the terminal member, the fillet of the brazing portion can be formed into an appropriate shape, and the residual stress in the brazing portion can be reduced. Therefore, it is possible to effectively suppress the occurrence of cracks in the ceramic member. In addition, according to the semiconductor manufacturing apparatus component, since a large space is secured between the side surface of the recess formed in the ceramic member and the first portion of the terminal member, the brazing material is not significantly excessive. Also, it is possible to effectively prevent the brazing filler metal from entering the gap between the side surface of the recess of the ceramic member and the terminal member and to join the two together. It is possible to effectively suppress the occurrence of cracks due to the difference.

(3) In the above component for a semiconductor manufacturing apparatus, the first portion of the terminal member is located between the opening side portion and the bottom side portion, and has a columnar shape with a diameter smaller than the minimum diameter of the bottom side portion. It is good also as a structure which has an intermediate part. According to this semiconductor manufacturing device component, a larger space is secured between the side surface of the recess formed in the ceramic member and the first portion of the terminal member. , the brazing material can be prevented from moving a relatively long distance along the outer peripheral surface of the terminal member, the fillet of the brazing portion can be properly shaped, and the residual stress in the brazing portion can be reduced. As a result, it is possible to extremely effectively suppress the occurrence of cracks in the ceramic member. Further, according to the present component for a semiconductor manufacturing apparatus, since a larger space is secured between the side surface of the recess formed in the ceramic member and the first portion of the terminal member, the brazing material is significantly excessive. Even so, it is possible to extremely effectively suppress the brazing material from entering the gap between the side surface of the recess of the ceramic member and the terminal member and joining them together. It is possible to extremely effectively suppress the occurrence of cracks due to the difference in thermal expansion.

(4) In the semiconductor manufacturing apparatus component described above, in a cross section including the central axis of the first portion of the terminal member, at least one of the recesses formed in the outer peripheral surface of the first portion contains the solder. A configuration may be employed in which a portion of the attachment portion is accommodated. According to this component for semiconductor manufacturing equipment, it is possible to suppress the reduction in the bonding strength between the terminal member and the electrode due to the shortage of the brazing material, while suppressing the residual stress in the brazed portion and the relationship between the ceramic member and the terminal member. It is possible to suppress the occurrence of cracks due to the difference in thermal expansion between the

The technology disclosed in this specification can be implemented in various forms, for example, it can be implemented in the form of parts for semiconductor manufacturing equipment, heating devices, holding devices, manufacturing methods thereof, and the like. It is possible.

1 is a perspective view schematically showing an external configuration of a heating device 100 according to a first embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of heating device 100 in a 1st embodiment. FIG. 3 is an explanatory diagram showing an enlarged XZ cross-sectional configuration of the heating device 100 in the X1 section of FIG. 2 ; FIG. 4 is an explanatory view showing the configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the present embodiment; FIG. 10 is an explanatory view showing the configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the comparative example; FIG. 11 is an explanatory view showing the detailed configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the second embodiment; FIG. 11 is an explanatory view showing the detailed configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the third embodiment; FIG. 11 is an explanatory view showing the detailed configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the fourth embodiment;

A. First embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically showing the external configuration of the heating device 100 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing the XZ sectional configuration of the heating device 100 according to the first embodiment. 3 is an explanatory view showing an enlarged XZ cross-sectional configuration of the heating device 100 in the X1 section of FIG. Each drawing shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may The same applies to other figures.

The heating device 100 is a device that holds an object (eg, a semiconductor wafer W) and heats it to a predetermined processing temperature (eg, about 400 to 800° C.), and is also called a susceptor. The heating apparatus 100 is used, for example, as a component for semiconductor manufacturing that constitutes a semiconductor manufacturing apparatus such as a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

As shown in FIGS. 1 and 2, the heating device 100 includes a holding member 10 and a support member 20. As shown in FIGS.

The holding member 10 has one surface (hereinafter referred to as "holding surface") S1 substantially orthogonal to the Z-axis direction (vertical direction) and a surface (hereinafter referred to as "back surface") S2 opposite to the holding surface S1. It is a substantially disc-shaped member having a The holding member 10 is made of ceramics containing, for example, AlN (aluminum nitride) or Al ₂ O ₃ (alumina) as a main component. In this specification, the main component means the component with the highest content ratio (weight ratio). The diameter of the holding member 10 is, for example, about 100 mm or more and 500 mm or less, and the thickness (dimension in the Z-axis direction) of the holding member 10 is, for example, about 3 mm or more and 30 mm or less. The holding member 10 corresponds to a ceramic member in the claims.

As shown in FIGS. 2 and 3, the rear surface S2 of the holding member 10 is formed with a pair of recesses 12 corresponding to a pair of terminal members 70 and a pair of power receiving electrodes 53, which will be described later. The cross section (XY cross section) of each concave portion 12 perpendicular to the Z-axis direction has a substantially circular shape.

