JP5376467B2 - Vertical structure gallium nitride based light emitting diode device and method for manufacturing the same - Google Patents

Abstract

A vertical gallium nitride-based light emitting diode and a manufacturing method thereof are provided to prevent junction leakage and a short circuit by preventing atoms composing a metal seed layer from penetrating into an active layer. A light emission structure(120) comprising an n-type GaN-based semiconductor layer(121), an active layer, and a p-type GaN-based semiconductor layer(123) is formed on a substrate, and then is etched to divide the light emission structure into units of LED(100). A p-electrode(150) is formed on each of the divided light emission structures, and a non-conductive material is filled between the divided light emission structures. A metal seed layer(160) is formed on the structure, and a first plated layer(170a) is formed on the metal seed layer excluding a region between the light emission structures. A second plated layer(170b) is formed on the metal seed layer between the first plated layers. The substrate is separated from the light emission structures, and then the non-conductive material is removed between the light emission structures exposed by separating the substrate. An n-electrode(180) is formed on the n-type GaN-based semiconductor layer, and then portions of the metal seed layer and the second plated layer are removed between the light emission structures.

Description

  The present invention relates to a method of manufacturing a vertical structure (vertical electrode type) gallium nitride-based (GaN) light emitting diode (hereinafter referred to as LED) element, and more specifically, to improve the reliability of the element. The present invention relates to a vertical structure gallium nitride LED device and a method for manufacturing the same.

  In general, gallium nitride LED elements are grown on a sapphire substrate. Since such sapphire substrates are solid and electrically non-conductive and have poor heat conduction characteristics, the size of the gallium nitride LED element can be reduced. There are limits to reducing manufacturing costs or improving light output and chip characteristics. In particular, since it is essential to apply a large current in order to increase the output of the LED element, it is extremely important to solve the heat release problem of the LED element.

  Conventionally, as a means for solving such a problem, a vertically structured gallium nitride LED element in which the sapphire substrate is removed by a laser lift-off (hereinafter referred to as “LLO”) technique has been proposed.

  Hereinafter, with reference to FIG. 1A to FIG. 1F and FIG. 2, problems of the conventional vertical structure gallium nitride LED device will be described in detail.

  1A to 1F are process cross-sectional views sequentially illustrating a method for manufacturing a vertical structure gallium nitride LED device according to the prior art.

  First, as shown in FIG. 1A, a light emitting structure 120 made of a gallium nitride based semiconductor layer is formed on a sapphire substrate 110. At this time, the light emitting structure 120 has a structure in which an n-type gallium nitride based semiconductor layer 121, a GaN / InGaN active layer 122 having a multi-well structure, and a p-type gallium nitride based semiconductor layer 123 are sequentially stacked.

  Next, as shown in FIG. 1B, a plurality of p-type electrodes 150 are formed on the p-type gallium nitride based semiconductor layer 123. At this time, the p-type electrode 150 functions as an electrode and a reflective film.

  Next, as shown in FIG. 1C, the light emitting structure 120 is separated into unit LED elements by a reactive ion etching (RIE) process or the like.

  Next, as shown in FIG. 1D, a protective film 140 is formed on the resulting entire structure so as to expose the p-type electrode 150. After that, a metal seed layer 160 is formed on the protective film 140 and the p-type electrode 150, and then an electrolytic plating or an electroless plating is performed using the metal seed layer 160, thereby forming a plating layer. A structural support layer 170 is formed. The structural support layer 170 functions as a support layer and an electrode of the final LED element. At this time, the structure support layer 170 is also formed in a region between the light emitting structures 120, and the structure support layer 170 having a relatively thick thickness is formed in this region.

  Thereafter, as shown in FIG. 1E, the sapphire substrate 110 is separated from the light emitting structure 120 by an LLO process.

  Thereafter, as shown in FIG. 1F, an n-type electrode 180 is formed on each of the n-type gallium nitride based semiconductor layers 121 separated and exposed from the sapphire substrate 110, and then the structure support layer 170 is diced. Alternatively, the plurality of gallium nitride-based LED elements 100 are formed by being separated into unit LED element sizes by a laser scribing process.

  However, in the process of performing the dicing or laser scribing process of the structural support layer 170 having a relatively thick thickness, the light emitting structure 120 may be broken or damaged.

  When the structure support layer 170 is formed, the structure support layer 170 is included due to a difference in thermal expansion coefficient between the light emitting structure 120 and the structure support layer 170 formed between the light emitting structures 120. Since the bending phenomenon of the entire structure occurs, it is not easy to perform the subsequent process.

  In addition, when the atoms constituting the metal seed layer 160 permeate the active layer 122, there is a problem that a junction leakage and a shot phenomenon occur.

  As described above, when the vertical structure gallium nitride LED device is manufactured by the conventional technique, there is a problem that the reliability of the vertical structure gallium nitride LED device is lowered due to the above-described problems.

  Meanwhile, a vertical gallium nitride LED device according to the related art may be manufactured as shown in FIG.

  FIG. 2 is a cross-sectional view showing the structure of still another vertical structure gallium nitride based LED device manufactured according to the prior art.

  As shown in FIG. 2, a structure support layer 270 that functions to support the LED element is formed at the bottom of the vertical structure gallium nitride LED element 200 according to the prior art. The structural support layer 270 may be formed of a Si substrate, a GaAs substrate, a metal layer, or the like.

  A bonding layer 260 and a reflective electrode 250 are sequentially formed on the structural support layer 270. Here, the reflective electrode 250 is preferably made of a metal having high reflectivity so as to simultaneously perform the functions of the electrode and the reflective film.

  On the reflective electrode 250, a p-type gallium nitride semiconductor layer 240, a GaN / InGaN active layer 230 having a multiple quantum well structure, and an n-type gallium nitride semiconductor layer 220 are sequentially formed.

