JP6475085B2 - Chip unloading method - Google Patents

Description

  The present invention relates to a chip unloading method for unloading individual chips in which a plate-like workpiece held on a chuck table of a processing apparatus is divided by a processing means.

  In the semiconductor device manufacturing process, devices such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and each region where the devices are formed is partitioned. Individual devices are manufactured by cutting along planned lines. Devices divided in this way are packaged and widely used in electric devices such as mobile phones and personal computers.

  Electrical devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology capable of reducing the size of a semiconductor device package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-Lead Package (QFN) has been put into practical use. This package technology called QFN is a method in which a plurality of devices are provided on a metal plate such as a copper plate in which a plurality of connection terminals corresponding to the connection terminals of the device are formed and the division lines to be divided for each device are formed in a lattice shape. A CSP substrate (package substrate) is formed by integrating the metal plate and the device with a resin portion that is arranged in a matrix and molded with resin from the back side of the device. The package substrate is cut along a planned dividing line to divide the package substrate into individually packaged chip size packages.

  The package substrate is generally cut by a cutting device having a cutting blade having a cutting edge on the outer periphery. In this cutting apparatus, a chuck table in which relief grooves for escaping the cutting blade of the cutting blade are formed in a lattice shape in an area corresponding to the division line and a suction hole is provided in each of a plurality of areas partitioned by the relief grooves. The package substrate is sucked and held on the chuck table, and the package substrate is moved along the planned dividing line by moving the chuck table along the planned dividing line of the package substrate in the cutting feed direction while rotating the cutting blade. And cut into individual chip size packages. In addition, the said chuck table consists of metal plates, such as stainless steel, and coat | covers the holding layer which consists of flexible members, such as rubber | gum, on the surface (for example, refer patent document 1).

  As described above, the chip size packages individually divided by cutting the package substrate along the planned dividing line are accommodated in the accommodating means, and sent to the chip sorting step for sorting the chip size packages.

JP 2013-65603 A

  The above-described package substrate is subjected to an inspection process for inspecting the quality of the chip before being divided into individual chip size packages, and in the case of a defective product, a mark indicating a defect on the resin side which is the back side of the chip size package Is attached. And in the chip selection process, since marks indicating defects on the resin side which is the back surface are detected from the individually divided chip size packages and defective chips are excluded, a considerable amount of time is spent. There is a problem that it is inefficient.

  The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is to provide a chip carry-out method capable of easily selecting defective chips from individually divided chips. .

In order to solve the above main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece, first suction means for applying a suction force to the holding surface of the chuck table, and the chuck A chip divided into a plurality of chips from a processing apparatus comprising: a water supply means for supplying water to the holding surface of the table; and a dividing means for dividing the workpiece held on the holding surface of the chuck table into a plurality of chips A method for carrying out a chip for carrying out
An unloading jig comprising a holding plate having a chip holding portion for holding each chip by suction and a second suction means for applying a suction force to the chip holding portion of the holding plate. An unloading jig preparation step to prepare;
A holding table mounting step of mounting the chip holding portion of the holding plate of the unloading jig so as to face the surface of the workpiece divided into individual chips held by the chuck table;
Actuating the second suction means to apply a suction force to the tip holding portion of the holding plate and blocking the suction force acting on the holding surface of the chuck table by the first suction means. Thus, the work pieces divided into individual chips are sucked and held on the chip holding portion of the holding plate, carried out of the chuck table, and the individual chips sucked and held by the chip holding portion of the holding table are Including a chip unloading step for exposing the back surface,
A chip carrying-out method is provided.

  In the chip unloading step, the suction force acting on the holding surface of the chuck table by the first suction means is shut off, and the water supply means is operated to supply water to the holding surface of the chuck table. Clean the backside of each individual chip.