The support member 20 is a substantially cylindrical member extending substantially in the Z direction. Like the holding member 10, the supporting member 20 is made of ceramics containing, for example _, AlN or _Al2O3 as a main component. The outer diameter of the support member 20 is, for example, about 30 mm or more and 90 mm or less, and the height (dimension in the Z-axis direction) of the support member 20 is, for example, about 100 mm or more and 300 mm or less.

As shown in FIG. 2, the support member 20 is formed with a through hole 22 extending in the Z-axis direction from the upper surface S3 to the lower surface S4 of the support member 20. As shown in FIG. A cross section (XY cross section) of the through-hole 22 perpendicular to the Z-axis direction has a substantially circular shape.

As shown in FIG. 2, the holding member 10 and the supporting member 20 are arranged such that the back surface S2 of the holding member 10 and the upper surface S3 of the supporting member 20 face each other in the Z-axis direction, and the holding member 10 and the supporting member 20 are arranged so as to be substantially coaxial with each other, and are joined to each other via a joining portion 30 formed of a known joining material.

As shown in FIG. 2, inside the holding member 10, a resistance heating element 50 as a heater for heating the holding member 10 is arranged. The resistance heating element 50 forms, for example, a pattern extending substantially spirally when viewed in the Z-axis direction. The resistance heating element 50 is made of a conductive material such as tungsten or molybdenum.

Moreover, as shown in FIGS. 2 and 3 , a pair of power receiving electrodes 53 are arranged on the holding member 10 . Each power receiving electrode 53 is, for example, a substantially circular plate member as viewed in the Z-axis direction. Each power receiving electrode 53 is made of, for example, metal such as tungsten or molybdenum. The power receiving electrode 53 corresponds to an electrode in claims.

One of the pair of power receiving electrodes 53 is exposed on the bottom surface of one of the pair of recesses 12 formed in the back surface S2 of the holding member 10, and the resistance heating element 50 forms a substantially spiral pattern. It is electrically connected to the resistance heating element 50 by contacting the lower surface near one end thereof. The other of the pair of power receiving electrodes 53 is exposed on the bottom surface of the other of the pair of recesses 12 formed in the back surface S2 of the holding member 10, and near the other end of the resistance heating element 50. It is electrically connected to the resistance heating element 50 by contacting the lower surface.

Further, as shown in FIGS. 2 and 3, a pair of terminal members 70 are accommodated in the through holes 22 formed in the support member 20. As shown in FIGS. Each terminal member 70 is a substantially cylindrical member. Each terminal member 70 is made of a conductive material such as nickel or titanium.

The upper end portion of one of the pair of terminal members 70 is accommodated in one of the pair of recesses 12 formed in the back surface S2 of the holding member 10, and the power receiving electrode 53 exposed on the bottom surface of the recess 12 , are joined by a brazing portion 56 . The upper end portion of the other of the pair of terminal members 70 is accommodated in the other of the pair of recesses 12 formed in the back surface S2 of the holding member 10, and the power receiving electrode exposed on the bottom surface of the recess 12 53 and a brazed portion 56 . Each brazing portion 56 is formed using a metal brazing material such as Ni alloy (Ni--Cr alloy, etc.), Au alloy (Au--Ni alloy, etc.), or pure Au. The configuration around the junction between the terminal member 70 and the power receiving electrode 53 will be described in detail later.

In the heating device 100 having such a configuration, when a voltage is applied to the resistance heating element 50 from a power source (not shown) through each terminal member 70 and each power receiving electrode 53, the resistance heating element 50 generates heat, thereby An object (for example, a semiconductor wafer W) held on the holding surface S1 of the member 10 is heated to a predetermined temperature (for example, about 400 to 650.degree. C.).

A-2. Detailed configuration near the joint between the terminal member 70 and the power receiving electrode 53:
As described above, the upper end portion of each terminal member 70 is accommodated in each recess 12 formed in the rear surface S2 of the holding member 10. As shown in FIG. Hereinafter, the columnar portion of each terminal member 70 that is accommodated within the recess 12 is referred to as a recessed portion inner portion 71 . As described above, the recess inner portion 71 of each terminal member 70 is joined to the power receiving electrode 53 by the brazing portion 56 . The concave portion inner portion 71 of the terminal member 70 corresponds to the first portion in the claims.

