JP6903512B2 - Joined body - Google Patents

Description

The techniques disclosed herein relate to conjugates.

A heating device (also referred to as a "susceptor") that heats an object (for example, a semiconductor wafer) to a predetermined processing temperature (for example, about 400 to 650 ° C.) while holding the object (for example, a semiconductor wafer) is known. The heating device is used as a part of a semiconductor manufacturing device such as a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

In general, a heating device is a plate-shaped holding body having a holding surface and a back surface substantially orthogonal to a predetermined direction (hereinafter, referred to as "first direction"), and a columnar shape extending in the first direction of the holding body. It is provided with a columnar support joined to the back surface. A resistance heating element is arranged inside the holder, and a plurality of power receiving electrodes (electrode pads) electrically connected to the resistance heating element are arranged on the back surface side of the holder. In addition, electrode terminals joined to each power receiving electrode are housed in the columnar support. When a voltage is applied to the resistance heating element via the electrode terminals and the power receiving electrode, the resistance heating element generates heat, and the object (for example, a semiconductor wafer) held on the holding surface of the holding body is, for example, 400 to 650 ° C. Heated to a degree. The power receiving electrode of the holding body and the electrode terminal (metal member) are joined by a joint portion containing a brazing material (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2013-193935

In the conventional bonding with brazing material, the boundary line between the external conductor (power receiving electrode) and the joint portion (brazing material) forms one gentle convex line as a whole in the cross section parallel to the first direction. ing. However, in such a configuration, since the contact area between the external conductor and the joint portion is small, there is a possibility that the joint strength between the external conductor and the joint portion cannot be sufficiently secured.

It should be noted that such a problem is common not only to the heating device but also to the holding device such as the electrostatic chuck and the vacuum chuck. Further, such a problem is a problem common to parts for semiconductor manufacturing equipment such as a shower head. Further, it is a common problem for a ceramic member in which an external conductor is arranged, a metal member, and a joint including a brazing material and a joint portion for joining the external conductor and the metal member.

This specification discloses a technique capable of solving the above-mentioned problems.

The techniques disclosed herein can be realized, for example, in the following forms.

(1) The joint disclosed in the present specification includes a ceramic member, an external conductor arranged on the surface side of the ceramic member, and a metal arranged so as to face the external conductor in the first direction. In a joint including a member and a joint including a brazing material and joining the external conductor and the metal member, at least one parallel to the first direction in the external conductor and the joint. In the cross section, the first boundary line between the external conductor and the joint has a plurality of bending points. According to the present joint, the first boundary line between the external conductor and the joint has a plurality of inflection points in at least one cross section parallel to the first direction of the external conductor and the joint. As a result, in an arbitrary cross section parallel to the first direction of the external conductor and the joint portion, the first boundary line between the external conductor and the joint portion has one or less bending points or less. Since the contact area between the external conductor and the joint portion is large, the joint strength between the external conductor and the joint portion can be improved.

(2) In the joint, an internal conductor which is further arranged inside the ceramic member and electrically connected to a surface of the external conductor opposite to the surface to be joined to the joint is provided. In the cross section, the first boundary line has a convex line portion protruding toward the metal member side, and the internal conductor is a portion of the external conductor corresponding to the convex line portion. It may be configured to be arranged in. According to this joint, the distance between the external conductor and the metal member is shorter than that in the configuration where the internal conductor is arranged in the portion of the external conductor that does not correspond to the convex line portion. The electrical resistance between the internal conductor and the metal member can be reduced by the amount arranged in.

(3) The cross section of the joint body is further provided with an internal conductor arranged inside the ceramic member and in contact with a surface of the external conductor opposite to the surface bonded to the joint portion. In the second boundary line between the internal conductor and the ceramic member and the external conductor, the alignment of the straddling portion extending so as to straddle the internal conductor and the ceramic member is a straight line or It may be a curved structure. According to this joint, of the second boundary line between the internal conductor and the ceramic member and the external conductor, the alignment of the straddling portion extending so as to straddle the internal conductor and the ceramic member is a straight line or It is a curve. As a result, it is possible to suppress stress concentration at a specific part of the interface between the internal conductor and the ceramic member and the external conductor, as compared with a configuration in which the alignment of the straddling portion is, for example, a alignment having corners. it can.

