JP5344078B2 - Electro-optical device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device, capable of solving non-uniformity in electrical resistance in fixing portions and of causing no display problem such as deterioration of contrast, etc., by making pressing conditions of a display substrate and a relay substrate be equal all over the fixing portions, and to provide an electronic apparatus comprising the electro-optical device. <P>SOLUTION: A planarization film 80 is formed between electrodes such as electrodes 74 and 75 connected to wiring lines formed on a relay substrate such as a flexible substrate, etc., and a first interlayer dielectric 284 is formed on the planarization film 80 and at ends of the electrodes 74 and 75. Further, a transparent electrode 77 is formed on the electrodes 74 and 75 and on convex portions 79. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an electro-optical device and an electronic apparatus, and more particularly, to an electro-optical device including an organic electroluminescence material and an electronic apparatus including the electro-optical device.

  In recent years, a color electro-optical device having a structure in which a light emitting element made of a light emitting material such as an organic fluorescent material is sandwiched between a pixel electrode (anode) and a cathode, in particular, an organic electroluminescence (organic EL) material is used as the light emitting material. An organic EL display device has been developed. A conventional electro-optical device (organic EL display device) will be briefly described below.

  FIG. 13 is a diagram illustrating a wiring structure of a conventional electro-optical device. As shown in FIG. 13, the conventional electro-optical device includes a plurality of scanning lines 901, a plurality of signal lines 902 extending in a direction intersecting the scanning lines 901, and a plurality of light emitting elements extending in parallel with the signal lines 902. A power supply wiring 903 is provided, and a pixel region A is provided at each intersection of the scanning line 901 and the signal line 902. Each signal line 902 is connected to a data side driving circuit 904 including a shift register, a level shifter, a video line, and an analog switch, and each scanning line 901 is connected to a scanning side driving circuit 905 including a shift register and a level shifter. ing.

  Each pixel region A has a switching thin film transistor 913 to which a scanning signal is supplied to the gate electrode via the scanning line 901 and a holding for holding an image signal supplied from the signal line 902 via the switching thin film transistor 913. The capacitor Cap, the current thin film transistor 914 to which the image signal held by the holding capacitor Cap is supplied to the gate electrode, and the light emission power supply wiring when electrically connected to the light emission power supply wiring 903 via the current thin film transistor 914 A pixel electrode 911 into which a driving current flows from 903 and a light emitting layer 910 sandwiched between the pixel electrode 911 and the cathode 912 are provided. The cathode 912 is connected to the cathode power supply circuit 931.

  The light emitting layer 910 includes three types of light emitting elements, a light emitting layer 910R that emits red light, a light emitting layer 910G that emits green light, and a light emitting layer 910B that emits blue light. The light emitting layers 910R, 910G, and 910B include Striped arrangement. The light emitting power supply wirings 903R, 903G, and 903B connected to the light emitting layers 910R, 910G, and 910B via the current thin film transistor 914 are connected to the light emitting power supply circuit 932, respectively. The reason why the power supply wiring for light emission is wired for each color is that the driving potential of the light emitting layer 910 is different for each color.

  In the above configuration, when a scanning signal is supplied to the scanning line 901 and the switching thin film transistor 913 is turned on, electric charge corresponding to the image signal supplied to the signal line 902 at that time is held in the holding capacitor Cap. The on / off state of the current thin film transistor 914 is determined according to the amount of charge held in the storage capacitor Cap. Then, a current flows from the light emitting power supply wirings 903R, 903G, and 903B to the pixel electrode 911 via the current thin film transistor 914, and further, a drive current flows to the cathode 912 via the light emitting layer 910. At this time, light emission corresponding to the amount of current flowing through the light emitting layer 910 is obtained from the light emitting layer 910.

  By the way, in the electro-optical device shown in FIG. 13, the scanning line 901, the signal line 902, the cathode 912, the light-emitting power supply wiring 903 (903R, 903G, 903B), the scanning side driving circuit 905, and the pixel region A are made of glass or the like. A configuration in which circuits such as a cathode power supply circuit 931, a light emission power supply circuit 932, and a data side driving circuit 904 are formed on a transparent substrate (display substrate) and arranged on a flexible flexible substrate (relay substrate). Sometimes it is said.

  In such a configuration, the flexible substrate is fixed to the substrate, and the scanning line 901, the signal line 902, the cathode 912, and the light-emitting power supply wiring 903 are electrically connected to the circuit formed on the flexible substrate. There is a need. The fixing and electrical connection between the substrate and the flexible substrate are performed by disposing an anisotropic conductive film containing conductive particles between the substrate and the flexible substrate and pressing the flexible substrate against the substrate.

  In order to stably emit light from the light emitting layer 910 provided in the above-described electro-optical device, it is required to reduce the potential fluctuation of the driving current applied from the light emitting power supply wiring 903 to the pixel electrode 911 as much as possible. In particular, the electro-optical device shown in FIG. 13 is a current-driven electro-optical device. In order to prevent display defects such as display unevenness and contrast reduction, the wiring resistance of the cathode 912 and the light-emitting power supply wiring 903 is used. It is necessary to minimize the voltage drop due to the above. For this reason, the cathode 912 and the light-emitting power supply wiring 903 are formed wider than the scanning line 901 and the signal line 902.

  When the substrate and the flexible substrate are fixed, there is a demand to make the pressure bonding conditions the same over the entire surface of the fixing portion in order to make the electrical resistance generated mainly in the pressing portion uniform. In order to satisfy this requirement, it is necessary to make the shape of the terminal provided in the fixing portion to which the above-described various wirings are connected the same.

  However, as described above, since the electro-optical device shown in FIG. 13 is a current-driven electro-optical device, reducing the wiring width of the cathode 912 and the light-emitting power supply wiring 903 causes a voltage drop due to wiring resistance or the like. It is difficult to consider. In addition, since the scanning lines 901 and the signal lines 902 are large in number, and it is necessary to make the lines thin and narrow in order to arrange all of them, the line widths of the scanning lines 901 and the signal lines 902 are set to the cathode 912 and the light emission. It is also difficult to make it the same width as the power supply wiring 903.

  The present invention has been made in view of the above circumstances, and eliminates the non-uniformity of electrical resistance in the fixed portion by making the pressure bonding conditions of the display substrate and the relay substrate the same throughout the fixed portion. It is an object of the present invention to provide an electro-optical device that does not cause display problems such as a decrease in contrast and an electronic apparatus including the electro-optical device.

  In order to solve the above problems, an electro-optical device according to an aspect of the invention includes a scan line, a pixel, and a pixel on a first substrate having a first side and a second side that intersects the first side. A display region in which a light emitting element having a light emitting layer is provided between an electrode and a cathode; a power supply line that supplies a driving current to the light emitting element and has a line width wider than a line width of the signal line; A scanning line driving circuit for supplying scanning signals to the lines; a scanning line driving circuit control signal wiring for supplying scanning line driving circuit control signals to the scanning line driving circuit; and the display region in the direction of the first side. And a first external connection terminal connected to the control signal line for the scanning line driving circuit, and arranged outside the display area in the direction of the first side and connected to the power line. A plurality of second external connection terminals, wherein the first external connection terminals The width is the same as the width of the control signal line for the scanning line driving circuit, and the width of each of the plurality of second external connection terminals is narrower than the width of the power line, and the plurality of second external connection terminals Is provided outside the first external connection terminal in the direction of the second side.
  In order to solve the above problems, an electro-optical device according to an aspect of the invention includes a scan line, a pixel, and a pixel on a first substrate having a first side and a second side that intersects the first side. A display region provided with a light emitting element having a light emitting layer between an electrode and a cathode; a cathode wiring electrically connected to the cathode and having a line width wider than a line width of the signal line; A scanning line driving circuit for supplying scanning signals to the lines; a scanning line driving circuit control signal wiring for supplying scanning line driving circuit control signals to the scanning line driving circuit; and the display region in the direction of the first side. And a first external connection terminal connected to the control signal wiring for the scanning line driving circuit, and arranged outside the display area in the direction of the first side and connected to the cathode wiring. A plurality of second external connection terminals, wherein the first external connection end The width of each of the plurality of second external connection terminals is smaller than the width of the cathode wiring, and the width of each of the plurality of second external connection terminals is the same as the width of the control signal wiring for the scanning line driving circuit. The connection terminal is provided outside the first external connection terminal in the direction of the second side.

  Further, a convex insulating film is formed on the external connection terminal, and the liquid material is applied to a region formed by the convex portion.

  Further, the liquid liquid material is applied by an ink jet method.

The power supply line is electrically connected to the pixel electrode.
Further, a signal line is further provided on the first substrate, a third external connection terminal connected to the signal line is provided, and each width of the third external connection terminal is equal to a line width of the signal line. It is characterized by being the same.
The first external connection terminal, the second external connection terminal, and the third external connection terminal are each formed with a convex portion.
In addition, a plurality of recesses are formed on the surfaces of the first external connection terminal, the second external connection terminal, and the third external connection terminal, respectively.
A second substrate is bonded to the second side of the first substrate, and a semiconductor chip is provided on the second substrate, and the first external connection terminal and the second substrate are provided. The external connection terminal is electrically connected to the semiconductor chip through a wiring.
An electro-optical device manufactured using the above manufacturing method.

  Furthermore, an electronic apparatus comprising the electro-optical device described above.

1 is an exploded perspective view schematically showing an electro-optical device according to an embodiment of the present invention. 3 is a cross-sectional view showing a state where the relay substrate 30 and the display substrate 20 are fixed by an anisotropic conductive film 40. FIG. 1 is a diagram schematically showing a wiring structure of an electro-optical device according to an embodiment of the present invention. 1 is a schematic plan view of an electro-optical device according to an embodiment. FIG. 5 is a cross-sectional view taken along line A-A ′ of FIG. 4. FIG. 5 is a top view of the vicinity of a fixing portion 65 shown in FIG. 4. It is sectional drawing of the 2nd external connection terminal 66c and the 2nd external connection terminal 70 which follow the B-B 'line in FIG. It is an enlarged view of the external connection terminal 70 in FIG. FIG. 5 is an enlarged view of second external connection terminals 70 and 70 in which a first interlayer insulating layer 284 is formed thick. FIG. 5 is an enlarged view of first external connection terminals 70 and 70 in which a first interlayer insulating layer 284 is formed thick and a planarizing film is provided between electrodes 74 and 75. 1 is a diagram illustrating an example of an electronic apparatus including an electro-optical device according to an embodiment of the invention. It is a perspective view which shows the mobile telephone as another electronic device. It is a figure which shows the wiring structure of the conventional electro-optical apparatus. It is a figure which shows the structure of a coating device. It is a figure which shows the top view which shows a head unit. It is a flowchart figure which shows one Embodiment of the formation method of the pattern of this invention. It is a schematic diagram which shows one Embodiment of the formation method of the pattern of this invention. It is a schematic diagram which shows one Embodiment of the formation method of the pattern of this invention. It is a schematic diagram which shows a mode that a droplet is arrange | positioned based on the bitmap data set on the board | substrate. It is a schematic diagram which shows a mode that a droplet is arrange | positioned based on the bitmap data set on the board | substrate. It is a schematic diagram which shows a mode that a droplet is arrange | positioned based on the bitmap data set on the board | substrate. It is a schematic diagram which shows the other Example of a mode that a droplet is arrange | positioned based on the bitmap data set on the board | substrate. It is a schematic diagram which shows the other Example of a mode that a droplet is arrange | positioned based on the bitmap data set on the board | substrate. It is a schematic diagram which shows other embodiment of the formation method of the pattern of this invention. 1 is an exploded perspective view illustrating an example of an electro-optical device according to an embodiment of the invention applied to a plasma display device. It is a side view which shows a head unit. It is a front view which shows a head unit. It is sectional drawing which shows a head unit. It is a perspective view which shows a head unit.

  Hereinafter, an electro-optical device and an electronic apparatus according to an embodiment of the invention will be described in detail with reference to the drawings. Each drawing referred to in the following description has a different scale for each layer and each member so that each layer and each member can be recognized on the drawing.

