JP2011181831A

JP2011181831A - Substrate structure

Info

Publication number: JP2011181831A
Application number: JP2010046844A
Authority: JP
Inventors: Hideki Nakazato; 秀樹中里; Shinya Saito; 紳也斎藤; Akinori Ito; 明憲伊藤; Yuji Yamauchi; 裕司山内
Original assignee: Furukawa Electric Co Ltd; Furukawa Automotive Systems Inc
Current assignee: Furukawa Electric Co Ltd; Furukawa Automotive Systems Inc
Priority date: 2010-03-03
Filing date: 2010-03-03
Publication date: 2011-09-15

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate structure such that electronic components are mounted on a first wiring board and a second wiring board without damaging the respective wiring boards. <P>SOLUTION: When connector housings 11 and 12 are mounted on the first wiring board 10 and the second wiring board 20 which are arranged in parallel, a projection part 13 of the connector housing 11 is inserted into a hole part 10a of the first wiring board 10 from above. A projection part 23 of the connector housing 21 is inserted into a hole part 20a of the second wiring board 20 from below. The projection part 13 of the connector housing 11 which protrudes from the hole part 10a of the first wiring board 10, and the projection part 23 of the connector housing 21 which protrudes from the hole part 20a of the second wiring board 20 are brought into contact with each other, and fixed in one body. This substrate structure is employed to mount the connector housings 11 and 21 on the wiring boards 10 and 20 without damaging the wiring boards 10 and 20. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、例えばコネクタやリレー、抵抗、コンデンサ、半導体素子等の電気部品を配線基板に実装する際に用いられる基板構造に関する。 The present invention relates to a board structure used when mounting electrical components such as connectors, relays, resistors, capacitors, and semiconductor elements on a wiring board.

前記電気部品を配線基板に実装する構造としては、例えば第１配線基板と第２配線基板とが平行に配置された構造において、各配線基板の両方或いは一方に電気部品を実装した構造がある。しかし、電気部品を実装する際の押し付け力が配線基板に対し垂直に付与されると、配線基板に撓みや変形が発生するだけでなく、基板の肉厚が薄いと、例えば割れや亀裂、断線等の損傷が生じることがある。 As a structure for mounting the electric component on the wiring board, for example, in a structure in which the first wiring board and the second wiring board are arranged in parallel, there is a structure in which the electric parts are mounted on both or one of the wiring boards. However, if the pressing force for mounting electrical components is applied perpendicular to the wiring board, not only will the wiring board bend or deform, but if the board is thin, for example, cracks, cracks, breaks, etc. Damage may occur.

そこで、前記配線基板の撓みや変形を防止する構造としては、例えば樹脂プレートの上面に第１のメタルコア基板を固定し、該樹脂プレートの下面に第２のメタルコア基板を固定して、該各メタルコア基板の両方に電気部品を実装した構造が提案されている（特許文献１参照）。しかし、特許文献１の構造も電気部品を基板に対し垂直に実装する場合、前記構造と同じ問題が発生することになる。 Therefore, as a structure for preventing the wiring board from being bent or deformed, for example, a first metal core substrate is fixed to the upper surface of the resin plate, and a second metal core substrate is fixed to the lower surface of the resin plate. A structure in which electrical components are mounted on both substrates has been proposed (see Patent Document 1). However, the structure of Patent Document 1 also has the same problem as the structure described above when the electrical component is mounted perpendicular to the substrate.

国際公開第２００６／１０４０３７号パンフレットInternational Publication No. 2006/104037 Pamphlet

この発明は、第１配線基板及び第２配線基板に損傷を与えることなく、該各配線基板に対し電気部品を実装することができる基板構造を提供することを目的とする。 It is an object of the present invention to provide a board structure that can mount an electrical component on each wiring board without damaging the first wiring board and the second wiring board.

この発明は、平行に配置された第１配線基板と第２配線基板とに電気部品を実装する基板構造であって、前記第１配線基板及び第２配線基板に形成された厚み方向に貫通する孔部を介して、該各配線基板に実装される電気部品を支持する部品支持手段を設けた基板構造であることを特徴とする。 The present invention is a board structure for mounting electrical components on a first wiring board and a second wiring board that are arranged in parallel, and penetrates in a thickness direction formed in the first wiring board and the second wiring board. It is a board structure provided with component support means for supporting an electrical component mounted on each wiring board through a hole.

このような構造を採用することにより、第１配線基板及び第２配線基板に形成された孔部を介して、該各配線基板に実装される電気部品を部品支持手段で支持することができる。これにより、第１配線基板及び第２配線基板に損傷を与えることなく、各配線基板に対し電気部品を実装することができる。 By adopting such a structure, the electrical component mounted on each wiring board can be supported by the component support means through the holes formed in the first wiring board and the second wiring board. Thereby, an electrical component can be mounted on each wiring board without damaging the first wiring board and the second wiring board.

この発明は、前記部品支持手段を、前記電気部品に形成された突出部で構成し、前記電気部品に形成された突出部を、前記第１配線基板及び第２配線基板に形成された孔部に挿通し、前記第１配線基板の孔部より突出された前記電気部品の突出部と、前記第２配線基板の孔部より突出された前記電気部品の突出部とを互いに当接し合うようにして一体的に固定した基板構造であることを特徴とする。 In the present invention, the component support means is constituted by a protruding portion formed in the electric component, and the protruding portion formed in the electric component is formed in the hole portion formed in the first wiring substrate and the second wiring substrate. The protruding part of the electrical component protruding from the hole of the first wiring board and the protruding part of the electrical component protruding from the hole of the second wiring board are in contact with each other. And a substrate structure fixed integrally.

このような構造を採用することにより、第１配線基板及び第２配線基板に損傷を与えることなく、各配線基板に対し電気部品を実装することができる。 By adopting such a structure, an electrical component can be mounted on each wiring board without damaging the first wiring board and the second wiring board.

また、この発明は、前記部品支持手段を、前記第１配線基板と第２配線基板との対向面間に配置された支持板と、前記電気部品が取り付けられる接続端子とで構成し、前記電気部品が取り付けられる接続端子を、前記第１配線基板及び／又は第２配線基板に形成された孔部に挿通し、前記第１配線基板及び／又は第２配線基板の孔部より突出された前記接続端子を、該第１配線基板と第２配線基板との対向面間に配置された支持板の端子係合部に係合した基板構造であることを特徴とする。 Further, in the present invention, the component support means includes a support plate disposed between opposing surfaces of the first wiring board and the second wiring board, and a connection terminal to which the electric component is attached. The connection terminal to which the component is attached is inserted into the hole formed in the first wiring board and / or the second wiring board, and protruded from the hole of the first wiring board and / or the second wiring board. It is a board | substrate structure which engaged the connection terminal with the terminal engaging part of the support plate arrange | positioned between the opposing surfaces of this 1st wiring board and a 2nd wiring board.