(4) In the joint, at least one of both ends of the first boundary line may be a concave line portion recessed on the side opposite to the metal member. According to the present joint, at least one of both ends of the first boundary line is a concave line portion recessed on the side opposite to the metal member. As a result, the dimensions (thickness) of the outer peripheral side of the joint portion in the first direction are larger than those in which both ends of the first boundary line are convex line portions protruding toward the metal member side. The joint is thick on the outer peripheral side of the joint that is easily oxidized by being exposed to the outside air. As a result, it is possible to prevent the external conductor from being oxidized by the thick portion of the joint portion.

(5) In the joint, in the cross section, the plurality of inflection points in the first boundary line are on the end side of the first boundary line in the second direction orthogonal to the first direction. The configured inflection point may be characterized in that it is arranged at a position closer to the metal member. According to this joint, the plurality of inflection points on the first boundary line are such that the inflection points located on the end side of the first boundary line in the second direction orthogonal to the first direction are metal members. It is located near. As a result, for example, when a metal member receives an external force and a stress (moment) is generated at the joint, the distance between the external conductor and the metal member is easily displaced, and the external conductor and the metal member are placed on the outer peripheral side of the joint. It is possible to suppress the non-conductivity between them.

The techniques disclosed in the present specification can be realized in various forms, for example, for holding devices such as electrostatic chucks and vacuum chucks, heating devices such as susceptors, and semiconductor manufacturing devices such as shower heads. It can be realized in the form of parts, a joint body including a ceramic member on which an external conductor is arranged, a metal member, and a joint portion including a brazing material, a method for manufacturing the same, and the like.

It is a perspective view which shows schematic appearance structure of the heating apparatus 100 in this embodiment. It is explanatory drawing which shows typically the XZ cross-sectional structure of the heating apparatus 100 in this embodiment. It is explanatory drawing which shows schematic the XZ cross-sectional structure which enlarged X1 part of FIG. It is explanatory drawing which shows schematic the XZ cross-sectional structure in the comparative example 1. FIG. It is explanatory drawing which shows schematic the XZ cross-sectional structure in the comparative example 2. FIG. It is explanatory drawing which shows schematic the XZ cross-sectional structure in the comparative example 3. FIG.

A. This embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically showing an external configuration of the heating device 100 in the present embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the heating device 100 in the present embodiment. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the heating device 100 is actually installed in a direction different from such a direction. You may.

The heating device 100 is a device that heats an object (for example, a semiconductor wafer W) to a predetermined processing temperature (for example, about 400 to 650 ° C.) while holding the object (for example, a semiconductor wafer W), and is also called a susceptor. The heating device 100 is used as a part of a semiconductor manufacturing device such as a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.). The heating device 100 corresponds to a bonded body within the scope of the claims.

As shown in FIGS. 1 and 2, the heating device 100 includes a holding body 10 and a columnar support 20.

(Holder 10)
The holding body 10 is a substantially disk-shaped member having a holding surface S1 and a back surface S2 that are substantially orthogonal to a predetermined direction (vertical direction in the present embodiment). Holding member 10, for example, formed by AlN ceramics mainly the (aluminum nitride) or _Al 2 _{O 3} (alumina). The main component referred to here means the component having the highest content ratio (weight ratio). The diameter of the holding body 10 is, for example, about 100 mm or more and 500 mm or less, and the thickness (length in the vertical direction) of the holding body 10 is, for example, about 3 mm or more and 10 mm or less. The holding body 10 corresponds to a ceramic member in the claims, and the predetermined direction (vertical direction) corresponds to the first direction in the claims.

