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JP6363508B2 - 樹脂組成物及びその硬化物(1) - Google Patents

樹脂組成物及びその硬化物(1) Download PDF

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Publication number
JP6363508B2
JP6363508B2 JP2014549830A JP2014549830A JP6363508B2 JP 6363508 B2 JP6363508 B2 JP 6363508B2 JP 2014549830 A JP2014549830 A JP 2014549830A JP 2014549830 A JP2014549830 A JP 2014549830A JP 6363508 B2 JP6363508 B2 JP 6363508B2
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Japan
Prior art keywords
compound
resin composition
skeleton
meth
group
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English (en)
Japanese (ja)
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JPWO2014083850A1 (ja
Inventor
伸彦 内藤
伸彦 内藤
潤 木戸場
潤 木戸場
雄一朗 松尾
雄一朗 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Publication of JPWO2014083850A1 publication Critical patent/JPWO2014083850A1/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polyethers (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2014549830A 2012-11-28 2013-11-27 樹脂組成物及びその硬化物(1) Active JP6363508B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012259621 2012-11-28
JP2012259621 2012-11-28
PCT/JP2013/006982 WO2014083850A1 (ja) 2012-11-28 2013-11-27 樹脂組成物及びその硬化物(1)

Publications (2)

Publication Number Publication Date
JPWO2014083850A1 JPWO2014083850A1 (ja) 2017-01-05
JP6363508B2 true JP6363508B2 (ja) 2018-07-25

Family

ID=50827511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014549830A Active JP6363508B2 (ja) 2012-11-28 2013-11-27 樹脂組成物及びその硬化物(1)

Country Status (5)

Country Link
JP (1) JP6363508B2 (zh)
KR (1) KR101999614B1 (zh)
CN (1) CN104813741B (zh)
TW (1) TWI658062B (zh)
WO (1) WO2014083850A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6534540B2 (ja) * 2014-09-27 2019-06-26 アイカ工業株式会社 熱硬化性シート組成物
TWI727026B (zh) * 2016-03-30 2021-05-11 日商Adeka股份有限公司 硬化性組成物,硬化物之製造方法及其硬化物
CN108699320B (zh) * 2016-03-30 2020-11-06 株式会社Adeka 固化性组合物、固化物的制造方法、及其固化物
WO2018106092A1 (ko) 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
TWI668270B (zh) * 2016-12-09 2019-08-11 南韓商Lg化學股份有限公司 封裝組成物
KR102034455B1 (ko) * 2016-12-09 2019-10-21 주식회사 엘지화학 밀봉재 조성물
JP6878076B2 (ja) * 2017-03-24 2021-05-26 日鉄ケミカル&マテリアル株式会社 オキサゾリドン環含有エポキシ樹脂組成物、その製造方法、硬化性樹脂組成物、及び硬化物
KR102658947B1 (ko) * 2017-06-07 2024-04-18 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
KR102625644B1 (ko) * 2017-12-13 2024-01-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 트라이알킬 보란 착물 개시제 및 광산을 함유하는 광학 투명 접착제
EP3800228B1 (en) * 2018-06-12 2024-07-31 Lg Chem, Ltd. Sealant composition
KR20210132001A (ko) * 2019-02-21 2021-11-03 덴카 주식회사 조성물
CN113454182A (zh) * 2019-07-17 2021-09-28 积水化学工业株式会社 有机el显示元件用密封剂
JP2019206717A (ja) * 2019-08-08 2019-12-05 三井化学株式会社 画像表示装置封止材
KR102448613B1 (ko) * 2020-11-23 2022-09-28 솔루스첨단소재 주식회사 수지 조성물
KR20230102200A (ko) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재
KR20230102199A (ko) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재
KR20230102201A (ko) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 고온안정성 에폭시 수지 조성물 및 이를 포함하는 봉지재
KR20240107583A (ko) * 2022-12-30 2024-07-09 솔루스첨단소재 주식회사 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재

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JPS4850231A (zh) 1971-10-27 1973-07-16
JPS4876609A (zh) 1972-01-13 1973-10-15
JP2001081182A (ja) 1999-09-09 2001-03-27 Nippon Shokubai Co Ltd 重合性樹脂および重合性樹脂組成物
JP4655172B2 (ja) 2000-04-27 2011-03-23 日立化成工業株式会社 水酸基含有オキセタン化合物
JP2004111380A (ja) * 2002-08-29 2004-04-08 Toray Ind Inc 有機電界発光素子封止用樹脂組成物、有機電界発光素子及び有機電界発光素子の封止方法
JP4850231B2 (ja) * 2005-01-26 2012-01-11 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤
JP2006236987A (ja) * 2005-01-26 2006-09-07 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP4452683B2 (ja) * 2005-01-26 2010-04-21 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
JP2006307063A (ja) * 2005-04-28 2006-11-09 Idemitsu Kosan Co Ltd エポキシ樹脂組成物及びそれを用いた光学電子部材
JP2007284475A (ja) * 2006-04-12 2007-11-01 Shin Etsu Chem Co Ltd 紫外線硬化型エンドシール材
JP2008059945A (ja) * 2006-08-31 2008-03-13 Nagase Chemtex Corp 電子デバイスの製造方法
JP5153498B2 (ja) * 2008-07-22 2013-02-27 電気化学工業株式会社 樹脂組成物
JP2011021183A (ja) * 2009-06-15 2011-02-03 Sekisui Chem Co Ltd 光硬化性樹脂組成物、有機エレクトロルミネッセンス表示素子用封止剤、及び、有機エレクトロルミネッセンス表示素子
JP5555532B2 (ja) 2010-04-22 2014-07-23 積水化学工業株式会社 有機el素子用封止剤及び有機el素子
WO2012020688A1 (ja) * 2010-08-12 2012-02-16 ダイセル化学工業株式会社 低透湿性樹脂組成物及びその硬化物
JP2012059553A (ja) 2010-09-09 2012-03-22 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子及びその製造方法
EP2439240A1 (en) * 2010-10-06 2012-04-11 Henkel AG & Co. KGaA Radiation curable composition
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤

Also Published As

Publication number Publication date
TW201428025A (zh) 2014-07-16
KR20150090063A (ko) 2015-08-05
TWI658062B (zh) 2019-05-01
CN104813741A (zh) 2015-07-29
CN104813741B (zh) 2018-01-05
WO2014083850A1 (ja) 2014-06-05
KR101999614B1 (ko) 2019-07-12
JPWO2014083850A1 (ja) 2017-01-05

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