JP5134484B2 - Temperature measuring device and method for calibrating sensor unit used in temperature measuring device - Google Patents

Description

  The present invention relates to a temperature measurement device used for measuring the performance of a substrate processing apparatus and a method for calibrating a sensor unit used in the temperature measurement device.

  For example, in a heat treatment apparatus for heat treating a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus, the heat treatment is performed by placing the substrate on a heat treatment plate such as a hot plate or a cool plate. ing. In such a case, it is necessary to measure the temperature of the substrate to be heat-treated. Such a measurement of the temperature of the substrate during processing may be required not only by a heat treatment apparatus but also by a coater for applying a photoresist and a developer for developing a photoresist.

By the way, when performing temperature measurement of such a board | substrate, it is difficult to measure the temperature of the board | substrate which is actually performing the process. For this reason, in general, a temperature sensor using a temperature detection member such as a platinum resistor or a thermocouple, or a temperature sensor using the resonance frequency of a crystal resonator is embedded in the temperature measurement substrate, and this temperature measurement substrate is mounted. It is installed in a processing section of a substrate processing apparatus such as a heat treatment apparatus, and the temperature of the substrate to be processed by the substrate processing apparatus is measured by measuring the temperature of the substrate for temperature measurement (for example, patent document) 1).
JP 2008-140833 A

  The patent document describes a temperature measurement substrate in which a plurality of temperature sensors are bonded and fixed to a substrate, separate conductors are connected to each of the sensors, and the respective conductors are bonded to the substrate.

  As described above, when the terminals of the temperature sensor and the conducting wire are joined, if a thick conducting wire is used for the joint portion in order to obtain mechanical strength, heat is radiated through the conducting wire, resulting in a temperature measurement error. In addition, a temperature measurement error is generated even when the bonding state of the bonding portion is not uniform.

  For this reason, an object of the present invention is to provide a temperature measurement device capable of accurately measuring the temperature of the temperature measurement substrate with a simple configuration.

  Another object of the present invention is to provide a temperature calibration method capable of accurately performing temperature calibration of a temperature sensor used in a temperature measurement device in order to accurately measure the temperature of a temperature measurement substrate. It is to provide.

The invention according to claim 1 is a temperature measurement device for measuring the performance of a substrate processing apparatus, and a temperature measurement substrate disposed in a processing section of the substrate processing apparatus, and a temperature fixed to the substrate. A sensor, a resin printed wiring board formed with a pair of conductive metal patterns connected to electrodes of the temperature sensor, a pair of conductive wires connected to the pair of conductive metal patterns, and the pair of conductive wires A pair of conductive metal patterns, a first pattern portion connected to a pair of electrodes in the temperature sensor, and a second pattern portion connected to the pair of conductive wires. And a connection part that connects the first pattern part and the second pattern part and has a thermal resistance higher than that of the first pattern part and the second pattern part .

The invention according to claim 2 is the invention according to claim 1 , wherein the resinous printed wiring board has a thickness of 500 μm to 30 μm and is bendable.

The invention described in claim 3 is the invention described in claim 1 or 2 , further comprising a tube-shaped fixing member that is bonded to the substrate and that houses the conducting wire therein.

According to a fourth aspect of the present invention, there is provided a temperature calibration method for calibrating a temperature sensor used in a temperature measurement device for measuring the performance of a substrate processing apparatus, wherein the resin print having a conductive metal pattern formed thereon is provided. A connection step of connecting all temperature sensors fixed to a temperature measurement substrate disposed in a processing section of the substrate processing apparatus and a pair of conductive wires corresponding to the temperature sensor, and a printed circuit board; A measurement process of immersing a wiring board in a temperature-controlled liquid together with a temperature sensor and a conductor connected thereto, and measuring the output signal of the temperature sensor at that time by changing the temperature of the liquid multiple times And a calibration step of calibrating the temperature of the sensor based on the temperature of the liquid in the measurement step and the output signal of the temperature sensor at that time.

