JP6938160B2 - Processing method of work piece - Google Patents

Description

The present invention relates to a method for processing a workpiece.

Problems such as chipping of the edge of the work piece after thinning or peeling of the edge of the work piece joined to the substrate when the process of forming a film on the work piece is carried out in the process after thinning. was there. Therefore, conventionally, the cutting blade is cut by positioning the cutting blade in the tangential direction of the disk-shaped workpiece, that is, at a position where the cutting direction of the cutting blade and the tangent of the peripheral edge of the workpiece are 0 degrees. While doing so, edge trimming was performed by rotating the work piece to remove the outer peripheral portion of the work piece (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-2623

Even if the edge trimming method shown in Patent Document 1 was performed, chipping still occurred. Further, if edge trimming is performed by the edge trimming method shown in Patent Document 1 before the film forming process, the outer peripheral portion of the work piece is substantially at a right angle, so that the chemical solution does not spread uniformly to the stepped portion and the processing quality. There was a problem that it got worse.

The present invention has been made in view of such a point, and an object of the present invention is to provide a method for processing a workpiece capable of suppressing the occurrence of chipping.

In order to solve the above-mentioned problems and achieve the object, the processing method of the workpiece of the present invention has a disk shape in which a plurality of devices are formed on the surface and a curved surface curved in the outer peripheral direction is provided on the outer periphery. A method of processing a work piece, which thins the work piece to a predetermined thickness and removes a region to be removed including the curved surface on the outer periphery of the thinned work piece. By rotating the chuck table on which the work piece is placed around the axis while cutting into the work piece to be removed area by a predetermined thickness, the work piece is to be removed on the surface side. and before grinding the edge trimming step for removing the curved surface, and a substrate attaching step of attaching a substrate on the surface side of the workpiece which該湾curved is removal of the removal region where the surface side , The back surface grinding step of grinding the back surface of the work piece to which the substrate is attached to make the work piece a predetermined thickness, and the tangent line between the cutting direction of the cutting blade and the peripheral edge of the work piece. A positioning step of positioning the cutting blade at an angle exceeding 0 degrees, and cutting to remove the planned removal area by rotating the work piece while cutting the cutting blade into the work piece and the substrate. wherein the step, the angle formed between the tangent line of the periphery of the cutting the cutting the cutting direction and the workpiece blades step state, and are less and 90 degrees 5 degrees or more, the cutting process, the While cutting the cutting blade into the workpiece and the substrate, the workpiece is rotated to remove the entire area to be removed in the thickness direction, and the cutting blade in the pre-grinding edge trimming step is cut. The direction is parallel to the tangent line of the peripheral edge of the workpiece .

The angle between the tangent line of the periphery of the cutting the cutting the cutting direction and the workpiece blade process is desirably 5 degrees.
The angle between the tangent line of the periphery of the cutting the cutting the cutting direction and the workpiece blade process is desirably 10 degrees.
The angle between the tangent line of the periphery of the cutting the cutting the cutting direction and the workpiece blade process is desirably 45 degrees.

The angle between the tangent line of the periphery of the cutting the cutting the cutting direction and the workpiece blade process is desirably 90 degrees.

Therefore, the method for processing the workpiece of the present invention has the effect of suppressing the occurrence of chipping.