  FIG. 1 is an exploded perspective view schematically showing an electro-optical device according to an embodiment of the present invention. As shown in FIG. 1, the electro-optical device 10 according to the present embodiment is roughly composed of a display substrate 20 and a relay substrate 30 connected to the display substrate 20. The display substrate 20 is an active matrix organic EL device using a thin film transistor as a switching element.

  A plurality of scanning lines 21 are formed on the display substrate 20, and a plurality of signal lines 22 extending in a direction crossing the scanning lines 21 are formed. The display substrate 20 is provided with a display element 20a in which a plurality of light emitting elements are formed. Further, although not shown in FIG. 1, the display substrate 20 is provided with a power supply line and a cathode. Further, one end of the display substrate 20 is formed with scanning lines 21, signal lines 22, and external connection terminals 27 for power supply lines and cathodes (not shown).

  The electro-optical device 10 shown in FIG. 1 is a schematic diagram of the main configuration to the last, and there are many actual scanning lines 21, signal lines 22, and external connection terminals 27 with very narrow intervals. It should be noted that each is formed on the display substrate 20. Also, the connection state between the external connection terminal 27 and the scanning line 21 is not shown in FIG.

  The relay substrate 30 has a configuration in which a plurality of wirings 32 are formed on a flexible base substrate 31 and a semiconductor chip 33 is mounted at a predetermined position of the relay substrate 30. At one end of the wiring 32, an external connection terminal 34 for electrically connecting to the wiring such as the scanning line 21 and the signal line 22 formed on the display substrate 20 is formed. In FIG. 1, only the semiconductor chip 33 is mounted on the relay substrate 30, but a resistor, a capacitor, and other chip components are mounted at predetermined positions other than the portion where the semiconductor chip 33 is mounted. May be. In addition, the wiring 32 and the external connection terminal 34 formed on the relay board 30 are also schematically shown with an enlarged interval and a simplified structure in order to facilitate understanding of the structure.

  As shown in FIG. 1, the relay substrate 30 is fixed to the display substrate 20 via an anisotropic conductive film 40. At this time, the external connection terminal 34 of the relay substrate 30 is electrically connected to the external connection terminal 27 of the display substrate 20 through the anisotropic conductive film 40. The anisotropic conductive film 40 is a conductive polymer film used to electrically connect a pair of terminals with anisotropy, and is, for example, as shown in FIG. It is formed by dispersing a large number of conductive particles 41b in a thermoplastic or thermosetting adhesive resin 41a.

  FIG. 2 is a cross-sectional view showing how the relay substrate 30 and the display substrate 20 are fixed by the anisotropic conductive film 40. As shown in FIG. 2, since the conductive particles 41b are sandwiched between the external connection terminal 27 formed on the display substrate 20 and the external connection terminal 34 formed on the relay substrate 30, the external connection terminal 27 and the relay wiring are connected. Is electrically connected to the external connection terminal 34. On the other hand, in a portion other than the portion where the external connection terminal 27 and the external connection terminal 34 are formed, even if the conductive particles 41b are sandwiched, the connection terminal does not exist, and thus conduction is not achieved. In this way, conduction can be established only between the external connection terminal 27 and the external connection terminal 34.

  In order to fix the display substrate 20 and the relay substrate 30 using the anisotropic conductive film 40, the display substrate 20 is placed on a mounting table (not shown) having a guide plate having a rough surface. The display substrate 20 is vacuum-sucked. At this time, the display substrate 20 is mounted on the mounting table so that at least a portion where the relay substrate 30 is fixed to the display substrate 20 is positioned above the guide plate. Here, the guide plate having a rough surface is used to reduce the temperature applied to the display substrate 20 by reducing the contact area between the guide plate and the display substrate 20 and suppressing heat dissipation from the guide plate. Because.

  When the mounting of the display substrate 20 on the mounting table is completed, the anisotropic conductive film 40 is attached to the portion of the display substrate 20 to which the relay substrate 30 is fixed, and the surface on which the semiconductor chip 33 is mounted is placed downward. The relay substrate 30 is aligned so that the external connection terminal 34 is positioned above the anisotropic conductive film 40 on the side. When the above steps are finished, the external connection formed on the external connection terminal 34 and the display substrate 20 is heated and pressurized on the back surface of the surface on which the external connection terminal 34 is formed using a heating and pressure head (not shown). Conductivity with the terminal 27 is established, and the relay substrate 30 is fixed to the display substrate 20. At this time, the temperature applied to the relay substrate 30 and the display substrate 20 from the heating and pressing head is about several hundreds to several hundreds of degrees, and the applied pressure is several megapascals. Through the above steps, the relay substrate 30 can be fixed to the display substrate 20.

  Next, details of the wiring structure of the electro-optical device 10 of the present embodiment will be described. FIG. 3 is a diagram schematically showing a wiring structure of the electro-optical device according to the embodiment of the invention. As shown in FIG. 3, the electro-optical device 10 includes a plurality of scanning lines 21, a plurality of signal lines 22 extending in a direction intersecting the scanning lines 21, and a plurality of light emitting elements extending in parallel with the signal lines 22. A power supply wiring 23 is wired, and a pixel region A is provided in the vicinity of each intersection of the scanning line 21 and the signal line 22.

  Each signal line 22 is connected to a data side drive circuit 33a including a shift register, a level shifter, a video line, and an analog switch. Each signal line 22 is connected to an inspection circuit 25 having a thin film transistor. Further, a scanning line driving circuit 24 having a shift register and a level shifter is connected to each scanning line 21.

  In each of the pixel regions A, a switching thin film transistor 52, a storage capacitor Cap, a current thin film transistor 53, a pixel electrode 51, a light emitting layer 50, and a cathode 26 are provided. The switching thin film transistor 52 has a gate electrode connected to the scanning line 21 and is driven according to a scanning signal supplied from the scanning line 21 to be turned on or off. The holding capacitor Cap holds an image signal supplied from the signal line 22 via the switching thin film transistor 52.

  The gate electrode of the current thin film transistor 53 is connected to the switching thin film transistor 52 and the storage capacitor Cap, and an image signal held by the storage capacitor Cap is supplied to the gate electrode. The pixel electrode 51 is connected to the current thin film transistor 53, and when the pixel electrode 51 is electrically connected to the light emission power supply wiring 23 via the current thin film transistor 53, a drive current flows from the light emission power supply wiring 23. The light emitting layer 50 is sandwiched between the pixel electrode 51 and the cathode 26.

  The light emitting layer 50 includes three types of light emitting elements: a light emitting layer 50R that emits red light, a light emitting layer 50G that emits green light, and a light emitting layer 50B that emits blue light. The light emitting layers 50R, 50G, and 50B are included. Are arranged in stripes. The light emitting power supply wirings 23R, 23G, and 23B connected to the light emitting layers 50R, 50G, and 50B through the current thin film transistor 53 are connected to the light emitting power supply circuit 33c. The reason why the light-emitting power supply wirings 23R, 23G, and 23B are wired for each color is that the driving potentials of the light-emitting layers 50R, 50G, and 50B are different for each color.

In the electro-optical device of this embodiment, a capacitance C ₁ is formed between the cathode 26 and the light-emitting power supply wirings 23R, 23G, and 23B. When the electro-optical device 10 is driven, charges are accumulated in the capacitance C ₁ . When the potential of the drive current flowing through each light emission power supply line 23 varies during driving of the electro-optical device 10, the accumulated charge is discharged to each light emission power supply line 23 to suppress the potential fluctuation of the drive current. . Thereby, the image display of the electro-optical device 10 can be kept normal.

  In the electro-optical device 10, when a scanning signal is supplied from the scanning line 21 and the switching thin film transistor 52 is turned on, the potential of the signal line 22 at that time is held in the holding capacitor Cap and held in the holding capacitor Cap. The on / off state of the current thin film transistor 53 is determined in accordance with the applied potential. A drive current flows from the light emitting power supply wirings 23R, 23G, and 23B to the pixel electrode 51 through the channel of the current thin film transistor 53, and further a current flows to the cathode 26 through the light emitting layers 50R, 50G, and 50B. At this time, light emission corresponding to the amount of current flowing through the light emitting layer 50 is obtained from the light emitting layer 50.

  Next, a specific configuration of the electro-optical device 10 of the present embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic plan view of the electro-optical device according to this embodiment, and FIG. 5 is a cross-sectional view taken along line A-A ′ of FIG. 4. As shown in FIG. 4, the electro-optical device 10 of this embodiment includes a substrate 60, a pixel electrode group region (not shown), a light-emitting power supply wiring 23 (23R, 23G, 23B), and a display pixel unit 61 (one point in the figure). It is roughly composed of a chain line).

  The substrate 60 is a transparent substrate made of, for example, glass. The pixel electrode group region is a region in which pixel electrodes (not shown) connected to the current thin film transistor 53 shown in FIG. As shown in FIG. 4, the light-emitting power supply wiring 23 (23R, 23G, 23B) is arranged around the pixel electrode group region and connected to each pixel electrode. The display pixel unit 61 is located at least on the pixel electrode group region and has a substantially rectangular shape in plan view. The display pixel unit 61 includes an actual display area (or also referred to as an effective display area) 62 (inside the frame of the two-dot chain line in the figure) in the center portion and a dummy area 63 (one point) arranged outside the actual display area 62. And a region between a chain line and a two-dot chain line).

  Further, the scanning line driving circuit 24 is disposed on both sides of the actual display area 62 in the drawing. The scanning line driving circuit 24 is provided on the lower layer side (substrate 60 side) of the dummy region 63. Further, on the lower layer side of the dummy region 63, a scanning line driving circuit control signal wiring 24a and a scanning line driving circuit power supply wiring 24b connected to the scanning line driving circuit 24 are provided. Furthermore, the above-described inspection circuit 25 is arranged above the actual display area 62 in the drawing. The inspection circuit 25 is provided on the lower layer side (substrate side 2) of the dummy region 63, and the inspection circuit 25 can inspect the quality and defects of the electro-optical device during manufacturing or at the time of shipment. it can.

  As shown in FIG. 4, the light-emitting power supply wirings 23 </ b> R, 23 </ b> G, and 23 </ b> B are disposed around the dummy region 63. Each light-emitting power supply wiring 23R, 23G, 23B extends from the lower side of the substrate 60 in FIG. 2 along the scanning line drive circuit control signal wiring 24a to the upper side in FIG. 24 a is bent from the position where it is interrupted, extends along the outside of the dummy area 63, and is connected to a pixel electrode (not shown) in the actual display area 62. Further, a cathode wiring 26 a connected to the cathode 26 is formed on the substrate 60. The cathode wiring 26a is formed in a substantially U shape in plan view so as to surround the light-emitting power supply wirings 23R, 23G, and 23B.

  Next, as shown in FIG. 5, the circuit unit 11 is formed on the substrate 60, and the display pixel unit 61 is formed on the circuit unit 11. In addition, the sealing material 13 that annularly surrounds the display pixel portion 61 is formed on the substrate 60, and the sealing substrate 14 is further provided on the display pixel portion 61. The sealing substrate 14 is bonded to the substrate 60 via the sealing material 13 and is made of glass, metal, resin, or the like. The adsorbent 15 is attached to the back side of the sealing substrate 14 so that water or oxygen mixed in the space between the display pixel unit 61 and the sealing substrate 14 can be absorbed. A getter agent may be used instead of the adsorbent 15. Further, the sealing material 13 is made of, for example, a thermosetting resin or an ultraviolet curable resin, and is particularly preferably made of an epoxy resin which is a kind of thermosetting resin.

