JP5865391B2 - 光硬化性ダイシングダイ接合テープ - Google Patents
光硬化性ダイシングダイ接合テープ Download PDFInfo
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- JP5865391B2 JP5865391B2 JP2013546243A JP2013546243A JP5865391B2 JP 5865391 B2 JP5865391 B2 JP 5865391B2 JP 2013546243 A JP2013546243 A JP 2013546243A JP 2013546243 A JP2013546243 A JP 2013546243A JP 5865391 B2 JP5865391 B2 JP 5865391B2
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- Prior art keywords
- sensitive adhesive
- pressure
- polymer
- adhesive composition
- die bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 45
- 229920000642 polymer Polymers 0.000 claims description 42
- 239000000203 mixture Substances 0.000 claims description 28
- -1 polyethylene backbone Polymers 0.000 claims description 25
- 239000012948 isocyanate Substances 0.000 claims description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 20
- 229920001600 hydrophobic polymer Polymers 0.000 claims description 18
- 239000002243 precursor Substances 0.000 claims description 18
- 150000002513 isocyanates Chemical class 0.000 claims description 16
- 229920002313 fluoropolymer Polymers 0.000 claims description 10
- 239000004811 fluoropolymer Substances 0.000 claims description 10
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 7
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 7
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000005056 polyisocyanate Substances 0.000 claims description 6
- 229920001228 polyisocyanate Polymers 0.000 claims description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 3
- IPZIVCLZBFDXTA-UHFFFAOYSA-N ethyl n-prop-2-enoylcarbamate Chemical group CCOC(=O)NC(=O)C=C IPZIVCLZBFDXTA-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 238000000016 photochemical curing Methods 0.000 claims description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 3
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 claims description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims 2
- 206010070834 Sensitisation Diseases 0.000 claims 1
- 239000002998 adhesive polymer Substances 0.000 claims 1
- 150000004678 hydrides Chemical class 0.000 claims 1
- 230000008313 sensitization Effects 0.000 claims 1
- 239000000178 monomer Substances 0.000 description 26
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 229920002554 vinyl polymer Polymers 0.000 description 12
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 6
- 238000012644 addition polymerization Methods 0.000 description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 4
- 239000012975 dibutyltin dilaurate Substances 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ZVEMLYIXBCTVOF-UHFFFAOYSA-N 1-(2-isocyanatopropan-2-yl)-3-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC(C(C)(C)N=C=O)=C1 ZVEMLYIXBCTVOF-UHFFFAOYSA-N 0.000 description 2