The invention according to claim 5 is the invention according to claim 4 , wherein the resinous printed wiring board is extremely thin and bendable, and in the measurement step, the printed wiring board is bent and a plurality of the printed wiring boards are bent. Put the temperature sensors together into the oil bath.

The invention according to claim 6 is the invention according to claim 4 or claim 5 , wherein the measuring step is performed for one temperature sensor among a plurality of temperature sensors immersed in a temperature-controlled liquid. Measuring the output signal at that time, and comparing the output value of the one sensor immersed in the liquid with the individual output values of the other temperature sensors, thereby comparing the one sensor with the other temperature. Determining the correlation data of the output value of each of the other sensors with respect to the output value of the one sensor when the sensor is immersed in a liquid at the same temperature, and in the calibration step, For the temperature sensor, temperature calibration is performed based on the temperature of the liquid in the measurement process and the output signal of the temperature sensor at that time, and for the other temperature sensors, the one temperature sensor is used. Relative to the support, calibrated using the correlation data.

  According to the first aspect of the present invention, it is possible to accurately measure the temperature of the substrate with a simple configuration.

In addition, due to the action of the connection portion having a higher thermal resistance than the first pattern portion and the second pattern portion, the heat transfer between the sensor and the conductor can be reduced, and the influence of heat radiation by the conductor can be minimized. Become.

According to the second aspect of the present invention, the heat capacity of the printed wiring board can be reduced, and more accurate measurement can be performed.

According to the third aspect of the present invention, the conducting wire can be easily fixed on the substrate.

According to the fourth aspect of the present invention, it is possible to accurately perform temperature calibration of the temperature measurement device and the temperature sensor used in the temperature measurement device with a simple configuration.

According to the fifth aspect of the present invention, the heat capacity of the printed wiring board can be reduced, and the temperature calibration work for a plurality of sensors can be performed collectively.

According to the invention described in claim 6 , it is possible to perform calibration with a small relative error between a plurality of sensors.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of a temperature measuring apparatus according to the present invention.

  This temperature measuring device is for measuring the performance of the heat treatment device 5 having the heat treatment plate 51, and the temperature measurement unit 4 for measuring the temperature of the temperature measurement substrate W and the measurement value by the temperature measurement unit 4 are used. A temperature measuring unit 2 that measures the temperature based on the personal computer 3 that functions as an input / output unit and a display unit is provided.

  FIG. 2 is a plan view of the temperature measuring unit 4.

  The temperature measurement unit 4 is for measuring the performance of the heat treatment apparatus 5 using the temperature measurement substrate W, and includes 17 sensor units 10 fixed to the temperature measurement substrate W and these sensors. The lead wire 18 connected to the section 10, cable clamps 31 and 32 for fixing the lead wire 18 to the temperature measurement substrate W, and the cable 19 in which the seventeen lead wires 18 are integrated are fixed to the temperature measurement substrate W. And a clamp 22 for

  FIG. 3 is a perspective view of the cable clamp 31.

  The cable clamp 31 is provided with a notch in a resin tube such as polyimide, and accommodates a single conductor 18 therein. The cable clamp 31 is bonded to the temperature measurement substrate W by a thermoplastic and heat-resistant adhesive in a recess formed in the temperature measurement substrate W.

  In addition, each notch | incision in the said cable clamp 31 and the cable clamp 32 is an incision in the direction which cuts a tube in the shape of a longitudinal split with respect to a tube along the longitudinal direction of a tube. In other words, it is a notch that cuts the cylindrical cross section of the tube like the letter C of the alphabet. By forming the cable clamp 31 and the cable clamp 32 with the tube thus cut, the cable 18 and the cable clamp 32 are bonded to the temperature measurement substrate W, and then the conductor 18 is connected to the temperature measurement substrate. Can be fixed to.

  FIG. 4 is a perspective view of the cable clamp 32.

