JP6489970B2 - Chuck table manufacturing method and processing apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a chuck table that sucks and holds a plate-shaped workpiece, and a processing apparatus using the chuck table.

  When dividing a semiconductor wafer, an optical device wafer, a ceramic package substrate, etc. into a plurality of chips, for example, a circular ring rotated along a planned division line (street) set for these workpieces. A workpiece is cut by cutting a cutting blade.

  Before the cutting blade is cut into the work piece, a dicing tape having a diameter larger than that of the work piece is attached to the work piece, and an annular frame is fixed to the outer peripheral portion of the dicing tape ( For example, see Patent Document 1). Thereby, the dispersion | distribution etc. of the chip | tip formed by the cutting | disconnection of a to-be-processed object can be prevented.

JP 2011-159823 A

  By the way, the above-mentioned dicing tape cannot be used repeatedly and is discarded after use. Therefore, the cost of the dicing tape has been a problem in the conventional processing methods.

  The present invention has been made in view of such problems, and the object thereof is a method for manufacturing a chuck table that can appropriately suck and hold a plate-like workpiece without using a dicing tape, And a processing apparatus using the chuck table.

  According to the present invention, a chuck table that holds a plate-like workpiece divided into a plurality of regions by a scheduled division line on a holding surface, and a processing means that processes the workpiece held on the chuck table; A manufacturing method of a chuck table used in a processing apparatus comprising: a cover step for covering the holding surface of a plate-like porous material having the holding surface with a covering member; and a work piece after performing the cover step After performing the first relief groove forming step for forming the first relief groove corresponding to the planned dividing line of the object on the holding surface and the first relief groove forming step, the resin is supplied to the first relief groove. After the first relief groove sealing step to be cured and the first relief groove sealing step, a second relief groove that is shallower and narrower than the first relief groove is formed along the first relief groove. Second relief groove formation formed in resin The surface of the porous material except for the top surface, a holding region corresponding to the workpiece of the holding surface, and a negative pressure transmission region connected to a suction source and transmitting negative pressure to the holding region of the holding surface. There is provided a method for manufacturing a chuck table, comprising: a surface sealing step for sealing; and a peeling step for peeling the covering member from the holding surface.

  In the present invention, it is preferable that the processing means includes a cutting blade for cutting a workpiece, and in the second clearance groove forming step, the second clearance groove having a width wider than the thickness of the cutting blade is formed.

  Further, according to the present invention, there is provided a processing apparatus using the chuck table manufactured by the method for manufacturing the chuck table, comprising: a support base that supports the chuck table; and a transport unit that transports the chuck table. In addition, the negative pressure transmission region is provided at a position facing the support base and a first negative pressure transmission region connected to the suction path of the support base, and a position contacting the transport means. A second negative pressure transmission region connected to the suction path of the conveying means, and in each of the first negative pressure transmission region and the second negative pressure transmission region, a negative pressure maintaining member comprising a check valve is provided. A processing apparatus is provided, wherein the transport means is configured to transport a workpiece together with the chuck table by applying a negative pressure to the holding region via the second negative pressure transmission region. Is provided.

  In the chuck table manufacturing method according to the present invention, since the chuck table is manufactured using a plate-like porous material, for example, one (or a small number) of suction holes each corresponding to a chip into which a workpiece is divided is provided. Compared with a chuck table or the like provided, a chuck table capable of sucking and holding a chip with a strong force can be realized. That is, according to the present invention, it is possible to manufacture a chuck table that can appropriately suck and hold a plate-like workpiece without using a dicing tape.

  In the chuck table manufacturing method according to the present invention, the chuck table can be manufactured by relatively simple steps such as formation of a relief groove in the porous material and sealing with a resin. In such a case, a user of the processing apparatus can manufacture the chuck table.

It is a perspective view which shows typically the structural example etc. of a chuck table. FIG. 2A is a perspective view schematically showing the cover step, and FIG. 2B is a partial cross-sectional side view schematically showing the first relief groove forming step. 3A is a cross-sectional view schematically showing the first clearance groove sealing step, FIG. 3B is a cross-sectional view schematically showing the peeling step, and FIG. It is a partial cross section side view which shows a planarization step typically. 4A is a partial sectional side view schematically showing the second relief groove forming step, and FIG. 4B is a sectional view schematically showing the surface sealing step. C) is a partial cross-sectional side view schematically showing the structure and the like of a check valve. It is a perspective view showing typically an example of composition of a cutting device (working device) using a chuck table. 6A and 6B are partial cross-sectional side views schematically showing how the chuck table is transported by the transport unit. It is sectional drawing which shows typically the structural example of the chuck table manufactured with the manufacturing method of the chuck table which concerns on a modification.