このような構造を採用することにより、第１配線基板及び第２配線基板に損傷を与えることなく、電気部品が取り付けられる接続端子を介して、各配線基板に対し電気部品を実装することができる。 By adopting such a structure, the electrical components can be mounted on each wiring board via the connection terminals to which the electrical parts are attached without damaging the first wiring board and the second wiring board. .

この発明の態様として、前記端子係合部を、前記支持板の厚み方向に貫通して形成され前記接続端子の挿通が許容される保持孔、或いは、該支持板の厚み方向に貫通しない前記接続端子が係合される係合穴で構成することができる。 As an aspect of the present invention, the terminal engaging portion is formed through the support plate in the thickness direction, and the connection hole is allowed to pass through the connection terminal, or the connection does not penetrate in the thickness direction of the support plate. It can comprise an engagement hole with which the terminal is engaged.

これにより、接続端子を、第１配線基板及び／又は第２配線基板の孔部に対し挿通される位置に保持及び規制することができる。
また、この発明は、前記第１配線基板及び／又は第２配線基板に対し異なる半田付け手段で実装される複数種の電気部品を、該半田付け手段別に分けて前記第１配線基板と第２配線基板とに取り付け、前記電気部品を、該電気部品と対応する半田付け手段にて前記第１配線基板と第２配線基板とにそれぞれ実装した基板構造であることを特徴とする。 Thereby, a connection terminal can be hold | maintained and controlled in the position penetrated with respect to the hole of a 1st wiring board and / or a 2nd wiring board.
Further, according to the present invention, the first wiring board and the second wiring board are divided into a plurality of types of electrical components to be mounted on the first wiring board and / or the second wiring board by different soldering means. It is a board structure that is mounted on a wiring board, and the electrical components are mounted on the first wiring board and the second wiring board by soldering means corresponding to the electrical parts, respectively.

このような構造を採用することにより、電気部品を半田付けする際の工程数が少なくて済む。 By adopting such a structure, it is possible to reduce the number of steps when soldering the electrical component.

前記第１及び第２の電気部品は、例えばコネクタ（コネクタハウジングを含む）、リレー、抵抗、コンデンサ、半導体素子等で構成することができる。 The first and second electrical components can be constituted by, for example, a connector (including a connector housing), a relay, a resistor, a capacitor, a semiconductor element, or the like.

この発明によれば、第１配線基板及び第２配線基板に損傷を与えることなく、該各配線基板に対し電気部品を実装することができる。 According to the present invention, electrical components can be mounted on each wiring board without damaging the first wiring board and the second wiring board.

第１実施例の基板構造を示す縦断側面図。FIG. 3 is a longitudinal side view showing the substrate structure of the first embodiment. 基板構造の他の例を示す縦断側面図。The vertical side view which shows the other example of a board | substrate structure. 突出部の他の当接構造を示す説明図。Explanatory drawing which shows the other contact structure of a protrusion part. 第２実施例の基板構造を示す縦断側面図。The vertical side view which shows the board | substrate structure of 2nd Example. 保持孔が多数配列された支持板の他の例を示す説明図。Explanatory drawing which shows the other example of the support plate in which many holding holes were arranged. 第３実施例の基板構造を示す縦断側面図。The longitudinal side view which shows the board | substrate structure of 3rd Example. 第１実施例の比較構造を示す縦断側面図。FIG. 3 is a longitudinal side view showing a comparative structure of the first embodiment. 第２実施例の比較構造を示す縦断側面図。The vertical side view which shows the comparative structure of 2nd Example. 第３実施例の比較構造を示す縦断側面図。The vertical side view which shows the comparative structure of 3rd Example.

図１の（ａ），（ｂ）は、第１実施例の基板構造を示す縦断側面図である。
第１実施例の基板構造は、第１の電気部品の一例であるコネクタハウジング１１が実装された第１配線基板１０と、第２の電気部品の一例であるコネクタハウジング２１が実装された第２配線基板２０とを対向させて平行に配置するとともに、該配線基板１０，２０を、間隔を隔てて一体的に固定している。 FIGS. 1A and 1B are longitudinal sectional side views showing the substrate structure of the first embodiment.
The board structure of the first embodiment has a first wiring board 10 on which a connector housing 11 that is an example of a first electrical component is mounted, and a second that is mounted on a connector housing 21 that is an example of a second electrical part. The wiring boards 20 are arranged in parallel so as to face each other, and the wiring boards 10 and 20 are fixed integrally with a space therebetween.

構造を説明すると、コネクタハウジング１１の下面側中央部に突設された接続端子１２と、該コネクタハウジング１１の下面側両端部に形成された突出部１３とは、第１配線基板１０の厚み方向に貫通して形成された孔部１０ａに上方から挿通され、その挿通側端部は、孔部１０ａより下方に所望する長さ突出されている。 Explaining the structure, the connection terminal 12 projecting from the lower surface side center portion of the connector housing 11 and the projecting portions 13 formed at both lower surface side end portions of the connector housing 11 are in the thickness direction of the first wiring board 10. Is inserted from above into the hole 10a formed so as to penetrate through the hole 10a, and the insertion side end protrudes below the hole 10a to a desired length.

また、コネクタハウジング２１の下面側中央部に突設された接続端子２２と、該コネクタハウジング２１の下面側両端部に形成された突出部２３とは、第２配線基板２０の厚み方向に貫通して形成された孔部２０ａに下方から挿通され、その挿通側端部は、孔部２０ａより上方に所望する長さ突出されている。 Further, the connection terminal 22 projecting from the center portion on the lower surface side of the connector housing 21 and the protruding portions 23 formed at both end portions on the lower surface side of the connector housing 21 penetrate in the thickness direction of the second wiring board 20. The hole 20a is inserted through the hole 20a from below, and the insertion side end protrudes above the hole 20a to a desired length.

前記接続端子１２，２２は、例えばフローやリフロー等の半田付け手段を用いて、第１配線基板１０及び第２配線基板２０に対しそれぞれ半田付け接続されている。 The connection terminals 12 and 22 are soldered and connected to the first wiring board 10 and the second wiring board 20, respectively, using soldering means such as flow or reflow.