FIG. 1 is a perspective view showing an example of a work piece to be processed in the work piece processing method according to the first embodiment. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a flowchart showing the flow of the processing method of the workpiece according to the first embodiment. FIG. 4 is a perspective view showing a configuration example of a cutting device used in the method for processing a workpiece according to the first embodiment. FIG. 5 is a side view showing a pre-grinding edge trimming step of the processing method of the workpiece according to the first embodiment. FIG. 6 is a plan view showing a pre-grinding edge trimming step of the processing method of the workpiece according to the first embodiment. FIG. 7 is a side cross-sectional view showing the workpiece after the pre-grinding edge trimming step of the machining method of the workpiece according to the first embodiment. FIG. 8 is a side sectional view showing a substrate sticking step of the processing method of the workpiece according to the first embodiment. FIG. 9 is a side sectional view showing a back surface grinding step of the processing method of the workpiece according to the first embodiment. FIG. 10 is a side sectional view showing a work piece after the back surface grinding step of the work piece processing method according to the first embodiment. FIG. 11 is a plan view showing a positioning step of the processing method of the workpiece according to the first embodiment. FIG. 12 is a side sectional view showing a cutting process of the processing method of the workpiece according to the first embodiment. FIG. 13 is a plan view showing a positioning step of the processing method of the workpiece according to the first modification of the first embodiment. FIG. 14 is a plan view showing a positioning step of the processing method of the workpiece according to the second modification of the first embodiment. FIG. 15 is a diagram showing the size of chipping generated when the angle is changed in the processing method according to the first embodiment. FIG. 16 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 0 degrees. FIG. 17 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 1 degree. FIG. 18 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is set to 2 degrees. FIG. 19 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is set to 3 degrees. FIG. 20 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 5 degrees. FIG. 21 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 10 degrees. FIG. 22 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 45 degrees. FIG. 23 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 90 degrees.

A mode for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The processing method of the workpiece according to the first embodiment will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a work piece to be processed in the work piece processing method according to the first embodiment. FIG. 2 is a cross-sectional view taken along the line II-II in FIG.

In the first embodiment, as shown in FIG. 1, the workpiece W to be processed in the processing method of the workpiece is a disk-shaped semiconductor wafer or an optical device wafer whose base material is silicon, sapphire, gallium, or the like. be. The workpiece W has a disk shape, and the device D is formed in a region partitioned by a plurality of scheduled division lines L formed in a grid pattern on a flat surface WS. A plurality of devices D are formed on the surface WS of the workpiece W. Further, as shown in FIG. 2, the back surface WR on the back side of the front surface WS of the workpiece W is formed flat. As shown in FIG. 2, the workpiece W is provided with a convexly curved curved surface CF on the outer periphery. For this purpose, the workpiece W includes a flat front surface WS, a back surface WR, and a convexly curved curved surface CF. Further, the workpiece W includes an outer peripheral area ER to be removed, which surrounds the area where the plurality of devices D are provided. The planned removal region ER refers to a region provided on the outer periphery of the workpiece W and on which the device D is not formed, and includes at least a curved surface CF.

The processing method of the workpiece according to the first embodiment will be described with reference to the drawings. FIG. 3 is a flowchart showing the flow of the processing method of the workpiece according to the first embodiment. FIG. 4 is a perspective view showing a configuration example of a cutting device used in the method for processing a workpiece according to the first embodiment. FIG. 5 is a side view showing a pre-grinding edge trimming step of the processing method of the workpiece according to the first embodiment. FIG. 6 is a plan view showing a pre-grinding edge trimming step of the processing method of the workpiece according to the first embodiment. FIG. 7 is a side cross-sectional view showing the workpiece after the pre-grinding edge trimming step of the machining method of the workpiece according to the first embodiment. FIG. 8 is a side sectional view showing a substrate sticking step of the processing method of the workpiece according to the first embodiment. FIG. 9 is a side sectional view showing a back surface grinding step of the processing method of the workpiece according to the first embodiment. FIG. 10 is a side sectional view showing a work piece after the back surface grinding step of the work piece processing method according to the first embodiment. FIG. 11 is a plan view showing a positioning step of the processing method of the workpiece according to the first embodiment. FIG. 12 is a side sectional view showing a cutting process of the processing method of the workpiece according to the first embodiment.

In the processing method of the workpiece according to the first embodiment (hereinafter, simply referred to as a processing method), the workpiece W is thinned to a predetermined thickness T (shown in FIG. 10), and the thinned workpiece is thinned. This is a method of removing the area ER to be removed on the outer periphery of W. As shown in FIG. 3, the processing method includes a pre-grinding edge trimming step ST1, a substrate sticking step ST2, a back surface grinding step ST3, a positioning step ST4, and a cutting step ST5. As a processing method, the cutting device 1 which is the processing device shown in FIG. 4 is used in the pre-grinding edge trimming process ST1, the positioning process ST4, and the cutting process ST5.