As shown in FIG. 3 , in this embodiment, the recessed portion 71 of each terminal member 70 is composed of an opening side portion 74 , a bottom side portion 72 and an intermediate portion 73 . The opening side portion 74 is a columnar portion close to the opening 13 of the concave portion 12 formed on the back surface S2 of the holding member 10 . The bottom surface side portion 72 is a columnar portion located on the bottom surface side (upper side in this embodiment) of the recess 12 with respect to the opening side portion 74 . The intermediate portion 73 is a columnar portion located between the opening side portion 74 and the bottom side portion 72 . The length (dimension in the Z-axis direction) of the bottom surface side portion 72 is preferably 2 mm or more, for example. Also, the length (dimension in the Z-axis direction) of the intermediate portion 73 is preferably 2 mm or more, for example.

In this embodiment, the maximum value of the diameter D2 of the bottom side portion 72 is smaller than the diameter D4 of the opening side portion 74, and the diameter D3 of the intermediate portion 73 is smaller than the minimum value of the diameter D2 of the bottom side portion 72. In addition, the diameter D4 of the opening side portion 74 is, for example, 3.5 mm or more and 5 mm or less. Moreover, the difference between the diameter D4 of the opening side portion 74 and the maximum value of the diameter D2 of the bottom side portion 72 is preferably 0.2 mm or more, for example. Moreover, the difference between the maximum value of the diameter D2 of the bottom surface side portion 72 and the diameter D3 of the intermediate portion 73 is preferably 0.3 mm or more, for example.

Further, as shown in FIG. 3, in the present embodiment, among the portions constituting the recessed portion inner portion 71 of each terminal member 70, the outer peripheral surfaces of the opening side portion 74 and the intermediate portion 73 are not formed with unevenness. . On the other hand, grooves are formed on the outer peripheral surface of the bottom surface side portion 72 . This groove may be a plurality of grooves independent of each other, or may be a single groove extending spirally. Therefore, in a cross section (for example, the cross section shown in FIG. 3) including the central axis CL of the recessed portion inner portion 71 of the terminal member 70, the outer peripheral surface of the bottom surface side portion 72 has a plurality of electrodes arranged alternately along the direction of the central axis CL. A convex portion 78 and a plurality of concave portions 79 are formed.

Further, as shown in FIG. 3, in the present embodiment, in a cross section including the central axis CL of the recess inner portion 71 of each terminal member 70 (for example, the cross section shown in FIG. 3), it is formed on the outer peripheral surface of the bottom side portion 72. A portion of the brazing portion 56 is received within at least one recess 79 formed by the recess. In the example shown in FIG. 3 , of the plurality of recesses 79 formed on the outer peripheral surface of the bottom surface side portion 72, two recesses 79 located on the power receiving electrode 53 side (upper side) accommodate a portion of the brazed portion 56. It is

A-3. Manufacturing method of heating device 100:
A method for manufacturing the heating device 100 of the present embodiment is, for example, as follows. First, the holding member 10 and the supporting member 20 are produced.

The holding member 10 can be produced, for example, by hot-press firing a molded body obtained by molding a mixed raw material powder in which an appropriate amount of yttrium oxide powder is added to aluminum nitride powder. In order to form the resistance heating element 50 inside the holding member 10, for example, the resistance heating element 50 made of mesh metal or metal foil, or the metal powder that is the material of the resistance heating element 50 is mixed with the mixed raw material powder. sandwiched between Similarly, in order to form the power receiving electrode 53 on the holding member 10 , for example, the power receiving electrode 53 made of a metal plate or the metal powder that is the material of the power receiving electrode 53 is connected to the resistance heating element 50 and then Sandwiched between mixed raw material powders. By hot-press firing the whole in this state, the holding member 10 in which the resistance heating element 50 and the power receiving electrode 53 are arranged can be produced.

Further, the recessed portion 12 of the back surface S2 of the holding member 10 is formed, for example, by performing a grinding process using a grinding tool after the hot press firing described above. This grinding process is performed until the power receiving electrode 53 is exposed. Even if the power receiving electrode 53 is made thicker than the resistance heating element 50 and is slightly ground by a grinding tool during the grinding process for forming the concave portion 12, the power receiving electrode 53 will not be damaged such as cracking. It is preferable to

The support member 20 is made by, for example, adding an organic solvent such as methanol to a mixture of aluminum nitride powder and, if necessary, an appropriate amount of yttrium oxide powder, a binder, a dispersant, and a plasticizer, and mixing the mixture in a ball mill. A raw material powder is produced by granulating the slurry with a spray dryer, and the raw material powder is filled in a rubber mold and subjected to cold isostatic pressing to obtain a molded body. It can be made by sintering the body after degreasing it.

Next, the holding member 10 and the supporting member 20 are joined together. After the rear surface S2 of the holding member 10 and the upper surface S3 of the supporting member 20 are subjected to lapping as necessary, at least one of the rear surface S2 of the holding member 10 and the upper surface S3 of the supporting member 20 is coated with, for example, a rare earth element or an organic solvent. are evenly coated with a paste-like bonding agent, and then degreased. Next, the back surface S2 of the holding member 10 and the upper surface S3 of the supporting member 20 are superimposed and baked under normal pressure while applying a load, thereby forming the joining portion 30 that joins the holding member 10 and the supporting member 20 together.