  A pixel electrode group region 11 a is provided in the central portion of the circuit portion 11. The pixel electrode group region 11 a includes a current thin film transistor 53 and a pixel electrode 51 connected to the current thin film transistor 53. The current thin film transistor 53 is embedded in the base protective layer 281, the second interlayer insulating layer 283, and the first interlayer insulating layer 284 stacked on the substrate 60, and the pixel electrode 51 is formed on the first interlayer insulating layer 284. Is formed. One of the electrodes (source electrode) connected to the current thin film transistor 53 and formed on the second interlayer insulating layer 283 is connected to the light-emitting power supply wiring 23 (23R, 23G, 23B). The circuit unit 11 is also formed with the storage capacitor Cap and the switching thin film transistor 52 described above, but these are not shown in FIG. Further, in FIG. 5, illustration of the signal line 22 is omitted.

  Next, in FIG. 5, the above-described scanning line driving circuit 24 is provided on both sides of the pixel electrode group region 11a in the drawing. 4 includes an N-channel or P-channel thin film transistor 24c that constitutes an inverter included in the shift register, and the thin film transistor 24c is not connected to the pixel electrode 51. Except for, the structure is the same as that of the current thin film transistor 53 described above. Although the inspection circuit 25 is not shown in FIG. 5, the inspection circuit 25 is similarly provided with a thin film transistor. The thin film transistor provided in the inspection circuit 25 has the same structure as the current thin film transistor 53 except that the thin film transistor is not connected to a dummy pixel electrode 51 ′ described later.

For example, the red light-emitting power supply wiring 23R on the left side in FIG. 5 is formed on the first wiring 23R1 via the first wiring 23R1 formed on the base protective layer 281 and the second interlayer insulating layer 283. The second wiring 23R2. First wiring 23R1 and the second wiring 23R2 are connected by a contact hole 23R3 penetrating the second interlayer insulating layer 283 as shown in FIGS. 4 and 5. Thus, the first wiring 23R1 is formed at the same hierarchical position as the cathode wiring 26a, and the second interlayer insulating layer 283 is disposed between the first wiring 23R1 and the cathode wiring 26a. Further, as shown in FIG. 5, the cathode wiring 26a is electrically connected to the cathode wiring 26b formed on the second interlayer insulating layer 283 through the contact hole, so to speak, the cathode wiring 26a is also a double wiring. It has a structure. Accordingly, the second wiring 23R2 is formed at the same level as the cathode wiring 26b, and the first interlayer insulating layer 284 is disposed between the second wiring 23R2 and the cathode wiring 26b. By adopting such a structure, the second capacitance C2 is formed between the first wiring 23R1 and the cathode wiring 26a and between the second wiring 23R2 and the cathode wiring 26b.

For example, the red light-emitting power supply wiring 23R on the left side in FIG. 5 is formed on the first wiring 23R ₁ via the first wiring 23R ₁ formed on the base protective layer 281 and the second interlayer insulating layer 283. The second wiring 23R ₂ is formed. The first wiring 23R ₁ and the second wiring 23R ₂ are connected by a contact hole 23R ₃ penetrating the second interlayer insulating layer 283 as shown in FIG. Thus, the first wiring 23R ₁ is formed at the same level as the cathode wiring 26a, and the second interlayer insulating layer 283 is disposed between the first wiring 23R ₁ and the cathode wiring 26a. . Further, as shown in FIG. 5, the cathode wiring 26a is electrically connected to the cathode wiring 26b formed on the second interlayer insulating layer 283 through the contact hole, so to speak, the cathode wiring 26a is also a double wiring. It has a structure. Therefore, the second wiring 23R ₂ is formed at the same level as the cathode wiring 26b, and the first interlayer insulating layer 284 is disposed between the first wiring 23R ₂ and the cathode wiring 26b. By adopting such a structure, a _second capacitance C ₂ is formed between the first wiring 23R ₁ and the cathode wiring 26a and between the second wiring 23R ₂ and the cathode wiring 26b. ing.

Similarly, the blue and green light-emitting power supply wirings 23G and 23B on the right side of FIG. 5 also adopt a double wiring structure, and the first wirings 23G ₁ and 23B ₁ formed on the base protective layer 281 respectively. 4 and second wirings 23G ₂ and 23B ₂ formed on the second interlayer insulating layer 283. The first wirings 23G ₁ and 23B ₁ and the second wirings 23G ₂ and 23B ₂ are as shown in FIG. Are connected by contact holes 23G ₃ and 23B ₃ penetrating through the second interlayer insulating layer 283. A _second capacitance C ₂ is formed between the blue first wiring 23B ₁ and the cathode wiring 26a and between the blue second wiring 23B ₂ and the cathode wiring 26b.

The distance between the first wiring 23R ₁ and the second wiring 23R ₂ is preferably in the range of 0.6 to 1.0 μm, for example. If the distance is less than 0.6 μm, parasitic capacitance between the source metal and the gate metal having different potentials such as the signal line 22 and the scanning line 21 is not preferable. For example, in the actual display area 62, there are many locations where the source metal and the gate metal intersect, and if there is a large parasitic capacitance at such locations, there is a risk of causing a time delay of the image signal. As a result, an image signal cannot be written into the pixel electrode 51 within a predetermined period, which causes a decrease in contrast. The material of the second interlayer insulating layer 283 sandwiched between the first wiring 23R ₁ and the second wiring 23R ₂ is preferably, for example, SiO _2, but if formed to be 1.0 μm or more, the substrate 60 may be broken by the stress of SiO _2. .

Further, a cathode 26 extending from the display pixel portion 61 is formed on the upper side of each light emitting power supply wiring 23R. As a result, the second wiring 23R ₂ of each light-emitting power supply wiring 23R is disposed opposite to the cathode 26 with the first interlayer insulating layer 284 interposed therebetween, whereby the second wiring 23R ₂ and the cathode 26 have the aforementioned first wiring. 1 capacitance C ₁ is formed. Here, the distance between the second wiring 23R ₂ and the cathode 26 is preferably in the range of 0.6 to 1.0 μm, for example. When the distance is less than 0.6 μm, parasitic capacitance between the pixel electrode and the source metal having different potentials such as the pixel electrode and the source metal increases, and therefore a wiring delay of the signal line using the source metal occurs. As a result, the image signal cannot be written within a predetermined period, which causes a decrease in contrast. The material of the first interlayer insulating layer 284 sandwiched between the second wiring 23R ₂ and the cathode 26 is preferably, for example, SiO ₂ or acrylic resin. However, if SiO ₂ is formed to have a thickness of 1.0 μm or more, the substrate 60 may be broken by stress. In the case of an acrylic resin, it can be formed up to about 2.0 μm. However, since it has a property of expanding when it contains water, the pixel electrode formed thereon may be broken.

As described above, the display substrate 20 is provided with the _first capacitance C ₁ between the light emitting power supply wiring 23 and the cathode 26, so that the potential of the drive current flowing through the light emitting power supply wiring 23 varies. In addition, the charge accumulated in the _first capacitance C ₁ is supplied to the light-emitting power supply wiring 23, and the potential deficiency of the drive current is compensated by this charge, so that the potential fluctuation can be suppressed. The image display can be kept normal. In particular, since the light-emitting power supply wiring 23 and the cathode 26 face each other outside the display pixel portion 61, the distance between the light-emitting power supply wiring 23 and the cathode 26 is reduced and stored in the _first capacitance C1. The amount of charge that is generated can be increased, and the potential fluctuation of the drive current can be further reduced to stably display an image. Further, the light-emitting power supply wiring 23 has a double wiring structure composed of the first wiring and the second wiring, and the second capacitance C ₂ is provided between the first wiring and the cathode wiring. Further, since the electric charge accumulated in the _second capacitance C ₂ is also supplied to the light emitting power supply wiring 23, the potential fluctuation can be further suppressed, and the image display of the light emitting device 1 can be kept more normal. .

  Next, the light emitting layer 50 and the bank part (insulating part) 122 are formed in the actual pixel region 62 of the display pixel part 61. As shown in FIG. 5, the light emitting layer 50 is laminated on each of the pixel electrodes 51. The bank unit 122 is provided between each pixel electrode 51 and each light emitting layer 50, and partitions each light emitting layer 50. The bank unit 122 is configured by laminating an inorganic bank layer 122 a located on the substrate 60 side and an organic bank layer 122 b located away from the substrate 60. A light shielding layer may be disposed between the inorganic bank layer 122a and the organic bank layer 122b.

The inorganic and organic bank layers 122a and 122b are formed to extend on the peripheral edge of the pixel electrode 51, and the inorganic bank layer 122a extends to the center side of the pixel electrode 51 from the organic bank layer 122b. Is formed. Also, the inorganic bank layer 122a is, for example, preferably made of an inorganic material of SiO _2, TiO _2, SiN or the like. The film thickness of the inorganic bank layer 122a is preferably in the range of 50 to 200 nm, particularly 150 nm. If the film thickness is less than 50 nm, the inorganic bank layer 122a is thinner than the hole injection / transport layer described later, and the flatness of the hole injection / transport layer cannot be ensured. On the other hand, if the film thickness exceeds 200 nm, the step due to the inorganic bank layer 122a becomes large, and the flatness of the light emitting layer to be described later stacked on the hole injection / transport layer cannot be secured, which is not preferable.

Furthermore, the organic bank layer 122b is formed of a normal resist such as an acrylic resin or a polyimide resin. The thickness of the organic bank layer 122b is preferably in the range of 0.1 to 3.5 μm, and particularly preferably about 2 μm. If the thickness is less than 0.1 μm, the organic bank layer 122b becomes thinner than the total thickness of the hole injection / transport layer and the light emitting layer, which will be described later, and the light emitting layer may overflow from the upper opening, which is not preferable. On the other hand, if the thickness exceeds 3.5 μm, the step due to the upper opening becomes large, and step coverage of the cathode 26 formed on the organic bank layer 122b cannot be ensured. Further, if the thickness of the organic bank layer 122b is 2 μm or more, it is more preferable because the insulation between the cathode 26 and the pixel electrode 51 can be improved.
In this way, the light emitting layer 50 is formed thinner than the bank portion 122.

  Further, an area showing lyophilicity and an area showing liquid repellency are formed around the bank portion 122. The lyophilic regions are the inorganic bank layer 122a and the pixel electrode 51, and lyophilic groups such as hydroxyl groups are introduced into these regions by plasma treatment using oxygen as a reactive gas. Further, the region showing liquid repellency is the organic bank layer 122b, and a liquid repellent group such as fluorine is introduced by plasma treatment using tetrafluoromethane as a reaction gas.

  The light emitting layer 50 is laminated on a hole injection / transport layer (not shown) laminated on the pixel electrode 51. In the present specification, a configuration including the light emitting layer 50 and the hole injection / transport layer is referred to as a functional layer, and a configuration including the pixel electrode 51, the functional layer, and the cathode 26 is referred to as a light emitting element. The hole injection / transport layer has a function of injecting holes into the light emitting layer 50 and a function of transporting holes inside the hole injection / transport layer. By providing such a hole injecting / transporting layer between the pixel electrode 51 and the light emitting layer 50, device characteristics such as light emitting efficiency and life of the light emitting layer 50 are improved. Further, in the light emitting layer 50, holes injected from the hole injection / transport layer and electrons from the cathode 26 are combined to generate fluorescence. The light emitting layer 50 has three types, a red light emitting layer that emits red (R), a green light emitting layer that emits green (G), and a blue light emitting layer that emits blue (B). As shown in FIG. 2, the light emitting layers are arranged in stripes.

  Next, as shown in FIG. 5, the dummy light emitting layer 210 and the dummy bank unit 212 are formed in the dummy region 63 of the display pixel unit 61. The dummy bank unit 212 is configured by laminating a dummy inorganic bank layer 212 a located on the substrate 60 side and a dummy organic bank layer 212 b located away from the substrate 60. The dummy inorganic bank layer 212a is formed on the entire surface of the dummy pixel electrode 51 '. The dummy organic bank layer 212b is formed between the pixel electrodes 51 in the same manner as the organic bank layer 122b. The dummy light emitting layer 210 is formed on the dummy pixel electrode 51 'via the dummy inorganic bank 212a.