一方、前記第１配線基板１０の孔部１０ａより下方に突出されたコネクタハウジング１１の突出部１３と、第２配線基板２０の孔部２０ａより上方に突出されたコネクタハウジング２１の突出部２３とは、長手方向で互いに当接し合うようにして一体的に接合されている。
このような構造を採用することにより、第１配線基板１０と第２配線基板２０とが、間隔を隔てられたまま一体的に組み付けられている。 On the other hand, a protrusion 13 of the connector housing 11 protrudes downward from the hole 10a of the first wiring board 10, and a protrusion 23 of the connector housing 21 protrudes upward from the hole 20a of the second wiring board 20. Are joined together so as to contact each other in the longitudinal direction.
By adopting such a structure, the first wiring board 10 and the second wiring board 20 are integrally assembled with a space therebetween.

実施例において、第１配線基板１０と第２配線基板２０は、同一の大きさ及び形状に形成されている。また、第１配線基板１０及び第２配線基板２０の反搭載面には、図１のｃ部に示すように、導電性を有する金属箔や金属層からなる配線回路が形成されている。 In the embodiment, the first wiring board 10 and the second wiring board 20 are formed in the same size and shape. Further, on the opposite mounting surfaces of the first wiring board 10 and the second wiring board 20, a wiring circuit made of conductive metal foil or metal layer is formed as shown in part c of FIG.

第１配線基板１０の孔部１０ａと、第２配線基板２０の孔部２０ａは、同一の間隔に隔てて配列されたスルーホールタイプの貫通孔である。また、孔部１０ａ，２０ａは、コネクタハウジング１１，２１の接続端子１２，２２及び突出部１３，２３の挿通が許容される大きさ及び形状に形成されている。 The hole 10a of the first wiring board 10 and the hole 20a of the second wiring board 20 are through-hole type through holes arranged at the same interval. The holes 10a and 20a are formed in a size and shape that allow the connection terminals 12 and 22 and the protrusions 13 and 23 of the connector housings 11 and 21 to be inserted.

コネクタハウジング１１の突出部１３は、接続端子１２より長尺に形成されている。かつ、コネクタハウジング２１の突出部２３は、接続端子２２より長尺に形成されている。 The protruding portion 13 of the connector housing 11 is formed longer than the connection terminal 12. In addition, the protruding portion 23 of the connector housing 21 is formed to be longer than the connection terminal 22.

次に、前記コネクタハウジング１１，２１の実装手順を説明する。
先ず、コネクタハウジング１１の接続端子１２と突出部１３を、第１配線基板１０の孔部１０ａに上方から挿通し、その挿通側端部を、孔部１０ａより下方に所望する長さ突出する。 Next, a procedure for mounting the connector housings 11 and 21 will be described.
First, the connection terminal 12 and the protrusion 13 of the connector housing 11 are inserted into the hole 10a of the first wiring board 10 from above, and the insertion side end protrudes below the hole 10a to a desired length.

一方、コネクタハウジング２１の接続端子２２と突出部２３を、第２配線基板２０の孔部２０ａに下方から挿通し、その挿通側端部を、孔部２０ａより上方に所望する長さ突出する。 On the other hand, the connection terminal 22 and the protrusion 23 of the connector housing 21 are inserted into the hole 20a of the second wiring board 20 from below, and the insertion side end protrudes above the hole 20a to a desired length.

次に、第１配線基板１０の孔部１０ａより下方に突出されたコネクタハウジング１１の突出部１３と、第２配線基板２０の孔部２０ａより上方に突出されたコネクタハウジング２１の突出部２３とを、長手方向で互いに当接し合うようにして一体的に接合する（図１のａ参照）。
このような構造を採用することにより、第１配線基板１０と第２配線基板２０とが、突出部１３，２３の当接により間隔を隔てたまま一体的に組み付けられている。 Next, a protruding portion 13 of the connector housing 11 that protrudes downward from the hole portion 10a of the first wiring board 10, and a protruding portion 23 of the connector housing 21 that protrudes upward from the hole portion 20a of the second wiring board 20; Are joined together so as to contact each other in the longitudinal direction (see a in FIG. 1).
By adopting such a structure, the first wiring board 10 and the second wiring board 20 are integrally assembled with the protrusions 13 and 23 being spaced apart from each other.

また、突出部１３，２３の当接部分を、図示しない高周波溶接装置で溶接するか、接着剤で接着する等して一体的に接合する。
組み付け後、例えばフローやリフロー等の半田付け手段を用いて、第１配線基板１０に対し接続端子１２を半田付け接続し、第２配線基板２０に対し接続端子２２を半田付け接続すれば、第１配線基板１０に対しコネクタハウジング１１を垂直に実装する作業と、第２配線基板２０に対しコネクタハウジング２１を垂直に実装する作業が完了する（図１のｂ参照）。 Further, the abutting portions of the protrusions 13 and 23 are integrally joined by welding with a high-frequency welding apparatus (not shown) or by bonding with an adhesive.
After assembly, for example, by using soldering means such as flow or reflow, the connection terminal 12 is soldered to the first wiring board 10 and the connection terminal 22 is soldered to the second wiring board 20. The work of mounting the connector housing 11 vertically on the one wiring board 10 and the work of mounting the connector housing 21 vertically on the second wiring board 20 are completed (see b in FIG. 1).

第１実施例の基板構造の比較構造としては、例えば図７に示すように、平行して配置された配線基板９３，９４の対向面間に、絶縁性を有する樹脂プレート９５を挟み込んで一体的に固定した構造がある。
これは、コネクタ９０を構成するコネクタハウジング９１を第１配線基板９３及び第２配線基板９４に取り付け、コネクタハウジング９１に突設された接続端子９２を、配線基板９３，９４の孔部９３ａ，９４ａに挿通して半田付け接続した構造である。
これに対し、第１実施例の基板構造は、第１配線基板１０に装着されたコネクタハウジング１１の突出部１３と、第２配線基板２０に装着されたコネクタハウジング２１の突出部２３とを互いに当接し合って一体的に固定するので、コネクタハウジング１１，２１を配線基板１０，２０に対し垂直に実装する際の押し付け力が突出部１３，２３の当接部分で受止められる。
これにより、コネクタハウジング１１，２１を実装する際の押し付け力が、第１配線基板１０及び第２配線基板２０に付加されることがないので、配線基板１０，２０に損傷を与えることなく、配線基板１０，２０に対しコネクタハウジング１１，２１を確実に実装することができる。 As a comparative structure of the substrate structure of the first embodiment, for example, as shown in FIG. 7, an insulating resin plate 95 is sandwiched between opposing surfaces of wiring substrates 93 and 94 arranged in parallel, and integrated. There is a fixed structure.
This is because the connector housing 91 constituting the connector 90 is attached to the first wiring board 93 and the second wiring board 94, and the connection terminals 92 projecting from the connector housing 91 are connected to the holes 93 a and 94 a of the wiring boards 93 and 94. It is a structure that is inserted through and soldered.
On the other hand, the board structure of the first embodiment is such that the protrusion 13 of the connector housing 11 attached to the first wiring board 10 and the protrusion 23 of the connector housing 21 attached to the second wiring board 20 are mutually connected. Since they are in contact with each other and fixed integrally, the pressing force when the connector housings 11 and 21 are mounted perpendicularly to the wiring boards 10 and 20 is received by the contact portions of the protrusions 13 and 23.
As a result, the pressing force when mounting the connector housings 11 and 21 is not applied to the first wiring board 10 and the second wiring board 20, so that the wiring boards 10 and 20 are not damaged. The connector housings 11 and 21 can be reliably mounted on the boards 10 and 20.

