JP4968488B2 - Mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device with which suitable junction is obtained on all electrodes of a mounted component even when a load applied on the mounted component in mounting is increased. <P>SOLUTION: A support member is arranged wherein the support member generates a resistive force against reactive force, to a structure farthest from a reactive force generating position in an action direction of the reactive force generated from the load, applied between a substrate electrode and a mounted component electrode, of a structural member from a mounting head body which stops in a mounting position, to a drive mechanism of a Y-axis slider. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a mounting apparatus used when mounting an electronic component such as a so-called IC chip on a substrate. More specifically, it is used when an electrode provided on the chip is bonded to a wiring on a substrate, etc., and a mounting device that performs the bonding by applying a load toward the substrate to the chip, or the The present invention relates to an apparatus for bonding by applying heat while applying a load, and further to a so-called ultrasonic mounting apparatus for further applying ultrasonic vibration along a direction different from the direction in which the load is applied to the chip.

  For example, as shown in Patent Document 1 as a conventional technique, a conventional ultrasonic mounting apparatus is connected to an additional axis of a load and is parallel to the additional axis and on an axis away from the additional axis. It has a bracket that holds the ultrasonic horn. More specifically, the load on the chip is generated as a driving force along an axis that coincides with the additional axis by a voice coil motor. The drive shaft of the voice coil motor transmits a driving force, that is, a load along the axis. The bracket described above has an L shape, and is connected to one end of one L-shaped linear portion extending in a direction orthogonal to the drive shaft, and an ultrasonic horn is connected to the other linear portion parallel to the axis. Hold. That is, the driving force generated by the voice coil motor drive shaft transmits a load in a direction parallel to the axis to the ultrasonic horn via the straight portion of the L-shaped bracket that is located away from the axis. The ultrasonic horn transmits the load received from the bracket in a direction orthogonal to the direction in which the load is applied, and transmits the load again to the bonding tool extending along the additional axis. The bonding tool receives the additional load transmitted through the ultrasonic horn, returns the applied direction of the load to the above-described additional axis of the load, and transmits this to the chip. In the conventional configuration, an ultrasonic vibration is applied from the ultrasonic horn to the bonding tool in a direction different from the load application axis in a state where a load passing through the above-described path is applied to the chip. Have got a joint.

JP 2001-110850 A Japanese Patent Laid-Open No. 11-097493

  In recent years, the chip to be mounted becomes a composite part, the chip shape becomes complicated, or the number of electrodes that require bonding of the chip increases, so that the difficulty of electrode bonding increases, and the stability of bonding is improved. There is a demand for improvement in strength itself. In order to meet this requirement, an increase in the applied load at the time of joining is the most appropriate and appropriate response. However, as described in Patent Document 1 (see paragraph [0006], FIG. 12, etc.) or Patent Document 2 (see abstract), a conventional so-called cantilever ultrasonic horn using an L-shaped bracket is used. When the additional load is increased in the configuration, the horn or the bracket that supports the horn may be bent or a stress may be generated in the bending direction. When such a phenomenon occurs, the chip may be tilted during mounting and the mounting position may be shifted, or a bonding electrode with an unstable mounting state may be generated. It was. In addition, such a bending of the bracket or the generation of a moment that can be a resistance against an additional load causes an error between the driving force generated from the voice coil motor and the load to be actually applied to the chip, There is also a possibility of causing a problem that it is difficult to control an appropriate load.

  Cited Document 1 discloses a technique for preventing a load from being applied to a chip in a state in which a rotational moment centering on the fixed end of the ultrasonic horn is taken into account. Specifically, without changing the additional axis of the driving force obtained from the voice coil motor, the chip is directly pressed through a pressing member disposed at the tip of the driving shaft of the motor and a so-called bonding tool. It is said. Further, in order to separate the moment applied from the bracket from the actual applied load, the member that supports the horn is separated from the bracket, and the support member is suspended by so-called urging means. It is considered that the generation of the moment described above can be suppressed to some extent by suspending with the bracket of the ultrasonic horn.