  The cable clamp 32 is also provided with a cut in a resin tube such as polyimide, and stores the 17 conductors 18 together in the inside thereof. The cable clamp 32 is also bonded to the temperature measurement substrate W by a thermoplastic and heat-resistant adhesive in a recess formed in the temperature measurement substrate W.

  FIG. 5 is a plan view of the sensor unit 10, and FIG. 6 is a side sectional view thereof.

  The sensor unit 10 includes a temperature sensor 15 bonded to the temperature measurement substrate W in a recess (see FIG. 6) formed in the temperature measurement substrate W. The temperature sensor 15 is bonded to a recess formed on the temperature measuring substrate W with a heat-resistant ceramic adhesive. As this temperature sensor, a temperature sensor using a resonance frequency of a crystal resonator (hereinafter referred to as “crystal temperature sensor”) is used. When this crystal temperature sensor is used, it is difficult to be affected by noise, and high resolution, high accuracy, and high stability can be obtained. However, instead of the quartz temperature sensor, for example, a temperature sensor using a temperature detecting member such as a platinum resistor or a thermocouple may be used.

  The sensor unit 10 includes a resin printed wiring board 14 on which a pair of conductive metal patterns are formed. The pair of conductive metal patterns include a first pattern portion 11 connected to the pair of electrodes in the temperature sensor 15, a second pattern portion 12 connected to the pair of conductors 16 and 17, and a first pattern portion, respectively. 11 and a connection part 13 that connects the second pattern part 12 to each other. The pair of electrodes and the first pattern portion 11 in the temperature sensor 15, or the pair of conductive wires 16 and 17 and the second pattern portion 12 are connected by dotite or soldered.

A first pattern portion 11 and the second pattern unit 1 2, for convenience connected to the electrodes and conductors 16 and 17 of the temperature sensor 15, having a certain area. On the other hand, the area of the connecting portion 13 is set to be small within a range that does not hinder energization in order to reduce the heat transfer between the temperature sensor 15 and the conducting wires 16 and 17 by increasing the thermal resistance. Yes. In order to heat resistance necessary size, the area of the connecting portion in a plan view (i.e., the cross-sectional area of the energizing unit), the area of the first pattern portion 11 and the second pattern portion 1 2 in a plan view It is preferable to set it to 1/3 or less (that is, the cross-sectional area of the current-carrying portion).

  The printed wiring board 14 is made of an extremely thin resin such as polyimide. And this printed circuit board 14 is adhere | attached on the surface of the board | substrate W for temperature measurement with the heat-resistant double-sided tape or the adhesive agent 20 which has thermoplastic heat resistance.

  The pair of conductors 16 and 17 is a conductor 18 in which a fluororesin cover is surrounded on the outer periphery of a coaxial cable, one of which is a core wire and the other is a sheath, and the temperature measurement substrate W is formed by the cable clamps 31 and 32 described above. Fixed to the surface of the.

  FIG. 7 is an explanatory diagram illustrating a manufacturing process of the sensor unit 10.

  The printed wiring board 14 which comprises the sensor part 10 is manufactured in the state connected 17 by the connection parts 21 made from ultra-thin resin, such as a polyimide. In this state, the temperature sensor 15 and the conductive wire 18 are connected to the first pattern portion 11 and the second pattern portion 12 of the printed wiring board 14.

  The sensor unit 10 thus manufactured is immersed in an oil bath that stores oil whose temperature is adjusted to a predetermined temperature, and the measurement temperature is calibrated. At this time, since the 17 sensor units 10 are connected, the temperature calibration work can be executed in a lump, and the work efficiency can be improved. This temperature calibration operation will be described in detail later.

  The sensor unit 10 after temperature calibration is individually divided and fixed on the temperature measurement substrate W by cutting the printed wiring board 14.