Next, the terminal member 70 is inserted into the through hole 22 of the support member 20 , and the upper end portion of the terminal member 70 (bottom side portion 72 of the recessed portion 71 ) is brazed to the power receiving electrode 53 to form the brazed portion 56 . to form The heating device 100 having the configuration described above is manufactured by the manufacturing method described above.

A-4. Effect of this embodiment:
As described above, the heating device 100 of the present embodiment includes the holding member 10 in which the recess 12 is formed, the power receiving electrode 53 exposed on the bottom surface of the recess 12, and the columnar recess portion accommodated in the recess 12. 71 , and a brazing portion 56 that joins the power receiving electrode 53 and the recessed portion 71 of the terminal member 70 . In addition, in the heating device 100 of the present embodiment, in a cross section including the central axis CL of the inner recess portion 71 of the terminal member 70 (for example, the cross section shown in FIG. A plurality of protrusions 78 and a plurality of recesses 79 that are alternately arranged along the direction of the central axis CL are formed on the outer peripheral surface of the bottom surface side portion 72 of the recess inner portion 71 . Since the heating device 100 of the present embodiment has such a configuration, as will be described in detail below, the brazed portion can be The residual stress at 56 can be effectively reduced, and the occurrence of cracks in the holding member 10 caused by the residual stress can be effectively suppressed.

FIG. 4 is an explanatory diagram showing the configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of this embodiment. Column A in FIG. 4 shows a configuration in which the amount of brazing material is appropriate when the terminal member 70 and the power receiving electrode 53 are joined by brazing, and column B in FIG. A configuration in which the amount of brazing material is slightly larger than the appropriate amount is shown, and column C of FIG. 4 shows a configuration in which the amount of brazing material is significantly larger than the appropriate amount. there is

Moreover, FIG. 5 is an explanatory diagram showing the configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the comparative example. As in FIG. 4, column A of FIG. 5 shows a configuration in which the amount of brazing material is appropriate when joining the terminal member 70 and the power receiving electrode 53 by brazing. Column B of FIG. 5 shows the configuration when the amount of the brazing material is slightly larger than the appropriate amount, and Column C of FIG. configuration is shown. In the heating device 100 of the comparative example shown in FIG. 5, the concave portion 71 (the portion accommodated in the concave portion 12) of the terminal member 70 is composed of the opening side portion 74 and the bottom side portion 72, and The heating device 100 of the first embodiment differs from the heating device 100 of the first embodiment in that the convex portion 78 and the concave portion 79 are not formed on the outer peripheral surface of the portion 71 inside the concave portion.

Here, when the terminal member 70 and the power receiving electrode 53 are joined by brazing, in order to avoid a decrease in joint strength due to insufficient brazing material, the appropriate amount of brazing material is set so that the area between the joint surfaces of both members is A larger amount than the amount that can be filled is set. Therefore, when the terminal member 70 and the power receiving electrode 53 are joined by brazing, the brazing material flows out from the region between the joining surfaces of the two members to the outer peripheral side, and the flowing-out brazing material spreads on the surfaces of the two members due to surface tension. and solidify in pools on the surface. As a result, the brazed portion 56 is formed with a fillet F surrounding the area between the joint surfaces of the two members from the outer peripheral side. Since the brazing filler metal shrinks when it is cooled and solidified, if the shape of the fillet F is not appropriate, the angle formed by the surface of the power receiving electrode 53 and the inclined surface of the fillet F (hereinafter referred to as "specific angle θ" ) is large, the residual stress in the brazed portion 56 becomes large. Residual stress in the brazed portion 56 is preferably small because it causes cracks in the holding member 10 .

In the heating device 100 of the comparative example shown in FIG. 5, since the convex portion 78 and the concave portion 79 are not formed on the outer peripheral surface of the concave portion 71 of the terminal member 70, the surface area of the concave portion 71 of the terminal member 70 is compared. small. That is, the outer peripheral surface of the recessed portion 71 of the terminal member 70 cannot hold (accommodate) a large amount of brazing material. Therefore, when the terminal member 70 and the power receiving electrode 53 are joined by brazing, the brazing material moves a relatively long distance along the outer peripheral surface of the recessed portion inner portion 71 of the terminal member 70, and as a result, the fillet F is identified. becomes relatively large, and the residual stress in the brazed portion 56 becomes relatively large. Therefore, in the heating device 100 of the comparative example, the holding member 10 may crack due to the residual stress in the brazed portion 56 . In particular, as shown in columns B and C of FIG. The risk of cracks occurring in the holding member 10 increases.