As shown in FIG. 2, a resistance heating element 50 as a heater for heating the holding body 10 is arranged inside the holding body 10. The resistance heating element 50 is formed of, for example, a conductive material such as tungsten or molybdenum. The pair of ends of the resistance heating element 50 are arranged on the peripheral side of the holding body 10. Further, inside the holding body 10, a pair of peripheral side via conductors 51, a pair of conductive paths 53, and a via group 52 are provided. Each peripheral side via conductor 51 is a linear conductor extending in the vertical direction, and is located on the peripheral side of the holding body 10. The upper end of each peripheral side via conductor 51 is connected to each end of the resistance heating element 50. Each conductive path 53 is a linear conductor extending in the radial direction of the holding body 10, and the lower end of each peripheral side via conductor 51 is connected to the radial outer end of each conductive path 53. The via group 52 includes a plurality of (two in this embodiment) vias 52A which are linear conductors extending in the vertical direction. The upper end of each via 52A is connected to the inner end of each conductive path 53 in the radial direction. Further, a pair of recesses 12 are formed in the vicinity of the central portion of the back surface S2 of the holding body 10, and a power receiving electrode (electrode pad) 54 is arranged in each recess 12. Each power receiving electrode 54 is arranged so as to be exposed on the back surface S2 of the holding body 10, and as will be described later, the exposed portion of the power receiving electrode 54 is covered with a joint portion 56. The lower end of each via 52A is connected to each power receiving electrode 54. As a result, the resistance heating element 50 and each power receiving electrode 54 are electrically connected. The power receiving electrode 54 corresponds to the external conductor in the claims, and the via group 52 (via 52A) corresponds to the internal conductor in the claims.

(Columnar support 20)
The columnar support 20 is a substantially columnar member extending in the predetermined direction (vertical direction). Columnar support 20, similarly to the holding member 10 is formed by ceramics, for example, as a main component AlN or _Al 2 _{O 3.} The outer diameter of the columnar support 20 is, for example, about 30 mm or more and 90 mm or less, and the height (length in the vertical direction) of the columnar support 20 is, for example, about 100 mm or more and 300 mm or less.

The holding body 10 and the columnar support 20 are arranged so that the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 face each other in the vertical direction. The columnar support 20 is joined to the vicinity of the center of the back surface S2 of the holding body 10 via a joining layer 30 formed of a known joining material.

As shown in FIG. 2, the columnar support 20 is formed with a through hole 22 that opens on the back surface S2 side of the holding body 10. The through hole 22 is a hole having a substantially circular cross section, which extends in substantially the same direction as the vertical direction and has a substantially constant inner diameter in the extending direction. A plurality of (two in this embodiment) electrode terminals 70 are housed in the through hole 22. The upper end of each electrode terminal 70 is joined to the power receiving electrode 54 via a joint portion 56 containing a metal brazing material (for example, a gold brazing material). The joint portion 56 may contain a substance other than the brazing material. When a voltage is applied to the resistance heating element 50 from a power source (not shown) via each electrode terminal 70, each power receiving electrode 54, and via group 52 (via 52A), the resistance heating element 50 generates heat and the holding surface of the holding body 10 is generated. The object held on S1 (for example, the semiconductor wafer W) is heated to a predetermined temperature (for example, about 400 to 650 ° C.). The electrode terminal 70 corresponds to a metal member within the scope of claims.

A-2. Detailed configuration of the power receiving electrode 54, the electrode terminal 70, and the joint portion 56:
FIG. 3 is an explanatory view schematically showing an XZ cross-sectional configuration in which the X1 portion of FIG. 2 is enlarged. As shown in FIG. 3, in at least one cross section (XZ cross section) parallel to the vertical direction of the power receiving electrode 54 and the joint 56, the first boundary line L1 between the power receiving electrode 54 and the joint 56 has a plurality of inflections. It has points (P1, P2). The inflection point is a point at which the first boundary line L1 changes from convex upward to convex downward and from convex downward to convex upward.