  The dummy inorganic bank layer 212a and the dummy organic bank layer 211b have the same material and the same film thickness as the inorganic and organic bank layers 122a and 122b described above. The dummy light-emitting layer 210 is laminated on a dummy hole injection / transport layer (not shown), and the material and film thickness of the dummy hole injection / transport layer and the dummy light-emitting layer are the above-described hole injection / transport. This is the same as the layer and the light emitting layer 50. Therefore, like the light emitting layer 50 described above, the dummy light emitting layer 210 is formed thinner than the dummy bank portion 212.

  By disposing the dummy region 63 around the actual display region 62, the thickness of the light emitting layer 50 in the actual display region 62 can be made uniform, and display unevenness can be suppressed. That is, by arranging the dummy region 63, the drying condition of the discharged composition ink when the display element is formed by the ink jet method can be made constant in the actual display region 62. Therefore, there is no possibility that the thickness of the light emitting layer 50 is uneven.

Next, the cathode 26 is formed on the entire surface of the actual display region 62 and the dummy region 63 and extends to the substrate 60 outside the dummy region 63, and outside the dummy region 63, that is, outside the display pixel unit 61. The light-emitting power supply wiring 23 is opposed to the light-emitting power supply wiring 23. The end of the cathode 26 is connected to a cathode wiring 26 a formed in the circuit unit 11. The cathode 26 serves as a counter electrode of the pixel electrode 51 and causes a current to flow through the light emitting layer 50. The cathode 26 is formed by, for example, laminating a cathode layer 26b made of a laminate of lithium fluoride and calcium and a reflective layer 26c. Of the cathode 26, only the reflective layer 26 c extends to the outside of the display pixel unit 61. The reflective layer 26c reflects light emitted from the light emitting layer 50 toward the substrate 60, and is preferably made of, for example, Al, Ag, Mg / Ag laminate, or the like. Furthermore, an anti-oxidation protective layer made of SiO ₂ , SiN or the like may be provided on the reflective layer 26c.

  As shown in FIG. 4, the relay substrate 30 is fixed to one end of the substrate 60 using the anisotropic conductive film 40 described above. The semiconductor chip 33 mounted on the relay substrate 30 incorporates the data side drive circuit 33a, the cathode power supply circuit 33b, and the light emission power supply circuit 33c shown in FIG. A portion surrounded by a broken line in FIG. 4 indicates a fixing portion between the display substrate 20 and the relay substrate 30. FIG. 6 is a top view of the vicinity of the fixing portion 65 shown in FIG. In FIG. 6, the anisotropic conductive film 40 and the relay substrate 30 are not shown.

  As shown in FIG. 6, an external connection terminal is formed in the fixing portion 65. The external connection terminal is provided with a first external connection terminal having a width approximately equal to the width of the wiring for each narrow wiring, and a plurality of narrower widths than the line width are provided for the wide wiring. A second external connection terminal is provided. For example, for each of the scanning line drive circuit control signal wirings 24a having a narrow line width, the first external connection terminals 67, 68 having a width comparable to the line width of the scanning line drive circuit control signal wirings 24a, 69 is provided. On the other hand, for the light emission power supply wiring 23R having a wide width, second external connection terminals 66a, 66b, 66c having a width smaller than the line width of the light emission power supply wiring 23R are provided. Further, the second external connection terminal 70 having a line width comparable to that of the signal line 22 is provided for each of the signal lines 22 narrower than the scanning line drive circuit control signal wiring 24a. Note that the numbers of the first external connection terminals and the second external connection terminals are appropriately set according to the line width of the wiring formed on the substrate 60.

  As described above, the number of the first external connection terminals and the second external connection terminals is changed in accordance with the line width of the wiring formed on the substrate 60. Because. That is, as described with reference to FIGS. 1 and 2, the display substrate 10 and the relay substrate 20 are fixed by the anisotropic conductive film 40, but the fixing conditions (for example, the width of the terminal, the bonding area, and the pressure) If the degree of engagement is different, the electrical resistance in the fixing portion 65 varies depending on the position. If the electrical resistance of the fixing portion 65 varies depending on the position, display defects such as display unevenness and contrast reduction occur. For this reason, in the adhering portion 65, the crimping conditions are made the same as much as possible by changing the number of external connection terminals according to the line width of the wiring formed on the substrate 60. Furthermore, the bonding area can be increased by providing a plurality of external connection terminals. That is, since an anisotropic conductive film can be disposed between a plurality of external connection terminals, strong adhesion is possible.

Next, the structure of the external connection terminal formed on the fixing portion 65 will be described in detail.
7 is a cross-sectional view of the second external connection terminal 66c and the second external connection terminal 70 taken along the line BB ′ in FIG. 6, and FIG. 8 is an enlarged view of the external connection terminal 70 in FIG. is there. As shown in FIGS. 7 and 8, a base protective layer 281 is formed on the substrate 60, and a gate insulating layer 71 mainly composed of SiO ₂ and / or SiN is formed on the base protective layer 281. Yes. The gate insulating layer 71 is formed to electrically insulate a channel region of a thin film transistor (not shown) from a gate electrode. In the present specification, the “main component” means a component having the highest content.

  A signal line 22 and a light-emitting power supply wiring 23R are formed on the gate insulating layer 71, and a second interlayer insulating layer 283 is formed on the signal line 22 and the light-emitting power supply wiring 23R. The light-emitting power supply wiring 23 and the scanning line drive circuit control signal wiring 24a are formed simultaneously with the scanning line 21 shown in FIG.

  A plurality of contact holes H are formed in the second interlayer insulating layer 283 above the signal lines 22 and the light-emitting power supply wirings 23R. An electrode 73 is formed on the second interlayer insulating layer 283 above the light-emitting power supply wiring 23R, and electrodes 74 and 75 are formed on the second interlayer insulating layer 283 above the signal line 22.

  Since these electrodes 73, 74, 75 are formed by sputtering after forming the contact hole H, a concave portion B is formed on the surface above the contact hole H by the amount of the metal material deposited in the contact hole H. Is formed. In this way, the electrical connection between the light-emitting power supply wiring 23R covered by the second interlayer insulating layer 283 and the electrode 74 formed on the second interlayer insulating layer 283 through the contact hole H, and the second interlayer The signal line 22 covered with the insulating layer 283 and the electrodes 74 and 75 formed on the second interlayer insulating layer 283 are electrically connected.

Further, the ends and sides of the electrodes 73, 74, 75 formed on the second interlayer insulating layer 283, and between these electrodes 73, 74, 75 are made of SiN or the like for the purpose of electrical insulation. A first interlayer insulating layer 284 made of an inorganic material is formed. Transparent electrodes 77 made of ITO or the like are formed on the upper, side, and peripheral portions of the electrodes 73, 74, and 75. Further, the transparent electrodes 77 and the second external portion formed on the peripheral portions of the electrodes 73, 74, and 75 are formed. A protective layer 78 made of SiO ₂ is formed between the connection terminals 66c, 70, 70. The electrodes 73, 74, and 75 are formed simultaneously with the gate line shown in FIG. 3, and the transparent electrode 77 is formed of ITO and formed simultaneously with the pixel electrode (anode). At this time, a material such as ITO is formed by a method such as sputtering.

  Apart from this method, a metal layer can be formed on the uppermost surface of the external connection terminal by applying a liquid material containing a conductive material by an inkjet method. As shown in FIG. 9 and the like, since the external connection terminal is formed of a plurality of conductive layers, it is not limited to the uppermost surface as in the above example, and at least one of the plurality of conductive layers. It is also possible to apply this method to all the layers, and it is also possible to form all the layers by the ink jet method.

  As the liquid material for the conductive film wiring, a dispersion liquid (liquid material) in which conductive fine particles are dispersed in a dispersion medium is used in this example, and it does not matter whether it is aqueous or oily. As the conductive fine particles used here, fine particles of conductive polymer, superconductor, and the like are used in addition to metal fine particles containing at least one of gold, silver, copper, palladium, and nickel. These conductive fine particles can be used by coating the surface with an organic substance or the like in order to improve dispersibility. Examples of the coating material that coats the surface of the conductive fine particles include organic solvents such as xylene and toluene, citric acid, and the like.

  The particle diameter of the conductive fine particles is preferably 1 nm or more and 0.1 μm or less. In particular, the thickness is preferably 5 nm or more and 0.1 μm. If it is larger than 0.1 μm, the nozzle of the droplet discharge head may be clogged. On the other hand, if it is smaller than 5 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of the organic matter in the obtained film becomes excessive.

  The liquid dispersion medium containing conductive fine particles preferably has a vapor pressure at room temperature of 0.001 mmHg to 200 mmHg (about 0.133 Pa to 26600 Pa). When the vapor pressure is higher than 200 mmHg, the dispersion medium rapidly evaporates after discharge, making it difficult to form a good film. The vapor pressure of the dispersion medium is more preferably 0.001 mmHg to 50 mmHg (about 0.133 Pa to 6650 Pa). When the vapor pressure is higher than 50 mmHg, nozzle clogging due to drying tends to occur when droplets are ejected by the inkjet method. On the other hand, in the case of a dispersion medium having a vapor pressure lower than 0.001 mmHg at room temperature, drying is slow and the dispersion medium tends to remain in the film, and it is difficult to obtain a high-quality conductive film after the subsequent heat / light treatment.

  The dispersion medium is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation. For example, in addition to water, alcohols such as methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene Hydrocarbon compounds such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether , Ether compounds such as p-dioxane, propylene carbonate, γ-butyrolactone, N-methyl 2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, and cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred from the viewpoints of fine particle dispersibility, dispersion stability, and ease of application to the inkjet method, and more preferred dispersion media , Water, and hydrocarbon compounds. These dispersion media may be used alone or as a mixture of two or more.

  The dispersoid concentration when the conductive fine particles are dispersed in the dispersion medium is 1% by mass or more and 80% by mass or less, and may be adjusted according to the desired film thickness of the conductive film. In addition, when it exceeds 80 mass%, it will be easy to aggregate and it will be difficult to obtain a uniform film | membrane.

  The surface tension of the conductive fine particle dispersion is preferably in the range of 0.02 N / m to 0.07 N / m. When the liquid is ejected by the ink jet method, if the surface tension is less than 0.02 N / m, the wettability of the ink composition to the nozzle surface increases, and thus flight bending tends to occur, exceeding 0.07 N / m. Since the meniscus shape at the nozzle tip is not stable, it becomes difficult to control the discharge amount and the discharge timing.

  In order to adjust the surface tension, a small amount of a surface tension regulator such as a fluorine-based, silicone-based, or nonionic-based material may be added to the dispersion within a range that does not significantly reduce the contact angle with the substrate. The nonionic surface tension modifier improves the wettability of the liquid to the substrate, improves the leveling property of the film, and helps prevent the occurrence of fine irregularities in the film. The dispersion may contain an organic compound such as alcohol, ether, ester, or ketone as necessary.

  The viscosity of the dispersion is preferably 1 mPa · s to 50 mPa · s. When a liquid material is ejected as droplets using the inkjet method, if the viscosity is less than 1 mPa · s, the nozzle periphery is easily contaminated by the outflow of the ink, and if the viscosity is greater than 50 mPa · s, the nozzle hole The clogging frequency of the liquid becomes high, and it becomes difficult to smoothly discharge the droplets.

  An example using gold fine particles is shown below.

  Xylene was added to a gold fine particle dispersion (trade name “Perfect Gold” manufactured by Vacuum Metallurgical Co., Ltd.) in which gold fine particles having a diameter of 10 nm were dispersed in toluene, and a liquid having a viscosity of 3 cp was used. At that time, the above-described liquid was applied to a region (a flat portion of the terminal) formed between the convex portions by using an inkjet method. At that time, a metal thin film made of gold is formed on the flat portion of the terminal portion and at least on the flat region side of the surface of the convex portion.

  For example, the apparatus illustrated in FIG. 14 can be used as an inkjet apparatus (also referred to as a liquid coating apparatus) used as an inkjet method.

  The ink jet device includes an ink jet head group 1, an X-axis direction drive shaft 4, a Y-direction guide shaft 5, a control device 6, a mounting table 7, a cleaning mechanism unit 8, a base 9, and a heater 15.

