JP6097604B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.

  Conventionally, as a technique for attaching an adhesive sheet to a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) in a semiconductor manufacturing process, a pasting apparatus provided with a cutting means for cutting the adhesive sheet into a predetermined shape in front of the pasting means has been proposed. (See Patent Document 1).

JP 2010-40874 A

  However, in the conventional technique such as Patent Document 1, it is necessary to separately provide a cutting means and a pasting means, and there is a problem that the apparatus becomes large.

  The objective of this invention is providing the sheet sticking apparatus and sheet sticking method which can perform a cutting | disconnection and sticking of an adhesive sheet with a simple structure.

In order to achieve such an object, the sheet sticking device according to the present invention is:
A feeding means for feeding out the belt-shaped original sheet;
A cutting means for applying a closed-loop cut to the original sheet with a cutting medium, and forming the inside of the cut as an adhesive sheet;
It is located inside the cutting medium, and includes an attaching means for holding the adhesive sheet and pressing and holding the held adhesive sheet against an adherend.

  Further, the cutting depth of the cutting medium is set deeper than the combined thickness of the adhesive sheet and the adherend, and the cutting means attaches the adhesive sheet to the adherend. At the same time, the adherend is cut in a closed loop shape, and the adherend is cut into the same shape as the adhesive sheet.

Moreover, the sheet sticking method according to the present invention includes:
A process of feeding out a belt-shaped original sheet;
Applying a closed-loop cut to the original sheet with a cutting medium, and forming the inside of the cut as an adhesive sheet;
A step of holding the adhesive sheet inside the cutting medium and pressing and holding the held adhesive sheet on an adherend is performed.

  According to the present invention, since the adhesive sheet is held and stuck to the adherend by the sticking means provided inside the cutting medium, the adhesive sheet can be cut and stuck with a simple configuration.

  The cutting depth of the cutting medium is set longer than the combined thickness of the adhesive sheet and the adherend, and the cutting means cuts the adherend into the same shape as the adhesive sheet at the same time as the adhesive sheet is pasted by the sticking means. By doing so, the adherend and the adhesive sheet can form a patch having the same shape.

The side view of the sheet sticking apparatus which concerns on 1st Embodiment. Operation | movement explanatory drawing of the sheet sticking apparatus which concerns on 1st Embodiment. Explanatory drawing of operation | movement of the cutting medium which concerns on a modification, and a to-be-adhered body.

Hereinafter, a sheet sticking apparatus according to an embodiment of the present invention will be described with reference to FIGS.
Note that the X axis, Y axis, and Z axis in this specification are orthogonal to each other, the X axis and Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Furthermore, in the present embodiment, when viewed from the front direction of FIGS. 1 and 3 parallel to the Y axis, and when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite. Direction, “left” is the X-axis arrow direction, “right” is the opposite direction, “front” is the front direction orthogonal to the Y-axis paper, and “rear” is the opposite direction.

  As shown in FIG. 1, the sheet sticking device 10 of the present invention applies a closed loop-like cut to the original sheet AS by the feeding means 20 for feeding the belt-like original sheet AS and a cutting blade 31 as a cutting medium, and the inside of the cut Cutting means 30 for forming the adhesive sheet AS1 and an attaching means that is located inside the cutting blade 31 and holds the adhesive sheet AS1 and presses and holds the held adhesive sheet AS1 on the wafer WF as an adherend. The self-viscous member 40 is disposed above the support means 50 that supports the wafer WF.

  The feeding means 20 rotates a support shaft 21 that supports the original fabric RS on which the original sheet AS is temporarily attached to the release sheet RL, and a winding shaft 22 that winds up the unnecessary sheet from which the adhesive sheet AS1 has been released from the original fabric RS. A rotation motor 23 is provided as a drive device that can be supported, and a plurality of guide rollers 24.

  The cutting means 30 has a cutting blade 31 formed on a sheet member 35 containing a magnetic material such as metal, and magnetism generating means such as a permanent magnet and an electromagnet inside, and supports the sheet member 35 to support the cutting blade. 31 and the self-viscous member 40 indirectly, the rotation motor 34 as a drive device provided with the output shaft 34A which supports the magnet roller 33 rotatably, and the raw fabric RS is sandwiched therebetween. A receiving roller 32 is provided opposite to the magnet roller 33 and rotatable in a direction opposite to the rotation direction of the magnet roller 33 in synchronization with the magnet roller 33 by a driving device (not shown). Note that the cutting depth L1 of the cutting blade 31, that is, the height from the surface of the self-viscous member 40 to the cutting edge of the cutting blade 31 is equal to or greater than the thickness L2 of the adhesive sheet AS1, and the thickness L2 of the adhesive sheet AS1 and the wafer WF. The thickness is set to be equal to or less than the total thickness L3.

