JP5333227B2 - 感放射線性組成物、及びフォトレジストパターンの形成方法 - Google Patents
感放射線性組成物、及びフォトレジストパターンの形成方法 Download PDFInfo
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- JP5333227B2 JP5333227B2 JP2009534394A JP2009534394A JP5333227B2 JP 5333227 B2 JP5333227 B2 JP 5333227B2 JP 2009534394 A JP2009534394 A JP 2009534394A JP 2009534394 A JP2009534394 A JP 2009534394A JP 5333227 B2 JP5333227 B2 JP 5333227B2
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- 125000001298 n-hexoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000006137 n-hexyl sulfonyl group Chemical group 0.000 description 1
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- 125000006608 n-octyloxy group Chemical group 0.000 description 1
- 125000003935 n-pentoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
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- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
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- VDSMPNIBLRKWEG-UHFFFAOYSA-N tert-butyl n-[6-[(2-methylpropan-2-yl)oxycarbonylamino]hexyl]carbamate Chemical compound CC(C)(C)OC(=O)NCCCCCCNC(=O)OC(C)(C)C VDSMPNIBLRKWEG-UHFFFAOYSA-N 0.000 description 1
- PDJJNHGVNMFOQO-UHFFFAOYSA-N tert-butyl n-[6-[bis[(2-methylpropan-2-yl)oxycarbonyl]amino]hexyl]-n-[(2-methylpropan-2-yl)oxycarbonyl]carbamate Chemical compound CC(C)(C)OC(=O)N(C(=O)OC(C)(C)C)CCCCCCN(C(=O)OC(C)(C)C)C(=O)OC(C)(C)C PDJJNHGVNMFOQO-UHFFFAOYSA-N 0.000 description 1
- NMEQKHOJGXGOIL-UHFFFAOYSA-N tert-butyl n-[7-[(2-methylpropan-2-yl)oxycarbonylamino]heptyl]carbamate Chemical compound CC(C)(C)OC(=O)NCCCCCCCNC(=O)OC(C)(C)C NMEQKHOJGXGOIL-UHFFFAOYSA-N 0.000 description 1
- YLKUQZHLQVRJEV-UHFFFAOYSA-N tert-butyl n-[8-[(2-methylpropan-2-yl)oxycarbonylamino]octyl]carbamate Chemical compound CC(C)(C)OC(=O)NCCCCCCCCNC(=O)OC(C)(C)C YLKUQZHLQVRJEV-UHFFFAOYSA-N 0.000 description 1
- XSIWKTQGPJNJBV-UHFFFAOYSA-N tert-butyl n-[9-[(2-methylpropan-2-yl)oxycarbonylamino]nonyl]carbamate Chemical compound CC(C)(C)OC(=O)NCCCCCCCCCNC(=O)OC(C)(C)C XSIWKTQGPJNJBV-UHFFFAOYSA-N 0.000 description 1
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- RAOIDOHSFRTOEL-UHFFFAOYSA-N tetrahydrothiophene Chemical group C1CCSC1 RAOIDOHSFRTOEL-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- UWIVZLWKBOZJFG-UHFFFAOYSA-N thiolan-1-ium trifluoromethanesulfonate Chemical compound C1CC[SH+]C1.[O-]S(=O)(=O)C(F)(F)F UWIVZLWKBOZJFG-UHFFFAOYSA-N 0.000 description 1