  The ink jet head group includes a head as an ink jet application unit that discharges a liquid containing predetermined conductive fine particles from a nozzle (discharge port) and applies the liquid to a substrate at predetermined intervals. The head group is formed by arranging a plurality of heads each having a plurality of nozzles. The plurality of head groups arranged has a layout as shown in FIG. That is, each head is inclined and arranged with respect to the scanning direction of the head.

  As shown in the drawing, a plurality of inkjet heads provided in the inkjet apparatus are arranged. A plurality of ink jet heads can be arranged to be inclined in a direction intersecting the scanning direction, and ink jet drawing can be performed. For example, it is possible to draw with an ink jet apparatus by tilting 30 degrees with respect to the scanning direction. The following effects can be obtained by tilting the inkjet head in the direction intersecting the scanning direction. That is, when the interval between patterns to be formed is narrow, the nozzle interval is apparently narrowed by tilting the head. By doing so, it becomes possible to draw a pattern with a narrow pitch, and any pattern can be formed by changing the angle of inclination. In that case, the ink jet apparatus is provided with a function capable of changing and adjusting the ink jet head to a desired angle.

  The inkjet head and unit will be described in detail below.

[Configuration of head unit]
Next, the configuration of the head unit 420 will be described. FIG. 15 is a plan view showing a head unit provided in the droplet discharge processing apparatus. FIG. 26 is a side view showing the head unit. FIG. 27 is a front view showing the head unit. FIG. 28 is a cross-sectional view showing the head unit.

  The head unit 420 includes a head main body 430 and an ink supply unit 431 as shown in FIGS. The head main body 430 includes a flat carriage 426 and a plurality of substantially identical head devices 433 attached to the carriage 426.

(Configuration of head device)
FIG. 29 is an exploded perspective view showing the head device 433 disposed in the head unit 420.

  As shown in FIG. 29, the head device 433 includes a strip-shaped printed board 435. Various electrical components 436 are mounted on the printed board 435, and electrical wiring (not shown) is provided. Further, a window portion 437 is formed through the printed circuit board 435 so as to be located at one end side in the longitudinal direction (right side in FIG. 6). Further, the printed circuit board 435 is provided with flow passages 438 through which the filter element material 13 that is ink can flow, on both sides of the window portion 437.

  The inkjet head 421 is integrally attached to one surface side (the lower surface side in FIG. 29) of the printed circuit board 435 by a mounting member 440 located at substantially one end side (the right side in FIG. 29) in the longitudinal direction. . The inkjet head 421 is formed in a rectangular shape, and is attached in a state where the longitudinal direction is along the longitudinal direction of the printed circuit board 435.

  In addition, each inkjet head 421 in each head device 433 may have substantially the same shape, that is, a product of a predetermined standard, for example, that is selected to have a predetermined quality. Specifically, these inkjet heads 421 have the same number of nozzles, which will be described later, and the nozzles are formed at the same position, which is efficient when assembling the inkjet head 421 with respect to the carriage 426. It is preferable because accuracy is improved. Furthermore, if products made through the same manufacturing and assembly process are used, it is not necessary to make a special product, and the cost can be reduced.

  Further, on the other surface side (upper surface side in FIG. 29) of the printed circuit board 435, it is located on the substantially other end side in the longitudinal direction (left side in FIG. 29) and is electrically connected to the ink jet head 421 by the electric wiring 442. A connector 441 is integrally attached. These connectors 441 are connected to electrical wirings 442 (including power supply wiring and signal wiring) wired to the sub-scanning drive device 427 so as not to affect the movement of the head unit 420. The electrical wiring 442 connects the control unit (not shown) and the head unit 420. That is, these electrical wirings 442 are on both sides in the arrangement direction of the two rows of head devices 433 from the sub-scanning driving device 427 to the head unit 420 as schematically shown by the two-dot chain arrows in FIGS. It is wired on the outer peripheral side of the head unit 420 and connected to the connector 441 so that no electrical noise is generated.

  Furthermore, an ink introducing portion 443 is attached to the other surface side (upper surface side in FIG. 29) of the printed board 435 corresponding to the ink jet head 421 on substantially one end side in the longitudinal direction (right side in FIG. 29). The ink introduction portion 443 includes a substantially cylindrical positioning tube portion 445 that fits a positioning pin portion 444 that is provided on the attachment member 440 and penetrates the printed circuit board 435, and a locking claw portion 446 that engages with the printed circuit board 435. have.

  The ink introduction part 443 is provided with a pair of tapered connection parts 448 each having a tapered end. These connecting portions 448 have an opening (not shown) that communicates with the flow passage 438 of the printed circuit board 435 in a substantially liquid-tight manner at the base end on the printed circuit board 435 side, and the filter element material 13 can flow through the distal end (not shown). It has a hole.

  Further, as shown in FIGS. 26 to 29, seal connecting portions 450 are respectively attached to these connecting portions 448 so as to be located on the distal end side. These seal connecting portions 450 are formed in a substantially cylindrical shape in which the connecting portion 448 is fitted in a substantially liquid-tight manner on the inner peripheral side, and a seal member 449 is provided at the tip portion.

  Next, the structure of the main body will be described.

  The mounting table 7 is for mounting the substrate 101 to which droplets (liquid) are applied by the coating apparatus, and includes a mechanism for fixing the substrate 101 at a reference position.

  An X-direction drive motor 2 is connected to the X-direction drive shaft 4. The X direction drive motor 2 is a stepping motor or the like, and rotates the X direction drive shaft 4 when a drive signal in the X axis direction is supplied from the control device 6. When the X direction drive shaft 4 is rotated, the inkjet head group 1 moves in the X axis direction.

  The Y-direction guide shaft 5 is fixed so as not to move with respect to the base 9. The mounting table 7 includes a Y-direction drive motor 3. The Y-direction drive motor 3 is a stepping motor or the like, and moves the mounting table 7 in the Y-axis direction when a drive signal in the Y-axis direction is supplied from the control device 6.

  The control circuit 6 supplies a droplet discharge control voltage to each head of the inkjet head group 1. Further, a drive pulse signal for controlling the movement of the inkjet head group 1 in the X-axis direction is supplied to the X-direction drive motor 2, and a drive pulse signal for controlling the movement of the mounting table 7 in the Y-axis direction is supplied to the Y-direction drive motor 3. .

  The cleaning mechanism unit 8 includes a mechanism for cleaning the inkjet head group 1. The cleaning mechanism unit 8 includes a Y-direction drive motor (not shown). The cleaning mechanism 8 moves along the Y-direction guide shaft 5 by driving the Y-direction drive motor. The movement of the cleaning mechanism 8 is also controlled by the control device 6.

  Here, the heater 15 is a means for heat-treating the substrate 101 by lamp annealing, evaporates and dries the liquid applied on the substrate, and converts it into a conductive film. The heater 6 is also turned on and off by the control circuit 6. Note that heat treatment using a hot plate instead of the heater or heat treatment using a drying furnace may be used.

  In such an ink jet apparatus, preliminary ejection and flushing are required for drawing by the ink jet apparatus.

  When forming an external connection terminal as a wiring pattern, preliminary discharge is performed in advance outside the substrate. This is for preventing clogging of the nozzle and discharging a predetermined amount of droplets. The amount of liquid droplets to be preliminarily ejected is about 200 to 5000 and is ejected from all nozzles formed on the ink jet head. The flushing is the same, and droplets are ejected from all nozzles to ensure ejection stability. The discharge amount is set as appropriate, but the same amount as the preliminary discharge is discharged.

  The droplets ejected by such an ink jet head are ejected in the order as shown in FIGS. Hereinafter, a forming method for forming an external connection terminal of the present invention will be described with reference to the drawings. FIG. 16 is a flowchart showing an embodiment of the pattern forming method of the present invention.

  Here, in this embodiment, a case where a conductive film wiring pattern is formed on a substrate will be described as an example.

  In FIG. 16, the pattern forming method according to the present embodiment includes a step (step S1) of cleaning a substrate on which liquid material droplets are arranged using a predetermined solvent and a part of the substrate surface treatment step. A liquid repellency treatment process (step S2), a liquid repellency reduction treatment process (step S3) constituting a part of the surface treatment process for adjusting the liquid repellency of the liquid-repellent substrate surface, and a surface treatment. A material placement step (step S4) for placing (forming) a film pattern by placing droplets of a liquid material containing a conductive film wiring forming material on the substrate, based on a droplet discharge method; An intermediate drying treatment step (step S5) including heat / light treatment for removing at least a part of the solvent component of the liquid material, and a firing step (step S7) for firing the substrate on which a predetermined film pattern is drawn. Have. After the intermediate drying process, it is determined whether or not the predetermined pattern drawing is completed (step S6). When the pattern drawing is completed, the baking process is performed. On the other hand, when the pattern drawing is not completed, the material arranging process is performed. Is done.

  Next, the material placement step (step S4) based on the droplet discharge method, which is a characteristic part of the present invention, will be described with reference to FIGS.

  In the material placement process of the present embodiment, a liquid film containing a conductive film wiring forming material is ejected onto a substrate from a droplet ejection head of a droplet ejection apparatus, thereby forming a linear film pattern (wiring) on the substrate. Pattern) is a step of forming an external connection terminal W. The liquid material is a liquid material in which conductive fine particles such as metal, which are conductive film wiring forming materials, are dispersed in a dispersion medium.

  In FIG. 16, the material placement step (step S4) is performed by ejecting liquid material droplets from the ejection nozzle 10A of the droplet ejection head 10 (the above-described head group) of the droplet ejection apparatus and placing the droplets on the substrate 11. The first step (see FIG. 16A) for forming the central portion (center pattern) W1 in the line width direction of the film pattern W on the substrate 11 and one of the central pattern W1 formed on the substrate 11 A second step (see FIG. 17B) for forming the side portion (first side portion pattern) W2, and the other side portion (second side portion pattern) W3 with respect to the central pattern W1 formed on the substrate 11. And a third step (see FIG. 17C). By these first, second, and third steps, a linear film pattern W as shown in FIG. 17C is formed.

  In the first step, as shown in FIG. 17A, droplets of the liquid material are ejected from the droplet ejection head 10 and arranged on the substrate 11 at a constant distance interval (pitch). Then, by repeating this droplet placement operation, a linear center pattern W1 constituting a part of the film pattern W is formed in the center of the film pattern W formation scheduled region W4 on the substrate 11. In addition, since the surface of the substrate 11 is previously processed to have a desired liquid repellency by steps S2 and S3, the spread of the droplets arranged on the substrate 11 is suppressed. Therefore, the pattern shape can be reliably controlled to be in a good state and the film thickness can be easily increased.

  Here, after disposing the droplets for forming the central pattern W1 on the substrate 11, an intermediate drying process (step S5) is performed as necessary to remove the dispersion medium. The intermediate drying process may be a light process using lamp annealing in addition to a general heat treatment using a heating device such as a hot plate, an electric furnace, and a hot air generator.

  Next, in the second step, as shown in FIG. 17B, the liquid material droplets are ejected from the droplet ejection head 10, and thereby the linear first adjacent to one side of the central pattern W 1. Side pattern W2 is formed. Here, when forming the first side pattern W2, the droplet discharge head 10 discharges the droplet so that the discharged droplet and the central pattern W1 formed on the substrate 11 overlap each other. . As a result, the central pattern W1 and the liquid droplets forming the first side pattern W2 are reliably connected, and the formed film pattern W does not have a discontinuous portion of the conductive film wiring forming material.

  Also in the second step, the droplets are arranged on the substrate 11 at a constant pitch, and by repeating this arrangement operation, a part of the film pattern W is formed on one side of the region W4 where the film pattern W is to be formed. Are formed, and the central pattern W1 and the first side pattern W2 are integrated.

  Also here, after the droplets for forming the first side pattern W2 are arranged on the substrate 11, an intermediate drying process (step S5) is performed as necessary to remove the dispersion medium.