Specifically, of the back surface S2 of the holding body 10, the facing portion facing the power receiving electrode 54 is on the pair of protruding portions 10A protruding toward the electrode terminal 70 side (lower side) and on the holding surface S1 side (upper side). It is a curved surface shape having three recessed portions 10B. The protruding portion 10A has a curved surface shape that is inclined so as to approach the holding surface S1 side from the central portion located at the lowest point toward the outer peripheral side. The recessed portion 10B has a curved surface shape that is inclined so as to approach the electrode terminal 70 side from the central portion located at the uppermost point toward the outer peripheral side. Further, the recessed portion 10B is located between the pair of protruding portions 10A and at both ends of the facing portion. However, in FIG. 3, the recessed portions 10B located at both ends are interrupted in the middle and do not have an inflection point. Then, a power receiving electrode 54 having a substantially uniform thickness is formed on the facing portion of the back surface S2 of the holding body 10 so as to follow the curved surface shape of the facing portion. Therefore, the lower surface of the power receiving electrode 54 also has a curved surface shape having a pair of protruding portions 54A protruding toward the electrode terminal 70 side (lower side) and three recessed portions 54B recessed toward the holding surface S1 side (upper side). .. The protruding portion 54A has a curved surface shape that is inclined so as to approach the holding surface S1 side from the central portion located at the lowest point toward the outer peripheral side. The recessed portion 54B has a curved surface shape that is inclined so as to approach the electrode terminal 70 side from the central portion located at the uppermost point toward the outer peripheral side. Further, the recessed portion 54B is located between the pair of protruding portions 54A and at both ends of the power receiving electrode 54. However, in FIG. 3, the recessed portions 54B located at both ends are interrupted in the middle and do not have an inflection point. A joint 56 is formed between the lower surface of the power receiving electrode 54 and the electrode terminal 70.

With the above configuration, in the XZ cross section of FIG. 3, the first boundary line L1 between the power receiving electrode 54 and the joint portion 56 is formed by the pair of convex line portions L1A which are the outer lines of the pair of protruding portions 54A and the recess. It is a curve including three concave line portions L1B which are outer lines of the portion 54B. Each convex line portion L1A is a convex line portion projecting toward the electrode terminal 70, and a portion at the tip of each convex line portion L1A in the projecting direction (Z-axis negative direction) of the convex line portion. Is the first inflection point P1. The "convex line segment" here means an inflection point (first inflection point P1) located at the lowest point, and one inclined portion extending diagonally upward from the inflection point. A line segment including the other inclined portion extending diagonally upward from the inflection point on the opposite side of the one inclined portion (hereinafter, the same applies). The concave wire portion L1B is a concave wire portion recessed on the side opposite to the electrode terminal 70, and the tip portion of the concave wire portion L1B is the second portion in the concave direction (Z-axis positive direction) of the concave wire portion. It is the inflection point P2 of. The "concave line segment" referred to here is an inflection point (second inflection point P2) located at the highest point, one inclined portion extending diagonally downward from the inflection point, and one of the inflection points. Refers to a line segment including the other inclined portion extending diagonally downward from the inflection point on the opposite side of the inclined portion (hereinafter, the same applies). However, in FIG. 3, the concave line portions L1B located at both ends of the first boundary line L1 are interrupted in the middle and do not have an inflection point. It should be noted that the height difference between the convex line portion L1A and the concave line portion L1B on the first boundary line L1 (hereinafter referred to as "concavo-convex difference" in the vertical direction between the first inflection point P1 and the second inflection point P2". Distance) is preferably 30 μm or more, and more preferably 300 μm or less. Further, the unevenness difference of the first boundary line L1 is preferably smaller than the thickness of the joint portion 56 (length in the vertical direction) and larger than the thickness of the power receiving electrode 54 (length in the vertical direction). Is preferable.

Further, the second boundary line L2 between the holding body 10 and the power receiving electrode 54 is formed by a pair of convex line portions L2A which are outer lines of the pair of protruding portions 10A in the facing portion of the back surface S2 of the holding body 10 and a recess. It is a curve including three concave line portions L2B which are outer lines of the portion 10B. Each convex wire portion L2A is a convex wire portion protruding toward the electrode terminal 70, and the concave wire portion L2B is a concave wire portion recessed on the opposite side to the electrode terminal 70. However, in FIG. 3, the concave line portions L2B located at both ends of the second boundary line L2 are interrupted in the middle and do not have an inflection point. In the present embodiment, for one via 52A, the protruding portion 10A in the holding body 10 (convex line portion L1A in the first boundary line L1) and the protruding portion 54A in the power receiving electrode 54 (second boundary). There is one convex line portion L2A) on the line L2 and one each. That is, the number of vias 52A, the number of protruding portions 10A (convex line portion L1A at the first boundary line L1) in the holding body 10, and the protruding portions 54A (convex shape at the second boundary line L2) at the power receiving electrode 54. The number of line portions L2A) is the same as each other.