- HMDQPBSDHHTRNI-UHFFFAOYSA-N 1-(chloromethyl)-3-ethenylbenzene Chemical compound ClCC1=CC=CC(C=C)=C1 HMDQPBSDHHTRNI-UHFFFAOYSA-N 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 2
- HVQPNKXSWMVRDZ-UHFFFAOYSA-N 3-isocyanatopropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCN=C=O HVQPNKXSWMVRDZ-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- ZWKNLRXFUTWSOY-QPJJXVBHSA-N (e)-3-phenylprop-2-enenitrile Chemical compound N#C\C=C\C1=CC=CC=C1 ZWKNLRXFUTWSOY-QPJJXVBHSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- OHIMDKUMPFEBRI-UHFFFAOYSA-N 1-(2-isocyanatobutan-2-yl)-4-prop-1-en-2-ylbenzene Chemical compound O=C=NC(C)(CC)C1=CC=C(C(C)=C)C=C1 OHIMDKUMPFEBRI-UHFFFAOYSA-N 0.000 description 1
- JRLLJITWABKEKE-UHFFFAOYSA-N 1-(2-isocyanatopropan-2-yl)-4-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=C(C(C)(C)N=C=O)C=C1 JRLLJITWABKEKE-UHFFFAOYSA-N 0.000 description 1
- QMMDPWDACKNGIC-UHFFFAOYSA-N 1-but-2-en-2-yl-3-(2-isocyanatobutan-2-yl)benzene Chemical compound O=C=NC(C)(CC)C1=CC=CC(C(C)=CC)=C1 QMMDPWDACKNGIC-UHFFFAOYSA-N 0.000 description 1
- GENXEVFXTJPRGD-UHFFFAOYSA-N 1-but-2-en-2-yl-4-(2-isocyanatobutan-2-yl)benzene Chemical compound O=C=NC(C)(CC)C1=CC=C(C(C)=CC)C=C1 GENXEVFXTJPRGD-UHFFFAOYSA-N 0.000 description 1
- BHBDKPKKEYKKQB-UHFFFAOYSA-N 1-ethenoxy-2-methylbutane Chemical compound CCC(C)COC=C BHBDKPKKEYKKQB-UHFFFAOYSA-N 0.000 description 1
- SWZSKZZXXULJHU-UHFFFAOYSA-N 1-ethenoxyheptane Chemical compound CCCCCCCOC=C SWZSKZZXXULJHU-UHFFFAOYSA-N 0.000 description 1
- YAOJJEJGPZRYJF-UHFFFAOYSA-N 1-ethenoxyhexane Chemical compound CCCCCCOC=C YAOJJEJGPZRYJF-UHFFFAOYSA-N 0.000 description 1
- XXCVIFJHBFNFBO-UHFFFAOYSA-N 1-ethenoxyoctane Chemical compound CCCCCCCCOC=C XXCVIFJHBFNFBO-UHFFFAOYSA-N 0.000 description 1
- IOSXLUZXMXORMX-UHFFFAOYSA-N 1-ethenoxypentane Chemical compound CCCCCOC=C IOSXLUZXMXORMX-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- VQBQVCSDUPDTOQ-UHFFFAOYSA-N 1-ethenyl-3-(1-isocyanatoethyl)benzene Chemical compound O=C=NC(C)C1=CC=CC(C=C)=C1 VQBQVCSDUPDTOQ-UHFFFAOYSA-N 0.000 description 1
- YPYCTRHWKDAZLU-UHFFFAOYSA-N 1-ethenyl-4-(1-isocyanatoethyl)benzene Chemical compound O=C=NC(C)C1=CC=C(C=C)C=C1 YPYCTRHWKDAZLU-UHFFFAOYSA-N 0.000 description 1
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
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- GNEPBTGCKNEPNE-UHFFFAOYSA-N 1-isocyanatoprop-2-enylbenzene Chemical compound O=C=NC(C=C)C1=CC=CC=C1 GNEPBTGCKNEPNE-UHFFFAOYSA-N 0.000 description 1
- AHUATVXAIRUBNQ-UHFFFAOYSA-N 1-isocyanatopropan-2-yl 2-methylprop-2-enoate Chemical compound O=C=NCC(C)OC(=O)C(C)=C AHUATVXAIRUBNQ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