  An n-type electrode 210 is formed on the n-type gallium nitride based semiconductor layer 220. Here, a transparent electrode (not shown) for improving a current diffusion phenomenon may be further formed between the n-type gallium nitride based semiconductor layer 220 and the n-type electrode 210.

  In the vertical structure gallium nitride LED device 200 according to the related art, the p-type gallium nitride system is used so that the light generated from the active layer 230 can be reflected by the reflective electrode 250 and emitted to the outside as much as possible. Although the reflective electrode 250 is formed over the entire surface of the semiconductor layer 240, when the reflective electrode 250 is formed over the entire surface of the p-type gallium nitride based semiconductor layer 240 in this way, a polarization phenomenon occurs during the operation of the element, thereby causing piezoelectricity. An effect occurs, and this causes a problem that the reliability of the element is lowered.

  The present invention has been made in view of the above-described problems, and its purpose is to facilitate a dicing or scribing process for separating elements, and to prevent a bending phenomenon and a shot phenomenon of an entire structure including a structural support layer. An object of the present invention is to provide a vertical structure gallium nitride-based LED element that can be prevented and improve the reliability of the element, and a manufacturing method thereof.

  Another object of the present invention is to provide a vertically-structured gallium nitride LED element capable of improving the reliability of the element by reducing the piezoelectric effect due to the reflective electrode formed in the p-type gallium nitride semiconductor layer, and It is in providing the manufacturing method.

To achieve the above object, the vertical GaN-based light emitting diode according to the present invention - de element includes an n-type electrode, and a light emitting structure formed on the lower surface of the n-type electrode, the outer surface of the light emission structure a protective film formed on a p-type electrode formed on the lower surface of the light emitting structure coercive Mamorumaku is formed, is formed in the lower portion of the light emission structure, the metal in contact with the light emitting structure and a p-type electrode sheet - see including a conductive substrate formed at the bottom of the de-layer, a - and de layer, gold Shokushi
The conductive substrate includes a first plating layer and a second plating layer surrounding a lower surface and a side surface of the first plating layer, and at least one side surface of the metal seed layer and the second plating layer includes a diced surface. To do.

  In the vertical gallium nitride LED device of the present invention, the light emitting structure preferably includes an n-type gallium nitride semiconductor layer, an active layer, and a p-type gallium nitride semiconductor layer.

  In the vertical structure gallium nitride based LED device of the present invention, the upper surface of the n-type gallium nitride based semiconductor layer has an uneven shape, and the lower surface of the light emitting structure further includes a current blocking layer at the center thereof. It is preferable.

  In the vertical structure gallium nitride LED element of the present invention, the conductive substrate is preferably composed of a first plating layer and a second plating layer. In more detail, the first plating layer is made of Ni. It is preferable that the second plating layer is formed in a three-layer structure in which Au, Ni, and Au are sequentially stacked.

To achieve the above object, another vertical GaN-based LED according to the present invention includes a conductive substrate, a metal is formed on top of the conductive substrate sheet - and the de layer, a gold Shokushi - de a current blocking layer formed in the central portion of the layer, the gold Shokushi - a first electrode formed on either side of the current blocking layer on the de layer, the outer surface of the light emitting structure formed on the first electrode a protective film formed, seen including a second electrode formed on the light emitting structure, the conductive substrate is made of the second plating layer surrounding the bottom and side surfaces of the first plating layer and the first plating layer, At least one side surface of the metal seed layer and the second plating layer includes a diced surface.

  Also at this time, the light emitting structure includes a p-type gallium nitride based semiconductor layer, an active layer, and an n-type gallium nitride based semiconductor layer, and the upper surface of the n-type gallium nitride based semiconductor layer has an uneven shape. Can be. The first electrode may be a p-type electrode, and the second electrode may be an n-type electrode.

  The conductive substrate includes a first plating layer and a second plating layer, and the first plating layer is formed in a two-layer structure in which Ni and Au are sequentially stacked, and the second plating layer Is formed in a three-layer structure in which Au, Ni, and Au are sequentially laminated.

In order to achieve the above object, the vertical structure gallium nitride LED device manufacturing method according to the present invention includes an n-type gallium nitride semiconductor layer, an active layer, and a p-type gallium nitride semiconductor layer sequentially on a substrate. forming a light emitting structure is laminated, by etching the light emission structure, and separating the size of the unit LED elements, forming a p-type electrode to a separatory isolated light emitting structure on When the steps of filling the non-conductive material between the light emitting structure is released minute metal sheet on the structure of the results of that - forming a de layer, the area between the respective light emitting structure excluding gold Shokushi - forming a first plating layer on the de layer, a gold Shokushi between the first plating layer及beauty the first plating layer - forming a second plating layer on the surface of the de-layer the method comprising the steps of separating the board from the light emission structure, Removing the non-conductive material between each light emitting structure in which the plate is exposed is separated, forming an n-type electrode on the n-type gallium nitride based semiconductor layer, between the light emitting structure gold Shokushi - to the steps that ultimately separate the LED element and the second plated layer portions de layer及beauty and removed by the dicing, comprising a.

  In the method for manufacturing a vertical structure gallium nitride LED device according to the present invention, the non-conductive substance is preferably a photoresist.

  In the method for manufacturing a vertical structure gallium nitride LED device according to the present invention, insulation is performed along the upper surface of the substrate including each of the separated light emitting structures before the step of forming the p-type electrode. Forming a layer; and selectively etching the insulating layer to form a current blocking layer at the center of the upper surface of the light emitting structure, and simultaneously forming a protective film on both side surfaces of the light emitting structure; It is preferable to further include.

  In the method for manufacturing the vertical structure gallium nitride LED device of the present invention, after the step of forming the light emitting structure, a lower part of the substrate is formed to a predetermined thickness by a lapping and polishing process. Preferably, the method further includes a step of removing only.

  In the method for manufacturing a vertical gallium nitride LED device according to the present invention, the step of forming the first plating layer on the metal seed layer excluding the region between the light emitting structures may include the step of Forming a photoresist on the metal seed layer between the light emitting structures; forming a first plating layer on the metal seed layer between the photoresist; and And removing.