  Next, in the third step, as shown in FIG. 17C, liquid droplets of the liquid material are discharged from the liquid droplet discharge head 10, whereby the second linear line adjacent to the other side of the central pattern W1. Side pattern W3 is formed. Also in this case, when forming the second side pattern W3, the droplet discharge head 10 discharges the droplet such that at least a part of the discharged droplet and the central pattern W1 formed on the substrate 11 overlap. . As a result, the central pattern W1 and the droplets forming the second side pattern W3 are securely connected, and a discontinuous portion of the conductive film wiring forming material does not occur in the formed film pattern W. Thus, the central pattern W1 and the second side pattern W3 are integrated, and the three linear patterns W1, W2, and W3 are integrated to form a wide film pattern W. In the third step, the droplets are arranged on the substrate at a constant pitch. By repeating this arrangement operation, a part of the film pattern W is formed on the other side of the region W4 where the film pattern W is to be formed. A second side pattern W3 is formed.

  At this time, the line width of the final linear film pattern W can be controlled by adjusting the discharge position (distance from the central pattern W) of the droplets discharged in the second and third steps. Further, by changing the height (thickness) of the plurality of patterns W1, W2, and W3 formed in each of the first, second, and third steps from the surface of the substrate 11, the film pattern after integration is changed. The film thickness of W can be controlled.

  In addition, when uneven | corrugated shape is formed in the outline of a pattern, it is preferable to apply | coat a microdroplet so that an uneven | corrugated part may be filled as needed. These micro droplets are droplets smaller than the droplets to be applied normally (referring to the droplets applied by W1, W2, and W3), and the ejection amount is set to be smaller than that of the normal droplets. By applying the fine liquid droplets in this way, the pattern outline has no irregularities and a linear pattern can be formed.

  Next, a procedure for forming the linear center pattern W1 and the side patterns W2 and W3 will be described with reference to FIGS.

  First, as shown in FIG. 18A, the droplets L1 ejected from the droplet ejection head 10 are sequentially arranged on the substrate 11 at a predetermined interval. That is, the droplet discharge head 10 is arranged so that the droplets L1 do not overlap on the substrate 11 (first arrangement step). In this example, the arrangement pitch P1 of the droplets L1 is set to be larger than the diameter of the droplets L1 immediately after being arranged on the substrate 11. As a result, the droplets L1 immediately after being placed on the substrate 11 do not overlap (but do not contact), and the droplets L1 are prevented from coalescing and spreading on the substrate 11. The arrangement pitch P1 of the droplets L1 is set to be not more than twice the diameter of the droplets L1 immediately after being arranged on the substrate 11.

  Here, after disposing the droplet L1 on the substrate 11, an intermediate drying process (step S5) can be performed as necessary to remove the dispersion medium. As described above, the intermediate drying treatment may be, for example, a light treatment using lamp annealing in addition to a general heat treatment using a heating device such as a hot plate, an electric furnace, and a hot air generator. In this case, not only the dispersion medium but also the degree of heating and light irradiation may be increased until the dispersion liquid is converted into a conductive film, but it is sufficient if the dispersion medium can be removed to some extent.

Next, as shown in FIG. 18B, the above-described droplet placement operation is repeated.
That is, as in the previous time shown in FIG. 18A, the liquid material is ejected from the droplet ejection head 10 as the droplet L2, and the droplet L2 is arranged on the substrate 11 at regular intervals.

  At this time, the volume of the droplet L2 (the amount of the liquid material per droplet) and the arrangement pitch P2 thereof are the same as the previous droplet L1. The arrangement position of the droplet L2 is shifted by 1/2 pitch from the previous droplet L1, and the current droplet L2 is arranged at an intermediate position between the previous droplets L1 disposed on the substrate 11. (Second arrangement step). As shown in the drawing, the second liquid droplet L2 is applied so as to complement the space between the first liquid droplets L1 applied first, thereby providing a wiring pattern with excellent flatness (here, for external connection). Terminal) can be formed.

  As described above, the arrangement pitch P1 of the droplets L1 on the substrate 11 is larger than the diameter of the droplets L1 immediately after being arranged on the substrate 11 and not more than twice the diameter. For this reason, the droplet L2 is arranged at an intermediate position between the droplets L1, so that the droplet L2 partially overlaps the droplet L1, and the gap between the droplets L1 is filled. At this time, the current droplet L2 and the previous droplet L1 are in contact with each other, but since the dispersion medium has already been completely or partially removed from the previous droplet L1, the two merge together and spread on the substrate 11. There are few.

  In FIG. 18B, the position where the droplet L2 starts to be arranged is on the same side as the previous time (left side shown in FIG. 18A), but may be on the opposite side (right side). By ejecting droplets during reciprocating movement in each direction, the distance of relative movement between the droplet ejection head 10 and the substrate 11 can be reduced.

  After placing the droplet L2 on the substrate 11, in order to remove the dispersion medium, it is possible to perform an intermediate drying process as necessary, similarly to the previous time.

  By repeating such a series of droplet placement operations a plurality of times, the gaps between the droplets placed on the substrate 11 are filled, and as shown in FIG. 18C, a central pattern that is a linear continuous pattern is formed. W1 and side patterns W2 and W3 are formed on the substrate 11. In this case, by increasing the number of times the droplet placement operation is repeated, the droplets sequentially overlap the substrate 11, and the film thickness of the patterns W1, W2, and W3, that is, the height (thickness) from the surface of the substrate 11 increases. The height (thickness) of the linear patterns W1, W2, and W3 is set according to the desired film thickness required for the final film pattern, and the droplet placement operation is performed according to the set film thickness. The number of repetitions is set.

  In addition, the formation method of a linear pattern is not limited to what was shown to Fig.18 (a)-(c). For example, it is possible to arbitrarily set the arrangement pitch of the droplets and the shift amount at the time of repetition, and the arrangement pitches of the droplets on the substrate P when forming the patterns W1, W2, and W3 are set to different values. May be. For example, when the droplet pitch when forming the central pattern W1 is P1, the droplet pitch when forming the side patterns W2 and W3 may be wider than P1 (for example, P1 × 2). Of course, the pitch may be narrower than P1 (for example, P1 × 0.5). Further, the volume of the droplets when forming the patterns W1, W2, and W3 may be set to different values. Alternatively, in each of the first, second, and third steps, the droplet placement atmosphere (temperature, humidity, etc.) that is the atmosphere in which the substrate 11 and the droplet discharge head 10 are placed, that is, the material placement environment conditions are different from each other. May be set.

  In the present embodiment, the plurality of side patterns W2 and W3 are formed one by one, but two may be formed simultaneously. Here, there is a possibility that the total number of drying processes may be different between the case where a plurality of patterns W2 and W3 are formed one by one and the case where two patterns are simultaneously formed, so that the liquid repellency of the substrate 11 is not impaired. The drying conditions should be determined as follows.

  In the present embodiment, one central pattern W1 is formed in the first step, but two or more central patterns W1 may be formed. A film pattern having a wider line width can be easily formed by discharging droplets to both sides of the plurality of central patterns W1 and continuing them.

  Furthermore, it is possible to apply droplets from one nozzle, but it is also possible to apply droplets by using different nozzles in order to suppress variations in the discharge amount of droplets between nozzles as much as possible. For example, it is preferable to apply the droplet L1 by using a first nozzle, and apply the droplet L2 stored between the droplets L1 by using a second nozzle different from the first nozzle. Further, the first nozzle and the second nozzle may be formed in the same head, but since a plurality of heads are formed as described above, they may be formed in different heads. That is, the first nozzle is formed in the first head, the second nozzle is formed in the second head, and when forming a desired pattern, the first nozzle and the second nozzle are used for coating. It is also possible.

  Next, an example of the order in which droplets are ejected onto the substrate will be described with reference to FIGS. As shown in these drawings, a bitmap having pixels, which are a plurality of grid-like unit regions, on which liquid material droplets are ejected is set on the substrate 11. The droplet discharge head 10 discharges droplets to pixel positions set by a bitmap. Here, one pixel is set to a square. The droplet discharge head 10 discharges droplets from the discharge nozzle 10A while scanning the substrate 11 in the Y-axis direction. In the description using FIG. 19 to FIG. 22, “1” is given to the droplets ejected at the first scanning, and the droplets ejected at the second, third,..., N-th scanning. “2”, “3”,..., “N” are attached to. In the following description, it is assumed that a film pattern W is formed by discharging droplets to each of the regions (pattern formation scheduled regions) indicated by gray in FIG.

  As shown in FIG. 19A, at the time of the first scanning, a droplet is ejected while forming one pixel in the central pattern formation scheduled region in order to form the central pattern W1. Here, the droplets ejected to the substrate 11 are wetted and spread on the substrate 11 by landing on the substrate 11. That is, as shown by a circle in FIG. 19A, the droplet that has landed on the substrate 11 spreads so as to have a diameter c larger than the size of one pixel. Here, since the droplets are ejected at a predetermined interval (one pixel) in the Y-axis direction, the droplets arranged on the substrate 11 are set so as not to overlap each other. By doing so, it is possible to prevent the liquid material from being excessively provided on the substrate 11 in the Y-axis direction and to prevent the occurrence of bulges.

  In FIG. 19A, the liquid droplets arranged on the substrate 11 are arranged so as not to overlap each other, but the liquid droplets may be arranged so as to slightly overlap each other. Further, here, the liquid droplets are ejected with one pixel being opened, but the liquid droplets may be ejected with an interval of an arbitrary number of two or more pixels. In this case, the number of scanning operations and ejection operations of the droplet ejection head 10 with respect to the substrate 11 may be increased to interpolate between droplets on the substrate.

  FIG. 19B is a schematic diagram when droplets are ejected from the ejection nozzle 10 </ b> A of the droplet ejection head 10 to the substrate 11 by the second scanning. In FIG. 19B, “2” is given to the droplets ejected during the second scanning. During the second scan, the droplets are ejected so as to interpolate between the droplets “1” ejected during the first scan.

  Then, droplets are continuous in the first and second scanning and discharging operations, and a central pattern W1 is formed.

  Next, the droplet discharge head 10 and the substrate 11 are relatively moved in the X-axis direction by the size of one pixel. Here, the droplet discharge head 10 is moved by one pixel in the −X direction with respect to the substrate 11. Then, the droplet discharge head 10 performs the third scan. Accordingly, as shown in FIG. 20A, the droplet “3” for forming the first side pattern W2 is disposed on the substrate 11 so as to be adjacent to the −X side of the central pattern W1. . Again, the droplet “3” is arranged with one pixel in the Y-axis direction. Here, the droplet “3” in the first scanning after the step movement of the droplet discharge head 10 in the X-axis direction (that is, the third scanning in the whole) is the first scanning before the step movement. Is disposed at a position adjacent to the droplet “1” in the X axis.

  FIG. 20B is a schematic diagram when droplets are ejected from the droplet ejection head 10 to the substrate 11 by the fourth scan. In FIG. 20B, the droplets ejected during the fourth scan are marked with “4”. During the fourth scan, the droplets are ejected so as to interpolate between the droplets “3” ejected during the third scan. Then, the droplets are continuous in the third and fourth scanning and discharging operations, and the first side pattern W2 is formed. Here, the droplet “4” at the second scanning after the step movement (that is, at the fourth scanning in the whole) is the X axis with respect to the droplet “2” at the second scanning before the step movement. Are arranged at adjacent positions.

  Next, the droplet discharge head 10 and the substrate 11 are relatively moved in the X-axis direction by two pixels. Here, the droplet discharge head 10 is stepped by two pixels in the + X direction with respect to the substrate. Then, the droplet discharge head 10 performs the fifth scan. Thereby, as shown in FIG. 21A, the droplet “5” for forming the second side pattern W3 is arranged on the substrate so as to be adjacent to the + X side of the central pattern W1. Again, the droplet “5” is arranged with one pixel in the Y-axis direction. Here, the droplet “5” at the time of the fifth scanning after the step movement of the droplet discharge head 10 in the X-axis direction is arranged at a position adjacent to the droplet “1” with respect to the X-axis. .

