JP7165947B2 - temperature measuring device - Google Patents

Description

The present invention relates to a temperature measuring device used for performance measurement of a substrate processing apparatus.

For example, in a heat treatment apparatus for heat-treating a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus, heat treatment is performed by placing the substrate on a heat-treating plate such as a hot plate or a cool plate. ing. In such cases, it is necessary to measure the temperature of the substrate being heat treated. Such measurement of the temperature of the substrate during processing may be required not only in the heat treatment apparatus, but also in a coater that applies photoresist and a developer that develops the photoresist.

By the way, when measuring the temperature of such a substrate, it is difficult to actually measure the temperature of the substrate during processing. For this reason, in general, a temperature sensor using a temperature detecting member such as a platinum resistor or a thermocouple is embedded in a substrate for temperature measurement, and this substrate for temperature measurement is installed in a processing section of a substrate processing apparatus such as a heat treatment apparatus. By measuring the temperature of the substrate for temperature measurement, the temperature of the substrate processed by the substrate processing apparatus is measured.

Patent Literature 1 discloses a temperature measuring device having a configuration in which a temperature sensor is adhered to a recess formed in a substrate, and the recess is filled with an embedding resin. In the temperature measuring device described in Patent Document 1, a bonding pad formed by laminating an insulating thin plate and a conductive film is adhered to a substrate with an adhesive, and the bonding pad is used as a signal line for a temperature sensor. , and a relay line for transmitting the signal of this signal line to the temperature measurement unit.

Further, in Patent Document 2, a temperature sensor is arranged in a concave portion formed in a substrate, a signal line of the temperature sensor is connected to the upper surface of the temperature sensor, and the temperature sensor and the signal line are fixed with a cold welding agent. A temperature measuring device is disclosed.

Japanese Patent No. 4814429 JP-A-10-9963

As described in Patent Document 1, when adopting a configuration in which a signal line from a temperature sensor and a relay line are connected using a bonding pad and this bonding pad is adhered on a substrate, bonding The pad must be made of a heat-resistant material, but if the temperature measured by the temperature measuring device exceeds, for example, 400 degrees Celsius, selection of the material becomes difficult. In addition, since the temperature sensor and the bonding pad must be individually adhered to the substrate, it is necessary to prevent disconnection of the signal line from the temperature sensor during the adhesion work on the substrate. The work becomes complicated.

On the other hand, as described in Patent Document 2, when the relay wire is directly connected to the temperature sensor, the configuration becomes simple and the installation work of the temperature sensor becomes easy. Another problem is that when the temperature measuring device is installed in the substrate processing apparatus, mechanical stress is applied to the temperature sensor and the connecting portion between the temperature sensor and the relay wire through the relay wire, and disconnection or the like is likely to occur.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to easily and reliably connect signal lines and relay lines in a temperature sensor while having a simple structure, and the device can be moved. An object of the present invention is to provide a temperature measuring device that does not apply mechanical stress to the temperature sensor.

According to a first aspect of the invention, there is provided a temperature measuring apparatus for measuring performance of a substrate processing apparatus, comprising: a substrate for temperature measurement arranged in a processing section of the substrate processing apparatus; a plurality of temperature sensors provided, a plurality of relay lines connecting signal lines of the plurality of temperature sensors and a temperature measuring device, and a plurality of sensor holders fixing the plurality of temperature sensors to the temperature measurement substrate; , wherein the sensor holder includes a plate portion formed with a large number of holes, and a signal line of the temperature sensor and the relay wire attached on the opposite side of the plate portion from the temperature measurement substrate. and a support for supporting.

The invention according to claim 2 is the invention according to claim 1, wherein at least one of the signal line of the temperature sensor and the relay line is wound around the supporting portion, and the signal line of the temperature sensor and the relay line are wound around the support portion. The signal line of the temperature sensor and the relay line are supported by being connected to each other.

The invention according to claim 3 is based on the invention according to claim 2, wherein the support part in the sensor holder includes a support part erected on the plate part and a support part on the opposite side of the support part from the plate part. and a flange formed at the end of the.