  In the method for manufacturing a vertical gallium nitride based LED device according to the present invention, the n-type gallium nitride based semiconductor layer is formed before the step of forming an n-type electrode on the n-type gallium nitride based semiconductor layer. Preferably, the method further includes forming a surface unevenness on the surface and forming a contact hole by removing the n-type gallium nitride based semiconductor layer portion where the n-type electrode is formed by a predetermined thickness. .

  In the method for manufacturing a vertical gallium nitride LED element according to the present invention, the first plating layer is preferably formed in a two-layer structure in which Ni and Au are sequentially stacked.

  In the method for manufacturing a vertical gallium nitride LED element according to the present invention, the second plating layer is preferably formed in a three-layer structure in which Au, Ni, and Au are sequentially stacked.

  In the present invention, after the light emitting structure is separated into unit LED elements, a photoresist is filled between the separated light emitting structures so that atoms constituting the metal seed layer are active layers. Can prevent the junction leakage and shot phenomenon, etc., and also prevents the bending phenomenon of the entire structure including the structure support layer and facilitates the subsequent process. it can.

  In the present invention, the final separation of the LED elements is performed by a dicing process of the metal seed layer and the second plating layer having a much thinner thickness than the existing structural support layer. The element isolation process can be easily performed, such as preventing the light emitting structure from being broken or damaged during the dicing process.

  According to the present invention, a plurality of reflective electrodes are formed below the p-type gallium nitride semiconductor layer and spaced apart from each other by a predetermined distance, thereby forming a reflective electrode over the entire surface of the p-type gallium nitride semiconductor layer. In comparison, the piezoelectric effect can be reduced by localizing the polarization phenomenon generated by the reflective electrode during the operation of the element.

  Therefore, the present invention can improve the characteristics and reliability of the vertically structured gallium nitride LED device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily implement the embodiments.

  In the drawings, in order to clearly express a plurality of layers and regions, the thickness is shown enlarged. Similar parts are denoted by the same reference numerals throughout the specification.

  Hereinafter, a method for manufacturing a vertical structure gallium nitride LED device according to an embodiment of the present invention will be described in detail with reference to the drawings.

  First embodiment

  First, with reference to FIG. 3 and FIGS. 4A to 4M, a vertical structure gallium nitride LED device and a manufacturing method thereof according to the first embodiment of the present invention will be described in detail.

  FIG. 3 is a cross-sectional view showing the structure of the vertical structure gallium nitride LED device according to the first embodiment of the present invention, and FIGS. 4A to 4M are vertical diagrams according to the first embodiment of the present invention. It is process sectional drawing shown in order in order to demonstrate the manufacturing method of a structure gallium nitride type LED element.

  First, as shown in FIG. 4A, a light emitting structure 320 made of a gallium nitride based semiconductor layer is formed on a substrate 310. At this time, the light emitting structure 320 has a structure in which an n-type gallium nitride based semiconductor layer 321, a multi-well structure GaN / InGaN active layer 322 and a p-type gallium nitride based semiconductor layer 323 are sequentially stacked.

  Here, the substrate 310 is preferably formed using a transparent material including sapphire, and besides sapphire, zinc oxide (ZnO), gallium nitride (GaN), silicon carbide ( Silicon carbide (SiC) and aluminum nitride (AlN) can be used.

The n-type and p-type gallium nitride based semiconductor layers 321 and 323 and the active layer 322 are made of Al _x In _y Ga _(1-xy) N (where 0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 It may be a gallium nitride based semiconductor material having a composition formula (≦ x + y ≦ 1) and may be formed by a known nitride deposition process such as MOCVD and MBE processes.

  Meanwhile, the active layer 322 may be formed of a single quantum well layer or a double heterostructure. The active layer 322 determines whether the diode is a green light emitting element or a blue light emitting element based on the amount of indium (In) constituting the active layer 322. More specifically, for a light emitting device having blue light, about 22% indium is used, and for a light emitting device having green light, about 40% range indium is used. That is, the amount of indium used to form the active layer 322 varies depending on the required blue or green wavelength.

  Therefore, as described above, the active layer 322 has a great influence on the characteristics and reliability of the gallium nitride LED device. It must be safely protected from any defects.

  Next, as shown in FIG. 4B, a lower portion of the substrate 310 is removed by a predetermined thickness by a lapping and polishing process. The lapping and polishing process is for easily performing a subsequent LLO process of the sapphire substrate, and can be omitted.

  Thereafter, as shown in FIG. 4C, the light emitting structure 320 is etched to be separated into unit LED elements. As described above, by previously etching the light emitting structures 320 and separating them from each other, it is possible to prevent the gallium nitride based semiconductor layer constituting the light emitting structures 320 from being damaged by the laser in the subsequent LLO process.

  Thereafter, an insulating layer (not shown) is formed along the upper surface of the substrate 310 including the separated light emitting structures 320, and then selectively etched, as shown in FIG. A current blocking layer 330 is formed at the center of the upper surface of the light emitting structure 320, and a protective layer 340 is formed on both side surfaces of the light emitting structure 320.

  Here, the current blocking layer 330 diffuses the current concentrated in the lower part of the n-type electrode 380, which is subsequently formed, to other regions, thereby increasing the current diffusion efficiency, thereby achieving uniform light emission. It is to be able to obtain.

  Next, as shown in FIG. 4E, a p-type electrode 350 is formed on the light emitting structure 320 on which the current blocking layer 330 is not formed. The p-type electrode 350 is preferably formed using an Ag-based material or an Al-based material so that the functions of the electrode and the reflective film can be performed simultaneously.

  The p-type electrode 350 may be formed in a portion where the current blocking layer 330 is not formed as described above. However, although not shown, the p-type electrode 350 covers the current blocking layer 330 on the light emitting structure 320. It may be formed.

  Thereafter, as shown in FIG. 4F, a non-conductive material, for example, a first photoresist PR1 is filled between the separated light emitting structures 320.