  The self-viscous member 40 is a sheet-like member that is supported by the sheet member 35 and has an adhesive layer formed on the surface facing the adhesive sheets AS1 and AS2, and examples thereof include a self-viscous elastomer and a double-sided adhesive sheet.

  The support means 50 is a drive device including a table 51 that holds the wafer WF, a linear motion motor 52 as a drive device including an output shaft 52A that supports the table 51, and a slider 53A that supports the direct motion motor 52. The linear motor 53 is provided. A suction hole (not shown) is formed on the upper surface of the table 51, and a pressure reduction means such as a pressure reduction pump or a vacuum ejector (not shown) is connected to the suction hole.

  Next, operation | movement of the sheet sticking apparatus 10 is demonstrated. First, the raw fabric RS is set in the feeding means 20 as shown in FIG. When an operation start signal is input via an operation panel (not shown) or the like, the wafer WF is transferred onto the table 51 by a transfer means (not shown), the support means 50 drives a decompression means (not shown), and the wafer WF is moved. Hold by adsorption. Thereafter, when the feeding means 20 drives the rotation motor 23 and feeds the original fabric RS, the cutting means 30 drives the rotation motor 34 and a driving device (not shown), and the magnet roller 33 according to the feeding speed of the original fabric RS. Is rotated counterclockwise, and the receiving roller 32 is rotated clockwise. Thus, the cutting blade 31 cuts the original sheet AS in a closed loop shape at the cutting position P1 where the cutting blade 31 and the receiving roller 32 are closest to each other, and the adhesive sheet AS1 is formed inside the cutting. And the said adhesive sheet AS1 is hold | maintained with the adhesive force of the said self-viscous member 40, and peels from the peeling sheet RL by contact | abutting to the self-viscous member 40 simultaneously with the cutting | disconnection by the cutting blade 31. FIG. After that, as the magnet roller 33 and the receiving roller 32 rotate, the leading end portion of the adhesive sheet AS1 is moved to the affixing position P2 where the cutting blade 31 and the table 51 are closest to each other as shown in FIG. . When it is detected by a detection means such as an optical sensor or an imaging means (not shown) that the leading end of the adhesive sheet AS1 has moved to the sticking position P2, the feeding means 20 stops driving the rotation motor 23, and the cutting means 30 stops driving of the rotation motor 34 and a driving device (not shown).

  Thereafter, the support means 50 drives the linear motion motor 52 and the linear motor 53 to move the right end portion of the wafer WF to the attaching position P2, as indicated by a two-dot chain line in FIG. And the tip of the adhesive sheet AS1 are brought into contact with each other.

  Next, the feeding means 20 drives the rotation motor 23 to feed the raw material RS, and the cutting means 30 drives the rotation motor 34 and a driving device (not shown), and the magnet roller 33 and the receiving roller 32 are rotated in the same manner as described above. Rotate in the direction. Further, the support means 50 drives the linear motor 53 to move the table 51 in the right direction, and presses the adhesive sheet AS1 held by the self-viscous member 40 against the wafer WF as shown in FIG. Affix it. Note that while the adhesive sheet AS1 is being affixed to the wafer WF, the next adhesive sheet AS2 is formed at the cutting position P1, as shown in FIG. 2B.

  When the entire adhesive sheet AS1 is attached to the wafer WF, the support unit 50 drives the linear motion motor 52 and the linear motor 53 to place the table 51 at a predetermined position, and then the adhesive sheet is conveyed by a conveying unit (not shown). The wafer WF with the AS1 attached is transferred to the next process. When the detection means (not shown) detects that the front end of the adhesive sheet AS2 has moved to the application position P2, the feeding means 20 stops driving the rotation motor 23, and the cutting means 30 is connected to the rotation motor 34 and The driving of a driving device (not shown) is stopped. Next, the support means 50 drives the linear motor 52 and the linear motor 53 to move the table 51 to the position indicated by the solid line in FIG. 1, and thereafter repeats the same operation as described above.

  According to the embodiment as described above, since the adhesive sheet AS1 is held by the self-viscous member 40 provided inside the cutting blade 31 and attached to the wafer WF, the formation and application of the adhesive sheet AS1 is performed with a simple configuration. It can be carried out.