  However, the influence of the rotational moment described above is not limited to the so-called bonding tool and the configuration in the vicinity thereof, but is considered to extend to various sliders that support and drive the voice coil motor. Further, since the various sliders are added in a cantilever manner, the above-described rotational moment is generated even in a normal bonding operation. The effects of these moments on various sliders can be dealt with simply by improving the rigidity of these components. In this case, however, the weight of each component that makes up the moving part increases, and the operating speed of the device is maintained. Difficult to do. Therefore, when mounting a large-sized chip or the like, a mounting apparatus that can maintain the current operation speed without causing the mounting head body to bend and rotate, and in particular, an ultrasonic wave that is required to have a uniform applied load at the junction. It is required to provide a mounting device.

  The present invention has been made in view of the above situation, and an object thereof is to provide a mounting device, particularly a so-called ultrasonic mounting device, which suppresses the influence on various possible members due to a moment that can be applied to a so-called bonding tool. It is said.

In order to solve the above problems, an ultrasonic mounting apparatus according to the present invention presses an electrode of a mounting component against a wiring electrode on a substrate in a state where a load is applied along a predetermined additional axis, and the electrode and the wiring A mounting apparatus for joining with an electrode, which is arranged along an additional axis and generates a driving force along a predetermined additional axis, and a bonding tool that holds a mounting component at a lower end portion along the additional axis Pressurizing means and a bonding tool extending along a predetermined additional axis and having one end connected to the pressurizing means and a driving force as a load along the predetermined additional axis via the other end A mounting head main body having a pressing shaft that transmits the mounting head, a Z-axis main body driving means that supports the mounting head main body so as to be driven along a predetermined additional axis, and the mounting head main body together with the Z-axis main body driving means. Can be driven in the Y-axis direction perpendicular to the axis A mounting head body, a Z-axis body driving means, a reaction force of a load applied between the electrode and the wiring electrode when the electrode and the wiring electrode are joined, Mounting position support means for applying a preload to the Y-axis slider of the Y-axis driving means as a drag force against the Y-axis slider in a direction opposite to the acting direction of the rotational moment applied to the Y-axis slider of the Y-axis driving means. It is characterized by having.

  In the mounting apparatus described above, the Z-axis main body driving means supports the mounting head main body from a direction different from the extending direction of the predetermined additional shaft and moves the mounting head main body in a predetermined manner by moving in parallel with the additional shaft. Driven along the axis, the Y-axis slider of the Y-axis driving means supports the Z-axis main body driving means from a direction different from the extending direction of the predetermined additional axis and does not intersect with the moving axis of the Z-axis main body driving means. It is preferable to move in the axial direction to drive the Z-axis main body driving means and the mounting head main body in the Y-axis direction. In addition, the mounting head body includes a vibrator that generates ultrasonic vibrations and an ultrasonic wave that extends in a direction different from the additional axis, holds the bonding tool, and is connected to the vibrator to transmit ultrasonic waves to the bonding tool. And a sonic horn.

  The mounting position support means applies a preload to the Y-axis driving means at a position where the mounting head body mounts the mounting component on the substrate, and is fixed to a position where the preload is applied independently of the Y-axis driving means. More preferably. Further, the mounting position support means includes a support member that abuts a predetermined part of the Y-axis driving means, and a support member pressurizing means that extends and contracts the support member in a predetermined direction and applies a preload to the predetermined part via the support member. It is preferable that the portion of the support member that contacts the predetermined portion is more preferably constituted by a part of a spherical surface. Furthermore, it is more preferable that the mounting position support means described above has a pressurization adjusting means capable of adjusting the magnitude of the preload according to the driving force generated by the pressurizing means.