  In the embodiment of the present invention, the first photoresist PR1 blocks the penetration of the atoms constituting the metal seed layer 360 formed subsequently into the active layer 322, thereby causing junction leakage and shot phenomenon. Prevent such as.

  Thereafter, as shown in FIG. 4G, a metal seed layer 360 is formed on the resulting structure. The metal seed layer 360 functions as a crystal nucleus during a plating process of the structure support layer 370 described later. The metal seed layer 360 may be formed by a method such as a sputtering method or a vacuum deposition method.

  4H, after forming a second photoresist PR2 on the metal seed layer 360 between the light emitting structures 320, the metal seed between the second photoresist PR2 is formed. Electroplating is performed on the layer 360 to form a first plating layer 370a. At this time, the first plating layer 370a is preferably formed in a two-layer structure in which Ni and Au are sequentially stacked. Among these, the Au prevents surface oxidation of the Ni and improves the adhesion with the second plating layer 370b described later.

  Next, as shown in FIG. 4I, after the second photoresist PR2 is removed, a second plating layer is formed on the surface of the metal seed layer 360 between the first plating layer 370a and each of the first plating layers 370a. A structural support layer 370 including the first plating layer 370a and the second plating layer 370b is formed by forming 370b.

  The second plating layer 370b is preferably formed in a three-layer structure in which Au, Ni, and Au are sequentially stacked. Of the Au constituting the second plating layer 370b, the lowermost Au is for improving the adhesion with the first plating layer 370a, and the uppermost Au prevents Ni surface oxidation. In the subsequent packaging process, the adhesion in the die bonding process is improved.

  On the other hand, in the related art, the bending of the entire structure including the structure support layer 370 due to the difference in thermal expansion coefficient between the structure support layer 370 formed up to the region between the light emitting structures 320 and the light emitting structure 320. However, according to the embodiment of the present invention, the first photoresist PR1 is formed between the light emitting structures 320 separated as described above instead of the structure support layer. Since the structural support layer 370 according to the present invention is formed to have a certain thickness only on the light emitting structure 320, it is possible to prevent a bending phenomenon of the entire structure including the structural support layer 370. You can overcome the difficulty of progress.

  The structural support layer 370 functions as a support layer and an electrode of the final LED element. In addition, since the structure support layer 370 is made of a metal having excellent heat conduction, such as Ni and Au, the heat generated from the LED element can be easily released to the outside. Accordingly, even when a high current is applied to the LED element, heat can be efficiently released, so that a phenomenon in which the characteristics of the LED element are deteriorated even at a high current can be prevented.

  Thereafter, as shown in FIG. 4J, the substrate 310 is separated from the light emitting structure 320 by an LLO process.

  Next, as shown in FIG. 4K, after removing the protective film 340 between the light emitting structures 320 exposed by separating the substrate 310 and the first photoresist PR1, the n-type gallium nitride is removed. Surface irregularities 321a are formed on the surface of the semiconductor layer 321 in order to increase the light extraction efficiency.

  Thereafter, as shown in FIG. 4L, the n-type gallium nitride based semiconductor layer 321 where the n-type electrode 380 is formed is removed by a predetermined thickness to form a contact hole h, and then over the contact hole h. An n-type electrode 380 is formed.

  Thereafter, as shown in FIG. 4M, the metal seed layer 360 and the second plating layer 370b between the light emitting structures 320 are removed by a dicing process and separated into LED element units. The gallium nitride LED element 300 is formed. The LED element 300 may be separated by a laser scribe or wet etching process in addition to the above dicing process.

  Here, the final separation of the LED element 100 according to the prior art has been performed by dicing the structural support layer 170 having a relatively thick thickness. However, in the embodiment of the present invention, Since the final separation is performed by dicing the metal seed layer 360 and the second plating layer 370b having a much thinner thickness than the conventional structural support layer, the light emitting structure 320 is broken during the dicing process. Or damage can be prevented.

  That is, the vertical structure gallium nitride LED device of the present invention manufactured through the above-described process includes a conductive substrate 370 and a metal seed formed on the upper surface of the conductive substrate 370 as shown in FIG. The light emitting structure 320 is formed on the layer 360 and the metal seed layer 360.

  The conductive substrate 370 includes a first plating layer 370a and a second plating layer 370b. As described above in the process, the first plating layer 370a has a two-layer structure in which Ni and Au are sequentially stacked. The second plating layer 370b is formed in a three-layer structure in which Au, Ni, and Au are sequentially stacked.

  The light emitting structure 320 includes an n-type gallium nitride semiconductor layer 321, an active layer 322, and a p-type gallium nitride semiconductor layer 323, and a protective film 340 is formed on an outer portion of the light emitting structure 320.

  A current blocking layer 330 is formed at the center of the lower surface of the p-type gallium nitride based semiconductor layer 323. A p-type electrode 350 is formed on the p-type gallium nitride semiconductor layer 323 on both sides of the current blocking layer 330, and an n-type electrode 380 is formed on the upper surface of the n-type nitride semiconductor layer 321. Has been.

  The top surface of the n-type nitride semiconductor layer 321 is provided with irregularities 321a for increasing the light extraction efficiency.

  Second embodiment

  <Vertical structure gallium nitride LED element>

  First, with reference to FIGS. 5-8, the vertical structure gallium nitride LED element which concerns on the 2nd Embodiment of this invention is demonstrated in detail.

  FIG. 5 is a cross-sectional view showing the structure of a vertically structured gallium nitride LED device according to the second embodiment of the present invention, and FIGS. 6 to 8 are plan views showing the shapes of the reflective electrodes according to the present invention. It is.

  As shown in FIG. 5, an n-type electrode 410 is formed on the top of the vertical structure gallium nitride LED element 400 according to the second embodiment of the present invention.

