JP5997627B2 - Temporary fixing method of conductive member and solder sheet - Google Patents
Temporary fixing method of conductive member and solder sheet Download PDFInfo
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- JP5997627B2 JP5997627B2 JP2013024547A JP2013024547A JP5997627B2 JP 5997627 B2 JP5997627 B2 JP 5997627B2 JP 2013024547 A JP2013024547 A JP 2013024547A JP 2013024547 A JP2013024547 A JP 2013024547A JP 5997627 B2 JP5997627 B2 JP 5997627B2
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- 229910000679 solder Inorganic materials 0.000 title claims description 224
- 238000000034 method Methods 0.000 title claims description 38
- 238000005476 soldering Methods 0.000 claims description 22
- 230000005484 gravity Effects 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/37147—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4007—Shape of bonding interfaces, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4009—Loop shape
- H01L2224/40095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
この発明は、配線部材である導通部材と電子部品をはんだ付けする際に行う、導通部材とはんだシートの仮止め方法に関するものである。 The present invention relates to a temporary fixing method for a conductive member and a solder sheet, which is performed when a conductive member that is a wiring member and an electronic component are soldered.
近年、電子部品のはんだ付けを効率的に行う方法として、予め、はんだ付けを行う接合箇所にシート状のはんだ（以下、はんだシートと呼ぶ）を設置して、そのはんだシートの上に基板や電子部品、導通部材を置いて、その後、加熱することによってはんだ付けを行う、所謂リフロー方式と呼ばれるはんだ付け方式が実用化されている。そして、例えば、電動車両用に用いられるインバータなどの半導体モジュールを構成する半導体部品と、冷却器や回路基板とのはんだ付けなどに、このはんだ付け方式が用いられている。 In recent years, as a method for efficiently soldering electronic components, a sheet-like solder (hereinafter referred to as a solder sheet) is previously installed at a joint portion to be soldered, and a board or electronic device is placed on the solder sheet. A soldering method called a reflow method, in which a component and a conductive member are placed and then soldered by heating, has been put into practical use. For example, this soldering method is used for soldering a semiconductor component constituting a semiconductor module such as an inverter used for an electric vehicle and a cooler or a circuit board.
このとき、冷却器の上に基板や電子部品、導通部材をはんだ付けするために、必要な電子部品や導通部材、はんだシートを所定の位置に所定の順序で載置する必要がある。 At this time, in order to solder the substrate, the electronic component, and the conductive member on the cooler, it is necessary to place the necessary electronic component, the conductive member, and the solder sheet in a predetermined order at predetermined positions.
例えば、特許文献１に記載された発明では、平形ＩＧＢＴの両面に、それぞれ、はんだシート、金属板（本願発明の導通部材に対応）、はんだシート、絶縁基板を順に載置してはんだ付けによって接続している。 For example, in the invention described in Patent Document 1, a solder sheet, a metal plate (corresponding to the conductive member of the present invention), a solder sheet, and an insulating substrate are placed in this order on both sides of a flat IGBT and connected by soldering. doing.
しかしながら、特許文献１に記載された半導体装置の製造方法によると、平形ＩＧＢＴの両面の所定の位置に、大きさや形状の異なる、金属板や導通部材、はんだシートを確実にはんだ付けするために、これらの部品を正確に載置する必要があった。このとき、単に各部品を載置しただけでは、サイズの小さい導通部材や、そのはんだ接合面に配置したはんだシートにあっては、振動の発生等によって容易にその位置がずれてしまうため、積載された部品の位置がずれないように、位置決めを正確に行って、その状態を保持することができる治具を用いてはんだ付け作業を行う必要があった。また、部品を載置するために、多くの時間を要していた。 However, according to the method for manufacturing a semiconductor device described in Patent Document 1, in order to securely solder metal plates, conductive members, and solder sheets having different sizes and shapes to predetermined positions on both sides of a flat IGBT, It was necessary to place these parts accurately. At this time, simply placing each component will easily shift the position of the conductive member with a small size or the solder sheet placed on the solder joint surface due to the occurrence of vibration. Therefore, it is necessary to perform the soldering operation using a jig capable of accurately positioning and maintaining the state so as not to shift the position of the performed component. In addition, it takes a lot of time to place the parts.
本発明は上記事情に鑑みなされたもので、導通部材と電子部品をはんだ付けする際に、電子部品と導通部材のはんだ接合面の間に挟むはんだシートの位置ずれが発生せず、短時間で部品を載置することができる、導通部材とはんだシートの仮止め方法を提供することを目的とする。 The present invention has been made in view of the above circumstances, and when soldering the conducting member and the electronic component, the position of the solder sheet sandwiched between the solder joint surfaces of the electronic component and the conducting member does not occur, and in a short time. It is an object of the present invention to provide a method for temporarily fixing a conductive member and a solder sheet on which a component can be placed.
本発明に係る導通部材とはんだシートの仮止め方法は、導通部材とはんだシートの位置ずれの発生を防止して、導通部材と電子部品を確実にはんだ付けすることができる導通部材とはんだシートの仮止め方法に関するものである。 The temporary fixing method of the conductive member and the solder sheet according to the present invention prevents the occurrence of displacement between the conductive member and the solder sheet, and can reliably solder the conductive member and the electronic component. It relates to a temporary fixing method.