  According to the present invention, the rigidity of the mounting slider body (the structure from the Y-axis slider as a horizontal slider to the bonding tool) at the position where the mounting operation is actually performed can be substantially improved. In addition, according to the present invention, it is not necessary to move all the structural members that require this rigidity improvement together with the mounting head, and the rigidity of the mounting head is limited only when the mounting head applies a load to the chip. Will be improved. Therefore, it is possible to suppress as much as possible the range that affects the operation speed of the mounting head of the member that contributes to the provision of rigidity, and to eliminate the decrease in the mounting speed. In addition, by using so-called diffusion bonding by ultrasonic vibration, the rigidity of various sliders at the mounting position is improved without changing the existing device configuration as much as possible in an ultrasonic mounting device that does not require high loads. It becomes possible to do. Even when the load applied to the chip increases, the load applied to the chip directly along the axis of the bonding tool while suppressing the deflection of the ultrasonic horn or bracket, etc. and also suppressing the moment described above It becomes possible to perform addition.

  Further, according to the present invention, since the rigidity of the mounting head main body by the support means is always performed at the same position, it is possible to suppress distortion due to so-called rotational moment with high reproducibility and high accuracy. Become. Further, since the support means cancels the deformation by applying a preload after taking into account the so-called deformation margin of the structural member, the mounting head can always be supported at a desired position. Further, when the support means has a structure that supports the mounting head by point contact, variation in the contact state at each contact is suppressed, and distortion can be suppressed with high accuracy. In addition, since the weight of various movable members can be suppressed, it is possible to confirm the magnitude of the additional load on the driven structural portion in a relatively high state, coupled with the effect of eliminating the influence of the moment described above. It is possible to finely adjust the load to be applied to the chip and to easily and accurately control the load to be applied to the chip.

It is a figure which shows the schematic structure of the state which looked at the principal part of the mounting apparatus which concerns on 1st embodiment of this invention, and the said apparatus was seen from the side surface. It is a figure regarding the principal part of the mounting apparatus which concerns on embodiment shown to FIG. 1A, Comprising: It is a figure which shows schematic structure of the state which looked at the said apparatus from the side surface. It is a front view of the principal part of the mounting apparatus which concerns on embodiment shown to FIG. 1A, Comprising: It is a figure which shows the state which the said apparatus existed in the position which receives supply of mounting components. It is a front view of the principal part of the mounting apparatus which concerns on embodiment shown to FIG. 1A, Comprising: It is a figure which shows the state in the middle of the said apparatus holding | maintaining a mounting component and moving. It is a front view of the principal part of the mounting apparatus which concerns on embodiment shown to FIG. 1A, Comprising: It is a figure which shows the state which the said apparatus existed in the position which mounts the mounting components with respect to a board | substrate. It is a figure which shows the state which looked at the said principal part from the upper surface about the apparatus principal part in the state shown to FIG. 2A. It is a figure which shows the state which looked at the said principal part from the upper surface about the apparatus principal part in the state shown to FIG. 2C.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a schematic front view of a main part of an ultrasonic mounting apparatus according to an embodiment of the present invention, and FIG. 1B is a schematic side view of the main part. These drawings show a state in which the main part is present at the chip mounting position. The ultrasonic mounting apparatus 100 according to this embodiment includes a mounting head main body 10, a Z-axis main body driving unit 50, a Y-axis driving unit 60, and a mounting position support unit 70. The Z-axis body drive means 50 includes a Z-axis slide guide 55, a Z-axis slider 57, and a Z-axis drive force supply unit 51 that applies a drive force along the Z-axis to the Z-axis slider 57. The mounting head main body 10 is fixed to a Z-axis slider 57, and the Z-axis slider 57 is supported by a Z-axis slide guide 55 so as to be slidable in the Z-axis direction. The Z-axis slider guide 55 is supported by the Y-axis slider 61 in the Y-axis drive unit 60. The Y-axis slider 61 (Y-axis drive means 60) is constituted by a uniaxial drive mechanism 63 made of a known ball screw or the like.