  An n-type gallium nitride based semiconductor layer 420 is formed under the n-type electrode 410. In more detail, the n-type gallium nitride based semiconductor layer 420 is a GaN layer or GaN doped with an n-type impurity. / AlGaN layer.

  Here, in order to improve the current diffusion phenomenon, a transparent electrode (not shown) or the like may be further formed between the n-type electrode 410 and the n-type gallium nitride based semiconductor layer 420.

  An active layer 430 and a p-type gallium nitride semiconductor layer 440 are sequentially stacked under the n-type gallium nitride semiconductor layer 420 to form a light emitting structure. At this time, in the light emitting structure, the active layer 430 may be formed of a multiple quantum well structure composed of an InGaN / GaN layer, and the p-type gallium nitride based semiconductor layer 440 is formed of the n-type nitride. Similar to the gallium semiconductor layer 420, it may be formed of a GaN layer or a GaN / AlGaN layer doped with a p-type impurity.

  A plurality of reflective electrodes 450 are formed below the p-type gallium nitride based semiconductor layer 440 of the light emitting structure, spaced apart from each other by a predetermined distance. Here, in the vertical structure gallium nitride LED element (see FIG. 2) according to the conventional technique as described above, the reflective electrode 450 is formed over the entire surface of the p-type gallium nitride semiconductor layer 440. In the vertical structure gallium nitride LED element according to FIG. 2 (see FIGS. 2 and 5), unlike the LED element according to the prior art, a plurality of reflective electrodes 450 are arranged at predetermined intervals below the p-type gallium nitride semiconductor layer 440. By forming them apart from each other, there is an advantage that the piezoelectric effect can be localized by localizing the polarization phenomenon generated by the reflective electrode 450 during the operation of the element.

  At this time, the reflective electrode 450 is selected from the group consisting of Pd, Ni, Au, Ag, Cu, Pt, Co, Rh, Ir, Ru, Mo, W and an alloy including at least one of them. It is preferable to have any one single layer or any two or more multilayer structures.

  The reflective electrode 450 may have a circular shape as shown in FIG. 6, or may have an elliptical shape as shown in FIG. It is also possible to have a regular square shape as shown. Further, the form of the reflective electrode 450 is not limited to the above form, and within the scope of the technical idea of the present invention, for example, a regular polygon such as a regular pentagon and a regular hexagon, an asymmetric polygon, Various modifications including a combination of a circular shape, an elliptical shape, a regular polygon shape, and an asymmetric polygon shape can be made.

  The reflective electrode 450 preferably has a width in the range of 0.5 μm to 500 μm. This is because, when the width of the reflective electrode 450 is smaller than 0.5 μm, the size of the reflective electrode 450 is too small, and there is a limit in performing the reflection function. Since it is difficult to obtain a sufficient reduction effect of the piezoelectric effect, it is preferable that the piezoelectric effect is formed so as to have a width in the above range.

  A barrier layer 455 is formed under the p-type gallium nitride based semiconductor layer 440 including the reflective electrode 450. The barrier layer 455 is formed to have a Schottky contact characteristic, as opposed to the reflective electrode 450 forming an ohmic contact with the p-type GaN-based semiconductor layer 440. The current blocking layer is preferably configured to perform both functions of a current blocking layer. On the other hand, when the reflective electrode 450 is made of Ag or the like, the barrier layer 455 can function to prevent diffusion of Ag or the like constituting the reflective electrode 450.

The barrier layer 455 is any one selected from the group consisting of Al, Ti, Zr, Hf, Ta, Cr, In, Sn, Pt, Au, and an alloy including at least one of them. It can be made of a single layer or a metal having any two or more multilayer structures. In addition, instead of the above metals, TCO (transparent conductive oxide) such as ITO (Indium-Tin-Oxide), IZO (Indium-Zinc-Oxide), IO (Indium-Oxide), ZnO and SnO ₂ , transparent conductive Oxide) can also be applied.

  A bonding layer 460 is formed below the barrier layer 455.

  A structural support layer 470 that functions as a support layer and an electrode of the LED element is formed below the bonding layer 460. The structural support layer 470 is generally formed of a Si substrate, a Ge substrate, a SiC substrate, a GaAs substrate, a metal layer, or the like in consideration of the thermal stability of the element.

  As described above, according to the second embodiment of the present invention, the operation of the device is performed by forming the plurality of reflective electrodes 450 spaced apart from each other by a predetermined distance below the p-type gallium nitride based semiconductor layer 440. Sometimes, the polarization phenomenon generated by the reflective electrode 450 can be localized to reduce the piezoelectric effect, thereby improving the reliability of the element.

  <Method for Manufacturing Vertical Structure Gallium Nitride LED Device>

  Then, the manufacturing method of the vertical structure gallium nitride LED device according to the second embodiment of the present invention will be described in detail with reference to FIGS. 9A to 9E.

  9A to 9E are process cross-sectional views sequentially shown to explain a method for manufacturing a vertical structure gallium nitride-based LED element according to the second embodiment of the present invention.

  As shown in FIG. 9A, an n-type gallium nitride based semiconductor layer 420, an active layer 430, and a p-type gallium nitride based semiconductor layer 440 are sequentially grown on a sapphire substrate 490 to form a light emitting structure. As described above, the n-type gallium nitride semiconductor layer 420 may be formed of a GaN layer or a GaN / AlGaN layer doped with an n-type impurity, and the active layer 430 includes an InGaN / GaN layer. The p-type gallium nitride based semiconductor layer 440 may be formed of a GaN layer or GaN doped with a p-type impurity, similar to the n-type gallium nitride based semiconductor layer 420. / AlGaN layer.

  Thereafter, a plurality of reflective electrodes 450 are formed on the p-type gallium nitride based semiconductor layer 440 of the light emitting structure and spaced apart from each other by a predetermined distance. The reflective electrode 450 may be any one selected from the group consisting of Pd, Ni, Au, Ag, Cu, Pt, Co, Rh, Ir, Ru, Mo, W and an alloy including at least one of them. It is preferable to form such a single layer or any two or more multilayer structures. The reflective electrode 450 may be formed in various forms including a regular polygon, a circle, an asymmetric polygon, an ellipse, and combinations thereof, and may have a width in the range of 0.5 μm to 500 μm. It is preferable.