The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the sensor holder is a ceramic made by three-dimensional modeling.

The invention according to claim 5 is the invention according to any one of claims 1 to 4, further comprising a bundle fixing part for fixing the plurality of relay wires in a bundled state to the temperature measurement board. , the wire bundle fixing portion includes a metal mesh member disposed on the temperature measurement substrate, a plate that sandwiches the plurality of relay wires between the mesh member and the temperature measurement substrate, and the temperature measurement substrate. and a connecting member that connects the plate.

According to the first aspect of the present invention, by supporting the signal line and relay line of the temperature sensor on the support portion of the sensor holder, the assembly work is facilitated and stress is not applied to the signal line and relay line of the temperature sensor. can be prevented. Moreover, when the temperature sensor and the sensor holder are adhered to the substrate, the hole formed in the plate portion of the sensor holder enables good positioning of the temperature sensor and adhesion of the sensor holder.

According to the second aspect of the present invention, it is possible to easily support the signal line and the relay line of the temperature sensor at the post.

According to the third aspect of the invention, by utilizing the flange portion formed at the end portion of the post portion opposite to the plate portion, the signal line of the temperature sensor and the relay wire can be easily connected. It becomes possible to

According to the fourth aspect of the invention, a relatively small sensor holder can be manufactured with high accuracy, and high heat resistance can be obtained.

According to the fifth aspect of the present invention, the action of the mesh member makes it possible to satisfactorily fix a plurality of bundled trunk wires and reduce the influence of heat on the trunk wires.

1 is a schematic diagram showing a temperature measuring device according to the present invention together with a temperature measuring device 2; FIG. 1 is a diagram showing a sensor holder 3 according to a first embodiment of the invention together with a temperature sensor 4 and the like; FIG. FIG. 8 is a diagram showing a sensor holder 3 according to a second embodiment of the invention together with a temperature sensor 4 and the like; 4 is a side cross-sectional view of the connection fixing portion 5. FIG. 5 is a plan view showing the arrangement of the wire bundle 20 of the wire connection fixing portion 5, the mesh member 51, and the like. FIG. FIG. 11 is a side cross-sectional view of a connection fixing portion 5 according to another embodiment;

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing a temperature measuring device according to the present invention together with a temperature measuring device 2. As shown in FIG.

This temperature measuring device is used by being connected to a temperature measuring device 2 for measuring the temperature over time measured by a plurality of temperature sensors, which will be described later, when measuring the performance of a substrate processing apparatus such as a hot plate. A substrate W for temperature measurement composed of a semiconductor wafer and arranged in a processing section of a substrate processing apparatus, and a plurality of sensor holders 3 for arranging a plurality of temperature sensors on the substrate W for temperature measurement. , a plurality of relay wires 10 for connecting the signal lines of the plurality of temperature sensors and the temperature measuring device 2, and a connection fixing portion 5 for fixing the bundle 20 in which the plurality of relay wires 10 are bundled to the substrate W for temperature measurement. , provided.

The sensor holder 3 is used to fix the temperature sensor 4 to the substrate W for temperature measurement and to connect the signal line 41 of the temperature sensor 4 to the relay wire 10. 1 (nine in this embodiment) are provided. The relay wire 10 is bundled near the sensor holder 3 in the center to form a bundled wire 20 , which is fixed to the temperature measurement substrate W at the wire fixing portion 5 and then connected to the temperature measuring device 2 .

FIG. 2 is a diagram showing the sensor holder 3 according to the first embodiment of the invention together with the temperature sensor 4 and the like. Here, (b) in FIG. 2 shows the BB cross section of (a), (c) shows the side surface of (a), and (d) shows the AA cross section of (a).