すなわち、本発明に係る導通部材とはんだシートの仮止め方法は、異なる電子部品とそれぞれはんだ付けされて、前記異なる電子部品同士を接続する導電性を有する導通部材に設けられた、はんだ付けによって接合される接合面を有するはんだ固定部の前記接合面にはんだシートを仮止めする、導通部材とはんだシートの仮止め方法である。
この導通部材とはんだシートの仮止め方法であって、前記接合面の中に、前記接合面に鉛直な方向に延びる壁部を有する少なくとも１つの凹部を形成する工程と、前記はんだ固定部の接合面を、前記凹部がはんだシートの上に重なるように設置する工程と、前記凹部を、前記はんだシートの厚み方向に向かって加圧する工程と、前記壁部に前記加圧された前記はんだシートを接触させて前記凹部の内部にはんだシートを食い込ませ、前記壁部と前記はんだシートとの間に生じる摩擦力により、前記食い込んだはんだシートを前記厚み方向の重力に抗して保持させることで、前記はんだ固定部の接合面に前記はんだシートを仮止めする工程と、からなることを特徴とする。
In other words, the conductive member and the solder sheet temporary fixing method according to the present invention are soldered to different electronic components, and joined by soldering provided to the conductive member that has conductivity to connect the different electronic components. This is a temporary fixing method for a conductive member and a solder sheet, in which a solder sheet is temporarily fixed to the bonding surface of the solder fixing portion having the bonded surface .
A method for temporarily fixing a conductive member and a solder sheet, the method comprising: forming at least one recess having a wall portion extending in a direction perpendicular to the joint surface in the joint surface; and joining the solder fixing portion surface, and a step of installing to overlie the sheet solder said recess, said recess, and a step of pressing toward the thickness direction of the solder sheet, the solder sheet the pressurized to the wall portion By causing the solder sheet to bite into the inside of the concave portion and causing the frictional force generated between the wall portion and the solder sheet to hold the bitten solder sheet against gravity in the thickness direction , And a step of temporarily fixing the solder sheet to the joint surface of the solder fixing portion .
このように構成された導通部材とはんだシートの仮止め方法によれば、導通部材を電子部品に固定するはんだ固定部の中の、導通部材と電子部品とを接合する接合面の中に、接合面に鉛直な方向に延びる壁部を有する少なくとも１つの凹部を形成して、こうして凹部が設けられたはんだ固定部の接合面を、凹部がはんだシートの上に重なるように載置した後、凹部をはんだシートの厚み方向に向かって加圧することによって、加圧された凹部がはんだシートに食い込むことによりはんだシートに圧着されて、圧着によって変形したはんだシートが凹部の壁部に接触することによって、はんだシートと凹部との間に摩擦力が発生し、この摩擦力によって、はんだシートが重力に抗してはんだ固定部に保持されるため、導通部材とはんだシートを一体化することができる。そのため、はんだシートが一体化された導通部材を、はんだ付けする電子部品の上に設置することにより、導通部材とはんだシートの位置ずれを発生させることなく、所定の位置に確実にはんだ付けを行うことができる。また、予めはんだシートを導通部材のはんだ固定部に仮止めしておくことができるため、はんだ付けを行うセラミック基板や電子部品を載置するのに要する時間を短縮することができるため、はんだ付け作業を短時間で行うことができる。 According to the temporary fixing method of the conductive member and the solder sheet configured as described above, in the solder fixing portion for fixing the conductive member to the electronic component, the bonding is performed in the joint surface for bonding the conductive member and the electronic component. Forming at least one concave portion having a wall portion extending in a direction perpendicular to the surface, and placing the joint surface of the solder fixing portion thus provided with the concave portion so that the concave portion overlaps the solder sheet; By pressing the solder sheet in the thickness direction of the solder sheet, the pressed recess is pressed into the solder sheet by biting into the solder sheet, and the solder sheet deformed by the press contact with the wall of the recess, A frictional force is generated between the solder sheet and the recess, and this frictional force holds the solder sheet against the gravity against the solder fixing part. It is possible to the body of. Therefore, by installing the conductive member integrated with the solder sheet on the electronic component to be soldered, the conductive member and the solder sheet are securely soldered at a predetermined position without causing a positional shift. be able to. In addition, since the solder sheet can be temporarily fixed to the solder fixing portion of the conductive member in advance, the time required to place the ceramic substrate or electronic component to be soldered can be shortened. Work can be done in a short time.
さらに、はんだシートが変形して凹部に保持されさえすれば、導通部材と所定の電子部品とをはんだ付けすることができるため、はんだ固定部と同等のサイズのはんだシートを準備する必要はなく、少なくとも凹部と同等のサイズのはんだシートを準備すればよい。すなわち、必要なはんだシートの量を削減することができる。 Furthermore, as long as the solder sheet is deformed and held in the recess, the conductive member and the predetermined electronic component can be soldered, so there is no need to prepare a solder sheet of the same size as the solder fixing portion, What is necessary is just to prepare the solder sheet of the size at least equivalent to a recessed part. That is, the amount of necessary solder sheets can be reduced.
また、本発明に係る導通部材とはんだシートの仮止め方法は、前記凹部が、前記接合面に鉛直な方向に延びる貫通穴によって形成されることを特徴とする。 Moreover, the conducting member and the solder sheet temporary fixing method according to the present invention are characterized in that the recess is formed by a through hole extending in a direction perpendicular to the joint surface.
このように構成された導通部材とはんだシートの仮止め方法によると、凹部が接合面に鉛直な貫通穴によって形成されるため、はんだ固定部をはんだシートの厚み方向に加圧した際に、はんだシートと凹部を構成する壁面との接触面積が増大するため、はんだシートを凹部により一層食い込ませることができ、これによって、はんだシートをより一層確実に保持することができる。 According to the temporary fixing method of the conductive member and the solder sheet configured as described above, since the concave portion is formed by the through hole perpendicular to the joint surface, when the solder fixing portion is pressed in the thickness direction of the solder sheet, Since the contact area between the sheet and the wall surface constituting the recess is increased, the solder sheet can be further digged into the recess, whereby the solder sheet can be more reliably held.
また、本発明に係る導通部材とはんだシートの仮止め方法は、前記凹部が、プレス成型によって形成されるものであることを特徴とする。 Moreover, the temporary fixing method of the conducting member and the solder sheet according to the present invention is characterized in that the concave portion is formed by press molding.
このように構成された導通部材とはんだシートの仮止め方法によれば、凹部がプレス成型によって形成されるため、簡易な設備で容易に凹部を形成することができる。 According to the temporary fixing method of the conductive member and the solder sheet configured as described above, since the concave portion is formed by press molding, the concave portion can be easily formed with simple equipment.