  Embodiments of the present invention will be described with reference to the accompanying drawings. The manufacturing method of the chuck table according to this embodiment includes a cover step (see FIG. 2A), a first relief groove forming step (see FIG. 2B), and a first relief groove sealing step (FIG. 3A). )), Peeling step (see FIG. 3B), flattening step (see FIG. 3C), second relief groove forming step (see FIG. 4A), and surface sealing step (FIG. 4). (See (B)).

  In the cover step, the first surface (holding surface) of the plate-like porous material is covered with a covering member. In the first clearance groove forming step, a first clearance groove corresponding to a planned division line (street) of the workpiece is formed on the first surface of the porous material. In the first clearance groove sealing step, resin is supplied to the first clearance groove and cured. In the peeling step, the covering member is peeled from the first surface of the porous material.

  In the flattening step, the resin is ground to flatten the first surface side of the porous material. In the second clearance groove forming step, a second clearance groove that is shallower and narrower than the first clearance groove is formed in the resin along the first clearance groove. In the surface sealing step, the surface of the porous material excluding the holding region corresponding to the workpiece on the first surface and the negative pressure transmission region for transmitting the negative pressure to the holding region on the first surface is sealed. . Hereinafter, the manufacturing method of the chuck table according to the present embodiment will be described in detail.

  First, an outline of a chuck table manufactured by the chuck table manufacturing method according to the present embodiment will be described. FIG. 1 is a perspective view schematically showing a configuration example and the like of the chuck table. The chuck table 23 manufactured in the present embodiment is configured to suck and hold a workpiece 31 such as a semiconductor wafer, an optical device wafer, or a ceramic package substrate.

  The workpiece 31 is formed in a disk shape, for example, and one surface thereof is partitioned into a plurality of regions by scheduled division lines (streets) 33 arranged in a lattice pattern. In each region, a device 35 such as an IC, LED, SAW filter or the like is formed. However, the material and shape of the workpiece 31, the arrangement of the division lines 33, the type of the device 35, etc. are not limited.

  The chuck table 23 includes a disk-shaped porous material 1 made of a porous material. The porous material 1 has a substantially flat first surface 1 a that serves as a holding surface of the chuck table 23. In the holding region 1c corresponding to the workpiece 31 on the first surface 1a, relief grooves (the first relief groove 7 and the second relief groove 11) corresponding to the division line 33 of the workpiece 31 are formed. .

  Further, the porous material 1 has a negative pressure transmission region (a first negative pressure transmission region 1d (see FIG. 4B), a second negative pressure transmission region 1e) for transmitting a negative pressure to the holding region 1c. Is formed. The entire surface of the porous material 1 excluding the negative pressure transmission region and the holding region 1c is sealed with a resin 13 or the like. Each negative pressure transmission region is provided with a check valve (negative pressure maintaining member) 15 that prevents backflow of air.

  In the manufacturing method of the chuck table according to the present embodiment, first, a cover step of covering the first surface 1a of the plate-like porous material 1 with a covering member is performed. FIG. 2A is a perspective view schematically showing the cover step. As shown in FIG. 2A, in the cover step, first, a disk-shaped porous material 1 made of porous ceramic, metal, semiconductor, resin or the like is prepared.

  The diameter of the porous material 1 is larger than the diameter of the workpiece 31 to be held. The shape and size of the pores contained in the porous material 1 are arbitrarily set within a range in which the workpiece 31 can be sucked and held appropriately.

  In the cover step, as shown in FIG. 2A, the covering member 3 is attached to the first surface 1a of the porous material 1 serving as the holding surface. As the covering member 3, for example, a UV tape whose adhesive strength is reduced by irradiating with ultraviolet rays can be used. In the present embodiment, the covering member 3 having the same size as the porous material 1 is used. However, the covering member 3 is formed to have a size that covers only the holding region 1c corresponding to the workpiece 31, for example. May be. The covering member 3 should just cover the area | region of the 1st surface 1a corresponding to the area | region in which the device 35 of the workpiece 31 was formed at least.

