JP2017195289A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device which can concurrently perform in a parallel way, a transfer operation of transferring a component supplied by a component supply part on a relay table and a mounting operation of picking up the component from the relay table to mount the component on a substrate.SOLUTION: A component mounting device comprises: a backup part 13 for supporting an undersurface side of a terminal part (substrate side terminal part 2a) of a substrate 2; a component supply table 14 for supplying a component 4; a relay table 15 arranged between the backup part 13 and the component supply table 14; a relay table movement mechanism 15M of moving the relay table 15 between a first position where the component 4 is transferred by a transfer head 17 and a second position where the component 4 transferred by the transfer head 17 is located above the backup part 13; and a mounting head 18 for picking up the component 4 from the relay table 15 located at the second position to mount the component 4 on the substrate side terminal part 2a by being lifted up and down above the backup part 13.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a component mounting apparatus for mounting a component on a terminal portion of a substrate.

  A component mounting apparatus used in the manufacture of liquid crystal panels, etc., supports a lower surface side of a terminal portion of a substrate held by a substrate holding table by a backup unit, and picks up a component supplied from a component supply unit by a mounting head. It is configured to be mounted on the terminal portion of the substrate. The parts are placed on the relay table before being picked up by the mounting head, and are picked up and recognized by a camera or the like (see Patent Document 1 below).

JP 2002-9493 A

  However, a single head (mounting head) performs a transfer operation for transferring a component supplied from a component supply unit to a relay table and a mounting operation for picking up a component from the relay table and mounting the component on a substrate. In this case, the transfer operation and the mounting operation, which are originally independent operations, cannot be performed in parallel, and there is a problem that the tact may be reduced accordingly.

  Therefore, the present invention provides a component mounting capable of simultaneously performing a transfer operation for transferring a component supplied from a component supply unit to a relay table and a mounting operation for picking up a component from the relay table and mounting the component on a substrate. An object is to provide an apparatus.

  The component mounting apparatus of the present invention includes a substrate holding table that holds a substrate, a backup unit that supports the lower surface side of the terminal portion of the substrate held by the substrate holding table, a component supply unit that supplies components, A relay table provided between the backup unit and the component supply unit, a transfer head for transferring the component supplied from the component supply unit to the relay table, and the component transferred by the transfer head. A relay table moving mechanism for moving the relay table between a first position to be mounted and a second position at which the parts transferred by the transfer head are positioned above the backup unit; and the backup A mounting head that picks up the component from the relay table located at the second position and mounts it on the terminal portion by moving up and down above the portion. With.

  According to the present invention, a transfer operation for transferring a component supplied from a component supply unit to a relay table and a mounting operation for picking up a component from the relay table and mounting them on a substrate can be performed in parallel.

The perspective view of the component mounting apparatus in one embodiment of this invention 1 is a side view of a part of a component mounting apparatus according to an embodiment of the present invention. The perspective view which shows the component mounted in a board | substrate with the component mounting apparatus in one embodiment of this invention with a board | substrate (A) (b) The side view of the component mounting apparatus in one embodiment of this invention The perspective view which shows the relay table with which the component mounting apparatus in one embodiment of this invention is provided with a relay table moving mechanism The disassembled perspective view which shows the relay table with which the component mounting apparatus in one embodiment of this invention is provided with a relay table moving mechanism Operation explanatory diagram of a relay table provided in the component mounting apparatus according to the embodiment of the present invention Operation explanatory diagram of a relay table provided in the component mounting apparatus according to the embodiment of the present invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing of the component mounting apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing of the component mounting apparatus in one embodiment of this invention The perspective view of a part of component mounting apparatus in one embodiment of the present invention

  Embodiments of the present invention will be described below with reference to the drawings. The component mounting apparatus 1 shown in FIGS. 1 and 2 is used in a liquid crystal panel substrate production line or the like, and is provided on the upper surface of one end of the rectangular panel-shaped substrate 2 shown in FIG. The film-like component 4 is mounted (temporary pressure bonding) on the terminal portion (substrate-side terminal portion 2a). In the present embodiment, the film-like component 4 mounted on the substrate 2 is a flexible substrate, and has a terminal portion (component-side terminal portion 4a) on the lower surface side. The component mounting apparatus 1 mounts the component 4 on the substrate 2 by pressing the component side terminal portion 4a against a thermosetting resin tape 3 such as ACF attached to the substrate side terminal portion 2a.