Further, in the XZ cross section of FIG. 3, the lower end of each via 52A is arranged at a position corresponding to each convex line portion L1A of the first boundary line L1. Specifically, the lower end of each via 52A is located on the convex line portion L2A of the second boundary line L2. As a result, the distance between the via group 52 and the electrode terminal 70 is reduced by the amount that the lower end of each via 52A is located on the concave line portion L2B of the second boundary line L2. The electrical resistance between the two can be reduced. Further, one via 52A is arranged with respect to one convex line portion L1A. As a result, it is possible to suppress variations in the length of each via 52A as compared with a configuration in which a plurality of vias 52A are arranged with respect to one convex line portion L1A.

Further, in the second boundary line L2, the alignment of the straddling portion L2C extending so as to straddle the via group 52 and the holding body 10 is a curved line. Further, as shown in FIG. 3, both ends of the first boundary line L1 are concave line portions L1B. It is preferable that both ends of the first boundary line L1 are concave line portions L1B over the entire circumference of the joint portion 56.

A-3. Manufacturing method of heating device 100:
The manufacturing method of the heating device 100 is as follows, for example. First, the holding body 10 and the columnar support 20 are produced.

The method for producing the retainer 10 is as follows, for example. First, 100 parts by weight of aluminum nitride powder, and yttrium oxide (Y 2 _{O 3)} powder, 1 part by weight, and 20 parts by weight of an acrylic binder, the mixture was added a suitable amount of dispersant and plasticizer, organic or toluene A solvent is added and mixed with a ball mill to prepare a slurry for a green sheet. This green sheet slurry is formed into a sheet by a casting device and then dried to prepare a plurality of green sheets.

Further, a metallized paste is prepared by adding a conductive powder such as tungsten or molybdenum to a mixture of organic solvents such as aluminum nitride powder, acrylic binder and terpineol and kneading the mixture. By printing this metallized paste using, for example, a screen printing device, an unsintered conductor layer that later becomes a resistance heating element 50, a power receiving electrode 54, or the like is formed on a specific green sheet. At this time, depending on the printing conditions, the power receiving electrode 54 is printed so as to have a curved surface shape having irregularities. Further, by printing on the green sheet with via holes provided in advance, an unsintered conductor portion which will later become a via group 52 (via 52A) is formed.

Next, a plurality of these green sheets (for example, 20 sheets) are thermocompression-bonded, and if necessary, the outer periphery is cut to prepare a green sheet laminate. This green sheet laminate is cut by machining to produce a disk-shaped molded body, the molded body is degreased, and the degreased body is further fired to produce a fired body. The surface of this fired body is polished. The holding body 10 is produced by the above steps.

The method for producing the columnar support 20 is as follows, for example. First, an organic solvent such as methanol is added to a mixture of 100 parts by weight of aluminum nitride powder, 1 part by weight of yttrium oxide powder, 3 parts by weight of PVA binder, and an appropriate amount of a dispersant and a plasticizer, and a ball mill is used. Mix to obtain a slurry. This slurry is granulated with a spray dryer to prepare a raw material powder. Next, the raw material powder is filled in the rubber mold in which the core corresponding to the through hole 22 is arranged, and cold hydrostatic pressure pressing is performed to obtain a molded product. The obtained molded body is degreased, and the degreased body is further fired. The columnar support 20 is manufactured by the above steps.

Next, the holding body 10 and the columnar support 20 are joined. After lapping the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 as necessary, at least one of the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 is, for example, rare earth or organic. A known bonding agent made into a paste by mixing a solvent or the like is uniformly applied, and then degreased. Next, the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 are overlapped with each other, and hot press firing is performed to join the holding body 10 and the columnar support 20.