The sensor holder 3 covers the temperature sensor 4 arranged in the recess 90 formed in the substrate W for temperature measurement, and is adhered to the substrate W for temperature measurement with an adhesive (not shown). It is a thing. The sensor holder 3 has a plate portion 31 and a support portion provided on the side of the plate portion 31 opposite to the substrate W for temperature measurement. The support portion is composed of a column portion 34 erected on the plate portion 31 and a flange portion 35 formed at the end portion of the column portion 34 opposite to the plate portion 31 . A pair of large-diameter hole portions 32 and a large number of small-diameter hole portions 33 are formed in the plate portion 31 .

This sensor holder 3 is made of ceramics produced by three-dimensional modeling. This three-dimensional modeling is also called ceramic 3D modeling, and is a technique capable of producing a relatively small sensor holder 3 with high accuracy. In this three-dimensional modeling, first, a stirrer is used to mix ceramic powder and a UV curable resin to form a slurry, which is set in a modeling apparatus. Then, after converting the three-dimensional CAD data into slice data, a molding machine applies a slurry material to each layer and irradiates a laser beam to create a three-dimensional model. After removing the uncured resin by washing, the resin component is removed in a degreasing furnace, and then baked to complete the product. Since the completed sensor holder 3 is made of fired ceramics, it has high heat resistance. Moreover, since no metal material is used, the risk of metal contamination, which is a problem in semiconductor devices and the like, is reduced.

The temperature sensor 4 used in the temperature measuring device according to this embodiment has a platinum resistor. Thermocouples, which are generally used for temperature measurement, have a small temperature-sensing part and are easy to mount. On the other hand, the temperature sensor 4 equipped with a platinum resistor as used in this embodiment consists of three or four conductors 11, 12, 13 for its signal line 41, and is made of heat-resistant material such as polyimide. By using the relay wire 10 that is insulated and coated with a flexible resin, it is possible to reduce the influence of the wire resistance and perform temperature measurement with high accuracy.

When the sensor holder 3 is used to fix the temperature sensor 4 on the substrate W for temperature measurement, the temperature sensor 4 is arranged in the concave portion 90 of the substrate W for temperature measurement, and the sensor holder 3 is arranged on the temperature sensor 4. do. Then, the position of the temperature sensor 4 is confirmed using a large number of holes 33 formed in the plate portion 31 of the sensor holder 3 . After that, an adhesive is injected through a pair of holes 32 formed in the plate portion 31 . Then, the temperature sensor 4 is pressed toward the substrate W for temperature measurement using the hole 32 as necessary.

In this sensor holder 3, when the adhesive is injected, excess adhesive is discharged from the numerous holes 33 formed in the plate portion 31. Therefore, it is possible to check the amount of adhesive to be applied and set it to an appropriate amount. It becomes possible. In addition, since the adhesive is sucked up from the holes 33 formed in the plate portion 31 and air bubbles are easily removed, the adhesive strength can be improved.

The large number of holes 33 formed in the plate portion 31 of the sensor holder 3 also have the function of reducing the heat capacity of the sensor holder 3 as a whole and reducing the influence on temperature measurement. When the heat capacity of the sensor holder 3 becomes a problem, it is possible to further reduce the heat capacity by adopting a lattice structure or the like during three-dimensional modeling.

The signal line 41 of the temperature sensor 4 is led out to the opposite side of the substrate W for temperature measurement through one of the holes 33 formed in the plate portion 31 of the sensor holder 3 before the temperature sensor 4 is fixed. . The signal line 41 is wound around the three conductors 11, 12 and 13 wound around the flange portion 35 of the support portion and connected to them. Here, by fixing the signal line 41 and the three conductors 11, 12, 13 to the flange portion 35 in advance before bonding the temperature sensor 4 to the substrate W for temperature measurement, the signal line can be It is possible to easily perform the assembly work without applying stress to 41 or the three conductors 11, 12, and 13. Since the signal line 41 and the three conductors 11, 12 and 13 are connected by the flange portion 35 of the sensor holder 3 which is separated from the surface of the substrate W for temperature measurement, there is a problem of insulation and the conductors 11 and 12 , 13 can be prevented from being affected by heat or the like.