また、本発明に係る導通部材とはんだシートの仮止め方法は、前記凹部が、前記はんだ固定部の辺縁に、前記接合面に沿う方向に櫛刃状に形成されるものであることを特徴とする。 Further, in the temporary fixing method of the conductive member and the solder sheet according to the present invention, the concave portion is formed in a comb-blade shape in a direction along the joint surface on the edge of the solder fixing portion. And
このように構成された導通部材とはんだシートの仮止め方法によれば、凹部がはんだ固定部の辺縁に、接合面に沿う方向に櫛刃状に形成されるため、凹部が設けられたはんだ固定部とはんだシートとを重ねて載置したときに、凹部を構成する壁部とはんだシートとが接触する部位の長さを長く確保することができ、これによって、はんだ固定部をはんだシートの厚み方向に加圧した際に、はんだシートと凹部を構成する壁部との接触面積が増大するため、はんだシートを凹部により一層食い込ませることができ、はんだシートがはんだ固定部に確実に保持されることにより、導通部材とはんだシートの位置決めを確実に行うことができる。 According to the temporary fixing method of the conductive member and the solder sheet configured as described above, the concave portion is formed in a comb-blade shape in the direction along the joint surface on the edge of the solder fixing portion. When the fixed portion and the solder sheet are placed on top of each other, the length of the portion where the wall portion and the solder sheet that make up the concave portion come into contact with each other can be secured long. When the pressure is applied in the thickness direction, the contact area between the solder sheet and the wall that forms the recess increases, so that the solder sheet can be further bite into the recess and the solder sheet is securely held by the solder fixing portion. By doing so, the conducting member and the solder sheet can be reliably positioned.
また、本発明に係る導通部材とはんだシートの仮止め方法は、前記凹部が、前記はんだ固定部の中に、前記接合面に鉛直な方向に向かって多孔状に形成されるものであることを特徴とする。 Further, in the temporary fixing method of the conductive member and the solder sheet according to the present invention, the concave portion is formed in the solder fixing portion in a porous shape in a direction perpendicular to the joint surface. Features.
このように構成された導通部材とはんだシートの仮止め方法によれば、凹部がはんだ固定部の中に、接合面に鉛直な方向に向かって多孔状に形成されるため、凹部が設けられたはんだ固定部とはんだシートとを重ねて載置したときに、凹部を構成する壁部とはんだシートとが接触する部位の長さを長く確保することができ、これによって、はんだ固定部をはんだシートの厚み方向に加圧した際に、はんだシートと凹部を構成する壁部との接触面積が増大するため、はんだシートを凹部により一層食い込ませることができ、はんだシートがはんだ固定部により一層確実に保持されることにより、導通部材とはんだシートの位置決めを確実に行うことができる。 According to the conductive member and the solder sheet temporary fixing method configured as described above, the concave portion is formed in the solder fixing portion in a porous shape in the direction perpendicular to the joint surface, and thus the concave portion is provided. When the solder fixing part and the solder sheet are placed on top of each other, the length of the part where the wall part and the solder sheet that make up the concave portion come into contact with each other can be secured long. When the pressure is applied in the thickness direction, the contact area between the solder sheet and the wall portion that forms the recess increases, so that the solder sheet can be further digged into the recess, and the solder sheet can be more securely attached to the solder fixing portion. By being held, the conducting member and the solder sheet can be reliably positioned.
本発明に係る導通部材とはんだシートの仮止め方法によれば、導通部材によってはんだシートを保持することによって導通部材とはんだシートを一体化して、導通部材とはんだシートの位置ずれの発生を防止することができ、はんだシートと一体化された導通部材を電子部品の所定の位置に配置することによって、導通部材と電子部品を短時間で確実にはんだ付けすることができるという効果が得られる。 According to the temporary fixing method of the conducting member and the solder sheet according to the present invention, the conducting member and the solder sheet are integrated by holding the solder sheet by the conducting member, and the occurrence of the positional deviation between the conducting member and the solder sheet is prevented. In addition, by arranging the conductive member integrated with the solder sheet at a predetermined position of the electronic component, it is possible to reliably solder the conductive member and the electronic component in a short time.
以下、本発明に係る導通部材とはんだシートの仮止め方法の実施例について、図面を参照して説明する。 Embodiments of a temporary fixing method for a conductive member and a solder sheet according to the present invention will be described below with reference to the drawings.
以下、本発明の第１の実施例を、図１から図３を用いて説明する。 Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
本発明の導通部材とはんだシートの仮止め方法を適用して製造された導通部材であるビームリードは、例えば、車載用パワーデバイスのひとつであるインバータの製造に用いられる。 The beam lead, which is a conductive member manufactured by applying the conductive member and the solder sheet temporary fixing method of the present invention, is used, for example, in the manufacture of an inverter that is one of in-vehicle power devices.
図１（ａ）は、インバータのドライブ回路やゲート回路を構成するパワーデバイスの外観を示す。冷却器１０の上面には、複数の基板ＡＳＳＹ２０が、それぞれ、はんだシート３０によって冷却器１０の表面にはんだ付けされて固定されている。 FIG. 1A shows the appearance of a power device that constitutes a drive circuit and a gate circuit of an inverter. On the upper surface of the cooler 10, a plurality of substrates ASSY 20 are respectively soldered and fixed to the surface of the cooler 10 by solder sheets 30.