On the other hand, in the heating device 100 of the present embodiment, in a cross section including the central axis CL of the inner recess portion 71 of the terminal member 70 (for example, the cross section shown in FIG. 3), the outer peripheral surface of the inner recess portion 71 has a central axis CL Since a plurality of protrusions 78 and a plurality of recesses 79 are formed alternately along the CL direction, the surface area of the recess inner portion 71 of the terminal member 70 is relatively large. That is, the outer peripheral surface of the recess inner portion 71 of the terminal member 70 can hold (accommodate) a relatively large amount of brazing material. Therefore, when the terminal member 70 and the power receiving electrode 53 are joined by brazing, the brazing material can be prevented from moving along the outer peripheral surface of the terminal member 70 over a relatively long distance. becomes relatively small, and the residual stress in the brazed portion 56 becomes relatively small. As shown in columns B and C of FIG. 4, even if the amount of brazing material is larger than the appropriate amount, the outer peripheral surface of the recessed portion 71 of the terminal member 70 can hold the excess brazing material. Accordingly, the brazing material can be prevented from moving along the outer peripheral surface of the terminal member 70 over a relatively long distance, and the shape of the fillet F can be properly maintained. Therefore, according to the heating device 100 of the present embodiment, the residual stress in the brazed portion 56 can be effectively reduced, and the residual stress in the brazed portion 56 will prevent the holding member 10 from cracking. can be effectively suppressed.

Further, according to the heating device 100 of the present embodiment, the surface area of the recessed portion 71 of the terminal member 70 can be made relatively large, so that the excess brazing material does not reach the side surface of the recessed portion 12 of the holding member 10 and the terminal member 70 It is possible to suppress the joining of the holding member 10 and the terminal member 70 due to the difference in thermal expansion between the holding member 10 and the terminal member 70. It is possible to suppress the occurrence of cracks.

In addition, in the heating device 100 of the present embodiment, the recess inner portion 71 of the terminal member 70 is located on the bottom surface side of the recess 12 with respect to the columnar opening side portion 74 and the opening side portion 74, and In a cross section including the central axis CL of the recess inner portion 71 of the terminal member 70 , the plurality of protrusions 78 and the plurality of recesses 79 are formed on the outer peripheral surface of the bottom surface side portion 72 . formed. Therefore, according to the heating device 100 of the present embodiment, since a large space is secured between the side surface of the recess 12 formed in the holding member 10 and the recess inner portion 71 of the terminal member 70, the brazing material can be greatly reduced. Even if it is excessive, the brazing material can be prevented from moving a relatively long distance along the outer peripheral surface of the terminal member 70, and the fillet F of the brazing portion 56 can be formed into an appropriate shape, It is possible to effectively suppress the occurrence of cracks in the holding member 10 due to residual stress in the brazed portion 56 . Further, according to the heating device 100 of the present embodiment, since a large space is secured between the side surface of the recess 12 formed in the holding member 10 and the recess inner portion 71 of the terminal member 70, the brazing material can be greatly reduced. Even if it is excessive, the brazing material enters (crawls up) into the gap between the side surface of the concave portion 12 of the holding member 10 and the opening side portion 74 of the terminal member 70 to effectively join the two. It is possible to effectively prevent cracks from occurring due to the difference in thermal expansion between the holding member 10 and the terminal member 70 .

Further, in the heating device 100 of the present embodiment, the recessed portion 71 of the terminal member 70 is located between the opening side portion 74 and the bottom side portion 72 and has a columnar shape with a diameter smaller than the minimum diameter of the bottom side portion 72 . It has an intermediate portion 73 . Therefore, according to the heating device 100 of the present embodiment, a larger space is secured between the side surface of the recess 12 formed in the holding member 10 and the recess inner portion 71 of the terminal member 70, so that the brazing material can be significantly reduced. Even if it is excessively large, it is possible to prevent the brazing material from moving a relatively long distance along the outer peripheral surface of the terminal member 70, and the fillet F of the brazing portion 56 can be formed into an appropriate shape. , the occurrence of cracks in the holding member 10 due to the residual stress in the brazed portion 56 can be very effectively suppressed. Further, according to the heating device 100 of the present embodiment, since a larger space is secured between the side surface of the recess 12 formed in the holding member 10 and the recess inner portion 71 of the terminal member 70, the brazing material is greatly reduced. Even if the brazing material is excessively large, it is extremely effective to enter (climb up) the gap between the side surface of the recess 12 of the holding member 10 and the opening side portion 74 of the terminal member 70 to join them together. It is possible to effectively suppress the occurrence of cracks due to the difference in thermal expansion between the holding member 10 and the terminal member 70 .