As shown in FIG. 4, the cutting device 1 includes a chuck table 10 for holding the workpiece W, a cutting means 20 for cutting the workpiece W held on the chuck table 10, a chuck table 10 and cutting. The X-axis moving means 30 that moves the means 20 relative to the X-axis direction parallel to the horizontal direction, and the chuck table 10 and the cutting means 20 move relative to the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction. Control of the Y-axis moving means 40, the Z-axis moving means 50 for moving the chuck table 10 and the cutting means 20 relative to each other in the Z-axis direction orthogonal to both the X-axis direction and the Y-axis direction, and the imaging means 60. It is equipped with means 100.

In the chuck table 10, the workpiece W before machining is placed on the holding surface 10a to hold the workpiece W. The chuck table 10 has a disk shape in which a portion constituting the holding surface 10a is formed of porous ceramic or the like, is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown), and is placed on the holding surface 10a. The work piece W is held by suction. Further, the chuck table 10 is rotated around the axis parallel to the Z-axis direction by the rotation drive source 11.

The X-axis moving means 30 is a machining feeding means for machining and feeding the chuck table 10 in the X-axis direction by moving the chuck table 10 together with the rotation drive source 11 in the X-axis direction. The Y-axis moving means 40 is an indexing feeding means for indexing and feeding the chuck table 10 by moving the cutting means 20 in the Y-axis direction. The Z-axis moving means 50 is a cutting feeding means that cuts and feeds the cutting means 20 by moving the cutting means 20 in the Z-axis direction. The X-axis moving means 30, the Y-axis moving means 40, and the Z-axis moving means 50 have well-known ball screws 31, 41, 51 and ball screws 31, 41, 51 rotatably provided around the axis around the axis. A well-known pulse motor 32, 42, 52 and a well-known guide rail 33, 43, 53 for movably supporting the chuck table 10 or the cutting means 20 in the X-axis direction, the Y-axis direction, or the Z-axis direction are provided.

The cutting means 20 accommodates a spindle motor (not shown) that rotates around an axis parallel to the Y-axis direction, and the spindle motor is accommodated in the Y-axis direction and the Z-axis direction by the Y-axis moving means 40 and the Z-axis moving means 50. It includes a spindle housing 21 to be moved and a cutting blade 22 attached to the spindle motor. The cutting blade 22 is a cutting grindstone formed in an ultra-thin ring shape, and is rotated by a spindle motor around an axis parallel to the Y-axis direction to obtain a workpiece W held by the chuck table 10. It is to be machined. In the first embodiment, the thickness of the cutting blade 22 is 1 mm or more and about 3 mm or less.

The imaging means 60 images the workpiece W held on the chuck table 10 and is arranged at a position parallel to the cutting means 20 in the X-axis direction. In the first embodiment, the imaging means 60 is attached to the spindle housing 21. The imaging means 60 is composed of a CCD camera that images the workpiece W held on the chuck table 10.

The control means 100 controls each of the above-mentioned components of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece W. The control means 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. It is a computer that has and can execute a computer program. The arithmetic processing unit of the control means 100 executes a computer program stored in the ROM on the RAM to generate a control signal for controlling the cutting device 1. The arithmetic processing unit of the control means 100 outputs the generated control signal to each component of the cutting device 1 via the input / output interface device. Further, the control means 100 is connected to a display means (not shown) composed of a liquid crystal display device for displaying a processing operation state, an image, or the like, or an input means used by an operator when registering processing content information or the like. .. The input means is composed of at least one of a touch panel provided on the display means, a keyboard, and the like.

In the pre-grinding edge trimming step ST1, the operator places the back surface WR of the workpiece W on the holding surface 10a of the chuck table 10 of the cutting device 1, and instructs the control means 100 to start machining of the cutting device 1 via the input means. It is carried out by inputting. In the pre-grinding edge trimming step ST1, the control means 100 of the cutting device 1 causes the imaging means 60 to image the workpiece W held on the chuck table 10 and aligns the cutting means 20 with the workpiece W. As shown in FIG. 6, the cutting blade 22 is positioned on the peripheral edge of the workpiece W in the plan view of the cutting device 1. In the pre-grinding edge trimming step ST1, the control means 100 of the cutting device 1 divides the thickness of the cutting blade 22 which is the cutting direction of the cutting blade 22 into two equal parts. The chuck table 10 and the cutting blade 22 of the cutting means 20 are positioned at a position where the angle θ (shown in FIG. 11) formed by the tangent line TG shown by the bisector in FIG. That is, in the pre-grinding edge trimming step ST1, the control means 100 positions the cutting blade 22 and the tangent TG of the peripheral edge of the workpiece W in parallel in the plan view of the cutting device 1.

The angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG at the peripheral edge of the workpiece W divides the thickness of the cutting blade 22 into two halves in the plan view of the cutting device 1. It refers to the angle formed by the straight line SL and the tangent line TG at the position where it overlaps with the cutting edge of the cutting blade 22 in the peripheral edge portion of the workpiece W. In the pre-grinding edge trimming step ST1, the control means 100 rotates the cutting blade 22 of the cutting means 20 and causes the Z-axis moving means 50 to move the cutting blade 22 in the Z-axis direction as shown in FIG. By rotating the chuck table 10 around the axis of the rotation drive source 11 while cutting the cutting blade 22 into the planned removal region ER of the workpiece W by at least a predetermined thickness T, the surface WS side of the workpiece W The workpiece W is subjected to edge trimming to remove the curved surface CF of the above.

As shown in FIG. 8, the substrate sticking step ST2 is a step of sticking the substrate SB to the surface WS side of the workpiece W. The substrate SB is formed in a disk shape made of a hard material. The outer diameter of the substrate SB is slightly larger than the outer diameter of the workpiece W before processing.

The back surface grinding step ST3 is a step of grinding the back surface WR of the workpiece W to which the substrate SB is attached to make the workpiece W a predetermined thickness T. In the back surface grinding step ST3, as shown in FIG. 9, the substrate SB is suction-held on the holding surface 71a of the chuck table 71 of the grinding device 70, and the grinding wheel 72 is brought into contact with the back surface WR of the workpiece W. The chuck table 71 and the grinding wheel 72 are rotated around the axis to grind the back surface WR of the workpiece W. In the back surface grinding step ST3, the workpiece W is thinned until it reaches a predetermined thickness T. As shown in FIG. 10, the workpiece W after the back surface grinding step ST3 has a predetermined thickness T by removing the curved surface CF on the outer circumference over the entire circumference.

In the positioning step ST4, the straight line SL shown by the dotted line in FIG. 11 that bisects the thickness of the cutting blade 22 in the cutting direction of the cutting blade 22 and the tangent line shown by the alternate long and short dash line in FIG. TG is a step of positioning the cutting blade 22 at an angle θ exceeding 0 degrees. In the first embodiment, the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent line TG at the peripheral edge of the workpiece W is 5 degrees or more.

In the positioning step ST4, the operator places the substrate SB attached to the surface WS of the workpiece W, which is shown in the plan view of the cutting apparatus 1 of FIG. 11, on the holding surface 10a of the chuck table 10, and the input means. This is carried out by inputting a machining start instruction of the cutting device 1 to the control means 100 via the above. In the positioning step ST4, the control means 100 of the cutting device 1 causes the image pickup means 60 to image the workpiece W held on the chuck table 10, aligns the cutting means 20 with the workpiece W, and cuts the cutting blade. 22 is placed on the peripheral edge of the workpiece W, and the angle θ formed by the control means 100 of the cutting device 1 between the straight line SL that divides the thickness of the cutting blade 22 into two equal parts and the tangent line TG of the peripheral edge of the workpiece W. The chuck table 10 and the cutting blade 22 of the cutting means 20 are positioned at positions exceeding 0 degrees and 5 degrees or more.

The cutting step ST5 is a step of removing the planned removal region ER from the workpiece W by rotating the workpiece W while cutting the cutting blade 22 into the workpiece W and the substrate SB. In the cutting step ST5, the control means 100 rotates the cutting blade 22 of the cutting means 20 to move the cutting blade 22 to the Z-axis moving means 50 in the Z-axis direction as shown in FIG. 12, and the cutting blade 22 By rotating the chuck table 10 around the axis of the rotation drive source 11 while cutting into the work piece W to be removed area ER and the substrate SB, the work piece W to be removed from the work piece W to the entire circumference. Remove over.