また、コネクタハウジング１１，２１の突出部１３，２３を互いに当接して、配線基板１０，２０を、間隔を隔てた状態のまま一体的に組み付ける。
これにより、配線基板１０，２０の対向面間に、比較構造のような樹脂プレート９５を挟み込む必要がないので、構造全体の部品点数が少なくなり、組み付け工数を削減して、コストの低減を図ることができる。また、配線基板１０，２０の間に空気の層が形成されることになり、構造全体の放熱性能を高めて、コネクタハウジング１１，２１などの電気部品に与える影響を軽減することができる。 Further, the protrusions 13 and 23 of the connector housings 11 and 21 are brought into contact with each other, and the wiring boards 10 and 20 are assembled together while being spaced apart.
This eliminates the need to sandwich the resin plate 95 as in the comparative structure between the opposing surfaces of the wiring boards 10 and 20, thereby reducing the number of parts in the entire structure, reducing the number of assembly steps, and reducing costs. be able to. In addition, an air layer is formed between the wiring boards 10 and 20, so that the heat dissipation performance of the entire structure can be improved and the influence on the electrical components such as the connector housings 11 and 21 can be reduced.

図２は、第１実施例における基板構造の他の例を示す縦断側面図である。
本例の基板構造を説明すると、第２配線基板２０を、コネクタハウジング２１が装着された搭載面が下向きとなる姿勢に保持したまま、該搭載面に装着されたコネクタハウジング２１の下面を、基板が取り付けられる部分の板部や枠部などの押当て部２４に押し当てる。この後、第１配線基板１０を、コネクタハウジング１１側が上向きとなる姿勢に保持したまま降下させる。 FIG. 2 is a longitudinal sectional side view showing another example of the substrate structure in the first embodiment.
The board structure of this example will be described. While the second wiring board 20 is held in a posture in which the mounting surface on which the connector housing 21 is mounted faces downward, the lower surface of the connector housing 21 mounted on the mounting surface is Is pressed against the pressing portion 24 such as a plate portion or a frame portion of the portion to which is attached. Thereafter, the first wiring board 10 is lowered while being held in a posture in which the connector housing 11 side faces upward.

第１配線基板１０の孔部１０ａより下方にコネクタハウジング１１の突出部１３と、第２配線基板２０の孔部２０ａより上方に突出されたコネクタハウジング２１の突出部２３とを互いに当接し合うようにして、一体的に接合する。
これにより、第１配線基板１０と第２配線基板２０とを、間隔を隔てた状態のまま一体的に組み付けることができ、第１実施例と略同等の作用及び効果を奏することができる。 The protruding portion 13 of the connector housing 11 below the hole portion 10a of the first wiring board 10 and the protruding portion 23 of the connector housing 21 protruding above the hole portion 20a of the second wiring board 20 are in contact with each other. Then, they are joined together.
Thereby, the 1st wiring board 10 and the 2nd wiring board 20 can be assembled | attached integrally with the state spaced apart, and there can exist an effect | action and effect substantially equivalent to 1st Example.

図３の（ａ，ｂ，ｃ，ｄ，ｅ）は、前記突出部１３，２３の他の当接構造を示す説明図である。
前記実施例では、突出部１３，２３の対向端面を互いに当接し合うようにして一体的に接合するが、図３の（ａ〜ｅ）に示すような構造で接合してもよい。 (A, b, c, d, e) of FIG. 3 is explanatory drawing which shows the other contact structure of the said protrusion parts 13 and 23. As shown in FIG.
In the above-described embodiment, the opposing end surfaces of the projecting portions 13 and 23 are integrally joined so as to abut against each other, but may be joined by a structure as shown in FIGS.

例えば突出部１３の端面に形成された凹部１３ａと、突出部２３の端面に形成された凸部２３ａとを互いに合致させて接合する（図３のａ参照）。
また、突出部１３の端面に形成された凹状三角部１３ｂと、突出部２３の端面に形成された凸状三角部２３ｂとを互いに合致させて接合する（図３のｂ参照）。
また、突出部１３の端面に形成された凹状半円部１３ｃと、突出部２３の端面に形成された凸状半円部２３ｃとを互いに合致させて接合する（図３のｃ参照）。 For example, the concave portion 13a formed on the end surface of the protruding portion 13 and the convex portion 23a formed on the end surface of the protruding portion 23 are joined to each other so as to match each other (see a in FIG. 3).
Further, the concave triangular portion 13b formed on the end surface of the protruding portion 13 and the convex triangular portion 23b formed on the end surface of the protruding portion 23 are matched with each other and joined (see b in FIG. 3).
Moreover, the concave semicircle part 13c formed in the end surface of the protrusion part 13 and the convex semicircle part 23c formed in the end surface of the protrusion part 23 are mutually matched, and it joins (refer c of FIG. 3).

或いは、突出部１３，２３の対向端面にピン６０の上下両端を差し込んで互いに連結するか（図３のｄ参照）、突出部１３，２３の当接部外周面に、筒状又は環状に形成された連結部材７０を装着する等してもよい（図３のｅ参照）。
これにより、突出部１３，２３を確実に当接することができる。 Alternatively, the upper and lower ends of the pin 60 are inserted into the opposite end surfaces of the projecting portions 13 and 23 to be connected to each other (see d in FIG. 3), or formed in a cylindrical shape or an annular shape on the outer peripheral surface of the projecting portions 13 and 23 The connected connecting member 70 may be mounted (see e in FIG. 3).
Thereby, the protrusion parts 13 and 23 can be contact | abutted reliably.