  The mounting head body 10 includes a bonding tool 11, an ultrasonic horn 13, a vibrator 15, a horn support member 17 that is the L-shaped bracket described above, a rotating member 19, a DD motor 21 that is a rotational driving source, and a pressing shaft that is a driving shaft. 23, a pressurizing means 25 exemplified by a voice coil motor, a locking means 27, and a slide block 31. The slide block 31 is a member that is directly supported by the Z-axis slider 57 described above, and has a casing or a frame-like structure having a through hole in the vertical direction (Z-axis direction that is the driving direction of the pressurizing means). A pressurizing means 25 is arranged on the upper part of the slide block 31, and the pressing shaft 23 connected to the upper end of the pressurizing means 25 is connected to the slide block 31 through the upper and lower through holes. It extends in the Z-axis direction from the inside downward to the outside. The bonding tool 11 is a member having a substantially pipe structure, and is disposed so as to extend in the Z-axis direction so as to be coaxial with the pressing shaft 23. The bonding tool 11 has an exhaust port that communicates with a vacuum exhaust system (not shown) at the upper end, and sucks and holds a mounted component such as an IC chip at the opening at the lower end.

  The ultrasonic horn 13 is a member having a substantially conical shape arranged so that its axis extends in the Y-axis direction orthogonal to the Z-axis, and is connected to the above-described bonding tool 11 at the narrowed tip. Hold this. The ultrasonic horn 13 is connected to a vibrator 15 that emits ultrasonic vibration at the rear end. The ultrasonic vibration generated by the vibrator 15 is applied to the ultrasonic horn 13 and is amplified by the shape effect and transmitted to the bonding tool 11 as it is transmitted to the tip. The transmitted ultrasonic vibration is vibration in the Y-axis direction orthogonal to the Z-axis, and the vibration is transmitted to the electrode of the mounting component 1 to be described later via the bonding tool 11. When the ultrasonic vibration is applied to the wiring electrodes on the substrate 3 to be mounted while the electrodes are pressed with a predetermined additional load, the electrodes are joined. As described above, the horn support member 17 has an L-shape arranged so as to extend in the YZ plane (a plane parallel to the paper surface of FIG. 1A). The horn support member 17 supports the vicinity of the rear end of the ultrasonic horn 13 at the end portion (Z-axis lower end portion) of one of the L-shaped linear portions arranged so as to extend in the Z-axis direction.

  The end of the other linear portion extending in the Y-axis direction of the horn support member 17 is connected to the lower end of the Z-axis of the pressing shaft 23 that passes through the central axis of the rotating member 19. That is, the rotating member 19 is a cylindrical member that extends in the Z-axis direction and is arranged so as to be coaxial with the pressing shaft 23. The rotating member 19 supports the pressing shaft 23 so as to be slidable in the Z-axis direction by a linear motion bearing (not shown) that is coaxially extended in the Z-axis direction. The rotating member 19 is connected to a hollow DD motor 21 disposed on the slide block 31. Thereby, the rotation member 19 rotated by the DD motor 21 will also rotate the press shaft 23 together via the linear motion bearing inside. The mounting head body 10 is driven in the Y-axis and Z-axis directions while the mounting component 1 is sucked and held by the Y-axis driving means and the Z-axis driving means. Here, as described above, when the configuration from the pressing shaft 23 to the bonding tool 11 is maintained in a state where it can be said that the configuration is almost free from gravity, the configuration is unexpectedly operated due to the inertia of each configuration during the driving operation. There is a possibility to do. From the viewpoint of preventing the occurrence of such an unexpected operation, in the present embodiment, a lock unit 27 that restricts the operation of the pressing shaft 23 during movement is arranged.