  The chip carrying-out method according to the present invention includes a chuck table having a holding surface for holding a workpiece, first suction means for applying a suction force to the holding surface of the chuck table, and water for the holding surface of the chuck table. A method of carrying out a plurality of divided chips from a processing apparatus comprising: a water supply means for supplying; and a dividing means for dividing a workpiece held on a holding surface of a chuck table into a plurality of chips. An unloading jig comprising a holding plate provided on the surface with a chip holding part for sucking and holding each of the chips, and a second suction means for applying a suction force to the chip holding part of the holding plate Jig preparation step and placing the chip holding part of the holding plate of the unloading jig facing the surface of the workpiece divided into individual chips held by the chuck table The holding table placing step and the second suction means are operated to apply a suction force to the chip holding portion of the holding plate, and the suction force acting on the holding surface of the chuck table by the first suction means is applied. By cutting off, the work piece divided into individual chips is sucked and held on the chip holding part of the holding plate and carried out of the chuck table, and the back surface of each chip sucked and held by the chip holding part of the holding table is removed. A chip unloading step to be exposed, so that the workpiece divided into a plurality of chips can be reliably unloaded from the chuck table, and the defect attached to the back surface of the plurality of chips divided Can be easily confirmed, and defective chips can be easily eliminated.

  Further, the chip unloading method according to the present invention cuts off the suction force acting on the holding surface of the chuck table by the first suction means in the chip unloading step and operates the water supply means to operate the chuck table. Since the back surface of each divided chip is cleaned by supplying water to the holding surface, it is possible to confirm the mark indicating the defect attached to the back surface of each divided chip sucked and held by the holding plate. It becomes easier. And the good chip | tip hold | maintained at the holding | maintenance plate is conveyed to the next process, However Since the back surface is wash | cleaned as mentioned above, it does not contaminate the next process.

The perspective view of the cutting device as a processing apparatus with which the chip carrying-out method by this invention is implemented. FIG. 2 is a perspective view of a chuck table that holds a workpiece to be equipped in the cutting apparatus shown in FIG. 1. The perspective view and sectional drawing of a package board | substrate as a workpiece divided by the cutting apparatus shown in FIG. 3 shows a state in which an inspection process for inspecting the quality of each device (chip size package) on the package substrate shown in FIG. 3 is performed, and a mark M indicating failure is attached to the back surface of the defective device (chip size package). Perspective view. FIG. 4 is an explanatory view of a dividing step of dividing the package substrate shown in FIG. 3 into individual devices (chip size packages) by the cutting apparatus shown in FIG. 1. FIG. 6 is a perspective view showing a state where devices (chip size packages) that have been divided into individual parts after being subjected to the dividing step shown in FIG. 5 are held on the chuck table shown in FIG. 2. The perspective view of the carrying-out jig comprised according to this invention. The perspective view which shows the state which reversed the holding plate which comprises the carrying-out jig | tool shown in FIG. 7, and faced the surface of the device (chip size package) divided | segmented individually on the chuck table. The perspective view which shows the state reversed again from the state which attracted and hold | maintained the device (chip size package) each divided | segmented on the surface of the holding plate which comprises a carrying-out jig | tool.