図４の（ａ）は、第２実施例の基板構造を示す縦断側面図である。
第２実施例の基板構造は、図中仮想線で示す実装部品３１が取り付けられる接続端子４０，５０を、互いに対向して平行に配置された第１配線基板１０と第２配線基板２０とに挿通するとともに、該配線基板１０，２０の間に、絶縁性を有するプラスチック製の支持板３０を配置して、第１配線基板１０と、第２配線基板２０と、支持板３０とを、図示しないネジ等で固定している。
また、第１配線基板１０の上方と第２配線基板２０の下方とに突出された接続端子４０，５０の突出側端部には、図中仮想線で示す実装部品３１が取り付けられる。 FIG. 4A is a longitudinal side view showing the substrate structure of the second embodiment.
In the substrate structure of the second embodiment, the connection terminals 40 and 50 to which the mounting components 31 indicated by phantom lines in the figure are attached are connected to the first wiring substrate 10 and the second wiring substrate 20 which are arranged in parallel to face each other. The plastic support plate 30 having insulation properties is disposed between the wiring boards 10 and 20 so as to insert the first wiring board 10, the second wiring board 20, and the support plate 30. It is fixed with screws that do not.
In addition, a mounting component 31 indicated by a virtual line in the drawing is attached to the protruding side end portions of the connection terminals 40 and 50 protruding above the first wiring substrate 10 and below the second wiring substrate 20.

なお、ネジ等の締結部材の代わりに、高周波溶接装置で溶接するか、接着剤で接着する等して一体的に固定してもよい。 In addition, instead of a fastening member such as a screw, it may be fixed integrally by welding with a high frequency welding apparatus or bonding with an adhesive.

構造を説明すると、導電性を有する金属製の接続端子４０，５０は、第１配線基板１０の厚み方向に貫通して形成された孔部１０ａに上方から挿通され、その挿通側端部は、孔部１０ａより下方に所望する長さ突出されている。 Explaining the structure, the conductive metal connection terminals 40 and 50 are inserted from above into a hole 10a formed penetrating in the thickness direction of the first wiring board 10, and the insertion side end portion thereof is A desired length is projected below the hole 10a.

第１配線基板１０の孔部１０ａより下方に突出された接続端子４０は、支持板３０の厚み方向に貫通して形成された前記孔部１０ａと連通する位置の保持孔３０ａに上方から挿通され、保持孔３０ａより下方に所望する長さ突出されている。 The connection terminal 40 protruding downward from the hole 10a of the first wiring board 10 is inserted from above into a holding hole 30a at a position communicating with the hole 10a formed through the support plate 30 in the thickness direction. The desired length is projected below the holding hole 30a.

第１配線基板１０の孔部１０ａより下方に突出された接続端子５０は、支持板３０の保持孔３０ａと、第２配線基板２０の厚み方向に貫通して形成された前記保持孔３０ａと連通する位置の孔部２０ａとに上方から挿通され、孔部２０ａより下方に所望する長さ突出されている。
なお、保持孔３０ａより下方に突出された接続端子４０の挿通側端部は、第２配線基板２０に対し間隔を隔てられた位置まで挿通されている。 The connection terminal 50 protruding downward from the hole 10 a of the first wiring board 10 communicates with the holding hole 30 a of the support plate 30 and the holding hole 30 a formed so as to penetrate in the thickness direction of the second wiring board 20. It is inserted from above into the hole 20a at the position to be projected, and protrudes below the hole 20a to a desired length.
The insertion side end of the connection terminal 40 protruding downward from the holding hole 30 a is inserted to a position spaced from the second wiring board 20.

実施例において、第１配線基板１０と、第２配線基板２０と、支持板３０とは、平面から見て同一の大きさ及び形状に形成されている。
また、孔部１０ａ，２０ａ及び保持孔３０ａは、接続端子４０，５０の挿通が許容される大きさ及び形状に形成されている。また、支持板３０の保持孔３０ａは、ユニバーサル基板のように支持板３０の左右平面に対し等間隔に隔てて多数配列されている。 In the embodiment, the first wiring board 10, the second wiring board 20, and the support plate 30 are formed in the same size and shape when viewed from the plane.
Further, the holes 10a and 20a and the holding hole 30a are formed in a size and a shape that allow the connection terminals 40 and 50 to be inserted. In addition, the holding holes 30a of the support plate 30 are arranged at regular intervals with respect to the left and right planes of the support plate 30 like a universal substrate.

さらにまた、接続端子５０は、第１配線基板１０と、第２配線基板２０と、支持板３０とを上下に重ね合せてなる厚みよりも長尺に形成されているので、第１配線基板１０の孔部１０ａと第２配線基板２０の孔部２０ａとに跨って挿通される。
さらにまた、支持板３０の保持孔３０ａが形成された部分を除く残りの平面には、図示しない開口部が多数形成されている。 Furthermore, since the connection terminal 50 is formed to be longer than the thickness obtained by superimposing the first wiring board 10, the second wiring board 20, and the support plate 30 vertically, the first wiring board 10. The hole 10a and the hole 20a of the second wiring board 20 are inserted through the hole 10a.
Furthermore, a large number of openings (not shown) are formed on the remaining plane excluding the portion where the holding holes 30a of the support plate 30 are formed.

次に、前記接続端子４０，５０の実装手順を説明する。
先ず、接続端子４０を、第１配線基板１０の孔部１０ａと支持板３０の保持孔３０ａとに上方から挿通し、その挿通側端部を、保持孔３０ａより下方に所望する長さ突出する。 Next, a procedure for mounting the connection terminals 40 and 50 will be described.
First, the connection terminal 40 is inserted through the hole 10a of the first wiring board 10 and the holding hole 30a of the support plate 30 from above, and the insertion side end protrudes below the holding hole 30a to a desired length. .

一方、接続端子５０を、第１配線基板１０の孔部１０ａと、第２配線基板２０の孔部２０ａと、支持板３０の保持孔３０ａとに上方から挿通し、その挿通側端部を、孔部２０ａより下方に所望する長さ突出する（図４のａ参照）。
この後、接続端子５０の上下両端を、第１配線基板１０の孔部１０ａ及び第２配線基板２０の孔部２０ａより均等長さ突出されるように差し込み位置を上下調節した後、例えばフローやリフロー等の半田付け手段を用いて、第１配線基板１０と接続端子４０を半田付け接続し、第１配線基板１０及び第２配線基板２０と接続端子５０を半田付け接続する。 On the other hand, the connection terminal 50 is inserted from above into the hole 10a of the first wiring board 10, the hole 20a of the second wiring board 20, and the holding hole 30a of the support plate 30, and the insertion side end thereof is A desired length protrudes downward from the hole 20a (see a in FIG. 4).
Thereafter, the upper and lower ends of the connection terminal 50 are adjusted up and down so as to protrude from the hole 10a of the first wiring board 10 and the hole 20a of the second wiring board 20 by an equal length. Using a soldering means such as reflow, the first wiring board 10 and the connection terminal 40 are soldered and connected, and the first wiring board 10 and the second wiring board 20 and the connection terminal 50 are soldered and connected.