図１（ｂ）は、基板ＡＳＳＹ２０の詳細な構造を示す。基板ＡＳＳＹ２０は、セラミック基板２２の上面にはんだシート２４を介して、半導体素子であるＩＧＢＴやダイオード等の電子部品２６がはんだ付けされている。そして、電子部品２６の上面には、はんだシート２５を介して、異なる電子部品２６同士を接続して導通させる、例えば銅板で形成された、導電性を有する導通部材であるビームリード２８がはんだ付けされている。 FIG. 1B shows the detailed structure of the substrate assembly 20. In the substrate assembly 20, an electronic component 26 such as an IGBT or a diode as a semiconductor element is soldered to the upper surface of the ceramic substrate 22 via a solder sheet 24. Then, on the upper surface of the electronic component 26, a beam lead 28, which is a conductive member having conductivity, formed of, for example, a copper plate, is soldered by connecting the different electronic components 26 through the solder sheet 25 and conducting them. Has been.
[従来の問題点の説明]
次に、図２を用いて、従来の基板ＡＳＳＹ２０の製造時の問題点を説明する。図２は、図１（ａ）に示した、基板ＡＳＳＹ２０がはんだ付けされた冷却器１０のＡ−Ａ断面図を示す。すなわち、冷却器１０の上面には、はんだシート３０を介して、冷却器１０の上面とセラミック基板２２の下面とがはんだ付けされている。そして、セラミック基板２２の上面には、複数の電子部品２６が実装されて、それぞれ、はんだシート２４によって、セラミック基板２２の上面にはんだ付けされている。さらに、電子部品２６の上面にはビームリード２８が載置されて、はんだシート２５によって電子部品２６の上面にはんだ付けされている。
[Description of conventional problems]
Next, problems in manufacturing the conventional substrate assembly 20 will be described with reference to FIG. FIG. 2 is a cross-sectional view taken along the line AA of the cooler 10 to which the board assembly 20 is soldered as shown in FIG. That is, the upper surface of the cooler 10 and the lower surface of the ceramic substrate 22 are soldered to the upper surface of the cooler 10 via the solder sheet 30. A plurality of electronic components 26 are mounted on the upper surface of the ceramic substrate 22 and soldered to the upper surface of the ceramic substrate 22 by a solder sheet 24, respectively. Further, a beam lead 28 is placed on the upper surface of the electronic component 26 and soldered to the upper surface of the electronic component 26 by a solder sheet 25.
ここで、各部品を図２に示す状態ではんだ付けするには、冷却器１０の所定の位置に、はんだシート３０，セラミック基板２２，はんだシート２４，電子部品２６，はんだシート２５，ビームリード２８を順に載置する必要がある。 Here, in order to solder each component in the state shown in FIG. 2, the solder sheet 30, the ceramic substrate 22, the solder sheet 24, the electronic component 26, the solder sheet 25, and the beam lead 28 are placed at predetermined positions of the cooler 10. Must be placed in order.
このとき、従来は、治具を用いて各部品の位置決めを行っているが、載置する部品の層数が多く、なおかつ各部品の大きさも異なっているため、載置した際の部品の位置精度を保つのが困難であり、部品の位置ずれが発生して、これにより、所定の位置にはんだ付けを行うことができなくなる恐れがあった。また、多くの部品を載置する必要があるため、作業に多くの時間を要していた。 At this time, conventionally, each component is positioned using a jig, but since the number of layers of components to be placed is large and the size of each component is also different, the position of the component when placed It is difficult to maintain accuracy, and there is a possibility that the position of the component may be displaced, which makes it impossible to perform soldering at a predetermined position. Moreover, since it is necessary to mount many parts, work has taken a lot of time.
［実施例１の作用説明］
以下、図３を用いて、実施例１の動作の流れを説明する。
[Explanation of Operation of Example 1]
Hereinafter, the operation flow of the first embodiment will be described with reference to FIG.
まず、図３（ａ）に示すように、ビームリード２８（導通部材）を準備する。ビームリード２８の両端部には、それぞれ、電子部品２６（図２参照）とはんだ付けによって接合される平面状の接合面を有するはんだ固定部２８ａ，２８ｂが形成されている。なお、ここでいう接合面とは、はんだ固定部２８ａ，２８ｂのうち、はんだシート２５を介して電子部品２６とはんだ付けによって接合される面のことである。 First, as shown in FIG. 3A, a beam lead 28 (conductive member) is prepared. At both ends of the beam lead 28, solder fixing portions 28a and 28b each having a planar joining surface joined to the electronic component 26 (see FIG. 2) by soldering are formed. In addition, a joining surface here is a surface joined by soldering with the electronic component 26 via the solder sheet 25 among the solder fixing | fixed part 28a, 28b.
次に、はんだ固定部２８ａ，２８ｂの中に、図３（ｂ）に示すように、櫛刃状の切り欠き部４０ａ，４０ｂ（凹部）がそれぞれ形成される。 Next, as shown in FIG. 3B, comb blade-shaped notches 40a and 40b (concave portions) are formed in the solder fixing portions 28a and 28b, respectively.
この切り欠き部４０ａ，４０ｂは、はんだ固定部２８ａ，２８ｂの辺縁からはんだ付けによって接合される接合面に沿う方向に向けて、櫛刃状に切り込まれており、予め櫛刃状に成型されたプレス部材によって、はんだ固定部２８ａ，２８ｂをプレス加工することにより形成される。こうして成型された櫛刃状の切り欠き部４０ａ，４０ｂ（凹部）を形成する、はんだ固定部２８ａ，２８ｂの厚み方向に延びる面を壁部４１ａ，４１ｂと呼ぶことにする。 The notches 40a and 40b are cut in a comb blade shape from the edges of the solder fixing portions 28a and 28b to a direction along the joint surface to be joined by soldering, and are previously molded into a comb blade shape. The solder fixing portions 28a and 28b are formed by pressing with the pressed member. The surfaces extending in the thickness direction of the solder fixing portions 28a and 28b forming the comb-shaped notches 40a and 40b (concave portions) formed in this way are referred to as wall portions 41a and 41b.
次に、図３（ｃ）に示すように、こうして形成された切り欠き部４０ａ，４０ｂを有するビームリード２８が、固定台５０に載置されたはんだシート２５，２５の上に、切り欠き部４０ａ，４０ｂが重なるようにして載置される。 Next, as shown in FIG. 3C, the beam lead 28 having the notches 40 a and 40 b formed in this way is formed on the solder sheets 25 and 25 placed on the fixing base 50. 40a and 40b are placed so as to overlap.