  After the cover step, a first relief groove forming step for forming the first relief groove 7 corresponding to the division line 33 of the workpiece 31 on the first surface 1a of the porous material 1 is performed. FIG. 2B is a partial cross-sectional side view schematically showing the first clearance groove forming step. This first clearance groove forming step is performed by, for example, the cutting device 2 shown in FIG.

  The cutting device 2 includes a holding table 4 for holding the porous material 1. The holding table 4 is connected to a rotation drive source (not shown) including a motor and the like, and rotates around a rotation axis substantially parallel to the vertical direction. A table moving mechanism (not shown) is provided below the holding table 4, and the holding table 4 moves in the horizontal direction by the table moving mechanism.

  The upper surface of the holding table 4 is a holding surface 4 a that sucks and holds the second surface 1 b side of the porous material 1. A negative pressure of a suction source (not shown) acts on the holding surface 4a through a flow path (not shown) formed inside the holding table 4, and a suction force for sucking the porous material 1 is generated. To do.

  A cutting unit 6 for cutting the porous material 1 is disposed above the holding table 4. The cutting unit 6 includes a spindle housing (not shown) supported by a cutting unit moving mechanism (not shown). A spindle 8 connected to a rotation drive source (not shown) including a motor and the like is accommodated in the spindle housing.

  The spindle 8 rotates around a rotation axis substantially parallel to the horizontal direction by the rotational force transmitted from the rotational drive source, and moves together with the spindle housing by the cutting unit moving mechanism. An annular cutting blade 10 is attached to one end of the spindle 8 exposed to the outside of the spindle housing.

  In the first clearance groove forming step, first, the protective member 5 made of resin or the like is attached to the second surface 1 b of the porous material 1. Next, the protective member 5 affixed to the porous material 1 is brought into contact with the holding surface 4a of the holding table 4 to apply a negative pressure of the suction source. As a result, the porous material 1 is sucked and held by the holding table 4 with the covering member 3 on the first surface 1a side exposed upward.

  Further, the holding table 4 and the cutting unit 6 are relatively moved and rotated so that the cutting blade 10 is aligned with the first clearance groove formation planned line set on the first surface 1 a of the porous material 1. When the workpiece 31 is held by the porous material 1, the first clearance groove formation planned line is set to a position (a position corresponding to the planned division line 33) that overlaps the planned division line 33 of the workpiece 31. .

  Thereafter, the cutting blade 10 is rotated to cut into the covering member 3 and the porous material 1, and the holding table 4 is moved in a direction parallel to the first clearance groove formation planned line. Accordingly, the first clearance groove 7 having a predetermined depth can be formed on the first surface 1 a of the porous material 1. When the above procedure is repeated and the first clearance grooves 7 corresponding to all the division lines 33 are formed, the first clearance groove forming step is completed.

  After the first clearance groove forming step, a first clearance groove sealing step is performed in which resin is supplied to the first clearance groove 7 and cured. FIG. 3A is a cross-sectional view schematically showing the first escape groove sealing step. In the first relief groove sealing step, first, a liquid resin 9 is supplied to each first relief groove 7.

  The supply of the liquid resin 9 to the first relief groove 7 can be performed by any method such as spin coating, dip coating, spray coating, ink jetting, potting and the like. As the liquid resin 9, for example, a photo-curing resin that is cured by light such as ultraviolet rays, a thermosetting resin that is cured by heat, or the like may be used.

  After the liquid resin 9 is supplied to the first escape groove 7, the resin 9 is cured. The curing method of the resin 9 is appropriately selected according to the type of the resin 9. When the liquid resin 9 supplied to the first clearance groove 7 is completely cured, the first clearance groove sealing step ends.

  After the first clearance groove sealing step, a peeling step for peeling the covering member 3 from the first surface 1a of the porous material 1 is performed. FIG. 3B is a cross-sectional view schematically showing the peeling step. For example, when a UV tape is used as the covering member 3, the covering member 3 can be easily peeled off by irradiating ultraviolet rays to reduce the adhesive force.