  Hereinafter, a preferred embodiment of a chip carrying-out method according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a cutting apparatus as a processing apparatus in which the chip carrying-out method according to the present invention is implemented. A cutting device 2 shown in FIG. 1 includes a device housing 21 having a substantially rectangular parallelepiped shape. In the apparatus housing 21, a chuck table mechanism 3 as a workpiece holding means for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table mechanism 3 includes a rectangular cover table 31 and a chuck table 32 disposed on the cover table 31. As shown in FIG. 2, the chuck table 32 includes a support plate 321 and a holding sheet 322 disposed on the support plate 321. The support plate 321 is formed in a rectangular shape, and at least two positioning holes 321a are provided on the outer peripheral portion. The holding sheet 322 is formed of a flexible member such as rubber, and has a holding surface corresponding to the size of a package substrate as a plate-like workpiece to be described later. In the holding sheet 322, escape grooves 322a for letting off cutting edges of a cutting blade described later are formed in a lattice shape in an area corresponding to a division line provided on a package substrate described later, and the holding sheet 322 is partitioned by the releasing grooves 322a. A plurality of suction holes 322b that are selectively communicated with a first suction unit and a water supply unit, which will be described later, are provided in the plurality of regions. Thus, the support plate 321 provided with a plurality of suction holes 322b and supporting the holding sheet 322 is provided with a suction passage 321b communicating with the plurality of suction holes 322b on one side surface. The suction passage 321 b is connected to the first suction means 35 and the water supply means 36 via a common flexible hose 33 and a switching valve 34. Accordingly, when the flexible hose 33 connected to the suction passage 321b by the switching valve 34 is communicated with the first suction means 35 and the first suction means 35 is operated, a plurality of suctions are made via the flexible hose 33 and the suction passage 321b. A negative pressure acts on the hole 322b, and a suction force acts on the holding surface which is the surface of the holding sheet 322. Further, when the flexible hose 33 connected to the suction passage 321b by the switching valve 34 is communicated with the water supply means 36 and the water supply means 36 is operated, water is supplied to the plurality of suction holes 322b via the flexible hose 33 and the suction passage 321b. Is supplied to the entire holding surface, which is the surface of the holding sheet 322. The chuck table 32 configured in this way is configured to be rotatable by a rotation mechanism (not shown). Further, the chuck table mechanism 3 including the chuck table 32 is configured to be moved in a cutting feed direction (X-axis direction) indicated by an arrow X in FIG.

  A cutting device 2 shown in FIG. 1 includes a spindle unit 4 as a dividing means. The spindle unit 4 is moved in an index feed direction indicated by an arrow Y in FIG. 1 by an index feed means (not shown), and is moved in a cut feed direction indicated by an arrow Z in FIG. 1 by a notch feed means (not shown). ing. The spindle unit 4 as the dividing means is mounted on a moving base (not shown) and is adjusted to move in the direction indicated by the arrow Y as the indexing direction and the direction indicated by the arrow Z as the cutting direction, and the spindle housing The rotary spindle 42 is rotatably supported by 41, and a cutting blade 43 having a cutting edge on the outer periphery mounted on the front end portion of the rotary spindle 42 is provided.

  Further, the cutting device 2 includes an image pickup means 5 for picking up an image of the surface of the workpiece held on the chuck table 32 and detecting a region to be cut by the cutting blade 43. The image pickup means 5 includes an optical system including a microscope and an image pickup device (CCD), and sends the picked up image signal to a control means (not shown).

  Continuing the description with reference to FIG. 1, the apparatus housing 21 has a collection tray for collecting the workpiece cut adjacent to the chuck table 32 positioned at the workpiece attachment / detachment position shown in FIG. 1. 6 is disposed.

Next, a package substrate as a plate-like workpiece to be cut by the above-described cutting apparatus 2 will be described with reference to FIGS. 3 (a) and 3 (b).
A package substrate 7 shown in FIGS. 3A and 3B includes a metal plate 71, a plurality of first division planned lines 711 extending in a predetermined direction on the metal plate 71, and the first division planned lines. A plurality of second division lines 712 extending in a direction orthogonal to 711 are formed in a lattice shape. Devices (chip size packages) 713 are respectively arranged in a plurality of regions partitioned by the first scheduled division line 711 and the second scheduled division line 712, and the device 713 is formed of a synthetic resin from the back side of the metal plate 71. Molded by part 72. The package substrate 7 thus formed is cut along the first scheduled dividing line 711 and the second scheduled dividing line 712 and divided into individually packaged devices 713 (chips).

  The package substrate 7 configured as described above undergoes an inspection process for inspecting the quality of each device (chip size package) 713. If the package substrate 7 is defective, the back surface of the chip size package is shown in FIG. A mark M indicating a defect is attached to the synthetic resin portion 72 side.