そして、はんだ固定部２８ａ，２８ｂを、プレス機能を有する設備によって、上部から加圧力Ｆによって加圧する。 And the solder fixing | fixed part 28a, 28b is pressurized with the applied pressure F from the upper part by the installation which has a press function.
このプレス加工によって、ビームリード２８のはんだ固定部２８ａ，２８ｂに設けた切り欠き部４０ａ，４０ｂが、はんだシート２５，２５を加圧することによって、切り欠き部４０ａ，４０ｂ（凹部）を構成する複数の壁部４１ａ，４１ｂがはんだシート２５，２５に圧着して、圧着によって変形したはんだシート２５，２５が切り欠き部４０ａ，４０ｂの壁部４１ａ，４１ｂに接触することによって、はんだシート２５，２５と切り欠き部４０ａ，４０ｂの壁部４１ａ，４１ｂとの間に摩擦力が発生し、この摩擦力によって、はんだシート２５，２５が重力に抗してはんだ固定部２８ａ，２８ｂに保持される By this pressing, the notches 40a and 40b provided in the solder fixing portions 28a and 28b of the beam lead 28 pressurize the solder sheets 25 and 25, thereby forming a plurality of notches 40a and 40b (concave portions). When the wall portions 41a and 41b are pressed against the solder sheets 25 and 25 and the deformed solder sheets 25 and 25 are in contact with the wall portions 41a and 41b of the notches 40a and 40b, the solder sheets 25 and 25 are brought into contact with each other. And the wall portions 41a and 41b of the notches 40a and 40b generate frictional force, and the frictional force holds the solder sheets 25 and 25 to the solder fixing portions 28a and 28b against gravity.
そして、プレス加工が終了すると、図３（ｄ）に示すように、切り欠き部４０ａ，４０ｂの内部にはんだシート２５，２５が食い込むことによって、はんだシート２５，２５を形成していたはんだが、はんだ３５，３５として、ビームリード２８（導通部材）に保持される。 When the press working is completed, as shown in FIG. 3 (d), the solder sheets 25 and 25 are digged into the notches 40a and 40b, so that the solder forming the solder sheets 25 and 25 is The solder 35 is held by the beam lead 28 (conductive member).
このとき、プレス加工による加圧力Ｆが大きいと、はんだシート２５，２５が加圧力Ｆによって剪断されて、切り欠き部４０ａ，４０ｂの内部にのみ、剪断されたはんだ３５，３５が保持される。一方、プレス加工による加圧力Ｆが小さいと、切り欠き部４０ａ，４０ｂの内部にはんだ３５，３５が食い込むことによって保持されるのに加え、はんだ固定部２８ａ，２８ｂの裏面側には、加圧されて変形したはんだシート２５，２５が、剪断されずに保持される。 At this time, if the pressing force F by pressing is large, the solder sheets 25, 25 are sheared by the pressing force F, and the sheared solders 35, 35 are held only inside the notches 40a, 40b. On the other hand, when the pressurizing force F by press working is small, in addition to the solder 35 and 35 being held in the notches 40a and 40b, the back surfaces of the solder fixing portions 28a and 28b are pressurized. The deformed solder sheets 25, 25 are held without being sheared.
なお、はんだ固定部２８ａ，２８ｂの裏面側に、変形したはんだシート２５，２５が保持されていても、保持されていなくても、切り欠き部４０ａ，４０ｂの内部にはんだ３５，３５が食い込むことによって保持されさえすれば、ビームリード２８とはんだシートの仮止めが実行されたものとする。 It should be noted that the solders 35 and 35 bite into the notches 40a and 40b regardless of whether the deformed solder sheets 25 and 25 are held on the back surfaces of the solder fixing portions 28a and 28b. It is assumed that the beam lead 28 and the solder sheet are temporarily fixed as long as they are held by the above.
そして、切り欠き部４０ａ，４０ｂの中に、少なくともはんだ３５，３５が保持されたビームリード２８は、冷却器１０の所定の位置に、冷却器１０の側から、はんだシート３０，セラミック基板２２，はんだシート２４，電子部品２６の順に載置された、異なる電子部品２６，２６の上に架け渡すように載置される（図２参照）。そして、リフローはんだ付けを行う代表的な装置である真空リフローはんだ付け装置に投入されて加熱され、多層一括はんだ付けが行われる。 The beam lead 28 in which at least the solders 35 and 35 are held in the notches 40a and 40b is placed in a predetermined position of the cooler 10 from the cooler 10 side, and the solder sheet 30, the ceramic substrate 22, The solder sheet 24 and the electronic component 26 are placed in this order so as to be bridged over different electronic components 26 and 26 (see FIG. 2). And it puts into the vacuum reflow soldering apparatus which is a typical apparatus which performs reflow soldering, is heated, and multilayer batch soldering is performed.
［切り欠き部の形状の変形例の説明］
切り欠き部４０ａ，４０ｂの形状は、図３に示した櫛刃状に限定されるものではない。
[Description of modified shape of notch]
The shape of the notches 40a and 40b is not limited to the comb blade shape shown in FIG.
図４（ａ），（ｂ）は、切り欠き部の別の形状の一例を示すものである。ずなわち、図４（ａ）に示す切り欠き部４２ａ，４２ｂは、はんだ固定部２８ａ，２８ｂの中に、多孔状に形成されている。 4A and 4B show an example of another shape of the notch. That is, the notches 42a and 42b shown in FIG. 4A are formed in the solder fixing portions 28a and 28b in a porous shape.