  As shown in FIG. 3B, there is a possibility that a slight level difference due to the resin 9 exists on the first surface 1 a side of the porous material 1 after the covering member 3 is peeled off. Therefore, after the peeling step, it is desirable to perform a flattening step of grinding the cured resin 9 to flatten the first surface 1a side of the porous material 1. FIG. 3C is a partial cross-sectional side view schematically showing the planarization step.

  The flattening step is performed by, for example, the grinding apparatus 12 shown in FIG. The grinding device 12 includes a holding table 14 for holding the porous material 1. The holding table 14 is connected to a rotation drive source (not shown) including a motor and the like, and rotates around a rotation axis substantially parallel to the vertical direction. A table moving mechanism (not shown) is provided below the holding table 14, and the holding table 14 is moved in the horizontal direction by the table moving mechanism.

  The upper surface of the holding table 14 is a holding surface 14 a that sucks and holds the second surface 1 b side of the porous material 1. A negative pressure of a suction source (not shown) acts on the holding surface 14a through a flow path (not shown) formed inside the holding table 14, and a suction force for sucking the porous material 1 is generated. To do.

  Above the holding table 14, a grinding unit 16 for grinding the resin 9 protruding from the first surface 1 a of the porous material 1 is disposed. The grinding unit 16 includes a spindle housing 18 supported by a grinding unit lifting mechanism (not shown). Inside the spindle housing 18 is accommodated a spindle 20 connected to a rotational drive source (not shown) including a motor and the like.

  The spindle 20 rotates around a rotation axis substantially parallel to the vertical direction by a rotational force transmitted from a rotational drive source. A disc-shaped wheel mount 22 is fixed to the lower end portion of the spindle 20 exposed to the outside of the spindle housing 18.

  A grinding wheel 24 having substantially the same diameter as the wheel mount 22 is mounted on the lower surface of the wheel mount 22. The grinding wheel 24 includes a wheel base 26 made of a metal material such as stainless steel or aluminum. A plurality of grinding wheels 28 are annularly arranged on the lower surface of the wheel base 26.

  In the flattening step, first, the protective member 5 attached to the porous material 1 is brought into contact with the holding surface 14a of the holding table 14 to apply a negative pressure of the suction source. Thus, the porous material 1 is sucked and held by the holding table 14 with the first surface 1a side exposed upward.

  Next, the holding table 14 is moved below the grinding wheel 24. Further, as shown in FIG. 3C, the spindle housing 18 is lowered while rotating the holding table 14 and the grinding wheel 24, respectively. The lowering speed (lowering amount) of the spindle housing 18 is set such that the lower surface of the grinding wheel 28 is pressed against the upper surface of the resin 9 protruding from the first surface 1 a of the porous material 1.

  Thereby, the resin 9 protruding from the first surface 1a of the porous material 1 can be ground and planarized so that the first surface 1a and the resin 9 are flush with each other. When the first surface 1a side of the porous material 1 is flattened to a desired flatness, the flattening step ends. In this planarization step, the first surface 1a of the porous material 1 may be ground at the same time so that the first surface 1a and the resin 9 are completely flush with each other. Further, the flattening step may be omitted when the step due to the resin 9 is not a problem.

  After the flattening step, a second escape groove forming step for forming a second escape groove shallower and narrower than the first escape groove 7 in the resin 9 along the first escape groove 7 is performed. FIG. 4A is a partial cross-sectional side view schematically showing the second clearance groove forming step. This second clearance groove forming step is performed by, for example, the cutting device 32 shown in FIG.

  The cutting device 32 includes a holding table 34 for holding the porous material 1. The holding table 34 is connected to a rotation drive source (not shown) including a motor and the like, and rotates around a rotation axis substantially parallel to the vertical direction. A table moving mechanism (not shown) is provided below the holding table 34, and the holding table 34 is moved in the horizontal direction by the table moving mechanism.

  The upper surface of the holding table 34 is a holding surface 34 a that sucks and holds the second surface 1 b side of the porous material 1. A negative pressure of a suction source (not shown) acts on the holding surface 34a through a channel (not shown) formed in the holding table 34, and a suction force for sucking the porous material 1 is generated. To do.

  A cutting unit 36 for cutting the porous material 1 is disposed above the holding table 34. The cutting unit 36 includes a spindle housing (not shown) supported by a cutting unit moving mechanism (not shown). A spindle 38 connected to a rotation drive source (not shown) including a motor and the like is accommodated in the spindle housing.

