JP6374156B2 - 水平多関節ロボットおよび水平多関節ロボットの製造方法 - Google Patents
水平多関節ロボットおよび水平多関節ロボットの製造方法 Download PDFInfo
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- JP6374156B2 JP6374156B2 JP2013247026A JP2013247026A JP6374156B2 JP 6374156 B2 JP6374156 B2 JP 6374156B2 JP 2013247026 A JP2013247026 A JP 2013247026A JP 2013247026 A JP2013247026 A JP 2013247026A JP 6374156 B2 JP6374156 B2 JP 6374156B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 235000012431 wafers Nutrition 0.000 description 31
- 239000004065 semiconductor Substances 0.000 description 26
- 210000004247 hand Anatomy 0.000 description 20
- 239000003638 chemical reducing agent Substances 0.000 description 16
- 230000007246 mechanism Effects 0.000 description 13
- 230000003028 elevating effect Effects 0.000 description 8
- 230000008602 contraction Effects 0.000 description 7
- 230000032258 transport Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 210000005252 bulbus oculi Anatomy 0.000 description 2
- 210000000707 wrist Anatomy 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000001508 eye Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/14—Arm movement, spatial
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/14—Arm movement, spatial
- Y10S901/17—Cylindrical
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
図1は、本発明の実施の形態にかかる水平多関節ロボット1の斜視図である。図2は、図1に示す水平多関節ロボット1の、アーム6が上昇するとともに伸びている状態の斜視図である。図3は、図1に示す水平多関節ロボット1が使用される半導体製造システム9の概略平面図である。図4は、図1に示す水平多関節ロボット1の側面図である。
以上説明したように、本形態では、第2アーム部17に対する第3アーム部18の回動中心軸の鉛直方向に対する傾き、および、水平方向に対するハンド4、5の搭載面20aの傾きが調整された後に、水準器23の気泡管内の気泡が気泡管に印された基準線の中に収まるように、本体部7に水準器23が取り付けられている。そのため、本形態では、EFEM10の筺体14にロボット1を設置する際に、水準器23の気泡管の中の気泡が基準線の中に収まるようにロボット1を設置することで、ハンド4、5が回動可能に連結される第3アーム部18の第2アーム部17に対する回動中心軸の鉛直方向に対する傾きが適切な傾きとなり、かつ、水平方向に対する搭載面20aの傾きが適切な傾きとなるように、ロボット1を設置することが可能になる。したがって、本形態では、比較的短時間で容易に、かつ、水平方向へハンド4、5が精度良く動作するようにロボット1を筺体14に設置することが可能になる。
上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形実施が可能である。
2 ウエハ(半導体ウエハ、搬送対象物)
4、5 ハンド
6 アーム
7 本体部
17 第2アーム部(第2ハンド側アーム部)
18 第3アーム部(ハンド側アーム部)
20a 搭載面
23 水準器
Claims (4)
- 水平方向にアームが動作する水平多関節ロボットにおいて、
搬送対象物が搭載されるハンドと、前記ハンドがその先端側に回動可能に連結されるハンド側アーム部と前記ハンド側アーム部の基端側がその先端側に回動可能に連結される第2ハンド側アーム部との少なくとも2個のアーム部を有する前記アームと、前記アームの基端側が回動可能に連結される本体部とを備えるとともに、
少なくとも前記第2ハンド側アーム部に対する前記ハンド側アーム部の回動中心軸の鉛直方向に対する傾きが調整された後に、前記本体部に取り付けられた水準器を備えることを特徴とする水平多関節ロボット。 - 前記ハンドには、前記搬送対象物が搭載される搭載面が形成され、
前記水準器は、水平方向に対する前記搭載面の傾きが調整された後に取り付けられていることを特徴とする請求項1記載の水平多関節ロボット。 - 前記水準器は、気泡管を有する気泡管水準器であり、少なくとも前記第2ハンド側アーム部に対する前記ハンド側アーム部の回動中心軸の鉛直方向に対する傾きが調整された後に、前記気泡管内の気泡が前記気泡管に印された基準線の中に収まるように取り付けられていることを特徴とする請求項1または2記載の水平多関節ロボット。
- 搬送対象物が搭載されるハンドと、前記ハンドがその先端側に回動可能に連結されるハンド側アーム部と前記ハンド側アーム部の基端側がその先端側に回動可能に連結される第2ハンド側アーム部との少なくとも2個のアーム部を有するアームと、前記アームの基端側が回動可能に連結される本体部と、前記本体部に取り付けられる水準器とを備え、水平方向に前記アームが動作する水平多関節ロボットの製造方法であって、
少なくとも前記第2ハンド側アーム部に対する前記ハンド側アーム部の回動中心軸の鉛直方向に対する傾きを調整した後に、前記本体部に前記水準器を取り付けることを特徴とする水平多関節ロボットの製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020167002891A KR102294107B1 (ko) | 2013-08-09 | 2014-08-06 | 수평 다관절 로봇 및 수평 다관절 로봇의 제조 방법 |
US14/899,410 US10195743B2 (en) | 2013-08-09 | 2014-08-06 | Horizontal articulated robot and method for manufacturing horizontal articulated robot |
CN201480040746.3A CN105408068B (zh) | 2013-08-09 | 2014-08-06 | 水平多关节机器人以及水平多关节机器人的制造方法 |