The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and can of course be implemented in various modes without departing from the gist of the present invention. is there.
For example, as shown in FIG. 3, a base sheet BS as an adherend having an outer shape or width larger than the outer shape of the adhesive sheet AS1 is prepared, and the cutting depth L1 of the cutting blade 31 is set to the thickness L2 of the adhesive sheet AS1. Is set deeper than the total thickness L4 of the base sheet BS, the adhesive sheet AS1 is pasted to the base sheet BS at the pasting position P2, and at the same time, the base sheet BS is cut in a closed loop shape, The base material sheet BS can be cut into the same shape as the adhesive sheet AS1, and the base material sheet BS and the adhesive sheet AS1 can form the patch AS3 having the same shape.
Further, a laser cutter or a water cutter may be adopted as the cutting medium.
Further, the cutting blade 31 may be directly formed on the magnet roller 33, or the self-viscous member 40 may be directly attached to the magnet roller 33.
Further, the replacement method of the cutting blade 31 and the self-viscous member 40 may be a configuration in which the magnet roller 33 is replaced, or a configuration in which the cutting blade 31 and the self-viscous member 40 can be individually replaced. .
The shapes of the cutting blade 31 and the self-viscous member 40 may be circular, polygonal, elliptical, or the like, and the shape of the self-viscous member 40 may not correspond to the shape of the cutting blade 31. .
Further, the adhering means is composed of a ventilation hole formed inside the cutting medium and a decompression means such as a decompression pump and a vacuum ejector communicating with the ventilation hole, and adsorbs and holds the adhesive sheet AS1 through the ventilation hole, It is good also as a structure which presses and sticks the hold | maintained adhesive sheet AS1 to the wafer WF, or when pressurizing and sticking an adhesive sheet to a to-be-adhered body by making pressurization means, such as a pressure pump and a turbine, communicate with a vent hole In addition, the adhesive sheet AS1 may be pressed against the adherend by ejecting gas through the vent hole.
The sticking means may be constituted by a so-called electrostatic chuck that attracts static electricity.

  Furthermore, the material, type, shape, etc. of the original sheet AS (adhesive sheets AS1, AS2) and adherend in the present invention are not particularly limited. For example, the original sheet AS is not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When the heat-sensitive adhesive original sheet AS is employed, the formed adhesive sheet AS1 is heated. Appropriate heating means may be provided. Moreover, such an original sheet AS is, for example, a single layer having only an adhesive layer, having an intermediate layer between the base sheet and the adhesive layer, having a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. In addition, as an adherend, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or an optical disk, a glass plate, a steel plate, a pottery, a wooden plate, a resin plate, or any other member And articles can also be targeted. It should be noted that the adhesive sheet is replaced with functional and intended readings, for example, any shape such as a label for information description, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. Any sheet, film, tape or the like can be attached to any adherend as described above.

Each means in the present invention is not limited in any way as long as it can perform the operation or function described for those means, and moreover, it is completely limited to the structure of only one embodiment shown in the above embodiment. is not. For example, as long as the feeding means feeds a belt-shaped original sheet, there is no limitation as long as it is within the range in light of the technical common sense at the beginning of the application (the description of other means is omitted). .
Furthermore, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Sheet sticking apparatus 20 ... Feeding means 30 ... Cutting means 31 ... Cutting blade (cutting medium)
40 ... Self-viscous member (sticking means)
AS ... Original sheet AS1 ... Adhesive sheet WF ... Wafer (Substrate)
BS ... Base material sheet (adherence)

Claims (3)

A feeding means for feeding out the belt-shaped original sheet;
A cutting means for applying a closed-loop cut to the original sheet with a cutting medium, and forming the inside of the cut as an adhesive sheet;
An adhesive means that is located inside the cutting medium, holds the adhesive sheet, and presses and holds the held adhesive sheet against an adherend ,
The sticking device sticks the tip of the adhesive sheet to the adherend while the adhesive sheet is being formed . A feeding means for feeding out the belt-shaped original sheet;
A cutting means for applying a closed-loop cut to the original sheet with a cutting medium, and forming the inside of the cut as an adhesive sheet;
An adhesive means that is located inside the cutting medium, holds the adhesive sheet, and presses and holds the held adhesive sheet against an adherend,
The cutting depth of the cutting medium is set deeper than the combined thickness of the adhesive sheet and the adherend, and the cutting means attaches the adhesive sheet to the adherend, while the attaching means attaches the adhesive sheet, the subjecting a cut of a closed loop shape to an adherend, wherein the to Resid over preparative sticking device to disconnect the adherend to the adhesive sheet and the same shape. A process of feeding out a belt-shaped original sheet;
Applying a closed-loop cut to the original sheet with a cutting medium, and forming the inside of the cut as an adhesive sheet;
Holds the adhesive sheet inside of the cutting medium, retained the adhesive sheet and a sticking step of sticking by pressing to the adherend,
In the sticking step, the tip of the adhesive sheet is stuck to the adherend while the adhesive sheet is being formed .

Images