  In order to divide the package substrate 7 thus configured into devices 713 (chips) individually packaged using the cutting device 2, the holding sheet of the chuck table 32 constituting the chuck table mechanism 3 of the cutting device 2. The synthetic resin portion 72 side, which is the back side of the package substrate 7, is placed on 322. Then, the switching valve 24 communicates the suction passage 321b with the first suction means 35 via the flexible hose 33 and operates the first suction means 35 so that the holding surface which is the surface of the holding sheet 322 of the chuck table 32 is placed on the holding surface. The package substrate 7 is sucked and held on the holding sheet 322 by applying a suction force (package substrate holding step). Therefore, the package substrate 7 sucked and held on the holding sheet 322 of the chuck table 32 has the metal plate 71 side, which is the surface side, on the upper side.

  When the above-described package substrate holding step is performed, the chuck table mechanism 3 including the chuck table 32 holding the package substrate 7 is moved to a position immediately below the image pickup means 5 by operating a cutting feed means (not shown). When the chuck table 32 constituting the chuck table mechanism 3 is positioned immediately below the image pickup means 5, an alignment operation for detecting a processing region to be cut on the package substrate 7 is executed by the image pickup means 5 and a control means (not shown). In other words, the imaging unit 5 and the control unit (not shown) are arranged such that the position of the first division line 711 formed in a predetermined direction of the package substrate 7 and the cutting blade 43 that cuts along the first division line 711. Image processing such as pattern matching for matching is executed, and the processing region to be cut is aligned. Further, the alignment of the machining area to be cut is similarly performed on the second division line 712 formed in the package substrate 7 and extending in the direction orthogonal to the predetermined direction.

  As described above, when the alignment operation for detecting the machining area to be cut of the package substrate 7 is executed, the chuck table 32 constituting the chuck table mechanism 3 is moved to the cutting area by the cutting blade 43, and FIG. As shown in (a) of FIG. 5, one end of the predetermined first division line 711 is positioned slightly to the right in FIG. Then, the cutting blade 43 is rotated in the direction indicated by the arrow 43a and the notch feeding means (not shown) is operated to cut and feed the cutting blade 43 in the direction indicated by the arrow Z1 to be positioned at the predetermined cutting depth. The cutting depth is set at a position where the outer peripheral edge of the cutting blade 43 reaches an escape groove (not shown) provided in the holding sheet 322 of the chuck table 32. Next, by operating a cutting feed means (not shown), the chuck table mechanism 3 including the chuck table 32 is moved at a predetermined cutting feed speed in the direction indicated by the arrow X1 in FIG. When the other end of the predetermined first scheduled dividing line 711 of the package substrate 7 held on the chuck table 32 reaches the left side slightly below the cutting blade 43 as shown in FIG. In addition to stopping the movement of the chuck table mechanism 3 including 32, the cutting blade 43 is raised in the direction indicated by the arrow Z2, indexed to the first scheduled division line 711 to be cut next, and the cutting operation is repeated. As a result, the package substrate 7 is cut along the first scheduled division line 711 (first cutting step).

  If the first cutting step described above is performed, the chuck table 32 is rotated 90 degrees, and the second division planned line 712 formed on the package substrate 7 held on the chuck table 32 is in the cutting feed direction. It is positioned in the direction indicated by the arrow X, and the cutting operation is performed on the package substrate 7 along all the second scheduled division lines 712 in the same manner as the first cutting step (second cutting step).