図４（ａ）に示した、切り欠き部４２ａ，４２ｂを有するビームリード２８によっても、図３（ｄ）と同様にして、切り欠き部４２ａ，４２ｂの辺縁を構成する壁部４３ａ，４３ｂに、圧着されたはんだシート２５を食い込ませることによって接触させて、この接触によって発生する摩擦力によって、はんだシート２５を保持することができる。 Also by the beam lead 28 having the notches 42a and 42b shown in FIG. 4A, the wall portions 43a and 43b constituting the edges of the notches 42a and 42b in the same manner as in FIG. Then, the solder sheet 25 can be held by the frictional force generated by the contact of the solder sheet 25 that has been crimped by biting.
特に、図４（ａ）に示すように多孔状の切り欠き部４２ａ，４２ｂが形成されていると、はんだ固定部２８ａ，２８ｂをはんだシート２５に圧着したときに、切り欠き部４２ａ，４２ｂの辺縁を構成する壁部４３ａ，４３ｂとはんだシート２５との接触部位の長さが増大するため、はんだシート２５が切り欠き部４２ａ，４２ｂに食い込んだときに、はんだシート２５と壁部４３ａ，４３ｂとの接触面積がより大きくなり、これによって大きな摩擦力が発生して、はんだシート２５をより確実に保持することができる。 In particular, when the porous notches 42a and 42b are formed as shown in FIG. 4A, when the solder fixing portions 28a and 28b are pressure-bonded to the solder sheet 25, the notches 42a and 42b Since the length of the contact portion between the wall portions 43a and 43b constituting the edge and the solder sheet 25 increases, when the solder sheet 25 bites into the notches 42a and 42b, the solder sheet 25 and the wall portions 43a, The contact area with 43b becomes larger, thereby generating a large frictional force, and the solder sheet 25 can be held more reliably.
また、図４（ｂ）に示す切り欠き部４４ａ，４４ｂは、はんだ固定部２８ａ，２８ｂの中に、長孔形状を有するように形成されている。 Further, the notches 44a and 44b shown in FIG. 4B are formed in the solder fixing portions 28a and 28b so as to have a long hole shape.
図４（ｂ）に示した、切り欠き部４４ａ，４４ｂを有するビームリード２８によっても、図３（ｄ）と同様にして、切り欠き部４２ａ，４２ｂの辺縁を構成する壁部４５ａ，４５ｂに、圧着されたはんだシート２５を食い込ませることによって接触させて、この接触によって発生する摩擦力によって、はんだシート２５を保持することができる。 Also by the beam lead 28 having the cutout portions 44a and 44b shown in FIG. 4B, the wall portions 45a and 45b constituting the edges of the cutout portions 42a and 42b in the same manner as in FIG. Then, the solder sheet 25 can be held by the frictional force generated by the contact of the solder sheet 25 that has been crimped by biting.
図４（ｂ）に示す切り欠き部４４ａ，４４ｂが形成されていると、はんだ固定部２８ａ，２８ｂをはんだシート２５に圧着したときに、切り欠き部４４ａ，４４ｂの辺縁を構成する壁部４５ａ，４５ｂとはんだシート２５との接触部位の長さが増大するため、はんだシート２５が切り欠き部４４ａ，４４ｂに食い込んだときに、はんだシート２５と壁部４５ａ，４５ｂとの接触面積がより大きくなり、これによって大きな摩擦力が発生して、はんだシート２５をより確実に保持することができる。 When the notches 44a and 44b shown in FIG. 4B are formed, when the solder fixing portions 28a and 28b are pressure-bonded to the solder sheet 25, wall portions constituting the edges of the notches 44a and 44b are formed. Since the length of the contact part between 45a and 45b and the solder sheet 25 increases, when the solder sheet 25 bites into the notches 44a and 44b, the contact area between the solder sheet 25 and the wall parts 45a and 45b becomes larger. As a result, a large frictional force is generated, and the solder sheet 25 can be held more reliably.
以上、説明したように、実施例１に係る導通部材とはんだシートの仮止め方法によれば、異なる電子部品２６，２６とそれぞれはんだ付けされて、異なる電子部品同士を接続する導電性を有するビームリード２８（導通部材）に設けられた、はんだ付けによって接合される接合面を有するはんだ固定部２８ａ，２８ｂの接合面の中に、接合面に鉛直な方向に延びる壁部４１ａ，４１ｂを有する少なくとも１つの切り欠き部４０ａ，４０ｂ（凹部）を形成して、こうして切り欠き部４０ａ，４０ｂが設けられたはんだ固定部２８ａ，２８ｂの接合面を、切り欠き部４０ａ，４０ｂがはんだシート２５の上に重なるように載置した後、切り欠き部４０ａ，４０ｂをはんだシート２５の厚み方向に向かって加圧することによって、加圧された切り欠き部４０ａ，４０ｂがはんだシート２５に圧着されて、圧着によって変形したはんだシート２５が切り欠き部４０ａ，４０ｂの壁部４１ａ，４１ｂに接触することによって、はんだシート２５と切り欠き部４０ａ，４０ｂとの間に摩擦力が発生し、この摩擦力によって、はんだシート２５が重力に抗してはんだ固定部２８ａ，２８ｂに保持されるため、ビームリード２８（導通部材）とはんだシート２５を一体化することができる。そのため、はんだシート２５が一体化されたビームリード２８を、はんだ付けする電子部品２６の上に設置することによって、ビームリード２８とはんだシート２５、およびはんだシート２５と電子部品２６の位置ずれを発生させることなく、所定の位置に確実にはんだ付けを行うことができる。また、予めはんだシート２５をビームリード２８のはんだ固定部２８ａ，２８ｂに仮止めしておくことができるため、はんだ付けを行うセラミック基板２２や電子部品２６を載置するのに要する時間を短縮することができるため、はんだ付け作業を短時間で行うことができる。 As described above, according to the conductive member and the solder sheet temporary fixing method according to the first embodiment, the different electronic components 26 and 26 are respectively soldered and the conductive beams connecting the different electronic components are connected. At least wall portions 41a and 41b extending in a direction perpendicular to the joint surface are provided in the joint surfaces of the solder fixing portions 28a and 28b having joint surfaces to be joined by soldering provided on the lead 28 (conduction member). One notch 40a, 40b (concave portion) is formed, and thus the joint surface of the solder fixing portion 28a, 28b provided with the notch 40a, 40b is formed on the solder sheet 25. After being placed so as to overlap, the notches 40a and 40b are pressed in the thickness direction of the solder sheet 25, thereby pressing the notches When the portions 40a and 40b are crimped to the solder sheet 25 and the solder sheet 25 deformed by the crimping contacts the wall portions 41a and 41b of the notches 40a and 40b, the solder sheet 25 and the notches 40a and 40b A frictional force is generated between them, and the soldering sheet 25 is held by the solder fixing portions 28a, 28b against the gravity by this frictional force, so that the beam lead 28 (conducting member) and the soldering sheet 25 are integrated. be able to. For this reason, the beam lead 28 in which the solder sheet 25 is integrated is placed on the electronic component 26 to be soldered, so that the beam lead 28 and the solder sheet 25 and the solder sheet 25 and the electronic component 26 are displaced. Therefore, soldering can be reliably performed at a predetermined position. Further, since the solder sheet 25 can be temporarily fixed to the solder fixing portions 28a and 28b of the beam lead 28 in advance, the time required for placing the ceramic substrate 22 and the electronic component 26 to be soldered is shortened. Therefore, the soldering operation can be performed in a short time.