つまり、接続端子４０は、第１配線基板１０の孔部１０ａを介して、支持板３０の保持孔３０ａに挿通する。また、接続端子５０は、第１配線基板１０の孔部１０ａと第２配線基板２０の孔部２０ａとを介して、支持板３０の保持孔３０ａに挿通する。
このような構造を採用することにより、接続端子４０，５０が、第１配線基板１０の孔部１０ａ及び第２配線基板２０の孔部２０ａに対し挿通される位置に保持或いは位置決めされる。 That is, the connection terminal 40 is inserted into the holding hole 30 a of the support plate 30 through the hole portion 10 a of the first wiring board 10. The connection terminal 50 is inserted into the holding hole 30 a of the support plate 30 through the hole 10 a of the first wiring board 10 and the hole 20 a of the second wiring board 20.
By adopting such a structure, the connection terminals 40 and 50 are held or positioned at positions where they are inserted into the hole 10a of the first wiring board 10 and the hole 20a of the second wiring board 20.

なお、第１配線基板１０と第２配線基板２０との間を、該配線基板１０，２０の一側端部に跨って挿通された接続端子５０で電気的に接続してもよい。また、接続端子５０を、第２配線基板２０の孔部２０ａと、支持板３０の保持孔３０ａと、第１配線基板１０の孔部１０ａとに下方から挿通してもよい。 In addition, you may electrically connect between the 1st wiring board 10 and the 2nd wiring board 20 with the connection terminal 50 penetrated ranging over the one side edge part of this wiring board 10 and 20. FIG. Further, the connection terminal 50 may be inserted through the hole 20 a of the second wiring board 20, the holding hole 30 a of the support plate 30, and the hole 10 a of the first wiring board 10 from below.

第２実施例の基板構造の比較構造としては、例えば図８に示すように、平行して配置された配線基板９３，９４の対向面間に、樹脂プレート９５を挟み込んで一体的に固定した構造がある。
これは、コネクタ９０を構成するコネクタハウジング９１を第１配線基板９３に取り付け、コネクタハウジング９１に挿入された接続端子９２を、第１配線基板９３の孔部９３ａに挿通して半田付け接続している。 As a comparative structure of the substrate structure of the second embodiment, for example, as shown in FIG. 8, a structure in which a resin plate 95 is sandwiched between opposing surfaces of wiring substrates 93 and 94 arranged in parallel and fixed integrally. There is.
The connector housing 91 constituting the connector 90 is attached to the first wiring board 93, and the connection terminals 92 inserted into the connector housing 91 are inserted into the holes 93a of the first wiring board 93 and soldered and connected. Yes.

これに対し、第２実施例の基板構造は、接続端子４０を第１配線基板１０の孔部１０ａに挿通して半田付け接続し、接続端子５０を第１配線基板１０の孔部１０ａ及び第２配線基板２０の孔部２０ａに挿通して半田付け接続するので、比較構造のようにコネクタハウジング９１で接続端子９２を保持する必要がなく、支持板３０がコネクタハウジング９１の役目を果たすので、コネクタハウジング９１を廃止することができる。
これにより、比較構造に比べて、第２実施例の基板構造の方が、コネクタハウジング９１の廃止により構造全体の部品点数が少なくなり、組み付け工数を削減することができるとともに、構造の簡素化及び軽量化、コストの低減を図ることができる。
また、コネクタハウジング１１，２１を保持或いは位置決めするための部品として活用することができる。なお、コネクタハウジング１１，２１以外に、例えばコネクタやリレー、抵抗等の電気部品を取り付ける際にも利用することができる。 On the other hand, in the substrate structure of the second embodiment, the connection terminal 40 is inserted into the hole 10a of the first wiring board 10 and soldered, and the connection terminal 50 is connected to the hole 10a of the first wiring board 10 and the first wiring board 10. 2 Since it is inserted through the hole 20a of the wiring board 20 and soldered and connected, there is no need to hold the connection terminal 92 with the connector housing 91 as in the comparative structure, and the support plate 30 serves as the connector housing 91. The connector housing 91 can be eliminated.
Thereby, compared with the comparative structure, the board structure of the second embodiment can reduce the number of parts of the entire structure due to the abolition of the connector housing 91, reduce the number of assembling steps, simplify the structure and Weight reduction and cost reduction can be achieved.
Further, it can be utilized as a component for holding or positioning the connector housings 11 and 21. In addition to the connector housings 11 and 21, for example, it can also be used when attaching electrical components such as connectors, relays, and resistors.

図４の（ｂ）は、第２実施例における基板構造の他の例を示す縦断側面図である。
本例の基板構造は、接続端子４０を、第１配線基板１０の孔部１０ａに上方から挿通して、その挿通側端部を、支持板３０に形成された厚み方向に貫通しない凹状の保持穴３０ｂに上方から係合する。 FIG. 4B is a longitudinal side view showing another example of the substrate structure in the second embodiment.
In the substrate structure of this example, the connection terminal 40 is inserted into the hole 10a of the first wiring substrate 10 from above, and the insertion-side end portion is held in a concave shape that does not penetrate in the thickness direction formed in the support plate 30. The hole 30b is engaged from above.

また、接続端子４０を、第２配線基板２０の孔部２０ａに下方から挿通して、その挿通側端部を、支持板３０に形成された厚み方向に貫通しない凹状の保持穴３０ｂに下方から係合する。 Further, the connection terminal 40 is inserted into the hole 20a of the second wiring board 20 from below, and the insertion side end is inserted into the concave holding hole 30b formed in the support plate 30 in the thickness direction from below. Engage.

この後、例えばフローやリフロー等の半田付け手段を用いて、第１配線基板１０と接続端子４０を半田付け接続し、第２配線基板２０と接続端子４０を半田付け接続する。また、接続端子４０の突出側端部には、図中仮想線で示す実装部品３１が取り付けられる。 Thereafter, the first wiring board 10 and the connection terminals 40 are soldered and connected, and the second wiring board 20 and the connection terminals 40 are soldered and connected using, for example, a soldering means such as flow or reflow. Further, a mounting component 31 indicated by a virtual line in the drawing is attached to the protruding side end portion of the connection terminal 40.

このような構造を採用することにより、図４の（ａ）に示す基板構造と略同等の作用及び効果を奏することができる。 By adopting such a structure, it is possible to achieve substantially the same operations and effects as the substrate structure shown in FIG.

図５の（ａ）は、保持孔３０ａが多数配列された支持板３０の他の例を示す斜視図、図５の（ｂ）は、支持板３０の保持孔３０ａに接続端子４０，５０が挿通された状態を示す縦断側面図である。
本例の支持板３０は、接続端子４０，５０を挿通するための保持孔３０ａが、支持板３０の平面全体に対し等間隔に隔てて多数配列されている。 5A is a perspective view showing another example of the support plate 30 in which a large number of holding holes 30a are arranged, and FIG. 5B is a diagram showing the connection terminals 40 and 50 in the holding holes 30a of the support plate 30. FIG. It is a vertical side view which shows the state penetrated.
In the support plate 30 of this example, a large number of holding holes 30 a for inserting the connection terminals 40 and 50 are arranged at equal intervals with respect to the entire plane of the support plate 30.