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- 238000012546 transfer Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- 125000005951 trifluoromethanesulfonyloxy group Chemical group 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
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- 238000000108 ultra-filtration Methods 0.000 description 1
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Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Description
本発明の感放射線性組成物は、下記一般式(1)で表される繰り返し単位(1)及び下記一般式(2)で表される繰り返し単位(2)を有する重合体(A)と、感放射線性酸発生剤(B)とを含有する感放射線性組成物である。
本発明の感放射線性組成物に含まれる重合体(A)は、上記一般式(1)で表される繰り返し単位(以下、「繰り返し単位(1)」という)、及び上記一般式(2)で表される繰り返し単位(以下、「繰り返し単位(2)」という)を有する重合体である。
本発明の感放射線性組成物に含有される感放射線性酸発生剤(B)(以下、単に「酸発生剤(B)」ということがある)は、露光により酸を発生するものであり、光酸発生剤として機能する。この酸発生剤は、露光により発生した酸によって、感放射線性組成物に含有される重合体(A)中に存在する酸解離性基を解離させて(即ち、保護基を脱離させて)、重合体(A)をアルカリ可溶性とする。そして、その結果、レジスト被膜の露光部がアルカリ現像液に易溶性となり、これによりポジ型のレジストパターンが形成される。
本発明の感放射線性組成物は、これまでに説明した重合体(A)及び感放射線性酸発生剤(B)に加えて、窒素含有化合物(C)を更に含有していてもよい。この窒素含有化合物(C)は、露光により酸発生剤から生じる酸のレジスト被膜中における拡散現象を制御し、非露光領域における好ましくない化学反応を抑制するものである。即ち、この窒素含有化合物(C)は、酸拡散制御剤として機能する。このような窒素含有化合物(C)を配合することにより、得られる感放射線性組成物の貯蔵安定性が向上し、またレジストとしての解像度が更に向上するとともに、露光から露光後の加熱処理までの引き置き時間(PED)の変動によるレジストパターンの線幅変化を抑えることができ、プロセス安定性に極めて優れた組成物とすることができる。
本発明の感放射線性組成物には、必要に応じて、フッ素含有重合体添加剤(d1)、脂環式骨格含有添加剤(d2)、界面活性剤(d3)、増感剤(d4)等の各種の添加剤(D)を配合することができる。各添加剤の含有割合は、その目的に応じて適宜決定することができる。
(2)それ自身が現像液に可溶であり酸の作用によりアルカリ可溶性が増大するフッ素含有重合体添加剤(d1−2)。
(3)それ自身は現像液に不溶でアルカリの作用によりアルカリ可溶性となるフッ素含有重合体添加剤(d1−3)。
(4)それ自身が現像液に可溶でありアルカリの作用によりアルカリ可溶性が増大するフッ素含有重合体添加剤(d1−4)。
溶剤(E)としては、重合体(A)、及び感放射線性酸発生剤(B)が溶解する溶剤であれば、特に限定されるものではない。なお、感放射線性組成物が窒素含有化合物(C)、及び添加剤(D)を更に含有する場合には、これらの成分も溶解する溶剤であることが好ましい。
本発明の感放射線性組成物は、化学増幅型レジストとして有用である。化学増幅型レジストにおいては、露光により酸発生剤から発生した酸の作用によって、重合体(A)中の酸解離性基が解離して、カルボキシル基を生じ、その結果、レジストの露光部のアルカリ現像液に対する溶解性が高くなり、この露光部がアルカリ現像液によって溶解、除去され、ポジ型のフォトレジストパターンが得られる。
東ソー社製のGPCカラム(商品名「G2000HXL」2本、商品名「G3000HXL」1本、商品名「G4000HXL」1本)を使用し、流量:1.0ミリリットル/分、溶出溶媒:テトラヒドロフラン、カラム温度:40℃の分析条件で、単分散ポリスチレンを標準とするゲルパーミエーションクロマトグラフィ(GPC)により測定した。また、分散度「Mw/Mn」は、Mw及びMnの測定結果より算出した。
それぞれの重合体の13C−NMR分析は、日本電子社製の商品名「JNM−EX270」を使用し、測定した。