  The mounting position support means 70 exists as a characteristic configuration in the present invention. The mounting position support means 70 includes a substantially rod-shaped support member 71 and a support member drive system 73 that causes the support member 71 to expand and contract in the extending direction. One end portion of the substantially rod-shaped support member 71 is connected to the support member drive system 73, and the other end portion is processed into a spherical shape arranged so that its axis coincides with its diameter. A substantially plate-like contact member 59 protruding perpendicularly from the surface is disposed on the surface opposite to the surface that holds the Z-axis slider 57 in the Y-axis driving means 60. In the state where the mounting head main body 10 is in a position where the mounting component 1 is mounted on the substrate 3, the mounting position support means 70 is such that the contact member 59 and the support member 71 face each other and the end surfaces of the contact member 59 are opposed to each other. The center line extending in the extending direction and the axis of the support member 71 are arranged so as to substantially coincide with each other.

  At the time of mounting, the mounting head main body 10 presses the mounting component 1 against the substrate 3, and the reaction force against the pressing force is applied to the Y-axis slider 61 via the mounting head main body 10 and the Z-axis main body driving system 50. Added. The reaction force is a rotational moment that causes the Y-axis slider 61 to move to the lower right of the paper surface of FIG. 1B (in the direction perpendicular to the Y-axis and clockwise in the plane including the Z-axis) about the contact point between the mounting component 1 and the substrate 3. Give rise to The contact member 59 protruding in a direction substantially along the rotational moment comes into contact with the support member 71, and the rotation is restricted, so that the influence of the rotational moment can be offset.

  It should be noted that in practice, when a distortion that causes rotation of the Y-axis slider 61 occurs, it is impossible to suitably mount a mounting component or the like that requires fine alignment. For this reason, in the present embodiment, the support member drive system 73 slightly extends the support member 71 in the axial direction at the time of mounting, and the support member 71 becomes the contact member 59 when the mounting component 1 contacts the substrate 3. In contrast, a so-called preload is applied. More specifically, the contact of the support member 17 to the contact member 59 and the application of preload are performed almost simultaneously with or before the Z-axis slider 57 is completely lowered to the mounting position. . Since this embodiment can ensure correct operation along the axis of the mounting head body 10, the actual load itself is small as in the ultrasonic mounting apparatus, but the contact state of each electrode, the load on each electrode, and so on. In a system in which the additional state or the like greatly affects the bonding of each electrode, a particularly suitable effect is exhibited.

  Further, since the mounting position is set to a predetermined position and only the Y-axis slider 61 moves relative to the mounting position support means 70 as in this embodiment, the mounting position support means 70 and the Y axis It is possible to apply the preload while always keeping the slider 61 in a certain positional relationship. Therefore, it is possible to perform minute preload control at a reliable and suitable timing. Further, the contact surface of the support member 71 with the contact member 59 is a spherical surface, and the contact surface of the contact member 59 is a plane perpendicular to the extending direction, thereby shifting the stop position of the Y-axis slider 61. Regardless, the contact state of these members can be made constant. For the mounting position support means 70, the magnitude of the preload applied to the contact member 59 can be adjusted on the mounting position support means 70 side according to the driving force generated by the support member drive system 73. As such, a preload adjusting means may be further attached. The preload adjusting means may be provided in the support member driving means 73. Alternatively, for example, the support member 71 has a two-stage structure in which the support member 71 is axially coupled by a male screw and a female screw so that the position of the support member 71 in the drive shaft direction or the protruding amount on the contact member 59 side can be adjusted. A structure is conceivable so as to adjust the coupling interval.