つまり、接続端子４０，５０を、ユニバーサル基板のように支持板３０の平面に形成された所望する位置の保持孔３０ａに挿通するので、接続端子４０，５０の挿通位置を自由に選択及び変更することができる。 That is, since the connection terminals 40 and 50 are inserted into the holding holes 30a at desired positions formed on the plane of the support plate 30 like a universal substrate, the insertion positions of the connection terminals 40 and 50 can be freely selected and changed. be able to.

図６は、第３実施例の基板構造を示す縦断側面図である。
第３実施形態の基板構造は、リレー８０が実装された第１配線基板１０と、リードタイプの抵抗８２が実装された第２配線基板２０とを対向させて平行に配置するとともに、該配線基板１０，２０の間に、絶縁性を有するプラスチック製の支持板３０を配置して、第１配線基板１０と、第２配線基板２０と、支持板３０とを、第２実施例と同様にして一体的に固定している。 FIG. 6 is a longitudinal side view showing the substrate structure of the third embodiment.
In the substrate structure of the third embodiment, the first wiring substrate 10 on which the relay 80 is mounted and the second wiring substrate 20 on which the lead type resistor 82 is mounted are arranged in parallel to face each other. 10 and 20, an insulating plastic support plate 30 is disposed between the first wiring substrate 10, the second wiring substrate 20, and the support plate 30 in the same manner as in the second embodiment. It is fixed integrally.

構造を説明すると、リレー８０及び抵抗８２は、半田付け手段別に種類分けして、第１配線基板１０と第２配線基板２０とにそれぞれ取り付けられている。 Explaining the structure, the relay 80 and the resistor 82 are attached to the first wiring board 10 and the second wiring board 20, respectively, classified by soldering means.

また、第１配線基板１０に取り付けられたリレー８０は、フロー半田付け手段にて第１配線基板１０に半田付けされ、第２配線基板２０に取り付けられた抵抗８２は、リフロー半田付け手段にて第２配線基板２０に半田付けされている。 The relay 80 attached to the first wiring board 10 is soldered to the first wiring board 10 by flow soldering means, and the resistor 82 attached to the second wiring board 20 is soldered to the reflow soldering means. Soldered to the second wiring board 20.

リレー８０に突設された接続端子８１は、第１配線基板１０の孔部１０ａに上方から挿通され、フロー半田付け手段を用いて第１配線基板１０に半田付け接続されている。
抵抗８２の両端に突設された接続端子８３は、第２配線基板２０の孔部２０ａに下方から挿通され、リフロー半田付け手段を用いて第２配線基板２０に半田付け接続されている。
なお、第１配線基板１０と第２配線基板２０との間は、該配線基板１０，２０の一側縁部の孔部１０ａ，２０ａに挿通された接続端子５０で電気的に接続されている。 The connection terminal 81 protruding from the relay 80 is inserted from above into the hole 10a of the first wiring board 10 and is soldered and connected to the first wiring board 10 using flow soldering means.
The connection terminals 83 projecting from both ends of the resistor 82 are inserted into the hole 20a of the second wiring board 20 from below and are soldered and connected to the second wiring board 20 using reflow soldering means.
The first wiring board 10 and the second wiring board 20 are electrically connected by connection terminals 50 inserted through holes 10a and 20a at one side edge of the wiring boards 10 and 20. .

次に、前記リレー８０及び抵抗８２の実装手順を説明する。
先ず、図６に示すように、リレー８０及び抵抗８２を、半田付け手段別に種類分けして、第１配線基板１０と第２配線基板２０とにそれぞれ取り付ける。 Next, a procedure for mounting the relay 80 and the resistor 82 will be described.
First, as shown in FIG. 6, the relay 80 and the resistor 82 are classified according to soldering means and attached to the first wiring board 10 and the second wiring board 20, respectively.

このとき、リレー８０の接続端子８１を、第１配線基板１０の孔部１０ａに上方から挿通して、フロー半田付け手段を用いて第１配線基板１０に対しリレー８０の接続端子８１を半田付け接続する。 At this time, the connection terminal 81 of the relay 80 is inserted into the hole 10a of the first wiring board 10 from above, and the connection terminal 81 of the relay 80 is soldered to the first wiring board 10 using flow soldering means. Connecting.

また、抵抗８２の接続端子８３を、第２配線基板２０の孔部２０ａに下方から挿通して、リフロー半田付け手段を用いて第２配線基板２０に対し抵抗８２の接続端子８３を半田付け接続する。 Further, the connection terminal 83 of the resistor 82 is inserted into the hole 20a of the second wiring board 20 from below, and the connection terminal 83 of the resistance 82 is soldered and connected to the second wiring board 20 using reflow soldering means. To do.

このような構造を採用することにより、リレー８０及び抵抗８２を半田付けする際の工程数が少なくなる。 By adopting such a structure, the number of steps when soldering the relay 80 and the resistor 82 is reduced.

第３実施例の基板構造の比較構造としては、例えば図９に示すように、平行して配置された配線基板９３，９４の対向面間に、樹脂プレート９５を挟み込んで一体的に固定した構造がある。
これは、リレー８０の接続端子８１及び抵抗８２の接続端子８３を、第１配線基板９３の孔部９３ａに挿通して、フロー半田付け手段にてリレー８０を半田付けし、リフロー半田付け手段にて抵抗８２を半田付け接続している。また、抵抗８２の接続端子８３を第２配線基板９４の孔部９４ａに挿通して、リフロー半田付け手段にて抵抗８２を半田付けした構造である。 As a comparative structure of the substrate structure of the third embodiment, for example, as shown in FIG. 9, a structure in which a resin plate 95 is sandwiched and fixed integrally with opposing surfaces of wiring boards 93 and 94 arranged in parallel. There is.
This is because the connection terminal 81 of the relay 80 and the connection terminal 83 of the resistor 82 are inserted into the hole 93a of the first wiring board 93, and the relay 80 is soldered by the flow soldering means. The resistor 82 is connected by soldering. Further, the connection terminal 83 of the resistor 82 is inserted into the hole 94a of the second wiring board 94, and the resistor 82 is soldered by reflow soldering means.