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- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
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- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
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- 125000005002 aryl methyl group Chemical group 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
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- 238000011109 contamination Methods 0.000 description 1
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- IJDSUFQMYUARCQ-QZTJIDSGSA-N diisophorone Chemical compound C([C@@](C1)(C)C2)C(C)(C)C[C@]1(O)C1=C2CC(C)(C)CC1=O IJDSUFQMYUARCQ-QZTJIDSGSA-N 0.000 description 1
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- IYNRVIKPUTZSOR-HWKANZROSA-N ethenyl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC=C IYNRVIKPUTZSOR-HWKANZROSA-N 0.000 description 1
- LPUZTLKYAOOFDX-QXMHVHEDSA-N ethenyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC=C LPUZTLKYAOOFDX-QXMHVHEDSA-N 0.000 description 1
- YCUBDDIKWLELPD-UHFFFAOYSA-N ethenyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC=C YCUBDDIKWLELPD-UHFFFAOYSA-N 0.000 description 1
- IGBZOHMCHDADGY-UHFFFAOYSA-N ethenyl 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)OC=C IGBZOHMCHDADGY-UHFFFAOYSA-N 0.000 description 1
- CMXXMZYAYIHTBU-UHFFFAOYSA-N ethenyl 2-hydroxybenzoate Chemical compound OC1=CC=CC=C1C(=O)OC=C CMXXMZYAYIHTBU-UHFFFAOYSA-N 0.000 description 1
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- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
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- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J183/02—Polysilicates
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
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- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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Description
イソシアナト−1−メチルプロピル)−4−(1−メチルプロペニル)ベンゼン、1−(1−イソシアナト−1−メチルプロピル)−4−(1−メチルエテニル)ベンゼン、1−(1−イソシアナト−1−エチル)−3−(1−エテニル)ベンゼン、1−(1−イソシアナト−1−エチル)−4−(1−エテニル)ベンゼン等である。そのようなイソシアネートの製造方法は、米国特許第2,718,516号、同第2,821,544号、同4,377,530号および同4,439,616号各公報に記載されている。いくつかのイソシアネートは、市販で入手可能である。複数のエチレン性不飽和イソシアネートの混合物を使用してもよい。
エチルアセテート(100g)中でラジカル開始剤を用い、2−エチルヘキシルアクリレート(14g)と、ブチルアクリレート(63g)と、および2−ヒドロキシエチルアクリレート(23g)との共重合から感圧接着剤(PSA)を製造し、反応が完結するまで90℃(ジャケット温度)に加熱した。この前駆体ポリマーにメタクリロイルオキシエチルイソシアネート(24.10g)および触媒としてジブチル錫ジラウレート(0.065g)を添加し、組成物混合物を室温で8時間反応させた。イソホロンジイソシアネート(3.27g)を添加し、混合物を室温でさらに30分反応させた。得られたPSAポリマーをPET剥離紙上に塗布した。塗布されたPSAをポリオレフィンベースフィルムに室温で積層し、ダイシングテープを製造した。このダイシングテープにダイ接合フィルムを積層し、ダイシングダイ接合フィルムの組合せを製造した。ダイシングダイ接合フィルムを75μm厚さのシリコンウエハに積層し、極薄ダイヤモンド刃を有するダイシングソーを使用して20,000rpmより高速度で、シリコンウエハを複数の個々のダイにダイシングした。