  Here, in the present embodiment, a plurality of reflective electrodes 450 are formed on the p-type gallium nitride based semiconductor layer 440 so as to be spaced apart from each other by a predetermined distance, thereby causing a polarization phenomenon generated by the reflective electrode 450 during the operation of the element. Can be localized and the piezoelectric effect can be reduced.

As shown in FIG. 9B, a barrier layer 455 is formed on the p-type gallium nitride based semiconductor layer 440 including the plurality of reflective electrodes 450. The barrier layer 455 is preferably formed to have Schottky contact characteristics with the p-type gallium nitride based semiconductor layer 440. For this reason, Al, Ti, Zr, Hf, Ta, Cr, In, Sn , Pt, Au, and a metal having any one single layer selected from the group consisting of an alloy containing at least one of these, or any two or more multilayer structures. Further, instead of such metals, TCO (transparent conductive oxide) such as ITO (Indium-Tin-Oxide), IZO (Indium-Zinc-Oxide), IO (Indium-Oxide), ZnO and SnO ₂ , transparent conductivity Oxides) can also be applied.

  As shown in FIG. 9C, a bonding layer 460 and a structure support layer 470 are sequentially formed on the barrier layer 455. The structure support layer 470 is generally formed of a Si substrate, a Ge substrate, a SiC substrate, a GaAs substrate, a metal layer, or the like.

  As shown in FIG. 9D, the sapphire substrate 490 is removed by an LLO process.

  As shown in FIG. 9E, an n-type electrode 410 is formed on the n-type gallium nitride based semiconductor layer 420 from which the sapphire substrate 490 has been removed. Here, in order to improve the current diffusion phenomenon, a transparent electrode (not shown) may be further formed on the n-type gallium nitride based semiconductor layer 420 before the n-type electrode 410 is formed.

  Third embodiment

  <Vertical structure gallium nitride LED element>

  Next, a third embodiment of the present invention will be described with reference to FIGS. However, in the configuration of the third embodiment, the description of the same part as that of the second embodiment is omitted, and only the configuration that changes in the third embodiment will be described in detail.

  FIGS. 10-12 is sectional drawing which shows the structure of the vertical structure gallium nitride type LED element based on the 3rd Embodiment of this invention.

As shown in FIGS. 10 to 12, the vertical structure gallium nitride LED element according to the third embodiment has the same configuration as the vertical structure gallium nitride LED element according to the second embodiment. However, it differs from the second embodiment in that the barrier layer 455 is made of an insulating film instead of metal or TCO, but is formed so as to expose a part of the reflective electrode 450. Here, the insulating _{film, SiO 2, Al 2 O 3} , TiO 2, ZrO, HfO, may consist such oxide-based or nitride-based material such as SiN and AlN.

  At this time, as shown in FIG. 10, the barrier layer 455 made of the insulating film as described above includes the remaining reflective electrode 450 excluding a part of the lower surface of the reflective electrode 450 and the surface of the p-type gallium nitride based semiconductor layer 440. As shown in FIG. 11, it may be formed to expose a part of the lower surface of the reflective electrode 450 while filling a space between the reflective electrodes 450. As shown in FIG. 12, the lower surface of the p-type gallium nitride based semiconductor layer 440 between the plurality of reflective electrodes 450 is exposed to the lower surface of the reflective electrode 450 by the reflective electrode 450 so that the entire lower surface and a part of the side surface of the reflective electrode 450 are exposed. It is also possible to form a thin thickness.

  The barrier layer 455 made of the insulating film is not limited to the structure shown in FIGS. 10 to 12 and can be variously modified within the scope of the technical idea of the present invention.

  That is, in the vertical structure gallium nitride LED device according to the third embodiment, although the barrier layer 455 is formed of an insulating film, the reflective electrode 450 and the structural support layer 470 can be energized with each other. It is important to form so that a part of is exposed.

  The vertical structure gallium nitride LED element according to the third embodiment can obtain the same operations and effects as those of the second embodiment.

  <Method for Manufacturing Vertical Structure Gallium Nitride LED Device>

  Then, the manufacturing method of the vertical structure gallium nitride-based LED element according to the third embodiment of the present invention will be described in detail with reference to FIGS. 13A to 13E.

  13A to 13E are process cross-sectional views sequentially shown to explain a method for manufacturing a vertical structure gallium nitride-based LED element according to the third embodiment of the present invention.

  As shown in FIG. 13A, an n-type gallium nitride semiconductor layer 420, an active layer 430, and a p-type gallium nitride semiconductor layer 440 are sequentially grown on a sapphire substrate 490 to form a light emitting structure.

  Thereafter, a plurality of reflective electrodes 450 are formed on the p-type gallium nitride based semiconductor layer 440 and spaced apart from each other by a predetermined distance.

As shown in FIG. 13B, a barrier layer 455 is formed on the p-type gallium nitride based semiconductor layer 440 including the plurality of reflective electrodes 450. At this time, the barrier layer 455 is formed of an insulating film such as SiO ₂ , Al ₂ O ₃ , TiO ₂ , ZrO, HfO, SiN, and AlN, but exposes a part of the reflective electrode 450. It is important that the reflective electrode 450 is electrically connected to the structural support layer 470 that is formed subsequently.

  As shown in FIG. 13C, a bonding layer 460 and a structure support layer 470 are sequentially formed on the entire structure including the barrier layer 455.

  As shown in FIG. 13D, the sapphire substrate 490 is removed by an LLO process.

  As shown in FIG. 13E, an n-type electrode 410 is formed on the n-type gallium nitride based semiconductor layer 420 from which the sapphire substrate 490 has been removed.