  In the case of measuring how the temperature of the temperature measurement substrate processed by the heat treatment apparatus 5 having the heat treatment plate 51 is changed using the temperature measurement unit 4, the temperature measurement substrate W is used. The substrate is placed on the heat treatment plate 51, and the temperature measurement substrate W is heated by the heat treatment plate 51. The temperature of the temperature measurement substrate W at that time is measured by the temperature sensor 15 of the sensor unit 10, and the output signal is transmitted to the temperature measurement unit 2 via the conductor 18 (cable 19). The temperature measurement unit 2 measures the temperature based on the measurement value by the temperature sensor 15, stores the information, and displays it on the display screen of the personal computer 3.

  At this time, in the temperature measuring unit 4 described above, the temperature sensor 15 and the conductor 18 are connected by the printed wiring board 14 made of an extremely thin resin such as polyimide resin. Therefore, it is possible to perform temperature measurement with less error by preventing the influence of heat radiation. The thickness of the printed wiring board is about 500 μm to 30 μm in order to increase the thermal resistance and reduce the heat capacity. It should be noted that it is more desirable to make it as thin as possible as long as the handling strength is not hindered. At this time, since the area of the connecting portion 13 is set to be small within a range that does not hinder energization, the action of the connecting portion 13 having a large thermal resistance reduces the heat transfer between the temperature sensor 15 and the conductor 18. In addition, since the influence of heat radiation by the conductive wire 18 can be minimized, the temperature of the temperature measurement substrate can be measured more accurately.

  Further, by using the printed wiring board 14, it is possible to improve workability when a large number of temperature sensors 15 are attached to the temperature measurement board W, and replacement of the temperature measurement board W and the temperature sensor 15 is possible. Will also be easier. Moreover, the influence of an external stress can be prevented by using the flexible printed circuit board 14 comprised from ultra-thin resin like a polyimide resin.

  Further, by using the printed circuit board 14, even when a large number of temperature sensors 15 are used, the connection between the temperature sensor 15 and the conductive wire 18 becomes thermally uniform, and the relative error of the thermal response between the temperature sensors 15. Can be reduced.

  Next, a temperature calibration method of the sensor unit 10 for calibrating the temperature of the sensor unit 10 will be described. FIG. 8 is a flowchart showing the temperature calibration procedure of the sensor unit 10 according to the present invention.

  When the temperature calibration of the sensor unit 10 is performed, the temperature sensor 15 is connected to the printed wiring board 14 in advance (step S1), and the pair of conductors 16 and 17 are connected to the printed wiring board 14 (step S2). As a result, as shown in FIG. 7, 17 sensor portions 10 connected by the connecting portions 21 made of an extremely thin resin such as polyimide are formed. As shown in FIG. 2, the seventeen sensor units 10 are the seventeen sensor units 10 mounted on the temperature measurement substrate W in the temperature measurement unit 4.

  And these 17 sensor parts 10 are thrown in collectively in the oil bath by which temperature control was carried out (step S3). At this time, by utilizing the flexibility of the resinous printed wiring board 14, the printed wiring board 14 is bent and the respective sensor units 10 are put into the oil bath in a state of being small. In the oil bath, for example, fluorinate, which is a fluorine-based inert liquid manufactured by Sumitomo 3M Limited, or a liquid such as silicone oil (hereinafter simply referred to as “oil”) is stored. The temperature of the oil in the oil bath is set to T1 degrees Celsius.

  The temperature of the liquid in the oil bath is measured by a reference thermometer (hereinafter simply referred to as “reference thermometer”) installed in the oil bath. The reference thermometer is calibrated in advance with a standard thermometer defined in JCT23101 or the like, which is a technical requirement application guideline for a contact thermometer in JCSS (Japan Calibration Service System).

  When the reference thermometer indicates Celsius T1, the output signal from each sensor unit 10 is measured and stored. More specifically, when the temperature sensor 15 is a crystal thermometer, the frequency of the output signal from each sensor unit 10 is measured and stored. When the temperature sensor 15 is a platinum resistor, the resistance value is measured from the output signal from each sensor unit 10 and stored. The value of the output signal at this time is determined to be an output value output when each sensor unit 10 is at temperature T1.