  Next, the operation of each component when the ultrasonic mounting apparatus 100 according to the above-described embodiment actually mounts the mounting component 1 on the substrate 3 will be described. 2A is a front view showing a state in which the main part of the mounting apparatus exists in an arrangement in which the mounting component 1 is delivered from the supply unit, and FIG. 2B is a front view showing a state in which the mounting component 1 is held and moved in the Y-axis direction. FIG. 2 and FIG. 2C respectively show a front view of a state where the mounting component 1 is mounted on the substrate 3. 3A shows a state in which the main part in the state shown in FIG. 2A is viewed from above, and FIG. 3B shows a state in which the main part in the state shown in FIG. 2C is viewed from above. During the mounting process, the mounting head main body 10 is transported to the supply position of the mounting component 1 by the Z-axis main body driving means 50 and the Y-axis driving means 60. At that time, the lock unit 27 regulates the unexpected movement of the rotating member 19, the horn support member 17, the vibrator 15, the ultrasonic horn 13, and the bonding tool 11 together with the DD motor 21. The mounted component 1 is sucked and held by the supply unit 5, transferred to a predetermined supply position, and waits for sucking and holding by the mounting head body 10.

  When the mounting head body 10 sucks and holds the mounting component 1 at the tip of the bonding head 11 (FIGS. 2A and 3A), the mounting head body 10 transports the substrate in the Y-axis direction (not shown). Is conveyed by the Z-axis main body driving means 50 and the Y-axis driving means 60 to a predetermined position above the substrate 3 driven to the predetermined position. While the mounting component 1 is transported above the substrate 3, an arrangement of the substrate, a degree of displacement with respect to a predetermined Y axis, a holding posture of the mounting component 1, etc. are obtained by an image processing system (not shown), The total amount of deviation with respect to the posture that the mounting component 1 should take at the time of bonding is obtained. When the mounting head main body 10 is lowered by the Z-axis main body driving means, position correction in the Y-axis direction by the individual axial driving means, and the rotation member 19 is rotated by a θ drive system (not shown). A holding posture correction operation called so-called θ correction is performed. Further, the position correction in the X-axis direction perpendicular to the Y-axis and the Z-axis is performed by the above-described substrate transport system (not shown) (see FIG. 2B).

  When the conveyance is stopped at a predetermined position on the substrate 3, the support member 71 starts to be extended by the mounting position support means 70 simultaneously with the progress of the conveyance. After the conveyance is stopped, the Z-axis slider starts to descend. When the lowering is detected and a sensor (not shown) detects that the electrode of the mounting component 1 has been lowered to a predetermined height, which is a position immediately before contacting the electrode on the substrate 3, the rotation member 19 is fixed by the lock means 27. Is released. The descending of the mounting component is further continued, and when the mounting component 1 comes into contact with the substrate 3, the lowering operation is stopped. Note that the application of the preload by the support member 71 via the contact member 59 is started simultaneously with or just before the contact (FIGS. 2C and 3B). Here, the pressing means 25 drives the pressing shaft 23 again, and a predetermined load is applied to the mounting component 1 through the bonding tool 11. In a state where a predetermined load is applied to the mounting component 1, the vibrator 15 applies ultrasonic vibration to the bonding tool 11 via the ultrasonic horn 13, thereby joining the electrode of the mounting component 1 and the electrode of the substrate 3. Is done.

  As described above, in the present invention, a load is applied between the electrode of the mounting component 1 and the electrode of the substrate 3 to resist the rotational moment that can be generated in the structure related to the support of the bonding tool 11. Such a preload is applied to the Y-axis slider 61 in advance. Therefore, it becomes possible to cancel out the influence of the rotational moment acting on the L-shaped bracket, the ultrasonic horn and the like accompanying the increase in the load, which is a problem in the prior art. In addition, it becomes possible to construct a mechanism for actually transporting a bonding tool, etc., a mechanism for supporting these, etc. with a configuration equivalent to the conventional one, without reducing any so-called specifications of conventional mounting devices such as operation speed, etc. A sufficient load can be applied between the substrate electrode and the mounting component electrode. In addition, since the rotation of these structures is prevented, even when the load is increased, mounting is performed while accurately maintaining the positional accuracy, parallelism, etc. between the substrate electrode and the mounting component electrode. It becomes possible.