After joining the holding body 10 and the columnar support 20, each electrode terminal 70 is inserted into each through hole 22, and the upper end of each electrode terminal 70 is brazed to each power receiving electrode 54 with, for example, a gold brazing material. The joint portion 56 was formed by the above method. By the above manufacturing method, the heating device 100 having the above-described configuration is manufactured.

A-4. Effect of this embodiment:
As described above, according to the heating device 100 of the present embodiment, in at least one cross section (XZ cross section) parallel to the vertical direction of the power receiving electrode 54 and the joint portion 56, the power receiving electrode 54 and the joint portion 56 are connected to each other. The boundary line L1 of 1 has a plurality of inflection points (P1, P2). As a result, the power receiving electrode 54 and the junction 56 have one or less inflection points in an arbitrary cross section parallel to the vertical direction of the power receiving electrode 54 and the junction 56, as compared with the configuration in which the first boundary line L1 has one or less inflection points. Since the contact area between the power receiving electrode 54 and the joint portion 56 is large, the joint strength between the power receiving electrode 54 and the joint portion 56 can be improved.

Hereinafter, a specific description will be given. FIG. 4 is an explanatory view schematically showing the XZ cross-sectional structure in Comparative Example 1. In FIG. 4, the same reference numerals are given to the configurations common to the configurations shown in FIG. 3 described above, and the description thereof will be omitted. As shown in FIG. 4, Comparative Example 1 is different from the heating device 100 of the present embodiment in that the boundary line L1X between the power receiving electrode 54 and the joint portion 56 has one inflection point. That is, in Comparative Example 1, the boundary line L1X has one convex line portion as a whole, and one inflection point PX is located at the lowest point of the convex line portion. Since the first boundary line L1 between the power receiving electrode 54 and the joint portion 56 in the present embodiment has a plurality of inflection points (P1 and P2) (see FIG. 3), it is longer than the boundary line L1X in Comparative Example 1. This means that in the present embodiment, the contact area between the power receiving electrode 54 and the bonding portion 56 is large and the bonding strength between the two is high as compared with Comparative Example 1.

Further, FIG. 5 is an explanatory view schematically showing the XZ cross-sectional structure in Comparative Example 2. In FIG. 5, the same reference numerals are given to the configurations common to the configurations shown in FIG. 3 described above, and the description thereof will be omitted. As shown in FIG. 5, in Comparative Example 2, the boundary line L1Y between the power receiving electrode 54 and the joint portion 56 does not have the above-mentioned convex line portion or concave line portion, and has a fine zigzag shape. In that respect, it differs from the heating device 100 of the present embodiment. That is, in Comparative Example 2, the surface roughness of the lower surface of the power receiving electrode 54 is large. By increasing the surface roughness of the lower surface of the power receiving electrode 54 in this way, it is possible to increase the contact area between the power receiving electrode 54 and the joint portion 56, but the larger the surface roughness, the more power is received. A portion of the electrode 54 that is thin and does not function as an electrode is likely to occur. On the other hand, in the present embodiment, the lower surface and the upper surface of the power receiving electrode 54 have substantially the same surface roughness, and the thickness of the power receiving electrode 54 is substantially the same over the entire length, so that the power receiving electrode 54 is thin. It is unlikely that a part that does not function as an electrode will occur. In the direction orthogonal to the vertical direction (X-axis direction), the width of one convex line portion or one concave line portion in the present embodiment is equal to or larger than the width of the via 52A, whereas the width of the comparative example It is less than the width of one zigzag peak or valley in 5, and the width of the via 52A.

Further, in the present embodiment, the first boundary line L1 is a curve including at least a pair of convex line portions L1A and a concave line portion L1B located between the pair of convex line portions L1A. There are 3 or more inflection points. Therefore, the bonding strength between the power receiving electrode 54 and the bonding portion 56 can be more effectively improved as compared with the configuration having two inflection points.

Further, according to the present embodiment, in the XZ cross section of FIG. 3, the lower end of each via 52A is arranged at a position corresponding to each convex line portion L1A of the first boundary line L1. As a result, as compared with the configuration in which the lower end of the via 52A is arranged at a position not corresponding to the convex line portion L1A, the via 52A is arranged at a position where the distance between the power receiving electrode 54 and the electrode terminal 70 is short. The electrical resistance between the via 52A and the electrode terminal 70 can be reduced.