  FIG. 21B is a schematic diagram when droplets are ejected from the droplet ejection head 10 to the substrate 11 by the sixth scan. In FIG. 21B, “6” is given to the droplets ejected during the sixth scan. During the sixth scan, droplets are ejected so as to interpolate between the droplets “5” ejected during the fifth scan. Then, the droplets are continuous in the fifth and sixth scans and discharge operations, and the second side pattern W3 is formed. Here, the droplet “6” at the time of the sixth scanning is arranged at a position adjacent to the droplet “2” with respect to the X axis.

  As described above, it is possible to eject droplets to one pattern by the same nozzle, but it is also possible to eject droplets by different nozzles as described above. The ejection method when ejecting liquid droplets with different nozzles is as described above. Further, the use of nozzles can be similarly implemented in the examples described below.

  FIG. 22 is a diagram showing an example in which the arrangement order of droplet discharge positions is changed. In FIG. 22, the position adjacent to the −X side with respect to the X axis of the droplet “1” forming the central pattern W <b> 1 is the second scan after the step movement of the droplet discharge head 10 in the X axis direction ( The droplet “4” ejected at the time of the fourth scanning as a whole is disposed, while the droplet “2” forming the central pattern W1 is disposed at a position adjacent to the −X side with respect to the X axis. After the step movement of the ejection head 10 in the X-axis direction, the droplet “3” ejected at the first scanning (when the third scanning as a whole) is arranged. Similarly, at the position adjacent to the + X side with respect to the X axis of the droplet “1”, the droplet “6” discharged during the sixth scan as a whole is arranged, while the liquid forming the central pattern W1 At a position adjacent to the + X side of the droplet “2”, the droplet “5” ejected in the fifth scan as a whole is arranged. Thus, when forming each line W1, W2, W3, you may set so that each of the order of the discharge position of a droplet may differ for every line.

  Further, as in the example shown in FIG. 23, after the droplet “1” for forming the central pattern W1 is arranged, the droplet discharge head 10 is moved stepwise to form the first side pattern W2. The order of arranging the droplet “2” and then arranging the droplet “3” for forming the second side pattern W2 by moving the droplet ejection head 10 stepwise is also possible. Then, droplets “4”, “5”, and “6” are sequentially ejected so as to interpolate these. As described above, when the side patterns W2 and W3 are formed after the central pattern W1 is formed, the central pattern W1 is not formed without forming the side patterns W2 and W3 after the central pattern W1 is completely formed. The forming operation of the side patterns W2 and W3 may be started in a completed state.

  24A and 24B show examples of the arrangement of droplets for forming the first and second side patterns W2 and W3 on both sides of the central pattern W1 in the second and third steps. FIG. In the example of FIG. 24A, the central pattern W1 is formed under the same conditions as the ejection conditions (arrangement conditions) described with reference to FIG. On the other hand, the discharge conditions (arrangement conditions) in the second and third steps are different from the discharge conditions for forming the central pattern W1. Specifically, the volume of the droplet Ln is set larger than that in the first step. That is, the amount of liquid material discharged at a time is increased. In this example, the arrangement pitch of the droplets Ln is the same as that in the first step. By increasing the volume of the droplet Ln, the formation time of the entire film pattern W can be shortened, and the throughput can be improved. In addition, since the bulge is likely to be generated when the volume of the droplet is increased, a droplet volume condition in which no bulge is generated according to the material characteristics of the liquid material is obtained in advance, and based on the obtained condition, What is necessary is just to set the maximum possible volume.

  In the example of FIG. 24B, the discharge conditions of the second and third steps are such that the arrangement pitch of the droplets Ln is narrower than that of the first step. Note that the volume of the droplet Ln may be the same as that in the first step, or may be larger than that in the first step as shown in FIG. By narrowing the arrangement pitch of the liquid droplets, the amount of liquid droplets arranged per unit area increases, and a pattern can be formed in a short time.

  As described above, various ejection methods have been described. A method for ejecting liquid droplets using different nozzles will be supplemented below.

  When forming one pattern (here, one line), it is possible to use a plurality of nozzles. For example, the first droplet can be applied by a first nozzle, and the second droplet can be applied by a second nozzle different from the first nozzle. Furthermore, the third droplet can be applied from the third nozzle, and the fourth droplet can be applied from the fourth nozzle. By adopting such a coating method, when there is a variation in the discharge amount depending on the nozzle, the difference can be minimized. That is, when applied by the same nozzle, a difference occurs in the total amount of ejected droplets. As a result, the difference in film thickness and the difference in resistance value as an electrode are also affected. Therefore, in order to improve such a problem, by applying droplets to one electrode (or one pattern) with different nozzles, the difference in film thickness can be minimized, and the resistance of the electrode Can be made substantially uniform.

<Surface treatment process>
Next, the surface treatment steps S2 and S3 shown in FIG. 16 will be described. In the surface treatment process, the surface of the substrate on which the conductive film wiring (external connection terminal) is formed is processed to be liquid repellent with respect to the liquid material (step S2).

  Specifically, the substrate is subjected to surface treatment so that a predetermined contact angle with respect to the liquid material containing conductive fine particles is 60 ° C. or higher, preferably 90 ° C. or higher and 110 ° C. or lower. As a method for controlling the liquid repellency (wetting property) of the surface, for example, a method of forming a self-assembled film on the surface of the substrate, a plasma treatment method, a method of performing UV irradiation, or the like can be employed.

  In the self-assembled film forming method, a self-assembled film made of an organic molecular film or the like is formed on the surface of a substrate on which conductive film wiring is to be formed. The organic molecular film for treating the substrate surface has a functional group that can bind to the substrate and a functional group that modifies the surface properties of the substrate, such as a lyophilic group or a liquid repellent group, on the opposite side (controls the surface energy). And a carbon straight chain or a partially branched carbon chain connecting these functional groups, and is bonded to a substrate and self-assembles to form a molecular film, for example, a monomolecular film.

  Here, the self-assembled film is composed of a binding functional group capable of reacting with constituent atoms such as an underlayer of the substrate and other linear molecules, and has extremely high orientation due to the interaction of the linear molecules. It is a film formed by orienting a compound. Since this self-assembled film is formed by orienting single molecules, the film thickness can be extremely reduced, and the film is uniform at the molecular level. That is, since the same molecule is located on the surface of the film, uniform and excellent liquid repellency and lyophilicity can be imparted to the surface of the film.

  By using, for example, fluoroalkylsilane as the compound having high orientation, each compound is oriented so that the fluoroalkyl group is located on the surface of the film, and a self-assembled film is formed. Liquid repellency is imparted.

  Examples of compounds that form a self-assembled film include heptadecafluoro-1,1,2,2 tetrahydrodecyltriethoxysilane, heptadecafluoro-1,1,2,2 tetrahydrodecyltrimethoxysilane, heptadecafluoro-1 , 1,2,2 tetrahydrodecyltrichlorosilane, tridecafluoro-1,1,2,2 tetrahydrooctyltriethoxysilane, tridecafluoro-1,1,2,2 tetrahydrooctyltrimethoxysilane, tridecafluoro-1 , 1,2,2 tetrahydrooctyltrichlorosilane, trifluoropropyltrimethoxysilane, and other fluoroalkylsilanes (hereinafter referred to as “FAS”). These compounds may be used alone or in combination of two or more.

  Note that by using FAS, adhesion to the substrate and good liquid repellency can be obtained.

FAS is generally represented by the structural formula R _n SiX _(4-n) . Here, n represents an integer of 1 to 3, and X is a hydrolyzable group such as a methoxy group, an ethoxy group, or a halogen atom. R is a fluoroalkyl group, and has a structure of (CF ₃ ) (CF ₂ ) _x (CH ₂ ) _y (where x represents an integer of 0 to 10 and y represents an integer of 0 to 4). And when a plurality of R or X are bonded to Si, each R or X may be the same or different. The hydrolyzable group represented by X forms silanol by hydrolysis, reacts with the hydroxyl group of the base of the substrate (glass, silicon), and bonds to the substrate with a siloxane bond. On the other hand, since R has a fluoro group such as (CF ₃ ) on the surface, the base surface of the substrate is modified to a surface that does not get wet (surface energy is low).

  A self-assembled film made of an organic molecular film or the like is formed on a substrate by placing the above raw material compound and the substrate in the same sealed container and leaving them at room temperature for about 2 to 3 days. Further, by holding the entire sealed container at 100 ° C., it is formed on the substrate in about 3 hours. These are formation methods from the gas phase, but a self-assembled film can also be formed from the liquid phase. For example, the self-assembled film is formed on the substrate by immersing the substrate in a solution containing the raw material compound, washing, and drying. Note that before the self-assembled film is formed, it is desirable to pre-treat the substrate surface by irradiating the substrate surface with ultraviolet light or washing with a solvent.

  After performing the FAS process, a liquid repellency reduction process for processing to a desired liquid repellency is performed as necessary (step S3). That is, when the FAS treatment is performed as the lyophobic treatment, the lyophobic action is too strong and the substrate and the film pattern W formed on the substrate may be easily peeled off. Therefore, a process for reducing (adjusting) the liquid repellency is performed. Examples of the treatment for reducing the liquid repellency include ultraviolet (UV) irradiation treatment having a wavelength of about 170 to 400 nm. By irradiating the substrate with ultraviolet rays having a predetermined power for a predetermined time, the liquid repellency of the FAS-treated substrate is lowered, and the substrate has a desired liquid repellency. Alternatively, the liquid repellency of the substrate can be controlled by exposing the substrate to an ozone atmosphere.

  On the other hand, in the plasma processing method, plasma irradiation is performed on the substrate under normal pressure or vacuum. Various types of gas used for the plasma treatment can be selected in consideration of the surface material of the substrate on which the conductive film wiring is to be formed. Examples of the processing gas include tetrafluoromethane, perfluorohexane, perfluorodecane, and the like.

  The processing for processing the substrate surface to be liquid repellent may also be performed by sticking a film having a desired liquid repellent property, such as a polyimide film processed with ethylene tetrafluoride, to the substrate surface. Moreover, you may use a polyimide film with high liquid repellency as a board | substrate as it is.

  By performing such surface treatment on the surface on which the external connection terminals are formed, it is possible to form a wiring pattern that has excellent flatness and less irregularities in the outline when droplets are spouted. If the electrodes 73, 74, and 75 are to be formed, the surface treatment as described above is performed on the second interlayer insulating layer 283. Further, when an electrode is formed by ink jet at a position corresponding to the transparent electrode 77, an electrode (external connection terminal) by an ink jet method is formed on the uppermost layer by performing a surface treatment on the electrodes 73, 74, 75 which are the lower layers. Can be formed.

<Intermediate drying process>
Next, the intermediate drying step S5 shown in FIG. 16 will be described. In the intermediate drying process (heat / light treatment process), the dispersion medium or the coating material contained in the droplets arranged on the substrate is removed. That is, the liquid material for forming a conductive film disposed on the substrate needs to completely remove the dispersion medium in order to improve the electrical contact between the fine particles.
Further, when a coating material such as an organic material is coated on the surface of the conductive fine particles in order to improve dispersibility, it is also necessary to remove this coating material.

  The heat / light treatment is usually performed in the air, but may be performed in an inert gas atmosphere such as nitrogen, argon, or helium as necessary. The heat / light treatment temperature includes the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as the dispersibility and oxidation of fine particles, the presence and amount of coating material, and the heat resistance temperature of the substrate. It is determined appropriately in consideration of the above. For example, in order to remove a coating material made of an organic material, it is necessary to bake at about 300 ° C. In the case where a substrate such as plastic is used, it is preferably performed at room temperature or higher and 100 ° C. or lower.

  For the heat treatment, for example, a heating device such as a hot plate or an electric furnace can be used. Lamp annealing can be used for the light treatment. The light source used for lamp annealing is not particularly limited, but excimer lasers such as infrared lamps, xenon lamps, YAG lasers, argon lasers, carbon dioxide lasers, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used. These light sources generally have a power output in the range of 10 W to 5000 W, but in the present embodiment, a range of 100 W to 1000 W is sufficient. By the heat and light treatment, electrical contact between the fine particles is ensured and converted into a conductive film.