  Fourth embodiment

  <Vertical structure gallium nitride LED element>

  Next, a fourth embodiment of the present invention will be described with reference to FIG. However, in the configuration of the fourth embodiment, the description of the same part as that of the second embodiment is omitted, and only the configuration that is different from the fourth embodiment will be described in detail.

  FIG. 14 is a cross-sectional view showing the structure of a vertically structured gallium nitride LED device according to the fourth embodiment of the present invention.

As shown in FIG. 14, the vertical structure gallium nitride LED element according to the fourth embodiment is almost the same as the vertical structure gallium nitride LED element according to the second embodiment, except that The formation position of the reflective electrode 450 and the barrier layer 455 formed below the p-type gallium nitride based semiconductor layer 440 is mutually different, and the second embodiment is different from the second embodiment in that the barrier layer 455 is made of an insulating film. Different. Here, the insulating film used as the barrier layer 455 is the same oxide or nitride as SiO ₂ , Al ₂ O ₃ , TiO ₂ , ZrO, HfO, SiN, AlN, etc., as in the third embodiment. It can consist of physical substances. Further, as a modification, the barrier layer 455 has a Schottky contact characteristic, as opposed to the reflective electrode 450 forming an ohmic contact with the p-type gallium nitride based semiconductor layer 440. And may be configured to function as a current blocking layer together. The barrier layer 455 is any one selected from the group consisting of Al, Ti, Zr, Hf, Ta, Cr, In, Sn, Pt, Au, and an alloy including at least one of them. It can be made of a single layer or a metal having any two or more multilayer structures. Also, instead of the above metals, ITO (Indium-Tin-Oxide), IZO (Indium-Zinc-Oxide), IO (Indium-Oxide), TCO (Transparent Conductive Oxide) such as ZnO and SnO2, transparent conductivity Oxides) can also be applied.

  That is, in the vertical structure gallium nitride LED device according to the fourth embodiment, the barrier layer 455 is formed of an insulating film, but the barrier layer 455 is one of the reflective electrodes 450 as in the fourth embodiment. In place of forming the p-type gallium nitride semiconductor layer 440, first, a plurality of barrier layers 455 spaced apart from each other by a predetermined distance are formed below the p-type gallium nitride-based semiconductor layer 440, and then the p including the barrier layer 455 is formed. The reflective electrode 450 is formed below the type gallium nitride based semiconductor layer 440.

  The vertical structure gallium nitride based LED device according to the fourth embodiment has the p-type nitridation by a plurality of barrier layers 455 formed below the p-type gallium nitride based semiconductor layer 440 at predetermined intervals. The portions of the reflective electrode 450 that are in contact with the gallium-based semiconductor layer 440 are separated from each other by a predetermined distance, so that the same operation and effect as in the second embodiment can be obtained.

  <Method for Manufacturing Vertical Structure Gallium Nitride LED Device>

  Then, the manufacturing method of the vertical structure gallium nitride based LED element according to the fourth embodiment of the present invention will be described in detail with reference to FIGS. 15A to 15E.

  15A to 15E are process cross-sectional views sequentially shown to explain a method for manufacturing a vertical structure gallium nitride-based LED element according to the fourth embodiment of the present invention.

  As shown in FIG. 15A, an n-type gallium nitride based semiconductor layer 420, an active layer 430, and a p-type gallium nitride based semiconductor layer 440 are sequentially grown on a sapphire substrate 490 to form a light emitting structure.

Thereafter, a plurality of barrier layers 455 are formed on the p-type gallium nitride based semiconductor layer 440 and spaced apart from each other by a predetermined distance. The barrier layer 455 may be formed of an insulating film such as SiO ₂ , Al ₂ O ₃ , TiO ₂ , ZrO, HfO, SiN, and AlN.

  As shown in FIG. 15B, a reflective electrode 450 is formed on the p-type gallium nitride based semiconductor layer 240 including the barrier layer 455.

  As shown in FIG. 15C, a bonding layer 460 and a structure support layer 470 are sequentially formed on the reflective electrode 450.

  As shown in FIG. 15D, the sapphire substrate 490 is removed by an LLO process.

  As shown in FIG. 15E, an n-type electrode 410 is formed on the n-type gallium nitride based semiconductor layer 420 from which the sapphire substrate 490 has been removed.

  The above-described preferred embodiments of the present invention have been disclosed for the purpose of illustration, and those having ordinary knowledge in the technical field to which the present invention pertains depart from the technical idea of the present invention. Various substitutions, modifications, and alterations are possible within the scope of not being included, and such substitutions, alterations, and the like belong to the scope of the claims.

It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on a prior art. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on a prior art. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on a prior art. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on a prior art. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on a prior art. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on a prior art. It is sectional drawing which shows the structure of the other perpendicular structure gallium nitride type LED element manufactured by the prior art. It is sectional drawing which shows the structure of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the vertical structure gallium nitride type LED element which concerns on the 2nd Embodiment of this invention. It is a top view which shows the form of the reflective electrode which concerns on this invention. It is a top view which shows the form of the reflective electrode which concerns on this invention. It is a top view which shows the form of the reflective electrode which concerns on this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 2nd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 2nd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 2nd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 2nd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the vertical structure gallium nitride type LED element which concerns on the 4th Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 4th Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 4th Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 4th Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 4th Embodiment of this invention. It is process sectional drawing shown sequentially in order to demonstrate the manufacturing method of the vertical structure gallium nitride type LED element which concerns on the 4th Embodiment of this invention.