  Next, the oil temperature is changed by T2 (step S4). At this time, the 17 sensor units 10 may be put together in another oil bath whose temperature is controlled to a temperature T2 different from Celsius T1, or the temperature of the oil stored in the same oil bath may be set. You may make it change from T1 to T2. When the reference thermometer indicates Celsius T2, the output signal from each sensor unit 10 is measured again and stored. The value of the output signal at this time is determined to be an output value that is output when each sensor unit 10 is at temperature T2.

  If the required number of temperature changes is completed by executing the above operation by changing the temperature a plurality of times (step S5), each temperature data and an output signal from each sensor unit 10 at that time, The temperature of the sensor unit 10 is calibrated. That is, based on the characteristics of each temperature sensor 15 input in advance and a plurality of data indicating the system between the oil temperature and the output signal of each sensor unit 10 at that time, the actual temperature and each sensor at that time Data indicating the relationship with the output signal of the unit 10 is obtained.

  Thereby, the temperature calibration of the 17 sensor units 10 mounted on the temperature measurement substrate W in the temperature measurement unit 4 can be efficiently performed collectively. At this time, since the 17 sensor units 10 are not yet bonded to the temperature measurement substrate W, the oil bath used to batch-load the 17 sensor units 10 is 17 sensor units. 10 and the printed wiring board 14 need only be large enough to accommodate the temperature measurement board W, and need not be large enough. In particular, since the connecting portion 21 is made of an extremely thin resin such as polyimide and has flexibility, the temperature calibration is performed by bending the sensor portion 10 and using a cylindrical oil bath having a relatively small inner diameter. Can be performed. In general, when a cylindrical oil bath having a relatively small inner diameter is used, it is easier to maintain the temperature of the oil stored therein more uniformly than when a relatively large oil bath is used. For this reason, it becomes possible to perform temperature calibration work more correctly. Further, since the sensor unit 10 calibrates the temperature before being divided into 17, the 17 conductors 18 are not intertwined with each other so that handling is not hindered, and the workability is good.

  Further, according to this temperature calibration method, the temperature calibration is performed in a state where the temperature sensor 15 and the pair of conductors 16 and 17 are connected to the printed wiring board 14, so that electrical characteristics such as resistance and capacitance of the conductors can be obtained. It is possible to perform calibration in a form close to the actual usage conditions.

  In the above-described embodiment (hereinafter referred to as “first embodiment”), the output when the temperature of the oil in the oil bath is sequentially changed to T1, T2,... The calibration work is executed using the values as output values when the temperatures of the sensor units 10 are T1, T2,. However, in general, because of the difference in response speed between the reference thermometer in the oil bath and the temperature sensor 15 to be calibrated, even if the reference thermometer reaches a predetermined temperature, all 17 sensor units 10 have a uniform temperature. It may not be. In particular, when the response speed of the reference thermometer is slower than that of the sensor unit 10, the calibration error tends to increase.

  FIG. 9 is a diagram schematically showing temperature fluctuations of an article related to calibration in order to explain such a tendency. If the liquid temperature in the oil bath changes as shown in “True liquid temperature” in FIG. 9 when the set temperature is T1, the reference thermometer with a slow response speed delays d1 until the peak temperature T1 + Δtc is displayed. Occurs. On the other hand, since the sensor unit 10 has a relatively high response speed, a delay of d2 may be required until the peak temperature is reached. Therefore, even if the set temperature T1 is reached once with the reference thermometer, the temperature of the sensor unit 10 has already changed following the true liquid temperature, and an error of maximum Δtb is generated depending on the timing of calibration. become.