  The spindle 38 rotates around a rotation axis substantially parallel to the horizontal direction by a rotational force transmitted from a rotational drive source, and moves together with the spindle housing by a cutting unit moving mechanism. An annular cutting blade 40 is attached to one end of the spindle 38 exposed to the outside of the spindle housing. The cutting blade 40 is thinner than the cutting blade 10 used in the first clearance groove forming step.

  In the second relief groove forming step, first, the protective member 5 attached to the porous material 1 is brought into contact with the holding surface 34a of the holding table 34, and the negative pressure of the suction source is applied. Accordingly, the porous material 1 is sucked and held by the holding table 34 with the first surface 1a side exposed upward. Further, the holding table 34 and the cutting unit 36 are relatively moved and rotated so that the cutting blade 40 is aligned with the resin 9.

  Thereafter, the cutting blade 40 is rotated and cut into the resin 9, and the holding table 34 is moved in a direction parallel to the first clearance groove 7. However, the cutting depth of the cutting blade 40 is set such that the cutting blade 40 does not penetrate the resin 9 (does not reach the bottom of the first escape groove 7). Thereby, the second escape groove 11 which is shallower and narrower than the first escape groove 7 can be formed in the resin 9 along the first escape groove 7. When the above procedure is repeated and the second relief grooves 11 corresponding to all the first relief grooves 7 are formed, the second relief groove forming step ends.

  After the second relief groove forming step, a holding area 1c corresponding to the workpiece 31 on the first surface 1a and a negative pressure transmission area (first negative pressure transmission area 1d, first pressure transmission area) that transmits a negative pressure to the holding area 1c. 2) a surface sealing step for sealing the entire surface of the porous material 1 except for the negative pressure transmission region 1e). FIG. 4B is a cross-sectional view schematically showing the surface sealing step.

  In the surface sealing step, the protective member 5 is first peeled from the second surface 1b of the porous material 1, and then the holding region 1c and the negative pressure transmission region (first negative pressure transmission region 1d, second negative pressure transmission). The region 1e) is covered with a covering member (not shown). As the covering member, the same UV tape as the covering member 3 used in the cover step can be used.

  Next, a liquid resin 13 is supplied to the entire surface of the exposed porous material 1. The resin 13 can be supplied by any method such as spin coating, dip coating, spray coating, ink jetting, potting, etc., as in the first relief groove sealing step. Further, as the resin 13, a resin similar to the resin 9 can be used.

  After supplying the liquid resin 13 to the entire surface of the porous material 1, the resin 13 is cured. The curing method of the resin 13 is appropriately selected according to the type of the resin 13. Thereafter, the covering member covering the holding region 1c and the negative pressure transmission region (the first negative pressure transmission region 1d and the second negative pressure transmission region 1e) is peeled off, and the surface sealing step ends.

  The surface sealing step may be performed after the cover step and before the peeling step (typically, before the first relief groove forming step). In this case, the covering member 3 attached in the cover step can be used in the surface sealing step. Further, the first relief groove sealing step and the surface sealing step can be simultaneously performed to simplify the process.

  Before or after performing the surface sealing step, check valves (negative pressure maintaining members) 15 are provided in the first negative pressure transmission region 1d and the second negative pressure transmission region 1e. FIG. 4C is a partial cross-sectional side view schematically showing the structure of the check valve 15 and the like. 4C illustrates the check valve 15 provided in the second negative pressure transmission region 1e, but the same check valve is also used in the first negative pressure transmission region 1d on the second surface 1b side. 15 is provided upside down.

  As shown in FIG. 4C, the check valve 15 includes a cylindrical casing 17 having openings on the top and bottom. A plug 19 for closing the opening on one side (the lower side in FIG. 4C) is disposed inside the housing 17. The stopper 19 is in close contact with the inner wall surface of the housing 17 by the force of the spring 21. Therefore, as long as the pressure outside the porous material 1 (above the check valve 15) is not sufficiently lower than the pressure inside the porous material 1 (below the check valve 15), air leaks. It is suppressed.