PCT/JP2014/070736 WO2015020089A1 (ja) | 2013-08-09 | 2014-08-06 | 水平多関節ロボットおよび水平多関節ロボットの製造方法 |
US15/854,487 US20190001500A1 (en) | 2013-08-09 | 2017-12-26 | Horizontal multi-joint robot and production method for horizontal multi-joint robot |
US16/580,276 US10780586B2 (en) | 2013-08-09 | 2019-09-24 | Horizontal articulated robot with bevel gears |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201361864272P | 2013-08-09 | 2013-08-09 | |
US61/864,272 | 2013-08-09 |
Publications (2)
Publication Number | Publication Date |
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JP2015036183A JP2015036183A (ja) | 2015-02-23 |
JP6374156B2 true JP6374156B2 (ja) | 2018-08-15 |
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Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
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JP2013247026A Active JP6374156B2 (ja) | 2013-08-09 | 2013-11-29 | 水平多関節ロボットおよび水平多関節ロボットの製造方法 |
JP2013247027A Active JP6509487B2 (ja) | 2013-08-09 | 2013-11-29 | 産業用ロボット |
JP2013247028A Active JP6235881B2 (ja) | 2013-08-09 | 2013-11-29 | 産業用ロボット |
JP2013247029A Active JP6607661B2 (ja) | 2013-08-09 | 2013-11-29 | 水平多関節ロボット |
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JP2013247027A Active JP6509487B2 (ja) | 2013-08-09 | 2013-11-29 | 産業用ロボット |
JP2013247028A Active JP6235881B2 (ja) | 2013-08-09 | 2013-11-29 | 産業用ロボット |
JP2013247029A Active JP6607661B2 (ja) | 2013-08-09 | 2013-11-29 | 水平多関節ロボット |
Country Status (4)
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US (4) | US9539727B2 (ja) |
JP (4) | JP6374156B2 (ja) |
KR (2) | KR102294107B1 (ja) |
CN (2) | CN105378908B (ja) |
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US10780586B2 (en) | 2013-08-09 | 2020-09-22 | Nidec Sankyo Corporation | Horizontal articulated robot with bevel gears |
KR102402324B1 (ko) * | 2014-01-28 | 2022-05-26 | 브룩스 오토메이션 인코퍼레이티드 | 기판 이송 장치 |
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- 2014-08-06 CN CN201480040727.0A patent/CN105378908B/zh active Active
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- 2014-08-06 US US14/896,788 patent/US9539727B2/en active Active
- 2014-08-06 CN CN201480040746.3A patent/CN105408068B/zh active Active
- 2014-08-06 US US14/899,410 patent/US10195743B2/en active Active
-
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Also Published As
Publication number | Publication date |
---|---|
CN105408068A (zh) | 2016-03-16 |
JP2015036184A (ja) | 2015-02-23 |
KR20160042880A (ko) | 2016-04-20 |
US20160136819A1 (en) | 2016-05-19 |
KR20160041906A (ko) | 2016-04-18 |
US9539727B2 (en) | 2017-01-10 |
JP6509487B2 (ja) | 2019-05-08 |
CN105378908B (zh) | 2018-07-20 |
US20170008175A1 (en) | 2017-01-12 |
US10213924B2 (en) | 2019-02-26 |
JP2015036183A (ja) | 2015-02-23 |
US20190001500A1 (en) | 2019-01-03 |
JP6607661B2 (ja) | 2019-11-20 |
JP2015036185A (ja) | 2015-02-23 |
JP6235881B2 (ja) | 2017-11-22 |
JP2015036186A (ja) | 2015-02-23 |
KR102294107B1 (ko) | 2021-08-26 |
CN105378908A (zh) | 2016-03-02 |
US20160136818A1 (en) | 2016-05-19 |
CN105408068B (zh) | 2018-01-30 |
KR102277372B1 (ko) | 2021-07-14 |
US10195743B2 (en) | 2019-02-05 |
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