  The package substrate 7 that has been subjected to the first cutting step and the second cutting step as described above is cut along the first scheduled division line 711 and the second scheduled division line 712, and is shown in FIG. In this way, it is divided into individual packaged devices 713 (chips). If the first cutting step and the second cutting step are performed in this way, the chuck table mechanism 3 including the chuck table 32 is returned to the workpiece attaching / detaching position shown in FIG. The individually divided and packaged devices 713 (chips) held by the recovery tray are released by the mixed fluid of water and air ejected toward the recovery tray 6 after the suction holding by the chuck table 32 is released. 6 recovered. However, it takes a considerable amount of time to select the defective product with the mark M indicating the defect from the individually divided and packaged devices 713 (chips) collected in the collection tray 6 and is inefficient. Is. Therefore, in order to carry out the individually divided and packaged devices 713 (chips) held on the chuck table 32, they are attached to the synthetic resin portion 72 side which is the back surface of the package substrate 7 as shown in FIG. An unloading jig capable of easily selecting the packaged device 713 (chip) with the mark M indicating the defective is prepared (unloading jig preparing step).

FIG. 7 is a perspective view of an unloading jig for unloading the individually divided and packaged device 713 (chip) from the chuck table 32.
The unloading jig 8 in the illustrated embodiment includes a holding plate 81 for sucking and holding a plurality of individually divided and packaged devices 713 (chips) held by the chuck table 32, and a negative pressure applied to the holding plate 81. The second suction means 82 that causes the holding plate 81 to be operated, the holding member 83 that holds the holding plate 81, and the support legs 84 that support the holding plate 81. The holding plate 81 includes a chip holding portion 811 for sucking and holding the plurality of devices 713 (chips) on the surface 81a. The chip holding portion 811 is individually divided and packaged held on the chuck table 32. A plurality of suction holes 812 corresponding to a plurality of devices 713 (chips) are provided. Thus, a suction passage 813 communicating with the plurality of suction holes 812 is provided on one end face of the holding plate 81 provided with the plurality of suction holes 812 and provided with the chip holding portion 811. A second suction means 82 is connected to the suction passage 813 via a flexible hose 820. Further, on the surface 81 a of the holding plate 81, two positions that fit into two positioning holes 321 a formed in the support plate 321 constituting the chuck table 32 in the outer peripheral region surrounding the chip holding portion 811. A texture pin 814 is provided.

  The gripping member 83 and the support leg 84 will be described with reference to FIG. 8 as well. The gripping member 83 is disposed in the middle in the longitudinal direction on the back surface 81b of the holding plate 81, and the support leg 84 is 4 on the back surface 81b of the holding plate 81. It is arranged at the corner.