Further, according to the present embodiment, the alignment of the straddling portion L2C extending so as to straddle the via group 52 and the holding body 10 in the second boundary line L2 is a curved line. As a result, it is possible to suppress stress concentration at a specific portion of the interface between the via 52A and the holding body 10 and the power receiving electrode 54, as compared with a configuration in which the alignment of the straddling portion L2C is, for example, a alignment having a corner portion. Can be done. Hereinafter, a specific description will be given. FIG. 6 is an explanatory view schematically showing the XZ cross-sectional structure in Comparative Example 3. In FIG. 6, the same reference numerals are given to the configurations common to the configurations shown in FIG. 3 described above, and the description thereof will be omitted. As shown in FIG. 6, Comparative Example 3 is different from the heating device 100 of the present embodiment in that the alignment of the straddling portion L2Z is a alignment having a corner portion. That is, in Comparative Example 3, the second boundary line L2Z between the holding body 10 and the power receiving electrode 54 corresponds between the curved portion L2Z1 corresponding to the via 52A and the vias 52A, and is in a direction substantially orthogonal to each other in the vertical direction. It includes a straight portion LSZ2 extending in the (X-axis direction), and the connecting portion between the curved portion and the straight portion is a square portion. Therefore, for example, when an external force is applied to the electrode terminal 70, stress tends to be concentrated on the corner portion, and the electrode terminal 70 is easily damaged. On the other hand, in the present embodiment, since the alignment of the straddling portion L2C is a curved line, it is possible to suppress the concentration of stress at a specific portion of the interface between the via 52A and the holding body 10 and the power receiving electrode 54. it can.

Further, according to the present embodiment, both ends of the first boundary line L1 are concave line portions L1B. As a result, since both ends of the first boundary line L1 have a large vertical dimension (thickness) on the outer peripheral side of the joint portion 56 as compared with the configuration in which the convex line portion L1A is formed, the joint portion 56 is particularly exposed to the outside air and oxidized. The joint portion 56 is thick on the outer peripheral side of the easy-to-use joint portion 56. As a result, it is possible to prevent the power receiving electrode 54 from being oxidized by the thick portion of the joint portion 56.

B. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof, and for example, the following modifications are also possible.

The configuration of the heating device 100 in the above embodiment is merely an example and can be variously modified. For example, in the above embodiment, the outer shape of the holding body 10 and the columnar support 20 in the Z-axis direction is substantially circular, but other shapes may be used. Further, the electrode terminals accommodated in the through holes 22 formed in the columnar support 20 are not limited to the terminals electrically connected to the resistance heating element 50, and for example, the high frequency (RF) electrode that generates plasma is electrically connected. It may be a terminal that is physically connected or a terminal that is electrically connected to an adsorption electrode for electrostatic adsorption. Further, in the above embodiment, the power receiving electrode 54 is arranged in the recess 12 formed in the back surface S2 of the holding body 10, but may be arranged on the back surface S2 of the holding body 10. In short, the power receiving electrode may be arranged on the second surface side of the holding body.

Further, the forming material of each member constituting the heating device 100 in the above embodiment is merely an example, and each member may be formed of another material. For example, in the heating device 100 in the above embodiment, the holding body 10 and the columnar support 20 are made of ceramics containing aluminum nitride or alumina as a main component, but at least one of the holding body 10 and the columnar support 20 is used. However, it may be made of other ceramics, or may be made of a material other than ceramics (for example, a metal such as aluminum or an aluminum alloy). Similarly, the forming material such as the electrode terminal 70 may be another material.

Further, in the above embodiment, the via group 52 may include one via 52A or may include three or more vias 52A. Further, in the above embodiment, one via 52A is arranged for one convex line portion L1A, but the present invention is not limited to this, and a plurality of vias 52A are arranged for one convex line portion L1A. It may be arranged. Further, in the above embodiment, the via 52A is not limited to the form in which it is in direct contact with the power receiving electrode 54, but may be in the form in which it is indirectly connected to the power receiving electrode 54 via another conductor.