In addition, in the heating device 100 of the present embodiment, in a cross section including the central axis CL of the inner recess portion 71 of the terminal member 70, at least one recess 79 formed in the outer peripheral surface of the inner recess portion 71 includes a brazing portion. 56 is housed. In this configuration, the amount of brazing material when brazing the terminal member 70 and the power receiving electrode 53 is set to be larger than the amount that can fill the area between the joint surfaces of the two members, and the amount of brazing material is excessive. It means that the material is properly accommodated in the recess 79 formed in the outer peripheral surface of the recess inner portion 71 of the terminal member 70 . Therefore, according to the heating device 100 of the present embodiment, it is possible to suppress the reduction in the bonding strength between the terminal member 70 and the power receiving electrode 53 due to insufficient brazing material, and reduce the residual stress and retention in the brazed portion 56 . The occurrence of cracks due to the difference in thermal expansion between the member 10 and the terminal member 70 can be suppressed.

B. Second embodiment:
FIG. 6 is an explanatory diagram showing the detailed configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the second embodiment. FIG. 6 shows the XZ cross-sectional configuration of the heating device 100 of the second embodiment corresponding to the XZ cross-sectional configuration of the heating device 100 of the first embodiment shown in FIG. In the following, of the configuration of the heating device 100 of the second embodiment, the same configurations as those of the heating device 100 of the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

As shown in FIG. 6, the heating device 100 of the second embodiment differs from the heating device 100 of the first embodiment mainly in the configuration of the bottom surface side portion 72a that constitutes the recessed portion 71 of the terminal member 70. . Specifically, in the heating device 100 of the second embodiment, the bottom side portion 72a has a structure in which the wire 75 is wound around the outer peripheral surface of the terminal member 70 and fixed. The wire 75 may be a plurality of wires independent of each other, or may be a single wire extending substantially spirally. Therefore, in a cross section including the central axis CL of the inner recess portion 71 of the terminal member 70 (for example, the cross section shown in FIG. 6), the outer peripheral surface of the bottom surface side portion 72a of the inner recess portion 71 has a thickness along the direction of the central axis CL. A plurality of protrusions 78 (that is, portions where wires 75 are present) and a plurality of recesses 79 (that is, portions where wires 75 are not present) are formed alternately.

As described above, in the heating device 100 of the second embodiment, similarly to the heating device 100 of the first embodiment described above, in a cross section including the central axis CL of the inner recess portion 71 of the terminal member 70, the A plurality of protrusions 78 and a plurality of recesses 79 that are alternately arranged along the central axis CL direction are formed on the outer peripheral surface (more specifically, the outer peripheral surface of the bottom surface side portion 72a of the recess inner portion 71). Therefore, according to the heating device 100 of the second embodiment, similarly to the heating device 100 of the first embodiment described above, while suppressing a decrease in the bonding strength between the terminal member 70 and the power receiving electrode 53, Residual stress in the brazed portion 56 can be effectively reduced, and cracks in the holding member 10 caused by the residual stress can be effectively suppressed.

C. Third embodiment:
FIG. 7 is an explanatory diagram showing the detailed configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the third embodiment. FIG. 7 shows the XZ cross-sectional configuration of the heating device 100 of the second embodiment corresponding to the XZ cross-sectional configuration of the heating device 100 of the first embodiment shown in FIG. In the following, of the configuration of the heating device 100 of the third embodiment, the same configurations as those of the heating device 100 of the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

As shown in FIG. 7, the heating device 100 of the third embodiment differs from the heating device 100 of the first embodiment mainly in the structure of the recessed portion 71b of the terminal member 70. As shown in FIG. Specifically, in the heating device 100 of the third embodiment, the recess inner portion 71b of the terminal member 70 is composed of the opening side portion 74 and the bottom side portion 72b. In the third embodiment, the diameter D2 of the bottom side portion 72b is substantially the same as the diameter D4 of the opening side portion 74. As shown in FIG. In the third embodiment, as in the first embodiment, grooves are formed in the outer peripheral surface of the bottom surface side portion 72b. As a result, a cross section ( For example, in the cross section shown in FIG. 7), a plurality of protrusions 78 and a plurality of recesses 79 that are alternately arranged along the direction of the central axis CL are formed on the outer peripheral surface of the bottom side portion 72b.

As described above, in the heating device 100 of the third embodiment, similarly to the heating device 100 of the first embodiment, in a cross section including the central axis CL of the inner recess portion 71b of the terminal member 70, the inner recess portion 71b A plurality of protrusions 78 and a plurality of recesses 79 that are alternately arranged along the central axis CL direction are formed on the outer peripheral surface (more specifically, the outer peripheral surface of the bottom surface side portion 72b of the recess inner portion 71b). Therefore, according to the heating device 100 of the third embodiment, similarly to the heating device 100 of the first embodiment described above, while suppressing a decrease in the bonding strength between the terminal member 70 and the power receiving electrode 53, Residual stress in the brazed portion 56 can be effectively reduced, and cracks in the holding member 10 caused by the residual stress can be effectively suppressed.