  1 and 2, the component mounting apparatus 1 includes a substrate holding table 12, a backup unit 13, a component supply table 14 and a relay table 15 on a base 11, a camera 16, a transfer head 17 and a mounting head 18. It is the composition provided with. In the present embodiment, the left-right direction of the component mounting apparatus 1 viewed from the operator OP (FIG. 1) is the axial direction, and the front-rear direction viewed from the operator OP is the Y-axis direction. Also, the vertical direction is the Z-axis direction.

  1 and 2, the substrate holding table 12 holds the substrate 2 placed on the upper surface by a substrate transport mechanism (not shown) by vacuum suction or the like. The substrate holding table 12 is connected to a substrate holding table moving mechanism 12M provided on the base 11, and the substrate holding table moving mechanism 12M moves the substrate holding table 12 in the X axis direction, the Y axis direction, the Z axis direction, and Move around the Z axis.

  1 and 2, the backup unit 13 is provided behind the substrate holding table 12 (the back side as viewed from the operator OP). The backup unit 13 has a shape in which the upper surface is elongated in the X-axis direction. The backup unit 13 supports the lower surface side of the terminal portion (substrate side terminal portion 2 a) of the substrate 2 held by the substrate holding table 12.

  1 and 2, the component supply table 14 is a component supply unit that supplies components 4, and holds a plurality of components 4 in an aligned state on the upper surface. The component supply table 14 is connected to a component supply table moving mechanism 14M, and the component supply table moving mechanism 14M moves the component supply table 14 in the X-axis direction and the Y-axis direction.

  1 and 2, the relay table 15 is a member on which the component 4 supplied from the component supply table 14 is temporarily placed (temporarily placed), and is interposed between the backup unit 13 and the component supply table 14. Has been placed. The relay table 15 is connected to a relay table moving mechanism 15M provided on the base 11, and the relay table moving mechanism 15M moves the relay table 15 to a first position and a second position along the Y-axis direction. Move between. Here, the “first position” is a position (FIG. 4A) where the component 4 supplied from the component supply table 14 is transferred by the transfer head 17 described later. The “second position” is a position (FIG. 4B) where the component 4 transferred by the transfer head 17 is positioned above the backup unit 13. The second position is located in front of the first position.

  In FIG. 1, the camera 16 has the imaging field of view directed downward. The camera 16 is connected to a camera moving mechanism 16M, and the camera moving mechanism 16M moves the camera 16 in the X-axis direction. The camera moving mechanism 16M moves the camera 16 in the X-axis direction above the component 4 placed on the relay table 15, and the camera 16 has two component marks 4m arranged on the upper surface of the component 4 along the X-axis direction. (FIG. 3) is imaged.

  In FIG. 2, the transfer head 17 includes a component suction port 17K that sucks the component 4 at the lower end. The transfer head 17 is connected to a transfer head moving mechanism 17M (FIG. 1), and the transfer head moving mechanism 17M moves the transfer head 17 in the Y-axis direction and the Z-axis direction. The transfer head 17 moves between the upper region of the component supply table 14 and the upper region of the relay table 15, thereby moving the component 4 supplied from the component supply table 14 to the first position by the relay table moving mechanism 15M. It is transferred to the relay table 15 positioned (FIG. 4A).

  In FIG. 2, the mounting head 18 includes a component suction portion 18K that sucks the component 4 at the lower end. The mounting head 18 is connected to a mounting head moving mechanism 18M (FIG. 1), and the mounting head moving mechanism 18M moves the mounting head 18 in the Z-axis direction. The mounting head 18 moves up and down above the backup unit 13 to pick up and pick up the component 4 from the second relay table 15 (FIG. 4B) and press the component 4 against the board-side terminal unit 2a. (The details will be described later.)

  5 and 6, the relay table moving mechanism 15 </ b> M is provided on a base portion 11 </ b> B provided on the base 11, and includes a reference guide 21 and a swing guide 22. The reference guide 21 guides the movement of the relay table 15 from the first position to the second position, and extends in the horizontal direction (Y-axis direction). The swing guide 22 extends to the right of the reference guide 21 so as to be substantially parallel to the Y-axis direction (that is, substantially parallel to the reference guide 21).

  5 and 6, a reference guide side moving portion 23 that is movable along the reference guide 21 is provided on the upper surface side of the reference guide 21. The reference guide side moving part 23 includes a slider part 23a slidable on the reference guide 21, and a plate part 23b having a left end fixed to the slider part 23a and a right end side extending horizontally to the swing guide 22 side. .