さらに、はんだシート２５が変形して切り欠き部４０ａ，４０ｂに食い込むことによって保持されさえすればビームリード２８と電子部品２６をはんだ付けすることができるため、はんだ固定部２８ａ，２８ｂと同等のサイズのはんだシート２５を準備する必要はない。すなわち、はんだシート２５が加圧されたときに、最低限切り欠き部４０ａ，４０ｂを包含する面積を有していれば、はんだシート２５をビームリード２８に仮止めすることができる。したがって、必要なはんだシートの量を削減することができる。 Furthermore, since the beam lead 28 and the electronic component 26 can be soldered as long as the solder sheet 25 is deformed and held by biting into the notches 40a and 40b, the size equivalent to the solder fixing portions 28a and 28b. It is not necessary to prepare the solder sheet 25. That is, when the solder sheet 25 is pressed, the solder sheet 25 can be temporarily fixed to the beam lead 28 as long as it has an area that includes at least the notches 40a and 40b. Therefore, the amount of necessary solder sheets can be reduced.
また、実施例１に係る導通部材とはんだシートの仮止め方法によれば、切り欠き部４０ａ，４０ｂ，４２ａ，４２ｂ，４４ａ，４４ｂが、はんだ固定部２８ａ，２８ｂの中に、ビームリード２８と電子部品２６をはんだ付けする際の接合面に鉛直に延びる貫通穴によって形成されているため、はんだ固定部２８ａ，２８ｂをはんだシート２５の厚み方向に加圧した際に、はんだシート２５と切り欠き部４０ａ，４０ｂ，４２ａ，４２ｂ，４４ａ，４４ｂを構成する壁面４１ａ，４１ｂ，４３ａ，４３ｂ，４５ａ，４５ｂとの接触面積が増大するため、はんだシート２５を切り欠き部４０ａ，４０ｂ，４２ａ，４２ｂ，４４ａ，４４ｂにより一層食い込ませることができ、はんだ固定部２８ａ，２８ｂによって、はんだシート２５をより一層確実に保持することができる。 In addition, according to the temporary fixing method of the conductive member and the solder sheet according to the first embodiment, the notches 40a, 40b, 42a, 42b, 44a, 44b are connected to the beam leads 28 in the solder fixing portions 28a, 28b. Since the electronic component 26 is formed by a through hole extending vertically on the joint surface when soldering the electronic component 26, when the solder fixing portions 28 a and 28 b are pressed in the thickness direction of the solder sheet 25, the solder sheet 25 and the notch are notched. Since the contact area with the wall surfaces 41a, 41b, 43a, 43b, 45a, 45b constituting the portions 40a, 40b, 42a, 42b, 44a, 44b is increased, the solder sheet 25 is notched 40a, 40b, 42a, 42b. , 44a and 44b, and the solder fixing portions 28a and 28b further secure the solder sheet 25. It can be held to.
また、実施例１に係る導通部材とはんだシートの仮止め方法によれば、切り欠き部４０ａ，４０ｂがプレス成型によって形成されるため、簡易な設備で容易に切り欠き部４０ａ，４０ｂを形成することができる。 In addition, according to the temporary fixing method of the conductive member and the solder sheet according to the first embodiment, the cutout portions 40a and 40b are formed by press molding. Therefore, the cutout portions 40a and 40b are easily formed with simple equipment. be able to.
さらに、実施例１に係る導通部材とはんだシートの仮止め方法によれば、切り欠き部４０ａ，４０ｂがはんだ固定部２８ａ，２８ｂの辺縁に櫛刃状に形成されるため、切り欠き部４０ａ，４０ｂを構成する壁部４１ａ，４１ｂとはんだシート２５とが接触する部位の長さを長く確保することができ、これによって、加圧されたはんだ固定部２８ａ，２８ｂの切り欠き部４０ａ，４０ｂを構成する壁部４１ａ，４１ｂとはんだシート２５との接触面積が増大するため、はんだシート２５を切り欠き部４０ａ，４０ｂにより一層食い込ませることができ、はんだシート２５がはんだ固定部２８ａ，２８ｂに確実に保持されて、ビームリード２８とはんだシート２５の位置決めを確実に行うことができる。 Furthermore, according to the temporary fixing method of the conducting member and the solder sheet according to the first embodiment, the cutout portions 40a and 40b are formed in the shape of a comb blade on the edges of the solder fixing portions 28a and 28b. , 40b, the length of the part where the wall portions 41a, 41b contact the solder sheet 25 can be ensured long, whereby the notched portions 40a, 40b of the pressed solder fixing portions 28a, 28b. Since the contact area between the wall portions 41a and 41b and the solder sheet 25 increases, the solder sheet 25 can be further bitten by the cutout portions 40a and 40b, and the solder sheet 25 can be inserted into the solder fixing portions 28a and 28b. The beam lead 28 and the solder sheet 25 can be reliably positioned by being held securely.