D. Fourth embodiment:
FIG. 8 is an explanatory diagram showing the detailed configuration of the vicinity of the joint between the terminal member 70 and the power receiving electrode 53 in the heating device 100 of the fourth embodiment. FIG. 8 shows the XZ cross-sectional configuration of the heating device 100 of the fourth embodiment corresponding to the XZ cross-sectional configuration of the heating device 100 of the first embodiment shown in FIG. In the following, of the configuration of the heating device 100 of the fourth embodiment, the same configurations as those of the heating device 100 of the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

As shown in FIG. 8, in the heating device 100 of the fourth embodiment, buffer members (first buffer member 81 and second buffer member 82) are mainly arranged between the terminal member 70 and the power receiving electrode 53. is different from the heating device 100 of the first embodiment. Specifically, in the heating device 100 of the fourth embodiment, the first buffer member 81 is arranged below the power receiving electrode 53, and the second buffer member 82 is arranged below the first buffer member 81. The terminal member 70 (bottom side portion 72 of the terminal member 70 ) is arranged below the second cushioning member 82 .

The first cushioning member 81 and the second cushioning member 82 are substantially circular plate-shaped members when viewed in the Z-axis direction, and are made of metal such as tungsten, molybdenum, or kovar, for example. However, the first buffer member 81 and the second buffer member 82 are arranged to reduce the difference in thermal expansion between the terminal member 70 and the power receiving electrode 53 . Therefore, as the material for forming the first buffer member 81, the same material as the material for forming the power receiving electrode 53, or the thermal expansion coefficient between the thermal expansion coefficient of the power receiving electrode 53 and the thermal expansion coefficient of the second buffer member 82 is used. A material having a coefficient of thermal expansion between that of the first buffer member 81 and that of the terminal member 70 is used as the material of the second buffer member 82 . Used. Also in the fourth embodiment, the terminal member 70 and the power receiving electrode 53 are joined by the brazing portion 56 while sandwiching the first buffer member 81 and the second buffer member 82 .

As described above, the fourth embodiment is similar to the first embodiment except that the first buffer member 81 and the second buffer member 82 are arranged between the terminal member 70 and the power receiving electrode 53 . In addition, a groove is formed in the outer peripheral surface of the bottom surface side portion 72 that constitutes the recessed portion 71 of the terminal member 70. As a result, a cross section including the central axis CL of the recessed portion 71 of the terminal member 70 (for example, FIG. 8), a plurality of protrusions arranged alternately along the direction of the central axis CL on the outer peripheral surface of the recessed portion 71 (more specifically, on the outer peripheral surface of the bottom side portion 72 of the recessed portion 71). 78 and a plurality of recesses 79 are formed. Therefore, according to the heating device 100 of the fourth embodiment, similarly to the heating device 100 of the first embodiment described above, while suppressing a decrease in the bonding strength between the terminal member 70 and the power receiving electrode 53, Residual stress in the brazed portion 56 can be effectively reduced, and cracks in the holding member 10 caused by the residual stress can be effectively suppressed. Further, according to the heating device 100 of the fourth embodiment, it is possible to suppress the occurrence of cracks in the holding member 10 and the like due to the difference in thermal expansion between the terminal member 70 and the power receiving electrode 53 .

E. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

The configuration of the heating device 100 in the above embodiment is merely an example, and various modifications are possible. For example, in the above-described embodiment, the resistance heating element 50 and the power receiving electrode 53 are electrically connected by contacting each other. It may be

In each of the above-described embodiments, in a cross section including the central axis CL of the recess inner portion 71 of each terminal member 70, the brazing portion 56 is located in at least one recess 79 formed in the outer peripheral surface of the bottom surface side portion 72. Although said to be partially contained, it is not necessary that a portion of the brazed portion 56 is contained within the recess 79 .

In addition, in the first, second and fourth embodiments, the recessed portion 71 of the terminal member 70 is composed of the opening side portion 74, the bottom side portion 72 and the intermediate portion 73, but the recessed portion 71 is It is composed of an opening side portion 74 and a bottom side portion 72, and the intermediate portion 73 may not exist. Further, in the first, second and fourth embodiments, the diameter D2 of the bottom surface side portion 72 is smaller than the diameter D4 of the opening side portion 74, but the diameter D2 of the bottom surface side portion 72 is less than the diameter D4 of the opening side portion 74. They may be substantially the same.