図９の第１配線基板９３に実装された抵抗８２はフロータイプであり、これを図６のリフロータイプの抵抗８２に置き換えると、第１配線基板９３を小さくすることができるが、リフロー半田付け工程が増えることになる。
リレー８０と抵抗８２とを半田付けする際の半田付け手段が異なるため、異なる半田付け手段で半田付けしなければならず、リレー８０及び抵抗８２を半田付けする際の工程数が多くなるだけでなく、半田付け作業に手間及び時間が掛かる。 The resistor 82 mounted on the first wiring board 93 in FIG. 9 is a flow type, and if this is replaced with the reflow type resistor 82 in FIG. 6, the first wiring board 93 can be made smaller, but reflow soldering is performed. The process will increase.
Since the soldering means for soldering the relay 80 and the resistor 82 is different, it must be soldered by different soldering means, and only the number of steps for soldering the relay 80 and the resistor 82 is increased. In addition, the soldering work takes time and effort.

これに対し、第３実施例の基板構造は、リレー８０と抵抗８２とを半田付け手段別（フロータイプ、リフロータイプ）に種類分けして、フロー半田付け手段にてリレー８０を第１配線基板１０に半田付けし、リフロー半田付け手段にて抵抗８２を第２配線基板２０に半田付けするので、リレー８０及び抵抗８２を半田付けする際の工程数が少なくて済み、半田付け作業の能率アップを図ることができるとともに、半田付けコストの低減を図ることができる。 On the other hand, in the board structure of the third embodiment, the relay 80 and the resistor 82 are classified by soldering means (flow type, reflow type), and the relay 80 is connected to the first wiring board by the flow soldering means. Since the resistor 82 is soldered to the second wiring board 20 by the reflow soldering means, the number of processes for soldering the relay 80 and the resistor 82 is reduced, and the efficiency of the soldering work is increased. In addition, the soldering cost can be reduced.

また、リレー８０に比べて、抵抗８２のサイズが小さいので、第１配線基板１０或いは第２配線基板２０のいずれか一方に抵抗８２のみを実装すれば、その抵抗８２が実装された方の基板を小型化することができる。 Further, since the size of the resistor 82 is smaller than that of the relay 80, if only the resistor 82 is mounted on either the first wiring substrate 10 or the second wiring substrate 20, the substrate on which the resistor 82 is mounted. Can be miniaturized.

なお、第１配線基板１０と第２配線基板２０との間は、樹脂プレート９５の保持孔９５ａを介して、該配線基板１０，２０の孔部１０ａ，２０ａに挿通された接続端子９６で電気的に接続されている。
また、第１配線基板１０に抵抗８２を半田付けし、第２配線基板２０にリレー８０を半田付けしてもよい。 In addition, between the 1st wiring board 10 and the 2nd wiring board 20, it is electrically connected by the connection terminal 96 penetrated by the hole 10a, 20a of this wiring board 10 and 20 through the holding hole 95a of the resin plate 95. FIG. Connected.
Alternatively, the resistor 82 may be soldered to the first wiring board 10 and the relay 80 may be soldered to the second wiring board 20.

この発明の構成と、前記実施形態との対応において、
この発明の電気部品は、コネクタハウジング１１，２１と、実装部品３１と、リレー８０と、抵抗８２に対応し、
以下同様に、
部品支持手段は、突出部１３，２３と、支持板３０と、接続端子４０，５０に対応し、
端子係合部は、保持孔３０ａと、保持穴３０ｂに対応し、
半田付け手段は、フローやリフローに対応するも、
この発明は、上述の実施形態の構成のみに限定されるものではなく、請求項に示される技術思想に基づいて応用することができ、多くの実施の形態を得ることができる。 In the correspondence between the configuration of the present invention and the embodiment,
The electrical component of the present invention corresponds to the connector housings 11 and 21, the mounting component 31, the relay 80, and the resistor 82,
Similarly,
The component support means corresponds to the protrusions 13 and 23, the support plate 30, and the connection terminals 40 and 50,
The terminal engaging portion corresponds to the holding hole 30a and the holding hole 30b,
Soldering means supports flow and reflow,
The present invention is not limited to the configuration of the above-described embodiment, but can be applied based on the technical idea shown in the claims, and many embodiments can be obtained.

本発明の基板構造は、例えばコンデンサ、半導体素子等の電気部品を配線基板に実装する際にも利用することができる。 The board structure of the present invention can also be used when mounting electrical components such as capacitors and semiconductor elements on a wiring board.

１０…第１配線基板
２０…第２配線基板
１０ａ，２０ａ…孔部
１１，２１…コネクタハウジング
１２，２２…接続端子
１３，２３…突出部
３０…支持板
３０ａ…保持孔
３０ｂ…保持穴
３１…実装部品
４０，５０…接続端子
８０…リレー
８２…抵抗 DESCRIPTION OF SYMBOLS 10 ... 1st wiring board 20 ... 2nd wiring board 10a, 20a ... Hole 11, 21 ... Connector housing 12, 22 ... Connection terminal 13, 23 ... Projection part 30 ... Support plate 30a ... Holding hole 30b ... Holding hole 31 ... Mounting parts 40, 50 ... Connection terminal 80 ... Relay 82 ... Resistance

Claims

A board structure for mounting electrical components on a first wiring board and a second wiring board arranged in parallel,
A board structure provided with a component support means for supporting an electrical component mounted on each wiring board through a hole formed in the first wiring board and the second wiring board in the thickness direction.

The component support means is constituted by a protrusion formed on the electrical component,
The protrusion formed on the electrical component is inserted through the hole formed in the first wiring board and the second wiring board,
The protruding part of the electric component protruding from the hole of the first wiring board and the protruding part of the electric component protruding from the hole of the second wiring board are in contact with each other so as to be integrated with each other. The substrate structure according to claim 1, which is fixed.

The component support means comprises a support plate disposed between opposing surfaces of the first wiring board and the second wiring board, and a connection terminal to which the electric component is attached,
The connection terminal to which the electrical component is attached is inserted through a hole formed in the first wiring board and / or the second wiring board,
A terminal engaging portion of a support plate arranged between the opposing surfaces of the first wiring board and the second wiring board with the connection terminal protruding from the hole of the first wiring board and / or the second wiring board. The substrate structure according to claim 1, which is engaged with the substrate structure.

The terminal engaging portion;
A holding hole that is formed so as to penetrate in the thickness direction of the support plate and allows the insertion of the connection terminal, or an engagement hole that engages with the connection terminal that does not penetrate in the thickness direction of the support plate. Item 4. The substrate structure according to Item 3.

A plurality of types of electrical components mounted by different soldering means on the first wiring board and / or the second wiring board are attached to the first wiring board and the second wiring board separately for each soldering means,
The board structure according to claim 1, wherein the electrical components are mounted on the first wiring board and the second wiring board by soldering means corresponding to the electrical parts, respectively.