ODSカラム(商品名「Inertsil ODS−25μmカラム」(内径4.6mm、長さ250mm)、ジーエルサイエンス社製)を使用し、流量:1.0ミリリットル/分、溶出溶媒:アクリロニトリル/0.1%リン酸水溶液の分析条件で、高速液体クロマトグラフィー(HPLC)により測定した。なお、低分子量成分は、モノマーを主成分とする、分子量1,000未満(即ち、トリマーの分子量以下)の成分である。
まず、コータ/デベロッパ(1)(商品名「CLEAN TRACK ACT8」、東京エレクトロン社製)を用いて、8インチシリコンウエハの表面に膜厚77nmの下層反射防止膜(商品名「ARC29A」、ブルワー・サイエンス社製)を形成して基板とした。
上記感度(1)の評価で形成したライン・アンド・スペースのレジストパターンの線幅のうち、ラインの最小線幅(nm)を解像度の評価値とした(表4中、「解像度(1)(nm)」と示す)。解像度は、数値が小さいほど良好であることを示す。
上記感度(1)の評価で得たレジスト膜の90nmライン・アンド・スペースパターンの断面形状を、日立ハイテクノロジーズ社製の走査型電子顕微鏡(商品名「S−4800」)で観察し、レジストパターンの中間での線幅Lbと、膜の上部での線幅Laを測定した。測定した結果、(La−Lb)/Lbで算出される値が、0.9≦(La−Lb)/Lb≦1.1の範囲内である場合を「良好」とし、範囲外である場合を「不良」とした。
上記感度(1)の評価の最適露光量にて解像した90nmのライン・アンド・スペースパターンの観測で、走査型電子顕微鏡(商品名「S−9380」、日立ハイテクノロジーズ社製)にてパターン上部から観察した際の線幅において、表3に示す条件でPEBを行った場合の線幅と、PEBの温度を±2℃それぞれ変化させたときの上記最適露光量での線幅の差をそれぞれ測定し、温度差で割ったときの変化量をPEB温度依存性(nm/℃)とした。PEB温度依存性が、3nm/℃未満である場合を「良好」とし、3nm/℃以上である場合を「不良」とした。
上記感度(1)の評価の最適露光量にて解像した90nmのライン・アンド・スペースパターンの観測において、走査型電子顕微鏡(商品名「S−9380」、日立ハイテクノロジーズ社製)にてパターン上部から観察した際に、線幅を任意のポイントで観測し、その測定ばらつきを3σ(nm)で評価した。
上記感度(1)の評価の最適露光量にて解像した90nmのライン・アンド・スペースパターンの観測において、この最適露光量よりも大きな露光量にて露光を行った場合、得られるパターンの線幅が細くなるため、最終的にレジストパターンの倒壊が見られる。このレジストパターンの倒壊が確認されない最大の露光量における線幅を最小倒壊前寸法(nm)と定義し、パターン倒れ耐性の指標とし、その線幅が小さい程良好である。なお、最小倒壊前寸法(nm)の測定は、走査型電子顕微鏡(商品名「S−9380」、日立ハイテクノロジーズ社製)を用いた。
まず、感度(1)の測定に用いたコータ/デベロッパ(1)を用いて、処理条件100℃、60秒でHMDS(ヘキサメチルジシラザン)処理を行った8インチシリコンウエハを用意した。この8インチシリコンウエハ上に、各実施例及び比較例にて調整した感放射線性組成物をスピンコートし、表3の条件でベーク(PB)を行い、膜厚120nmのレジスト膜を形成した。
まず、コータ/デベロッパ(2)(商品名「CLEAN TRACK ACT12」、東京エレクトロン社製)を用いて、12インチシリコンウエハの表面に膜厚77nmの下層反射防止膜(商品名「ARC29A」、ブルワー・サイエンス社製)を形成して基板とした。
上記感度(2)の評価で形成したライン・アンド・スペースのレジストパターンの線幅のうち、ラインの最小線幅(nm)を解像度の評価値とした(表5中、「解像度(2)(nm)」と示す)。解像度は、数値が小さいほど良好であることを示す。
上記感度(2)の評価で得たレジスト膜の65nmライン・アンド・スペースパターンの断面形状を、日立ハイテクノロジーズ社製の走査型電子顕微鏡(商品名「S−4800」)で観察し、レジストパターンの中間での線幅Lbと、膜の上部での線幅Laを測定した。測定した結果、(La−Lb)/Lbで算出される値が、0.9≦(La−Lb)/Lb≦1.1の範囲内である場合を「良好」とし、範囲外である場合を「不良」とした。
まず、感度(2)にて用いたコータ/デベロッパ(2)を用いて、12インチシリコンウエハの表面に膜厚77nmの下層反射防止膜(商品名「ARC29A」、ブルワー・サイエンス社製)を形成して基板とした。
重合体(A)は、各合成例において、表1に示す化合物(M−1)〜(M−8)を用いて合成した。化合物(M−1)〜(M−8)を、以下の式(M−1)〜(M−8)に示す。
上記化合物(M−1)30.46g(50モル%)、上記化合物(M−2)19.54g(50モル%)を2−ブタノン100gに溶解し、更に、開始剤としてアゾビスイソブチロニトリル(表1中「AIBN」と記す)1.91g(5モル%)を投入した単量体溶液を準備した。
表1に示す配合処方とした以外は、合成例1と同様にして重合体(A−2)〜(A−8)を合成した。
表3に、各実施例及び比較例にて調製された感放射線性組成物の組成と、露光前及び露光後加熱条件(PB及びPEB)を示す。また、上記合成例にて合成した重合体(A−1)〜(A−8)以外の感放射線性組成物を構成する各成分(感放射線性酸発生剤(B)、窒素含有化合物(C)、添加剤(D)及び溶剤(E))について以下に示す。