  In this figure, the measured values of the plurality of sensor units 10 are represented as a single graph. However, if a reference thermometer with a different response speed is used, depending on the sensor position in the oil bath, etc., every 17 sensor units 10 There may be differences in temperature. Even if the 17 sensor units 10 are calibrated simultaneously at the same time, as long as a reference thermometer having a different response speed is used as a reference, a relative error between the 17 sensors is likely to occur.

  Therefore, a second embodiment of the present invention will be described that can be calibrated accurately even in such a case.

  That is, in the second embodiment, first, the above-described calibration is performed only for one sensor unit 10 (hereinafter referred to as “specific sensor unit 10”), and the other 16 sensor units 10 are calibrated first. Calibration is performed using the specific sensor unit 10 as a reference. As a result, calibration is performed based on the temperature measured by the sensor unit 10 having the same response speed, and more accurate calibration with less influence of the response speed of the sensor unit 10 becomes possible.

  The second embodiment will be described in detail as follows.

  The temperature sensor 15 is connected to the printed wiring board 14 in advance, and the pair of conductive wires 16 and 17 are connected to the printed wiring board 14 in advance. The seventeen sensor units 10 are collectively put into a temperature-controlled oil bath. The process up to this point is the same as in the first embodiment.

  Then, when the reference thermometer indicates T1 Celsius, an arbitrary sensor unit is selected from the 17 sensor units, and the output signal of the specific sensor unit is measured and stored as the specific sensor unit 10. . The specific sensor unit 10 may select any of the 17 sensor units, and no matter which one is selected, there is no difference in calibration accuracy.

  Next, the oil temperature is changed to T2. At this time, the specific sensor unit 10 may be put into another oil bath whose temperature is controlled to a temperature T2 different from the Celsius T1, or the temperature of the oil stored in the same oil bath is changed from T1 to T2. You may make it do. When the reference thermometer indicates Celsius T2, the output signal from the specific sensor unit 10 is measured and stored. The value of the output signal at this time is determined to be an output value output when the specific sensor unit 10 is at the temperature T2.

  If the required number of temperature changes is completed by executing the above operation by changing the temperature multiple times, the data of each temperature and the output signal from the specific sensor unit 10 at that time, the specific sensor unit 10 Perform temperature calibration. That is, based on the characteristics of the temperature sensor 15 in the specific sensor unit 10 input in advance and a plurality of data indicating the relationship between the oil temperature and the output signal of the specific sensor unit 10 at that time, the actual temperature and the time The data which shows the relationship with the output signal of each sensor part 10 is obtained.

  Next, the other 16 sensor units 10 are calibrated on the basis of the specific sensor unit 10 previously calibrated. That is, simultaneously with measuring the output signals of the specific sensor unit 10 in the oil bath, the output signals of the other 16 sensor units 10 are measured, and the output signals of all the 17 sensor units 10 are stored. . With this operation, it is possible to grasp the correlation data of the output values of the other 16 sensor units 10 with respect to the output values of the specific sensor unit 10 at the same temperature as the specific sensor unit 10. Note that the output value of the sensor unit 10 is not necessarily linearly proportional to the temperature, so it is desirable that the correlation data be measured at a plurality of temperatures. However, the temperature need not be the temperature of Celsius T1 or Celsius T2 described above, as long as the correlation data of each of the other 16 sensor units 10 with respect to the specific sensor unit 10 can be grasped.

  Using the correlation data obtained by the above-described operation, the other 16 sensor units 10 are calibrated on the basis of the specific sensor unit 10 previously calibrated. Accordingly, the temperature calibration of the 17 sensor units 10 mounted on the temperature measurement substrate W in the temperature measurement unit 4 can be performed accurately.

  In the second embodiment, the specific sensor unit 10 is calibrated first, and the other 16 sensor units 10 are calibrated on the basis of the specific sensor unit 10 previously calibrated. Since no reference thermometer is used for the sensor unit 10, Δtb can be kept small, and the response speed of the reference thermometer is the same as the response speed of the thermometer to be calibrated. Calibration with little relative error can be realized.