By connecting the temperature sensor 4 and the sensor holder 3 in advance, and connecting the signal line 41 and the three conductors 11, 12, and 13 in advance, the resistance values of these wires can be measured to detect faulty connections. It is also possible to confirm the presence/absence in advance. As a result, work on the temperature measurement substrate W can be reduced, and the risk of contamination can be reduced. Moreover, when such a configuration is adopted, even if disconnection or the like occurs, the temperature sensor 4 and the sensor holder 3 can be repaired as a set.

FIG. 3 is a diagram showing a sensor holder 3 according to a second embodiment of the invention together with a temperature sensor 4 and the like. Here, (b) in FIG. 3 shows the BB cross section of (a), (c) shows the side surface of (a), and (d) shows the AA cross section of (a). Note that members similar to those of the sensor holder 3 according to the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

The sensor holder 3 according to the second embodiment differs from the sensor holder 3 shown in FIG. 2 in that a space for housing the temperature sensor 4 is formed below the plate portion 31 . By adopting such a configuration, it is not necessary to perform counterbore processing or the like on the substrate W for temperature measurement to form a concave portion. Therefore, it is possible to construct a temperature measuring device by attaching the temperature sensor 4 to the substrate W for temperature measurement, which is a wafer, a glass substrate, or the like during production.

4 is a side cross-sectional view of the wire fixing portion 5 shown in FIG. 1, and FIG. 5 is a plan view showing the arrangement of the wire bundle 20, the mesh member 51, and the like. 5 shows a state in which three of the four screws 58 and the plate 56 are removed.

The wire fixing portion 5 is for fixing the wire bundle 20 in which a plurality of relay wires 10 are bundled to the substrate W for temperature measurement. , a plate 56 for sandwiching the wire bundle 20 bundled with a plurality of relay wires 10 between itself and the mesh member 51, and four screws 58 as connecting members for connecting the substrate W for temperature measurement and the plate 56. Prepare. The screw 58 passes through a through hole formed in the substrate W for temperature measurement and a hole portion 59 formed in the mesh member 51 and is screwed into a screw hole formed in the plate 56 .

An insulating member 52 such as, for example, a polyimide coated wire is wound around one of the four screws 58 , and the wire bundle 20 is wound around it and then attached to the wire 53 . is concluded by The wire bundle 20 is sandwiched and fixed between the mesh member 51 and the plate 56 .

The mesh member 51 and the plate 56 are made of stainless steel. The thermal conductivity of stainless steel is about one-tenth that of silicon forming the substrate W for temperature measurement. By interposing the mesh member 51 having a low thermal conductivity and a large space due to the mesh structure between the cable bundle 20 and the substrate W for temperature measurement, the influence of heat on the cable bundle 20 can be reduced. can be In a hot plate of a heat treatment apparatus in which the temperature measuring device according to the present invention is used, generally, the space above the hot plate is an air layer, so the temperature is considerably lower than the surface of the hot plate. Therefore, by lowering the thermal conductivity of the intervening member, it is possible to reduce the influence of heat on the wire bundle 20 . Therefore, when the temperature measuring device according to the present invention is used under the condition of 500° C., it becomes possible to use a heat-resistant resin such as polyimide as the insulation coating of the relay wire 10 constituting the bundle 20.

FIG. 6 is a side cross-sectional view of a connection fixing portion 5 according to another embodiment. In addition, members similar to those of the connection fixing portion 5 according to the embodiment shown in FIG.

In the embodiment shown in FIG. 4, through-holes are formed in the substrate W for temperature measurement, but in some cases it is not desired to form through-holes in order to deal with problems such as metal contamination. In the connection fixing part 5 according to this embodiment, the screw 54 is fixed in a concave portion formed in the substrate W for temperature measurement with an adhesive 57, and the mesh member 51 is arranged on the adhesive 57. . The wire bundle 20 is sandwiched and fixed between the mesh member 51 and the plate 56 . In this embodiment, a screw 54 and a nut 55 are used, but a screw hole may be formed in the plate 56 as in the embodiment shown in FIG.