また、実施例１に係る導通部材とはんだシートの仮止め方法によれば、切り欠き部４２ａ，４２ｂがはんだ固定部２８ａ，２８ｂの中に多孔状に形成されるため、切り欠き部４２ａ，４２ｂを構成する壁部４３ａ，４３ｂとはんだシート２５との接触面積が増大するため、はんだシート２５を切り欠き部４２ａ，４２ｂにより一層食い込ませることができ、はんだシート２５が切り欠き部４２ａ，４２ｂにより一層確実に保持されるため、ビームリード２８とはんだシート２５の位置決めを確実に行うことができる。 Further, according to the temporary fixing method of the conductive member and the solder sheet according to the first embodiment, the cutout portions 42a and 42b are formed in the solder fixing portions 28a and 28b in a porous shape, and thus the cutout portions 42a and 42b. Since the contact area between the wall portions 43a and 43b and the solder sheet 25 is increased, the solder sheet 25 can be further bitten by the cutout portions 42a and 42b, and the solder sheet 25 can be cut by the cutout portions 42a and 42b. Since it is held more reliably, the positioning of the beam lead 28 and the solder sheet 25 can be performed reliably.
なお、実施例１においては、切り欠き部の具体的な形状を櫛刃状、多孔状、長孔状として説明したが、切り欠き部の形状はこれらに限定されることはなく、その他の形状であっても同様の効果を得ることができる。特に、本願発明では、切り欠き部（凹部）の壁部にはんだシートを食い込ませることによって保持するため、高い保持力を得るためには、切り欠き部（凹部）によって形成される隙間の面積に対して、切り欠き部（凹部）の壁部の長さが長い形状であることが望ましい。 In addition, in Example 1, although the specific shape of the notch part was demonstrated as a comb blade shape, porous shape, and long hole shape, the shape of a notch part is not limited to these, Other shapes However, the same effect can be obtained. In particular, in the present invention, since the solder sheet is held by biting into the wall portion of the notch (recess), in order to obtain a high holding force, the area of the gap formed by the notch (recess) is reduced. On the other hand, it is desirable that the length of the wall portion of the notch (concave portion) is long.
また、実施例１においては、切り欠き部４０ａ，４０ｂ，４２ａ，４２ｂ，４４ａ，４４ｂは、いずれもはんだ固定部２８ａ，２８ｂを貫通するように形成したが、これは非貫通な切り欠き部としてもよい。切り欠き部が非貫通な凹部によって形成された場合であっても、凹部を構成する壁部に、圧着されたはんだシートを食い込ませて接触させることによって、摩擦力を発生させて保持することができるため、実施例１で説明したのと同様の効果を得ることができる。 Moreover, in Example 1, although notch part 40a, 40b, 42a, 42b, 44a, 44b was formed so that all might penetrate solder fixing | fixed part 28a, 28b, this is a non-penetrating notch part. Also good. Even when the notch is formed by a non-penetrating recess, it is possible to generate and hold a frictional force by causing the soldered sheet to bite into contact with the wall constituting the recess. Therefore, the same effect as described in the first embodiment can be obtained.
以上、この発明の実施例を図面により詳述してきたが、実施例はこの発明の例示にしか過ぎないものであるため、この発明は実施例の構成にのみ限定されるものではなく、この発明の要旨を逸脱しない範囲の設計の変更等があってもこの発明に含まれることは勿論である。 Although the embodiments of the present invention have been described in detail with reference to the drawings, the embodiments are only examples of the present invention, and the present invention is not limited to the configurations of the embodiments. Needless to say, design changes and the like within a range not departing from the gist of the invention are included in the present invention.
２８ ビームリード（導通部材）
２８ａ，２８ｂ はんだ固定部
２５ はんだシート
３５ はんだ
５０ 固定台
４０ａ，４０ｂ 切り欠き部（凹部）
Ｆ 加圧力
28 Beam Lead (Conductive Member)
28a, 28b Solder fixing part 25 Solder sheet 35 Solder 50 Fixing base 40a, 40b Notch (recessed part)
F Applied pressure
Claims (5)
前記接合面の中に、前記接合面に鉛直な方向に延びる壁部を有する少なくとも１つの凹部を形成する工程と、
前記はんだ固定部の接合面を、前記凹部がはんだシートの上に重なるように設置する工程と、
前記凹部を、前記はんだシートの厚み方向に向かって加圧する工程と、
前記壁部に前記加圧された前記はんだシートを接触させて前記凹部の内部にはんだシートを食い込ませ、前記壁部と前記はんだシートとの間に生じる摩擦力により、前記食い込んだはんだシートを前記厚み方向の重力に抗して保持させることで、前記はんだ固定部の接合面に前記はんだシートを仮止めする工程と、
からなることを特徴とする導通部材とはんだシートの仮止め方法。 A solder sheet is provided on the joint surface of the solder fixing portion having a joint surface to be joined by soldering, which is provided on a conductive member having electrical conductivity that is soldered to different electronic components and connects the different electronic components. Temporarily fixing the conductive member and the solder sheet temporarily fixing method,
Forming at least one recess having a wall portion extending in a direction perpendicular to the joint surface in the joint surface;
Installing the bonding surface of the solder fixing portion so that the concave portion overlaps the solder sheet;
Pressurizing the concave portion in the thickness direction of the solder sheet;
Said contacting the solder sheet under pressure in said wall portion so bite into solder sheet to the inside of the recess by frictional force generated between said wall portion and said solder sheet, the said ending past solder sheet By temporarily holding the solder sheet on the joint surface of the solder fixing part by holding it against gravity in the thickness direction ,
A conductive member and a solder sheet temporary fixing method comprising:
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