(B−1):4−シクロヘキシルフェニル・ジフェニルスルホニウム・ノナフルオロ−n−ブタンスルホネート
(B−2):トリフェニルスルホニウム・ノナフルオロ−n−ブタンスルホネート
(B−3):1−(4−n−ブトキシナフタレン−1−イル)テトラヒドロチオフェニウム・ノナフルオロ−n−ブタンスルホネート
(B−4):1−(4−n−ブトキシナフタレン−1−イル)テトラヒドロチオフェニウム・2−(ビシクロ[2.2.1]ヘプタ−2−イル)−1,1,2,2−テトラフルオロエタンスルホネート
(B−5):トリフェニルスルホニウム・2−(ビシクロ[2.2.1]ヘプタ−2−イル)−1,1,2,2−テトラフルオロエタンスルホネート
(B−6):トリフェニルスルホニウム・2−(ビシクロ[2.2.1]ヘプタ−2−イル)−1,1−ジフルオロエタンスルホネート
(C−1):N−t−ブトキシカルボニル−4−ヒドロキシピペリジン
(C−2):R−(+)−(tert−ブトキシカルボニル)−2−ピペリジンメタノール
(C−3):N−t−ブトキシカルボニルピロリジン
(C−4):N−t−ブトキシカルボニル−2−フェニルベンズイミダゾール
(D−1):リトコール酸t−ブトキシカルボニルメチル
(D−2):メタクリル酸2,2,2−トリフルオロエチルエステルとメタクリル酸1−エチルシクロヘキシルエステルとの共重合体(メタクリル酸2,2,2−トリフルオロエチルエステルとメタクリル酸1−エチルシクロヘキシルエステルの仕込みモル比が30:70、最終組成比が29.5:70.5、Mwが7300、Mw/Mnが1.60)
(E−1):プロピレングリコールモノメチルエーテルアセテート
(E−2):シクロヘキサノン
(E−3):γ−ブチロラクトン
合成例1で得られた重合体(A−1)100質量部、感放射線性酸発生剤(B)として4−シクロヘキシルフェニル・ジフェニルスルホニウム・ノナフルオロ−n−ブタンスルホネート(B−1)9.6質量部、窒素含有化合物(C)としてN−t−ブトキシカルボニル−4−ヒドロキシピペリジン(C−1)1.05質量部を混合し、この混合物に、溶剤(E)としてプロピレングリコールモノメチルエーテルアセテート(E−1)1400質量部とシクロヘキサノン(E−2)600質量部とを添加し、上記混合物を溶解させて混合溶液を得、得られた混合溶液を孔径0.20μmのフィルターでろ過して感放射線性組成物を調製した。表3に感放射線性組成物の配合処方を示す。
感放射線性組成物を調製する各成分を表3に示すように変えた以外は、参考例1と同様にして、感放射線性組成物(実施例1〜4、参考例2〜5、及び比較例1)を得た。得られた実施例1〜4、参考例2〜5、及び比較例1の感放射線性組成物について、上述した、感度(1)、解像度(1)、パターンの断面形状(1)、PEB温度依存性、LWR(ラインラフネス特性)、最小倒壊前寸法、及びブロッブ欠陥について評価を行った。評価結果を表4に示す。
表4及び表5から明らかなように、上記一般式(1)で表される繰り返し単位(1)となる化合物(M−1)と、上記一般式(2)で表される繰り返し単位(2)となる化合物(M−2)、(M−3)の少なくともいずれか一つとを有する重合体(A)を用いた感放射線性組成物(実施例1〜3、参考例1〜5)は、レジストパターンを形成した際に、解像度だけでなく、LWR、やPEB温度依存性等のレジスト諸性能が向上することが分かった。
Claims (6)
- 下記一般式(1)で表される繰り返し単位(1)及び下記一般式(2)で表される繰り返し単位(2)を有する重合体(A)と、感放射線性酸発生剤(B)とを含有し、
前記重合体(A)中、繰り返し単位(1)の含有率が20〜80モル%であり、繰り返し単位(2)の含有率が20〜80モル%であって、
液浸プロセスに使用されるレジスト膜の形成に用いられる感放射線性組成物。
- 前記感放射線性酸発生剤(B)が、下記一般式(4)で表される化合物である請求項1又は2に記載の感放射線性組成物。
- 感放射線性組成物を用いて、基板上にフォトレジスト膜を形成する工程と、
前記フォトレジスト膜上に、液浸液不溶性の液浸用保護膜を形成する工程と、
前記フォトレジスト膜に、液浸液を介して、所定のパターンを有するマスクを通して放射線を照射し、前記フォトレジスト膜を露光する工程と、
露光された前記フォトレジスト膜を現像し、フォトレジストパターンを形成する工程とを含むフォトレジストパターンの形成方法であって、
前記感放射線性組成物は、下記一般式(1)で表される繰り返し単位(1)及び下記一般式(2)で表される繰り返し単位(2)を有する重合体(A)と、感放射線性酸発生剤(B)とを含有し、
前記重合体(A)中、繰り返し単位(1)の含有率が20〜80モル%であり、繰り返し単位(2)の含有率が20〜80モル%であるフォトレジストパターンの形成方法。
- 前記感放射線性酸発生剤(B)が、下記一般式(4)で表される化合物である請求項4又は5に記載のフォトレジストパターンの形成方法。
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