310 Sapphire substrate 320 Light emitting structure 321, 420 n-type gallium nitride based semiconductor layer 322, 430 Active layer 323 440 p-type gallium nitride based semiconductor layer 330 Current blocking layer 340 Protective film 350 p-type electrode PR1 First photoresist 360 Metal Seed layer PR2 Second photoresist 370, 470 Structure support layer 370a First plating layer 370b Second plating layer 321a Surface unevenness h Contact hole 380, 410 N-type electrode 300, 400 LED element 450 Reflective electrode 455 Barrier layer 460 Bonding layer

Claims (21)

an n-type electrode;
A light emitting structure formed on the lower surface of the n-type electrode;
A protective film formed on the outer surface of the light emitting structure;
A p-type electrode formed on the lower surface of the light emitting structure on which the protective film is formed;
A metal seed layer formed under the light emitting structure and in contact with the light emitting structure and the p-type electrode;
A conductive substrate formed under the metal seed layer,
The conductive substrate is Ri consists second plating layer surrounding the bottom and side surfaces of the first plating layer and the first plating layer,
The vertical gallium nitride light emitting diode device according to claim 1, wherein at least one side surface of the metal seed layer and the second plating layer includes a diced surface .   The vertical light-emitting gallium nitride light-emitting diode device according to claim 1, wherein the light-emitting structure includes an n-type gallium nitride semiconductor layer, an active layer, and a p-type gallium nitride semiconductor layer.   The vertical structure gallium nitride based light-emitting diode device according to claim 1, wherein an upper surface of the n-type gallium nitride based semiconductor layer has an uneven shape.   4. The vertical gallium nitride light-emitting diode device according to claim 1, further comprising a current blocking layer at a central portion of the lower surface of the light emitting structure. 5.   5. The vertical structure gallium nitride based light-emitting diode according to claim 1, wherein the first plating layer has a two-layer structure in which Ni and Au are sequentially stacked. Element.   6. The vertically structured gallium nitride based light emitting device according to claim 1, wherein the second plating layer is formed in a three-layer structure in which Au, Ni, and Au are sequentially stacked. 7. Diode element. A conductive substrate;
A metal seed layer formed on the conductive substrate;
A current blocking layer formed in a central portion of the metal seed layer;
A first electrode formed on both sides of a current blocking layer on the metal seed layer;
A protective film formed on an outer surface of the light emitting structure formed on the first electrode;
A second electrode formed on the light emitting structure,
The conductive substrate is Ri consists second plating layer surrounding the bottom and side surfaces of the first plating layer and the first plating layer,
The vertical gallium nitride light emitting diode device according to claim 1, wherein at least one side surface of the metal seed layer and the second plating layer includes a diced surface .   The vertical light-emitting gallium nitride light-emitting diode device according to claim 7, wherein the light-emitting structure includes a p-type gallium nitride semiconductor layer, an active layer, and an n-type gallium nitride semiconductor layer.   9. The vertical gallium nitride light-emitting diode device according to claim 8, wherein an upper surface of the n-type gallium nitride semiconductor layer has an uneven shape.   10. The vertical gallium nitride based light-emitting diode device according to claim 7, wherein the first electrode is a p-type electrode. 11.   The vertical gallium nitride light-emitting diode device according to any one of claims 7 to 10, wherein the second electrode is an n-type electrode.   12. The vertical structure gallium nitride based light-emitting diode according to claim 7, wherein the first plating layer has a two-layer structure in which Ni and Au are sequentially stacked. Element.   The vertical structure gallium nitride based light emitting device according to any one of claims 7 to 12, wherein the second plating layer is formed in a three-layer structure in which Au, Ni, and Au are sequentially stacked. Diode element. Forming a light emitting structure in which an n-type gallium nitride based semiconductor layer, an active layer, and a p-type gallium nitride based semiconductor layer are sequentially stacked on a substrate;
Etching the light emitting structure to separate into unit LED element sizes;
Forming a p-type electrode on the separated light emitting structure;
Filling a non-conductive material between the separated light emitting structures;
Forming a metal seed layer on the resulting structure;
Forming a first plating layer on the metal seed layer excluding a region between the light emitting structures;
Forming a second plating layer on the surface of the metal seed layer between the first plating layer and each of the first plating layers;
Separating the substrate from the light emitting structure;
Removing the non-conductive material between the light emitting structures exposed by separating the substrate;
Forming an n-type electrode on the n-type gallium nitride based semiconductor layer;
And finally separating the LED element by dicing the metal seed layer and the second plating layer portion between the light emitting structures, and the vertical structure gallium nitride based light emitting diode. A manufacturing method of a gate element.   15. The method of claim 14, wherein the non-conductive material is a photoresist. Before the step of forming the p-type electrode,
Forming an insulating layer along an upper surface of the substrate including each of the separated light emitting structures;
And selectively etching the insulating layer to form a current blocking layer at the center of the upper surface of the light emitting structure, and simultaneously forming protective films on both side surfaces of the light emitting structure. 16. The method for manufacturing a vertical structure gallium nitride based light-emitting diode device according to claim 14 or 15.   17. The method of claim 14, further comprising removing a lower portion of the substrate by a predetermined thickness by a lapping and polishing process after forming the light emitting structure. The manufacturing method of the vertical structure gallium nitride type light-emitting diode element of any one of these. Forming a first plating layer on the metal seed layer excluding a region between the light emitting structures;
Forming a photoresist on the metal seed layer between the light emitting structures;
Forming a first plating layer on the metal seed layer between the photoresists;
The method for manufacturing a vertical structure gallium nitride based light-emitting diode device according to any one of claims 14 to 17, further comprising a step of removing the photoresist. Before forming an n-type electrode on the n-type gallium nitride based semiconductor layer,
Forming surface irregularities on the surface of the n-type gallium nitride based semiconductor layer;
19. The method of claim 14, further comprising: removing a predetermined thickness of the n-type gallium nitride based semiconductor layer portion where the n-type electrode is to be formed to form a contact hole. The manufacturing method of the vertical structure gallium nitride type light emitting diode element of any one of Claims 1.   20. The vertical structure gallium nitride based light emitting diode according to claim 14, wherein the first plating layer is formed in a two-layer structure in which Ni and Au are sequentially stacked. Device manufacturing method. The vertical gallium nitride light emitting diode according to any one of claims 14 to 20, wherein the second plating layer is formed in a three-layer structure in which Au, Ni, and Au are sequentially stacked. -Manufacturing method of a device.

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