  In the above-described embodiment, the tip of the rod-like support member 71 is spherical. When the structure such as the Z-axis slider 55 moves only in the Y-axis direction as in this embodiment, the stop position accuracy in the Y-axis direction is high, so that the reproducibility of the contact state is maintained by this configuration. Is possible. However, for example, when the Z-axis slider is already driven in the X-axis direction in accordance with the Y-axis, for example, the contact surface 71a is perpendicular to the axial direction and the contact surface of the contact member 59 extends (Y-axis direction). It is good also as a shape which consists of a part of cylinder which has the axis | shaft extended to (). By adopting this shape, even if an error occurs in the stop position accuracy in the Y-axis direction, it is possible to apply the above-described preload while eliminating the influence of the error.

  In the above-described embodiment, the case where the present invention is applied to an ultrasonic mounting apparatus in which an applied load applied between the substrate electrode and the mounting component electrode is relatively small is described. However, the object of application of the present invention is not limited to the device, but for a device that performs mounting only by applying pressure between the substrate electrode and the mounting component electrode, and further for a device that uses heat or other assistance in the device. Is applicable. That is, in this embodiment, the pressing shaft 23 receives a driving force generated by the voice coil motor as the pressurizing means 25 along a predetermined additional axis at one end, and the other end and the other end. The driving force is transmitted as an additional load along a predetermined additional axis to the bonding tool via the connected vibrator 15 or the like. However, in the case of another form of mounting apparatus, the pressing shaft may be directly connected to the bonding tool at the other end. Therefore, it is preferable that the driving force is defined as being transmitted to the bonding tool as a load along a predetermined additional axis via the other end of the pressing shaft.

  In these apparatuses, the mounting head main body 10 and the like are moved only in the Y-axis direction and the Z-axis direction as in the above-described embodiment, and the X-axis direction position correction is performed on the substrate side. preferable. That is, the Z-axis main body driving means 50 moves the mounting head main body 10 in a direction (a direction perpendicular to the extending direction) different from the extending direction of a predetermined additional axis (addition direction of a load applied to the bonding tool). It is preferable that the mounting head body is driven along a predetermined additional axis by supporting the mounting head and moving to a moving axis parallel to the additional axis. The Y-axis drive system has a direction different from the extending direction of the predetermined additional axis (the same direction as the direction perpendicular to the extending direction and the Z-axis main body driving means 50 supporting the mounting head main body 10). The Z-axis main body driving means 50 is supported and moved in the Y-axis direction not intersecting with the movement axis of the Z-axis main body driving means to drive the Z-axis main body driving means 50 and the mounting head main body 10 in the Y-axis direction. It is preferable. With this configuration, it becomes possible to apply preload to the Z-axis slider while maintaining positional accuracy, reproducibility, etc., and the configuration related to driving of the mounting head 10 etc. is actually lightened and simplified. It becomes possible to do. Thereby, effects such as simplification of the apparatus configuration and improvement of the mounting speed can be obtained.

  The mounting position support means 70 includes mounting head main body 10 and Z-axis main body driving means as a reaction force of a load applied between the electrode and the wiring electrode when the electrode of the mounting component and the wiring electrode of the substrate are joined. 50 and the Y-axis drive system 60 in a direction opposite to the direction of action of the rotational moment applied to the Y-axis drive system 60, the Y-axis drive system 60 is disposed at a position where a preload that is a resistance against the rotational moment can be applied. good. When a so-called X-axis drive system is arranged in the Y-axis drive system, the embodiment can be an aspect of the present invention by enabling the mounting position support means 70 to be driven in the X-axis direction. Further, in the case of the arrangement of the ultrasonic horn 13 and the like described above, the present invention can obtain a suitable effect, but the configuration of the ultrasonic generation system, the imparting system, and the like is not limited to the exemplified configuration.