It is a schematic diagram of the temperature measuring device concerning this invention. 3 is a plan view of a temperature measuring unit 4. FIG. It is a perspective view of a cable clamp. It is a perspective view of a cable clamp. It is a top view of a sensor part. It is a sectional side view of a sensor part. It is explanatory drawing which shows the manufacturing process of a sensor part. It is a flowchart which shows the procedure of temperature calibration. It is a figure which shows typically the temperature fluctuation of the articles | goods regarding calibration.

2 Temperature measurement unit 3 Personal computer 4 Temperature measurement unit 5 Heat treatment device 10 Sensor unit 11 First pattern unit 12 Second pattern unit 13 Connection unit 14 Printed circuit board 15 Temperature sensor 16 Conductor 17 Conductor 18 Conductor 19 Cable 20 Thermoplastic heat resistance Adhesive 21 connecting part 22 clamp 31 cable clamp 32 cable clamp 51 heat treatment plate W temperature measurement substrate

Claims (6)

A temperature measuring device for measuring the performance of a substrate processing apparatus,
A temperature measuring substrate disposed in a processing section of the substrate processing apparatus;
A temperature sensor fixed to the substrate;
A resin printed wiring board on which a pair of conductive metal patterns connected to the electrodes of the temperature sensor are formed;
A pair of conductive wires connected to the pair of conductive metal patterns;
A temperature measurement unit connected to the pair of conductors;
With
The pair of conductive metal patterns are:
A first pattern portion connected to a pair of electrodes in the temperature sensor;
A second pattern portion connected to the pair of conductive wires;
Connecting the first pattern part and the second pattern part, a connection part having a larger thermal resistance than the first pattern part and the second pattern part;
A temperature measuring device comprising: The temperature measuring device according to claim 1 ,
Printed circuit board of the resinous has a thickness of 30μm from 500 [mu] m, the temperature measuring device is bendable. In the temperature measuring device according to claim 1 or 2 ,
A temperature measurement device comprising a tube-shaped fixing member that is bonded to the substrate and that houses the conducting wire therein. A temperature calibration method for calibrating a temperature sensor used in a temperature measurement device for measuring the performance of a substrate processing apparatus,
With respect to the resin printed wiring board on which the conductive metal pattern is formed, all temperature sensors fixed to the temperature measurement substrate disposed in the processing section of the substrate processing apparatus and a pair corresponding to this temperature sensor A connecting step of connecting the conducting wire forming
A measurement in which a printed wiring board is immersed in a temperature-controlled liquid together with a temperature sensor and a conductor connected thereto, and the output signal of the temperature sensor at that time is measured multiple times by changing the temperature of the liquid. Process,
Based on the temperature of the liquid in the measurement step and the output signal of the temperature sensor at that time, a calibration step for performing temperature calibration of the sensor,
A temperature calibration method characterized by comprising: The temperature calibration method according to claim 4 , wherein
The resinous printed wiring board is extremely thin and bendable,
In the measurement step, a temperature calibration method in which the printed wiring board is bent and a plurality of temperature sensors are put together into an oil bath. In the temperature calibration method according to claim 4 or 5 ,
The measurement step includes
Measuring a current output signal of one temperature sensor among a plurality of temperature sensors immersed in a temperature-controlled liquid;
By comparing the output value of the one sensor immersed in the liquid with the individual output values of the other temperature sensors, the one sensor and the other temperature sensor were immersed in the liquid at the same temperature. Determining the correlation data of the output value of each of the other sensors with respect to the output value of the one sensor,
In the calibration step, for the one temperature sensor, temperature calibration is performed based on the temperature of the liquid in the measurement step and the output signal of the temperature sensor at that time, and for the other temperature sensors, the one temperature sensor A temperature calibration method for performing calibration using the correlation data with a temperature sensor as a reference.

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