The unloading jig 8 in the illustrated embodiment is configured as described above. Hereinafter, a method of unloading the device 713 (chip) individually divided and packaged from the chuck table 32 using the unloading jig 8 will be described. Will be described.
In order to carry out the device 713 (chip) individually divided and packaged as shown in FIG. 6 on the chuck table 32 using the carry-out jig 8, the chuck table mechanism 3 including the chuck table 32 is shown in FIG. Position it at the workpiece attachment / detachment position shown. Next, the holding member 81 of the unloading jig 8 is held and the holding plate 81 is reversed, and the surface 81a of the holding plate 81 is divided and packaged individually held by the chuck table 32 as shown in FIG. It is placed facing the surface of the device 713 (chip) (holding table placing step). At this time, two positioning pins 814 (see FIG. 7) provided on the surface 81a of the holding plate 81 are replaced with two positioning holes 321a (see FIG. 2 and FIG. 2) formed in the support plate 321 constituting the chuck table 32. The holding plate 81 is positioned at an appropriate position by fitting to (see FIG. 6). In this way, when the holding plate 81 is positioned at an appropriate position, the second suction means 82 of the carry-out jig 8 is operated to apply a suction force to the surface of the holding plate 81 so as to be divided and packaged individually. The device 713 (chip) is sucked and held. Then, by connecting the suction passage 321b to the water supply means 36 via the flexible hose 33 by the switching valve 24, the communication between the suction passage 321b and the suction means is interrupted, and the water supply means 36 is operated. Water is supplied to the entire holding surface which is the surface of the holding sheet 322. In this way, the holding surface which is the surface of the holding sheet 322 constituting the chuck table 32 while sucking and holding the devices 713 (chips) individually divided and packaged on the surface of the holding plate 81 constituting the unloading jig 8. If water is supplied to the entire surface, the holding member 83 is held and the holding plate 81 is slightly raised. At this time, since water is supplied to the entire holding surface, which is the surface of the holding sheet 322 constituting the chuck table 32, the device 713 is divided and packaged individually held by the holding plate 81 of the carry-out jig 8. The back surface of the (chip) is washed with the supplied water. Then, the holding plate 81 of the unloading jig 8 holding the individually divided and packaged devices 713 (chips) is unloaded from the chuck table 32, and the holding plate 81 is reversed again to support legs 84 as shown in FIG. Is grounded (chip unloading process). As a result, the individually divided device 713 (chip) sucked and held by the chip holding portion 811 on the front surface 81a of the holding plate 81 is in a state where the synthetic resin portion 72 side which is the back surface is exposed, and the synthetic resin portion The mark M indicating the defect attached to the 72 side can be easily confirmed. At this time, since the back surface of each of the individually divided and packaged devices 713 (chips) sucked and held by the holding plate 81 is cleaned as described above, it is easier to check the mark M indicating a defect. Therefore, after the operation of the suction means 82 of the unloading jig 8 is stopped and the suction holding of the device 713 (chip) by the chip holding portion 811 on the surface 81a of the holding plate 81 is released, a mark M indicating a defect is given. A defective device 713 (chip) can be easily eliminated. If the chip carry-out step is performed, the switching valve 24 blocks communication between the flexible hose 33 connected to the suction passage 321b formed in the support plate 321 constituting the chuck table 32 and the water supply means 36. To do.

  As described above, if the defective devices 713 (chips) in the plurality of devices 713 (chips) held by the chip holding portion 811 on the surface 81a of the holding plate 81 are excluded, they are held by the holding plate 81. The non-defective device 713 (chip) is sent to the next process. The non-defective device 713 (chip) held by the holding plate 81 and transported to the next process is not contaminated in the next process because the back surface is cleaned in the chip unloading process.

2: Cutting device 3: Chuck table mechanism 32: Chuck table 321: Support plate 322: Holding sheet 35: First suction means 36: Water supply means 4: Spindle unit 43: Cutting blade 6: Collection tray 7: Package substrate 713 : Device 8: Unloading jig 81: Holding plate 82: Second suction means 83: Holding member 84: Support leg

Claims (2)

A chuck table having a holding surface for holding a workpiece; first suction means for applying a suction force to the holding surface of the chuck table; water supply means for supplying water to the holding surface of the chuck table; A chip unloading method for unloading a chip divided into a plurality of parts from a processing device comprising a dividing means for dividing a workpiece held on a holding surface of a chuck table into a plurality of chips,
An unloading jig comprising a holding plate having a chip holding portion for holding each chip by suction and a second suction means for applying a suction force to the chip holding portion of the holding plate. An unloading jig preparation step to prepare;
A holding table mounting step of mounting the chip holding portion of the holding plate of the unloading jig so as to face the surface of the workpiece divided into individual chips held by the chuck table;
Actuating the second suction means to apply a suction force to the tip holding portion of the holding plate and blocking the suction force acting on the holding surface of the chuck table by the first suction means. Thus, the work pieces divided into individual chips are sucked and held on the chip holding portion of the holding plate, carried out of the chuck table, and the individual chips sucked and held by the chip holding portion of the holding table are Including a chip unloading step for exposing the back surface,
A method for carrying out a chip.   In the chip unloading step, the suction force acting on the holding surface of the chuck table by the first suction means is interrupted, and the water supply means is operated to supply water to the holding surface of the chuck table. The method of carrying out a chip according to claim 1, wherein the back surface of each of the divided chips is cleaned.