  As described above, the present invention is preferably used for a mounting apparatus used for mounting an electronic component such as an IC chip on a substrate, that is, a so-called flip chip bonding process. However, the application target of the present invention is not limited only to the flip chip bonding process, and is used when an electrode provided on a chip is bonded to a wiring on a substrate, and is directed toward the substrate with respect to the chip. The present invention can also be applied to joining processes of various configurations in which so-called mounting is performed by further applying ultrasonic vibration along a direction different from the direction in which the load is applied to the chip while applying a load.

1: mounting component, 3: substrate, 5: supply unit, 10: mounting head main body, 11: bonding tool, 13: ultrasonic horn, 15: vibrator, 17: horn support member, 19: rotating member, 21: DD motor, 23: pressing shaft, 25: pressurizing means, 27: locking means, 31: slide block, 50: Z-axis main body driving means, 51: Z-axis driving force supply unit, 55: Z-axis slide guide, 57: Z axis slider, 59: contact member, 60: Y axis drive means, 61: Y axis slider, 63: uniaxial drive mechanism, 70: mounting position support means, 71: support member, 73: support member drive system, 100: over Sonic mounting equipment

Claims (7)

A mounting apparatus that presses an electrode of a mounting component against a wiring electrode on a substrate in a state where a load is applied along a predetermined additional axis, and joins the electrode and the wiring electrode,
A bonding tool arranged along the additional axis and holding the mounting component at the lower end along the additional axis;
Pressurizing means for generating a driving force along the predetermined additional axis;
The bonding tool extends along the predetermined additional axis and has one end connected to the pressurizing means and the driving force as a load along the predetermined additional axis via the other end. A mounting shaft body having a pressing shaft for transmitting to
Z-axis body driving means for supporting the mounting head body so as to be driven along the predetermined additional axis;
Y-axis drive means having a Y-axis slider that supports the mounting head body together with the Z-axis body drive means so as to be drivable in the Y-axis direction perpendicular to the predetermined additional axis;
As the reaction force of the load applied between the electrode and the wiring electrode when the electrode and the wiring electrode are joined, the mounting head main body, the Z-axis main body driving means, and the Y-axis driving means Mounting position support means for applying a preload to the Y-axis slider of the Y-axis drive means as a resistance against the rotational moment in a direction opposite to the direction of action of the rotational moment applied to the Y-axis slider; A mounting apparatus comprising: The Z-axis main body driving means supports the mounting head main body from a direction different from the extending direction of the predetermined additional shaft, and moves the mounting head main body to the predetermined additional shaft by moving in parallel with the additional shaft. Drive along,
The Y-axis slider of the Y-axis driving means supports the Z-axis main body driving means from a direction different from the extending direction of the predetermined additional axis and does not intersect with the moving axis of the Z-axis main body driving means. The mounting apparatus according to claim 1, wherein the mounting apparatus moves in the direction to drive the Z-axis main body driving unit and the mounting head main body in the Y-axis direction.   The mounting head main body extends in a direction different from the additional axis and a vibrator that generates the ultrasonic vibrations, holds the bonding tool, and is connected to the vibrator to transmit the ultrasonic waves to the bonding The mounting apparatus according to claim 1, further comprising an ultrasonic horn that transmits the tool.   The mounting position support means applies the preload to the Y axis driving means at a position where the mounting head body mounts the mounting component on the substrate, and applies the preload independently of the Y axis driving means. The mounting apparatus according to claim 1, wherein the mounting apparatus is fixed at a position where the movement is performed.   The mounting position support means includes a support member that comes into contact with a predetermined portion of the Y-axis drive means, and a support member that applies a preload to the predetermined portion via the support member by expanding and contracting the support member in a predetermined direction. The mounting apparatus according to claim 1, further comprising a pressure unit.   The mounting apparatus according to claim 5, wherein the portion of the support member that contacts the predetermined portion is configured by a part of a spherical surface.   The said mounting position support means has a pressurization adjustment means which can adjust the magnitude | size of the said preload according to the said driving force which the said pressurization means generate | occur | produces. Mounting equipment.

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