  Next, an example of a processing apparatus using the chuck table 23 manufactured by the chuck table manufacturing method according to the present embodiment will be described. FIG. 5 is a perspective view schematically showing a configuration example of a cutting device (processing device) using the chuck table 23 according to the present embodiment. Note that the chuck table 23 according to the present embodiment can also be used in other processing apparatuses such as a laser processing apparatus.

  As shown in FIG. 5, the cutting device (processing device) 42 includes a base 44 that supports each structure. On the upper surface of the base 44, a rectangular opening 44a that is long in the X-axis direction (front-rear direction, processing feed direction) is formed. In this opening 44a, an X-axis moving table 46, an X-axis moving mechanism (chuck table moving means) (not shown) for moving the X-axis moving table 46 in the X-axis direction, and a dustproof and splashproof covering the X-axis moving mechanism A cover 48 is provided.

  The X-axis movement mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and an X-axis movement table 46 is slidably attached to the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 46, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 46 moves in the X-axis direction along the X-axis guide rail. A chuck table 23 is provided on the X-axis moving table 46 via a support base 50.

  In the vicinity of the opening 44a, a cantilever-like support structure 54 that supports a cutting unit (processing means) 52 for cutting the workpiece 31 is disposed. A cutting unit moving mechanism 56 that moves the cutting unit 52 in the Y-axis direction (left and right direction, indexing feed direction) and the Z-axis direction (vertical direction) is provided on the upper front surface of the support structure 54.

  The cutting unit moving mechanism 56 includes a pair of Y-axis guide rails 58 arranged on the front surface of the support structure 54 and parallel to the Y-axis direction. A Y-axis moving plate 60 constituting the cutting unit moving mechanism 56 is slidably attached to the Y-axis guide rail 58.

  A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 60, and a Y-axis ball screw 62 parallel to the Y-axis guide rail 58 is screwed into the nut portion. Yes. A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 62. When the Y-axis ball screw 62 is rotated by the Y-axis pulse motor, the Y-axis moving plate 60 moves along the Y-axis guide rail 58 in the Y-axis direction.

  A pair of Z-axis guide rails 64 parallel to the Z-axis direction are provided on the surface (front surface) of the Y-axis moving plate 60. A Z-axis moving plate 66 is slidably attached to the Z-axis guide rail 64.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 66, and a Z-axis ball screw 68 parallel to the Z-axis guide rail 64 is screwed into the nut portion. Yes. A Z-axis pulse motor 70 is connected to one end of the Z-axis ball screw 68. If the Z-axis ball screw 68 is rotated by the Z-axis pulse motor 70, the Z-axis moving plate 66 moves in the Z-axis direction along the Z-axis guide rail 64.

  A cutting unit 52 is provided below the Z-axis moving plate 66. The cutting unit 52 includes an annular cutting blade 72 attached to one end of a spindle (not shown). A rotation drive source (not shown) such as a motor is connected to the other end side of the spindle, and rotates the cutting blade 72 mounted on the spindle. A camera 74 that captures an image of the workpiece 31 is installed at a position adjacent to the cutting unit 52.

  In addition, it is desirable to form the 2nd escape groove 11 wider than the cutting blade 72 in the chuck table 23 mentioned above. Thereby, the interference between the cutting blade 72 and the chuck table 23 can be prevented when the workpiece 31 is processed.

  When the Y-axis moving plate 60 is moved in the Y-axis direction by the cutting unit moving mechanism 56, the cutting unit 52 and the camera 74 are moved in the Y-axis direction. Further, if the Z-axis moving plate 66 is moved in the Z-axis direction by the cutting unit moving mechanism 56, the cutting unit 52 and the camera 74 are moved in the Z-axis direction.

  In the vicinity of the opening 44a, a transport unit (transport means) 76 for transporting the chuck table 23 together with the workpiece 11 is provided. 6A and 6B are partial cross-sectional side views schematically showing how the chuck table 23 is transported by the transport unit 76. FIG.

  As shown in FIG. 6A, the support base 50 that supports the chuck table 23 is provided with a suction path 78 that transmits negative pressure. One end of the suction path 78 is connected to a suction source 82 via a valve 80 or the like. The first negative pressure transmission region 1d of the chuck table 23 is formed at a position facing the support base 50. When the chuck table 23 is placed on the support base 50, the first negative pressure transmission region 1d and the suction path 78 are formed. Is connected to the other end of the.