In the above-described embodiment, each terminal member 70 is configured as a single member, but each terminal member 70 is configured by a plurality of members arranged vertically and connected to each other by screws, crimps, or the like. It may be In this case, among the plurality of members forming each terminal member 70, the member joined to the power receiving electrode 53 exposed on the bottom surface of the concave portion 12 of the holding member 10 corresponds to the terminal member in the claims. In this case, among the plurality of members constituting each terminal member 70, only a portion of the member that is joined to the power receiving electrode 53 may be accommodated in the recess 12 of the holding member 10, or The entirety may be housed within the recess 12 of the holding member 10 . In either case, the portion housed in the recess 12 of the holding member 10 corresponds to the first portion in the claims.

Further, the shape, number, forming material, etc. of each member constituting the heating device 100 of the above-described embodiment are merely examples, and can be variously modified.

Moreover, the manufacturing method of the heating device 100 in the above-described embodiment is merely an example, and various modifications are possible. For example, in the above embodiment, the holding member 10 is produced by hot press firing, but the holding member 10 may be produced by firing a laminate of ceramic green sheets.

Further, in the above embodiment, the configuration of the joint between the power receiving electrode 53 electrically connected to the resistance heating element 50 provided in the heating device 100 and the terminal member 70 was described in detail. The technique includes a ceramic member having a recess, an electrode exposed at the bottom surface of the recess, a metal terminal member having a columnar first portion accommodated in the recess, the electrode and the terminal member. The same can be applied to a component for a semiconductor manufacturing apparatus provided with a brazing portion that joins the first portion of. For example, the technology disclosed in the present specification can be similarly applied to a joint between an electrode electrically connected to a chuck electrode of a ceramic member constituting an electrostatic chuck, which is a part of a semiconductor manufacturing apparatus, and a terminal member. It is possible.

10: Holding member 12: Recess 13: Opening 20: Supporting member 22: Through hole 30: Joint 50: Resistance heating element 53: Power receiving electrode 56: Brazing portion 70: Terminal member 71: Internal portion of recess 72: Bottom side portion 73: Intermediate portion 74: Opening side portion 75: Wire 78: Convex portion 79: Concave portion 81: First cushioning member 82: Second cushioning member 100: Heating device CL: Central axis F: Fillet S1: Holding surface S2: Back surface S3: Top surface S4: Bottom surface W: Semiconductor wafer

Claims (5)

a ceramic member having a concave portion;
an electrode exposed on the bottom surface of the recess;
a terminal member made of metal, the terminal member having a columnar first portion housed in the recess;
a brazing portion that joins the electrode and the first portion of the terminal member;
In parts for semiconductor manufacturing equipment comprising
In a cross section including the central axis of the first portion of the terminal member, a wire is wound around and fixed to the outer peripheral surface of the first portion, and a plurality of convex portions are arranged alternately along the central axis direction; a plurality of recesses are formed,
A component for semiconductor manufacturing equipment characterized by: The component for semiconductor manufacturing equipment according to claim 1,
The first portion of the terminal member includes a columnar opening side portion and a columnar bottom side portion located on the bottom side of the recess with respect to the opening side portion and having a diameter smaller than that of the opening side portion. have
In the cross section including the central axis of the first portion of the terminal member, the plurality of protrusions and the plurality of recesses are formed on the outer peripheral surface of the bottom side portion of the first portion,
A component for semiconductor manufacturing equipment characterized by: In the component for semiconductor manufacturing equipment according to claim 2,
The first portion of the terminal member has a columnar intermediate portion positioned between the opening side portion and the bottom side portion and having a smaller diameter than the minimum diameter of the bottom side portion.
A component for semiconductor manufacturing equipment characterized by: a ceramic member having a concave portion;
an electrode exposed on the bottom surface of the recess;
a terminal member made of metal, the terminal member having a columnar first portion housed in the recess;
a brazing portion that joins the electrode and the first portion of the terminal member;
In parts for semiconductor manufacturing equipment comprising
In a cross section including the central axis of the first portion of the terminal member, a plurality of convex portions and a plurality of concave portions are formed alternately along the central axis direction on the outer peripheral surface of the first portion. ,
The first portion of the terminal member includes a columnar opening side portion and a columnar bottom side portion located on the bottom side of the recess with respect to the opening side portion and having a diameter smaller than that of the opening side portion. have
In the cross section including the central axis of the first portion of the terminal member, the plurality of protrusions and the plurality of recesses are formed on the outer peripheral surface of the bottom side portion of the first portion,
The first portion of the terminal member has a columnar intermediate portion located between the opening side portion and the bottom side portion and having a smaller diameter than the minimum diameter of the bottom side portion.
A component for semiconductor manufacturing equipment characterized by: In the component for semiconductor manufacturing equipment according to any one of claims 1 to 4 ,
part of the brazing portion is accommodated in at least one recess formed in the outer peripheral surface of the first portion in a cross section including the central axis of the first portion of the terminal member;
A component for semiconductor manufacturing equipment characterized by:

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