When the screws 54 are fixed to the substrate for temperature measurement W using the adhesive 57 as in this embodiment, the adhesive 57 that can be used even at a high temperature of about 500 degrees Celsius is, for example, an Aron ceramic. Ceramic adhesives are conceivable. Since such a ceramic-based adhesive generally has low elasticity, when the screw 54 is tightened, stress is applied to the adhesive portion, causing a phenomenon in which the adhesive 57 is peeled off. In contrast, in this embodiment, the action of the mesh member 51 can solve such problems. Since the mesh member 51 is easily deformable, even if the adhesive 57 is partially peeled off due to an impact, only that part is deformed, and the entire peeling can be prevented. In particular, even if the adhesive 57 around the screw 54 peels off from the substrate W for temperature measurement, the screw 54 is fixed over the entire area of the mesh member 51 , so that it does not affect the fixation of the wire bundle 20 . do not have.

When the mesh member 51 is used, compared with the case where the mesh member 51 is replaced with a metal plate, the mesh member 51 is made of a highly flexible and easily deformable material, which reduces the impact on the wire bundle 20. can be prevented from spreading over the entire adhesive 57 . In addition, the mesh member 51 can absorb the adhesive 57 well, and can be strongly adhered to the surface of the substrate W for temperature measurement.

In the above-described embodiment, by winding the signal line 41 around the three conductors 11, 12, 13 wound around the flange portion 35, the three conductors 11, 12, 13 and the signal line 41 are connected to each other. is supported on the flange portion 35 of the support portion, the signal wire 41 may be wound around the flange portion 35, and both the three conductor wires 11, 12, 13 and the signal wire 41 may be wound around the flange portion 35. may In addition, by connecting at least one of the three conductors 11, 12, 13 or the signal line 41 to the support, the support section supports the three conductors 11, 12, 13 and the signal line 41. may be adopted.

Further, in the above-described embodiments, the substrate W for temperature measurement is formed of a semiconductor wafer, but other substrates may be used.

2 temperature measurement device 3 sensor holder 4 temperature sensor 5 connection fixing part 10 relay wire 11 conducting wire 12 conducting wire 13 conducting wire 20 bundled wire 31 plate portion 32 hole 33 hole 34 support 35 flange 41 signal wire 51 mesh member 54 screw 55 Nut 56 Plate 58 Screw W Board for temperature measurement

Claims (5)

A temperature measuring device for measuring the performance of a substrate processing apparatus,
a substrate for temperature measurement arranged in a processing section of the substrate processing apparatus;
a plurality of temperature sensors arranged on the substrate for temperature measurement;
a plurality of relay lines connecting the signal lines of the plurality of temperature sensors and a temperature measuring device;
a plurality of sensor holders for fixing the plurality of temperature sensors to the temperature measurement substrate;
with
The sensor holder is
a plate portion having a plurality of holes;
a support portion for supporting the signal line of the temperature sensor and the relay line attached on the opposite side of the plate portion from the substrate for temperature measurement;
A temperature measuring device comprising: The temperature measurement device according to claim 1,
At least one of the signal line of the temperature sensor and the relay line is wound around the support portion, and the signal line of the temperature sensor and the relay line are connected to each other, thereby forming a signal line of the temperature sensor and the relay line. A temperature measuring device supporting a line and a The temperature measuring device according to claim 2,
The support portion of the sensor holder includes a pillar portion erected on the plate portion;
a flange portion formed at an end portion of the support portion opposite to the plate portion;
A temperature measuring device comprising: In the temperature measuring device according to any one of claims 1 to 3,
The temperature measuring device, wherein the sensor holder is a ceramic made by three-dimensional modeling. In the temperature measuring device according to any one of claims 1 to 4,
further comprising a bundle fixing part for fixing the plurality of relay wires in a bundled state to the temperature measurement board;
The bundle fixing part is
a metal mesh member disposed on the substrate for temperature measurement;
a plate that sandwiches the plurality of relay lines between itself and the mesh member;
a connecting member that connects the substrate for temperature measurement and the plate;
A temperature measuring device comprising:

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