エチルアセテート(100g)中でラジカル開始剤を用い、2−エチルヘキシルアクリレート(14g)と、ブチルアクリレート(63g)と、および2−ヒドロキシエチルアクリレート(23g)との共重合から感圧接着剤(PSA)を製造し、反応が完結するまで90℃(ジャケット温度)に加熱した。この前駆体ポリマーにビニル末端ポリジメトキシルシロキサン(DMS−V46)(1.0g)と、メタクリロイルオキシエチルイソシアネート(MOI)(24.10g)と、および触媒としてジブチル錫ジラウレート(0.065g)とを添加した。その後、組成物混合物を室温で8時間反応させた。イソホロンジイソシアネート(3.27g)を添加し、混合物を室温でさらに30分反応させた。得られたPSAポリマーをPET剥離紙上に塗布した。塗布されたPSAをポリオレフィンベースフィルムに室温で積層し、ダイシングテープを製造した。このダイシングテープにダイ接合フィルムを積層し、ダイシングダイ接合フィルムの組合せを製造した。ダイシングダイ接合フィルムを75μm厚さのシリコンウエハに積層し、極薄ダイヤモンド刃を有するダイシングソーを使用して20,000rpmより高速度で、シリコンウエハを複数の個々のダイにダイシングした。
エチルアセテート(100g)中でラジカル開始剤を用い、2−エチルヘキシルアクリレート(14g)と、ブチルアクリレート(63g)と、2−ヒドロキシエチルアクリレート(23g)との共重合から感圧接着剤(PSA)を製造し、反応が完結するまで90℃(ジャケット温度)に加熱した。この前駆体ポリマーにビニル末端フルオロポリマー(LF200およびメタクリロイルオキシエチルイソシアネート(MOI)(24.10g)の付加物)と、触媒としてジブチル錫ジラウレート(0.065g)とを添加した。その後、組成物混合物を室温で8時間反応させた。(ビニル末端フルオロポリマーを、フルオロポリマー(10g)(LF200)と1.5gのMOIとの反応によって製造した。)(いくつかの試料では、疎水性ポリマーを安定化するためにトルエンまたはキシレンを組成物中で使用してよい。)イソホロンジイソシアネート(3.27g)を添加し、混合物を室温でさらに30分反応させた。得られたPSAポリマーをPET剥離紙上に塗布した。塗布されたPSAをポリオレフィンベースフィルムに室温で積層し、ダイシングテープを製造した。このダイシングテープにダイ接合フィルムを積層し、ダイシングダイ接合フィルムの組合せを製造した。ダイシングダイ接合フィルムを75μm厚さのシリコンウエハに積層し、極薄ダイヤモンド刃を有するダイシングソーを使用して20,000rpmより高速度で、シリコンウエハを複数の個々のダイにダイシングした。
Claims (11)
- (A)ペンダント炭素−炭素不飽和を有する感圧接着剤ポリマーであって、ポリエチレン骨格および少なくとも1つのペンダントアクリロイルウレタン基を有する前記感圧接着剤ポリマー(A)と、
(B)炭素−炭素不飽和で末端封止された疎水性ポリマーであって、ビニル末端シロキサンポリマーおよび/またはビニル末端フルオロポリマーである前記疎水性ポリマー(B)と、を含む、
感圧接着剤組成物。 - 前記疎水性ポリマー(B)のすべての末端が、炭素−炭素不飽和で末端封止されている、請求項1に記載の感圧接着剤組成物。
- さらに、前記感圧接着剤ポリマー(A)および前記疎水性ポリマー(B)を部分的に架橋するのに有効な量でポリイソシアネートを含む、請求項1または2に記載の感圧接着剤組成物。
- 前記ポリイソシアネートが、前記感圧接着剤ポリマー(A)および前記疎水性ポリマー(B)を架橋している、請求項3に記載の感圧接着剤組成物。
- 前記ポリイソシアネートが、ジイソホロンジイソシアネート、トルエンジイソシアネート、ジフェニルメタンジイソシアネート、および1,5−ナフタレンジイソシアネートからなる群より選択される、請求項3または4に記載の感圧接着剤組成物。
- 前記組成物がUV照射による光硬化性を有する、請求項1〜5のいずれか1項に記載の感圧接着剤組成物。
- 請求項1〜6のいずれか1項に記載の感圧接着剤組成物と接触している支持層と、請求項1〜6のいずれか1項に記載の感圧接着剤組成物と接触しているダイ接合接着剤層とを含む、光硬化性ダイシングダイ接合テープ。
- 光硬化する前に、前記感圧接着剤組成物がダイ接合接着剤層に接着し、光硬化の後に、前記感圧接着剤組成物がダイ接合接着剤層から剥離する、請求項7に記載の光硬化性ダイシングダイ接合テープ。
- 前記感圧接着剤組成物がUV照射による光硬化性を有する、請求項7または8に記載の光硬化性ダイシングダイ接合テープ。
- 請求項1に記載の疎水性ポリマー(B)存在下で、ポリエチレン鎖およびペンダントヒドロキシル基を有する前駆体ポリマーと、エチレン性不飽和イソシアネートとを反応して、請求項1に記載の感圧接着剤ポリマー(A)を調製する工程を含む、請求項1に記載の感圧接着剤組成物の製造方法。
- 請求項1に記載の疎水性ポリマー(B)存在下で、ポリエチレン鎖およびペンダントイソシアネート基を有する前駆体ポリマーと、アクリロイル基を含有する活性水素化物とを反応して、請求項1に記載の感圧接着剤ポリマー(A)を調製する工程を含む、請求項1に記載の感圧接着剤組成物の製造方法。
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US201061424860P | 2010-12-20 | 2010-12-20 | |
US61/424,860 | 2010-12-20 | ||
PCT/US2011/065346 WO2012087780A2 (en) | 2010-12-20 | 2011-12-16 | Photocurable dicing die bonding tape |
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US10043701B2 (en) | 2013-05-15 | 2018-08-07 | Infineon Technologies Ag | Substrate removal from a carrier |
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KR102540270B1 (ko) * | 2018-03-27 | 2023-06-07 | 미쯔비시 케미컬 주식회사 | 점착제 조성물, 점착 시트 및 에틸렌성 불포화기 함유 아크릴계 수지의 제조 방법 |
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