In the machining method according to the first embodiment, in the positioning step ST4, in the plan view of the cutting device 1, the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG at the peripheral edge of the workpiece W is set. The chuck table 10 and the cutting means 20 are positioned at positions exceeding 0 degrees and 5 degrees or more, the cutting blade 22 is cut into the planned removal area ER in the cutting process ST5, and the area to be removed from the workpiece W. Remove the ER. Therefore, it is possible to suppress chipping that occurs on the outer circumference of the workpiece W after removing the planned removal region ER. In particular, when the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG at the peripheral edge of the workpiece W exceeds 0 degrees and is 5 degrees or more, the workpiece W There is almost no chipping on the outer circumference.

As a result, the processing method can remove the planned removal region ER without causing chipping in the workpiece W. Further, it is possible to suppress the turning of the workpiece W from the substrate SB after the back surface grinding step ST3. Therefore, the processing method according to the first embodiment can suppress the occurrence of chipping of the workpiece W while suppressing the turning of the workpiece W from the substrate SB after the back surface grinding step ST3. It has the effect of being able to do it.

In addition, in the machining method according to the first embodiment, the cutting blade 22 is cut into the workpiece W and the substrate SB in the cutting process ST5 to remove the planned removal region ER from the workpiece W. The region ER to be removed can be removed in a slope shape from the work piece W to the substrate SB, and the chemical solution can be uniformly spread during the film forming process.

[Modification example]
The processing method of the workpiece according to the modified example of the first embodiment will be described with reference to the drawings. FIG. 13 is a plan view showing a positioning step of the processing method of the workpiece according to the first modification of the first embodiment. FIG. 14 is a plan view showing a positioning step of the processing method of the workpiece according to the second modification of the first embodiment. In FIGS. 13 and 14, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In the positioning step ST4 of the machining method according to the first embodiment, in the plan view of the cutting device 1, the angle θ formed by the straight line SL that bisects the thickness of the cutting blade 22 and the tangent TG at the peripheral edge of the workpiece W is set. The chuck table 10 and the cutting blade 22 of the cutting means 20 were positioned at positions of 5 degrees or more. The positioning step ST4 of the modification 1 shown in FIG. 13 positions the chuck table 10 and the cutting blade 22 of the cutting means 20 at a position where the angle θ is 45 degrees, and the positioning step ST4 of the modification 2 shown in FIG. 14 is The chuck table 10 and the cutting blade 22 of the cutting means 20 are positioned at a position where the angle θ is 90 degrees. As described above, the processing method of the work piece of the present invention is the tangent line between the straight line SL that bisects the thickness of the cutting blade 22 and the peripheral edge portion of the work piece W in the positioning step ST4 in the plan view of the cutting device 1. The chuck table 10 and the cutting means 20 are positioned at a position where the angle θ formed with the TG exceeds 0 degrees, and the chuck table 10 and the cutting means 20 are preferably positioned at a position where the angle θ is 5 degrees or more and 90 degrees or less. Positioning, more preferably, the chuck table 10 and the cutting means 20 are positioned at a position where the angle θ is 90 degrees.

Next, the inventors of the present invention confirmed the effect of suppressing chipping in the processing method for the workpiece according to the present invention. In the confirmation, the size of chipping generated at the boundary B between the cut region R1 and the uncut surface R2 when the planned removal region ER was removed from the surface WS side of the workpiece W was measured. FIG. 15 is a diagram showing the size of chipping generated when the angle is changed in the processing method according to the first embodiment. FIG. 15 shows the average value of chipping sizes in a diamond shape.

FIG. 16 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 0 degrees. FIG. 17 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 1 degree. FIG. 18 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is set to 2 degrees. FIG. 19 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is set to 3 degrees. FIG. 20 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 5 degrees. FIG. 21 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 10 degrees. FIG. 22 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 45 degrees. FIG. 23 is an enlarged view showing an image of the boundary between the cut region and the uncut region on the surface of the workpiece when the angle is 90 degrees.