Further, in the above embodiment, the second boundary line L2 may be a straight line instead of a curved line. Further, the linearity of the straddling portion L2C of the second boundary line L2 may be a straight line or a linearity having a corner portion. Further, at least one of both ends of the first boundary line L1 may be a convex line portion L1A.

Further, in the above embodiment, the first boundary line L1 is a curve including at least a pair of concave line portions L1B and a convex line portion L1A located between the pair of concave line portions L1B. , There may be three or more inflection points.

Further, in the XZ cross section of FIG. 3 of the above embodiment, the plurality of inflection points P1 and P2 at the first boundary line L1 are the first boundary lines L1 in the direction orthogonal to the vertical direction (XY plane direction). The inflection point located on the end side may be arranged closer to the electrode terminal 70. According to such a configuration, for example, when the electrode terminal 70 receives an external force and a stress (moment) is generated in the joint portion 56, the distance between the power receiving electrode 54 and the electrode terminal 70 is likely to be displaced on the outer peripheral side of the joint portion 56. It is possible to prevent the power receiving electrode 54 and the electrode terminal 70 from becoming non-conductive.

The present invention is applicable not only to heating devices but also to holding devices such as electrostatic chucks and vacuum chucks, heating devices such as susceptors, and parts for semiconductor manufacturing devices such as shower heads. In short, the present invention is applicable to a joint body including a ceramic member formed of ceramics, an external conductor, a metal member, and a joint portion.

Further, the manufacturing method of the heating device 100 in the above embodiment is merely an example, and various modifications can be made.

10: Holder 10A: Protruding part 10B: Recessed part 12: Recessed part 20: Columnar support 22: Through hole 30: Bonding layer 50: Resistor heating element 51: Peripheral side via conductor 52: Via group 52A: Via 53: Conductive path 54: Power receiving electrode 54A: Protruding part 54B: Depressed part 56: Joint part 70: Electrode terminal 100: Heating device L1: First boundary line L1A: Convex line part L1B: Concave line part L2: Second boundary line L2A : Convex wire part L2B: Concave wire part L2C: Straddling part P1: First inflection point P2: Second inflection point S1: Holding surface S2: Back surface S3: Top surface W: Semiconductor wafer

Claims (5)

Ceramic members and
An external conductor arranged on the surface side of the ceramic member and
A metal member arranged so as to face the external conductor in the first direction,
In a joint body including a brazing material and comprising a joint portion for joining the external conductor and the metal member.
In at least one cross section of the external conductor and the joint portion parallel to the first direction, the first boundary line between the external conductor and the joint portion protrudes toward the metal member and thereof. A curved line having a convex line portion where the protruding tip portion is an inflection point and a concave line portion which is recessed on the opposite side of the metal member and whose recessed tip portion is an inflection point. A joint characterized by being. In the joined body according to claim 1, further
It is provided with an internal conductor that is arranged inside the ceramic member and is electrically connected to a surface of the external conductor that is opposite to the surface to be joined to the joint portion.
In the cross section
The first boundary line has a convex line portion protruding toward the metal member, and has a convex line portion.
A bonded body, wherein the internal conductor is arranged at a position corresponding to the convex line portion of the external conductor. In the joint according to claim 1 or 2, further
An internal conductor arranged inside the ceramic member and in contact with a surface of the external conductor opposite to the surface bonded to the joint portion is provided.
In the cross section
Of the second boundary line between the internal conductor and the ceramic member and the external conductor, the alignment of the straddling portion extending so as to straddle the internal conductor and the ceramic member is a straight line or a curved line. A joint characterized by being. In the joint according to any one of claims 1 to 3,
A joint body characterized in that at least one of both ends of the first boundary line is a concave line portion recessed on the side opposite to the metal member. In the joint according to any one of claims 1 to 4.
In the cross section
The plurality of inflection points on the first boundary line are closer to the metal member as the inflection points located on the end side of the first boundary line in the second direction orthogonal to the first direction. A joint, characterized in that it is located in a position.

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