  At this time, not only the removal of the dispersion medium but also the degree of heating and light irradiation may be increased until the dispersion is converted into a conductive film. However, since the conversion of the conductive film may be performed collectively in the heat treatment / light treatment process after the arrangement of all the liquid materials is completed, it is sufficient here that the dispersion medium can be removed to some extent. For example, in the case of heat treatment, heating at about 100 ° C. is usually performed for several minutes. Also, the drying process can proceed simultaneously with the discharge of the liquid material. For example, by drying the droplets immediately after placing the droplets on the substrate by heating the substrate in advance or using a dispersion medium having a low boiling point along with cooling of the droplet discharge head. Can do.

  As described above, an overheat treatment may be applied after coating. That is, the substrate 101 on which the fine particle dispersion 21 is applied in a predetermined pattern is subjected to heat treatment in order to remove the solvent and improve electrical contact between the fine particles. The heat treatment is usually performed in the air, but can be performed in an inert gas atmosphere such as nitrogen, argon, or helium as necessary. The treatment temperature of the above heat treatment may be appropriately determined depending on the boiling point (vapor pressure) of the solvent, the pressure, and the thermal behavior of the fine particles, and is not particularly limited, but is desirably performed at room temperature or higher and 300 ° C. or lower. In the case of using a substrate such as plastic, it is preferably performed at a temperature between room temperature and 100 ° C.

  The heat treatment can be performed by lamp annealing in addition to the treatment by a normal hot plate, electric furnace or the like. The light source used for lamp annealing is not particularly limited, but excimer laser such as infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used as a light source. In general, these light sources have an output in the range of 10 W to 5000 W, but in the present embodiment, a range of 100 W to 1000 W is sufficient.

  As shown in FIGS. 7 and 8, a plurality of recesses B are formed on the surfaces of the second external connection terminals 66c, 70, 70 provided in the electro-optical device of the present embodiment. The second external connection terminals 66c, 70, 70 are divided as a plurality of electrodes. As shown in FIG. 6, the number of external connection terminals is changed in accordance with the line widths of the light-emitting power supply wiring 23R and the signal line 22, so that the fixing condition in the fixing portion 65 is made uniform. Since the plurality of recesses B are formed on the surfaces of the external connection terminals 66c, 70, 70, the second external connection terminals 66c, 70, 70 are further divided into a plurality of electrodes, so that the fixing conditions can be made uniform. This is extremely suitable for the purpose.

  Further, by forming the first interlayer insulating layer 284 at the ends of the electrodes 73, 74, 75, the convex portions 79 are formed at the ends of the second external connection terminals 66 c, 70, 70. When the projection 79 fixes the display substrate 10 and the relay substrate 20 using the anisotropic conductive film 40, the conductive particles 41 b included in the anisotropic conductive film 40 are connected to the second external connection terminals 66 c and 70. , 70 acts to prevent it from protruding from the sides. As a result, more conductive particles 41b are disposed on the second external connection terminals 66c, 70, and 70, so that the electrical resistance of the fixing portion 65 is extremely excellent.

  Since the display substrate 20 of the present embodiment described above is provided with a configuration for uniformizing the crimping condition in the fixing portion 65, the external connection terminal 34 formed on the relay substrate 30 fixed to the fixing portion 65. May be formed with the same line width as the light emitting power supply wiring 23R and the scanning line drive circuit control signal wiring 24a shown in FIG. However, in order to fix the relay substrate 30 and the display substrate 20 under more uniform pressure bonding conditions, it is preferable that the pattern is the same as the second external connection terminals 66c, 70, 70, etc. formed on the fixing portion 65. It is.

  By the way, the cathode 26 formed so as to cover the various wirings formed on the second interlayer insulating layer 283 shown in FIG. 5 and the upper portion of the actual display region 62 and the dummy region 63 (opposite side to the substrate 60 side). There is a tendency to increase the thickness of the first interlayer insulating layer 284 in order to reduce the parasitic capacitance between them and display defects such as display unevenness and contrast reduction as much as possible.

FIG. 9 is an enlarged view of the second external connection terminals 70, 70 in which the first interlayer insulating layer 284 is formed thick. As shown in FIG. 9, when the thickness of the first interlayer insulating layer 284 between the electrodes 74 and 75 is increased, the height of the convex portions 79 formed at the end portions of the first external connection terminals 70 and 70 is increased. 8 is formed higher than the height of the convex portion 79 shown in FIG. 7 and 8, the first interlayer insulating layer 284 is made of SiN. However, in FIG. 9, the first interlayer insulating layer 284 is formed using SiO ₂ .

  As shown in FIG. 9, by increasing the thickness of the first interlayer insulating layer 284, the height of the convex portions 79 formed at the ends of the electrodes 74 and 75 is increased, and the electrodes 74 and 75 and the transparent electrode 77 are increased. The thickness between the two becomes thinner. Further, when the first interlayer insulating layer 284 is formed directly on the second interlayer insulating layer 283 and the electrodes 74, 75, the convex portions 79 formed at the ends of the electrodes 74, 75 are only on the electrodes 74, 75. In addition, the flatness is lost due to the shape protruding from the surface of the first interlayer insulating layer 284 between the first external connection terminals 70 and 70, and the relay substrate 30 is fixed using the anisotropic conductive film 40. There is a risk that problems will occur.

  In order to prevent such a problem, in this embodiment, a flattening film for flattening the unevenness formed by the electrodes 74 and 75 is provided. FIG. 10 is an enlarged view of the first external connection terminals 70 and 70 in which the first interlayer insulating layer 284 is formed thick and a planarizing film is provided between the electrodes 74 and 75. The planarizing film 80 is formed in a portion other than the portion where the electrodes such as the electrode 74 and the electrode 75 are formed before the first interlayer insulating layer 284 is formed.

  Referring to FIG. 10, by forming the first interlayer insulating layer 284 after forming the planarizing film 80, the surface of the first interlayer insulating layer 284 between the first external connection terminals 70, 70, the protrusions 79, and the like. It can be seen that the height difference (step) of the is small. Therefore, no trouble occurs when the relay substrate 30 is fixed using the anisotropic conductive film 40.

  The electro-optical device according to the embodiment of the present invention has been described above. In addition to the organic EL (electroluminescence) device described above, this terminal structure is a liquid crystal display device, a plasma display device as shown in FIG. The present invention can be applied to displays such as inorganic EL devices and electrophoresis devices.

  Furthermore, although the mounting terminals formed on the display have been shown as an example, the tape side mounted on the mounting terminals can be a process as in the present invention. That is, the external connection terminals of the display can have a conventional structure, and the tape (relay board in the specification) can be processed as described above.

  In addition, by incorporating electronic components such as an electro-optical device, a mother board having a CPU (central processing unit), a keyboard, and a hard disk described above into a housing, for example, a notebook personal computer 600 (electronic) shown in FIG. Equipment). FIG. 11 is a diagram illustrating an example of an electronic apparatus including the electro-optical device according to the embodiment of the invention. In FIG. 9, 601 is a casing, 602 is a liquid crystal display device, and 603 is a keyboard. FIG. 12 is a perspective view showing a mobile phone as another electronic apparatus. A cellular phone 700 illustrated in FIG. 12 includes an antenna 701, a receiver 702, a transmitter 703, a liquid crystal display device 704, an operation button unit 705, and the like.

  In the above-described embodiment, a notebook computer and a mobile phone have been described as examples of electronic devices. However, the present invention is not limited to these, and a liquid crystal projector, a multimedia-compatible personal computer (PC), and an engineering workstation (EWS). It can be applied to electronic devices such as pagers, word processors, televisions, viewfinder type or monitor direct-view type video tape recorders, electronic notebooks, electronic desk calculators, car navigation devices, POS terminals, and devices equipped with touch panels. .

  As described above, according to the present invention, the planarization film is provided between the first terminals, between the second terminals, and between the first terminal and the second terminal, and the first terminal is formed on the planarization film. Since the insulating film is formed on the end of the first terminal and the end of the second terminal, the insulating layer is formed on the end of the first terminal and the end of the second terminal even if the thickness of the insulating layer is increased. There is an effect that the flatness can be ensured without the height of the insulating layer being so high as to the surface of the insulating layer formed on the planarizing film. As a result, there is an effect that the connection failure of the wiring connected to the first terminal and the second terminal does not occur.

  DESCRIPTION OF SYMBOLS 10 ... Electro-optical apparatus, 22 ... Signal line (1st wiring), 23, 23R ... Light emission power supply wiring (2nd wiring, power supply line), 24a ... Scan line drive circuit control signal wiring (1st wiring), 30 ... Relay substrate, 40 ... Anisotropic conductive film, 50 ... Light-emitting element, 53 ... Switching element, 66a, 66b, 66c ... Electrode (second terminal), 67, 68, 69, 70 ... Electrode (first terminal), 284: first interlayer insulating layer (insulating layer), 79: convex portion, 80: planarizing film, B: concave portion.

Claims (8)

  On a first substrate having a first side and a second side intersecting the first side,
  Scanning lines;
  A display region provided with a light emitting element having a light emitting layer between the pixel electrode and the cathode;
  A power supply line that supplies a driving current to the light emitting element and has a line width wider than a line width of the signal line;
  A scanning line driving circuit for supplying a scanning signal to the scanning line;
  A scanning line driving circuit control signal wiring for supplying a scanning line driving circuit control signal to the scanning line driving circuit;
  A first external connection terminal disposed outside the display area in the direction of the first side and connected to the control signal wiring for the scanning line driving circuit;
  A plurality of second external connection terminals disposed outside the display area in the direction of the first side and connected to the power supply line,
  The width of the first external connection terminal is the same as the width of the control signal line for the scanning line driving circuit,
  The width of each of the plurality of second external connection terminals is narrower than the width of the power supply line,
  The electro-optical device, wherein the plurality of second external connection terminals are provided outside the first external connection terminal in the direction of the second side.   The electro-optical device according to claim 1, wherein the power supply line is electrically connected to the pixel electrode.   On a first substrate having a first side and a second side intersecting the first side,
  Scanning lines;
  A display region provided with a light emitting element having a light emitting layer between the pixel electrode and the cathode;
  A cathode wiring electrically connected to the cathode and having a line width wider than the signal line; and
  A scanning line driving circuit for supplying a scanning signal to the scanning line;
  A scanning line driving circuit control signal wiring for supplying a scanning line driving circuit control signal to the scanning line driving circuit;
  A first external connection terminal disposed outside the display area in the direction of the first side and connected to the control signal wiring for the scanning line driving circuit;
  A plurality of second external connection terminals disposed outside the display area in the direction of the first side and connected to the cathode wiring;
  The width of the first external connection terminal is the same as the width of the control signal line for the scanning line driving circuit,
  The width of each of the plurality of second external connection terminals is narrower than the width of the cathode wiring,
  The electro-optical device, wherein the plurality of second external connection terminals are provided outside the first external connection terminal in the direction of the second side.   The electro-optical device according to any one of claims 1 to 3,
  A signal line is further provided on the first substrate,
  A third external connection terminal connected to the signal line;
  The width of each of the third external connection terminals is the same as the width of the signal line.   The electro-optical device according to claim 4,
  An electro-optical device, wherein the first external connection terminal, the second external connection terminal, and the third external connection terminal are each formed with a convex portion.   The electro-optical device according to claim 4,
  An electro-optical device, wherein a plurality of recesses are formed on the surfaces of the first external connection terminal, the second external connection terminal, and the third external connection terminal, respectively.   The electro-optical device according to any one of claims 1 to 3,
  A second substrate is bonded to the second side of the first substrate,
  A semiconductor chip is provided on the second substrate,
  The electro-optical device, wherein the first external connection terminal and the second external connection terminal are electrically connected to the semiconductor chip via wiring.   An electronic apparatus comprising the electro-optical device according to claim 1.

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