  When the workpiece 31 is held by the chuck table 23, the workpiece 31 is placed on the holding region 1c of the chuck table 23 supported by the support base 50 as shown in FIG. Open 80. Thereby, the negative pressure of the suction source 82 acts on the first negative pressure transmission region 1 d of the chuck table 23 through the suction path 78.

  Since the pressure in the suction path 78 connected to the first negative pressure transmission region 1d is sufficiently lower than the pressure inside the chuck table 23, the stopper of the check valve 15 provided in the first negative pressure transmission region 1d. 19 moves against the force of the spring 21, and a gap is formed between the plug 19 and the inner wall surface of the housing 17. As a result, the pressure inside the chuck table 23 decreases, and the workpiece 31 is sucked and held by the chuck table 23. That is, the workpiece 31 is sucked and held by the chuck table 23 with a negative pressure acting on the holding region 1c via the first negative pressure transmission region 1d.

  In the state where the pressure inside the chuck table 23 is lowered, the plug 19 of the check valve 15 provided in the second negative pressure transmission region 1e is in close contact with the inner wall surface of the housing 17 as described above. Therefore, the negative pressure from the suction source 82 does not leak in the second negative pressure transmission region 1e.

  On the other hand, when the chuck table 23 is transported together with the workpiece 11, the transport unit 76 is first brought into contact with the chuck table 23 as shown in FIG. The transport unit 76 is provided with a suction path 84 that transmits negative pressure. One end side of the suction path 84 is connected to a suction source 88 via a valve 86 and the like.

  A suction pad 90 that contacts the chuck table 23 is provided on the lower surface side of the transport unit 76, and the other end side of the suction path 84 is connected to the suction pad 90. Therefore, as shown in FIG. 6B, when the suction pad 90 of the transport unit 76 is brought into contact with the second negative pressure transmission area 1e of the chuck table 23, the other end side of the suction path 84 and the second negative pressure transmission area. 1e is connected.

  In this state, when the valve 80 is closed and the valve 86 is opened, the negative pressure from the suction source 82 to the first negative pressure transmission region 1 d is cut off, and the negative pressure of the suction source 88 passes through the suction path 84 and the second pressure of the chuck table 23. 2 Acts on the negative pressure transmission region 1e. Thereby, the chuck table 23 can be sucked and held by the transport unit 76 and transported. Since the check valve 15 is provided in the first negative pressure transmission region 1d, the pressure inside the chuck table 23 does not decrease due to leakage from the first negative pressure transmission region 1d.

  In addition, for example, when a temporary gap is generated between the chuck table 23 and the workpiece 31 due to vibration or the like during conveyance and the pressure inside the chuck table 23 increases, the second negative pressure transmission region 1e. The check valve 15 is opened to reduce the pressure inside the chuck table 23 again. That is, the workpiece 31 is sucked and held by the chuck table 23 with a negative pressure acting on the holding area 1c via the second negative pressure transmission area 1e. Therefore, the workpiece 31 can be transported together with the chuck table 23 without dropping off.

  As described above, in the chuck table manufacturing method according to the present embodiment, the chuck table 23 is manufactured using the plate-like porous material 1. For example, the chip 31 is formed by dividing the workpiece 31. Compared with a conventional chuck table or the like having one (or a small number) of corresponding suction holes, a chuck table capable of sucking and holding the divided chips with a strong force can be realized. That is, according to the present embodiment, it is possible to manufacture the chuck table 23 that can appropriately suck and hold the plate-like workpiece 31 without using a dicing tape.

  Further, in the method for manufacturing the chuck table according to the present embodiment, formation of relief grooves (first relief groove 7 and second relief groove 11) in the porous material 1 and sealing with the resins 9 and 13 are relatively simple. Since the chuck table 23 can be manufactured in a simple step, for example, when the chip size is changed, the user of the cutting device (processing device) 42 can also manufacture the chuck table 23.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above-described embodiment, the peeling step is performed after the first clearance groove sealing step, but the separation step is not necessarily performed immediately after the first clearance groove sealing step. For example, after performing the first relief groove sealing step, the second relief groove forming step, and the surface sealing step, a peeling step (also a flattening step as necessary) may be performed. In this case, there is an advantage that the covering member 3 can be used in the surface sealing step.