According to FIGS. 15 to 23, it was clarified that in the positioning step ST4, the size of chipping can be suppressed as the angle θ gradually becomes larger than 0 degrees. Therefore, according to FIGS. 15 to 23, it was clarified that chipping can be suppressed by setting the angle θ to an angle exceeding 0 degrees in the positioning step ST4. Further, according to FIGS. 15 to 23, it was clarified that chipping does not occur when the angle θ is set to 5 degrees or more in the positioning step ST4. Therefore, according to FIGS. 15 to 23, it was clarified that chipping can be more reliably suppressed by setting the angle θ to 5 degrees or more in the positioning step ST4. Further, according to FIGS. 15 to 23, it was clarified that the chipping can be suppressed more reliably by setting the angle θ to 90 degrees in the positioning step ST4.

The present invention is not limited to the first embodiment, the first modification, and the second modification. That is, it can be modified in various ways without departing from the gist of the present invention. For example, in the present invention, the chuck table 10 and the cutting blade 22 are positioned at positions where the angle θ exceeds 0 degrees, preferably 5 degrees or more, and more preferably 90 degrees even in the pre-grinding edge trimming step ST1. Edge trimming may be applied.

1 Cutting device 10 Chuck table 20 Cutting means 22 Cutting blade 30 X-axis moving means (moving means)
40 Y-axis moving means (moving means)
50 Z-axis moving means (moving means)
100 Control means ER Removal planned area D device SB Substraight SL Straight line (cutting direction)
T Predetermined thickness TG Tangent W Work piece WS Front surface WR Back surface ST2 Substraight attachment process ST3 Back surface grinding process ST4 Positioning process ST5 Cutting process θ Angle

Claims (5)

A disk-shaped workpiece having a plurality of devices formed on the surface and having a curved surface curved in the outer peripheral direction on the outer periphery is thinned to a predetermined thickness, and the outer periphery of the thinned workpiece is thinned. A method for processing a workpiece that removes a region to be removed including the curved surface.
By rotating the chuck table on which the work piece is placed around the axis while cutting the cutting blade into the area to be removed of the work piece by at least a predetermined thickness, the surface side of the work piece is and before grinding the edge trimming step for removing the curved surface of the to be removed region,
A substrate attachment step of attaching a substrate to the surface side of the workpiece from which the curved surface of the area to be removed on the surface side has been removed,
A back surface grinding step of grinding the back surface of the work piece to which the substrate is attached to make the work piece a predetermined thickness, and
The positioning step of positioning the cutting blade at an angle where the cutting direction of the cutting blade and the tangent line of the peripheral edge of the workpiece exceed 0 degrees.
It includes a cutting step of rotating the work piece while cutting the cutting blade into the work piece and the substrate to remove the planned removal area.
The angle between the tangent line of the periphery of the cutting the cutting the cutting direction and the workpiece blades step state, and are less and 90 degrees 5 degrees or more, the cutting process, workpiece and the sub While cutting the cutting blade straight, the workpiece is rotated to remove the entire area to be removed in the thickness direction, and at the same time, the entire area to be removed is removed.
A method for processing an workpiece in which the cutting direction of the cutting blade in the pre-grinding edge trimming step and the tangent line of the peripheral edge of the workpiece are parallel. The processing method for a work piece according to claim 1, wherein the angle formed by the cutting direction of the cutting blade in the cutting step and the tangent line of the peripheral edge portion of the work piece is 5 degrees. The processing method for a work piece according to claim 1, wherein the angle formed by the cutting direction of the cutting blade in the cutting step and the tangent line of the peripheral edge portion of the work piece is 10 degrees. The processing method for a work piece according to claim 1, wherein the angle formed by the cutting direction of the cutting blade in the cutting step and the tangent line of the peripheral edge portion of the work piece is 45 degrees. The processing method for a work piece according to claim 1, wherein the angle formed by the cutting direction of the cutting blade in the cutting step and the tangent line of the peripheral edge portion of the work piece is 90 degrees.

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