  Moreover, in the said embodiment, although the porous material 1 is sealed only with the resin 13 in the surface sealing step, the porous material 1 can also be sealed using a base made of metal or the like. FIG. 7 is a cross-sectional view schematically showing a configuration example of a chuck table manufactured by the chuck table manufacturing method according to the modification.

  The chuck table 25 shown in FIG. 7 includes a base 27 made of metal that covers at least a part of the surface of the porous material 1. The base 27 is provided with check valves (negative pressure maintaining members) 15 corresponding to the first negative pressure transmission region 1d and the second negative pressure transmission region 1e of the porous material. The base 27 is bonded to the porous material 1 by the resin 13 that functions as an adhesive. About another part, it may be the same as that of the chuck table 23 of the said embodiment.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

1 Porous material 1a 1st surface (holding surface)
1b Second surface 1c Holding region 1d First negative pressure transmission region (negative pressure transmission region)
1e Second negative pressure transmission region (negative pressure transmission region)
3 Covering member 5 Protection member 7 First relief groove (escape groove)
9 Resin 11 Second relief groove (escape groove)
13 Resin 15 Check valve (negative pressure maintaining member)
17 Housing 19 Plug 21 Spring 23 Chuck Table 25 Chuck Table 27 Base 31 Workpiece 33 Divided Line (Street)
35 Device 2 Cutting Device 4 Holding Table 4a Holding Surface 6 Cutting Unit 8 Spindle 10 Cutting Blade 12 Grinding Device 14 Holding Table 14a Holding Surface 16 Grinding Unit 18 Spindle Housing 20 Spindle 22 Wheel Mount 24 Grinding Wheel 26 Wheel Base 28 Grinding Wheel 32 Cutting device 34 Holding table 34a Holding surface 36 Cutting unit 38 Spindle 40 Cutting blade 42 Cutting device (processing device)
44 Base 44a Opening 46 X-axis moving table 48 Dustproof and drip-proof cover 50 Support base 52 Cutting unit (processing means)
54 Support structure 56 Cutting unit moving mechanism 58 Y-axis guide rail 60 Y-axis moving plate 62 Y-axis ball screw 64 Z-axis guide rail 66 Z-axis moving plate 68 Z-axis ball screw 70 Z-axis pulse motor 72 Cutting blade 74 Camera 76 Transport unit ( Transport means)
78 Suction path 80 Valve 82 Suction source 84 Suction path 86 Valve 88 Suction source 90 Suction pad

Claims (3)

Used in a processing apparatus comprising: a chuck table that holds a plate-like workpiece divided into a plurality of regions by a scheduled division line with a holding surface; and a processing means that processes the workpiece held on the chuck table. A method of manufacturing a chuck table, comprising:
A cover step of covering the holding surface of the plate-like porous material having the holding surface with a covering member;
A first relief groove forming step for forming, on the holding surface, a first relief groove corresponding to the line to be divided of the workpiece after performing the cover step;
After performing the first relief groove forming step, supplying a resin to the first relief groove and curing the first relief groove,
After performing the first relief groove sealing step, a second relief groove forming step for forming a second relief groove shallower and narrower than the first relief groove in the resin along the first relief groove;
A surface that seals the surface of the porous material excluding a holding region corresponding to the workpiece on the holding surface and a negative pressure transmission region that is connected to a suction source and transmits a negative pressure to the holding region of the holding surface. A sealing step;
And a peeling step of peeling the covering member from the holding surface. The processing means includes a cutting blade for cutting a workpiece,
2. The method of manufacturing a chuck table according to claim 1, wherein, in the second relief groove forming step, the second relief groove having a width wider than the thickness of the cutting blade is formed. A processing apparatus using a chuck table manufactured by the method for manufacturing a chuck table according to claim 1 or 2,
A support base for supporting the chuck table;
A conveying means for conveying the chuck table;
The negative pressure transmission region is
A first negative pressure transmission region provided at a position facing the support base and connected to a suction path of the support base;
A second negative pressure transmission region provided at a position in contact with the conveying means and connected to a suction path of the conveying means,
Each of the first negative pressure transmission region and the second negative pressure transmission region is provided with a negative pressure maintaining member including a check valve,
The conveying means is configured to convey a workpiece together with the chuck table by applying a negative pressure to the holding area via the second negative pressure transmission area. .

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