  5 and 6, a swing guide side moving portion 24 that is movable along the swing guide 22 is provided on the upper surface side of the swing guide 22. A plate-shaped relay table holding member 25 is stretched between the plate portion 23 b of the reference guide side moving portion 23 and the swing guide side moving portion 24.

  The relay table holding member 25 holds the rear end side of the relay table 15 on the upper surface thereof, and a groove-like portion (not shown) provided on the lower surface side is provided by extending the upper surface of the plate portion 23b in the X-axis direction. The guide 23g is engaged. For this reason, the relay table holding member 25 is movable relative to the plate portion 23b in a direction perpendicular to the direction in which the reference guide 21 extends (that is, the X-axis direction). A pivot shaft 24 a that protrudes upward from the swing guide side moving portion 24 is inserted into the connecting hole 25 </ b> H provided on the left end side of the relay table holding member 25.

  5 and 6, a ball screw 30B is provided in the reference guide 21 so as to extend in the Y-axis direction. A ball screw drive motor 30M that rotationally drives the ball screw 30B is provided at the rear end of the reference guide 21. The ball screw 30B is screwed with a nut portion (not shown) provided on the slider portion 23a. For this reason, when the ball screw driving motor 30M rotationally drives the ball screw 30B, the reference guide side moving portion 23 moves in the front-rear direction (Y-axis direction), and accordingly, the relay table 15 moves in the front-rear direction. As described above, the ball screw 30B and the ball screw drive motor 30M serve as the forward / backward moving mechanism 30 for moving the relay table 15 in the front / rear direction.

  5 and 6, a swing shaft base 31 is provided at the left rear portion of the base portion 11B, and a swing shaft 31a that protrudes and extends upward (that is, in the vertical direction) from the swing shaft base 31 is provided. Is provided. The rear end side (first position side) end of the swing guide 22 is pivotally connected to the swing shaft 31a, and the swing guide 22 can swing in the horizontal plane with the swing shaft 31a as a fulcrum. it can.

  5 and 6, a swing motor 32 is provided on the base portion 11B with the rotation shaft 32a facing upward. An offset portion 33 extends laterally from the rotating shaft 32 a, and an engaging portion 34 extending upward is provided at the end of the offset portion 33.

  5 and 6, a long hole 22 </ b> N extending along the longitudinal direction of the swing guide 22 is provided at the front end portion of the swing guide 22. The locking portion 34 is inserted into the long hole 22N from below, and when the rotation shaft 32a of the swing motor 32 rotates and the locking portion 34 moves along an arc orbit around the rotation shaft 32a, the locking portion 34 is obtained. While moving in the long hole 22N, the swing guide 22 is swung in a horizontal plane with the swing shaft 31a as a fulcrum. As described above, in this embodiment, the swing motor 32 moves the end portion on the front side (second position side) of the swing guide 22 in a direction (X-axis direction) orthogonal to the reference guide 21. This is a swing actuator that swings the swing guide 22 with the swing shaft 31a as a fulcrum.

  The rotation shaft 32a of the swing motor 32 is located at a position where the offset portion 33 extends along the Y axis and the end of the offset portion 33 (the end on the side where the locking portion 34 is provided) faces backward (the neutral position). The swinging guide 22 is in a posture extending parallel to the Y axis (to the reference guide 21) (FIG. 5). When the rotation shaft 32a of the swing motor 32 positioned at the neutral position rotates in the clockwise direction as viewed from the operator OP (arrow R1 shown in FIG. 7), the swing guide 22 moves through the locking portion 34 and the long hole 22N. And swings so that the front end side is swung to the right. Then, the swing guide 22 has a non-parallel posture with respect to the reference guide 21 that gradually increases in distance from the reference guide 21 from the rear to the front (from the first position side to the second position side). (FIG. 7).

  On the other hand, when the rotating shaft 32a of the swinging motor 32 positioned at the neutral position rotates in the counterclockwise direction as viewed from the operator OP (arrow R1 shown in FIG. 8), the swinging guide 22 has the locking portion 34 and the length. It swings so that the front end side is swung leftward through the hole 22N. Then, the swing guide 22 has a non-parallel posture with respect to the reference guide 21 such that the distance from the reference guide 21 gradually narrows from the rear to the front (FIG. 8).

  While the reference guide side moving part 23 is moved from the rear to the front by the forward / backward moving mechanism 30 (arrow A shown in FIG. 7), the rotation shaft 32a of the swing motor 32 is rotated clockwise from the neutral position. When the front end side of the swing guide 22 is swung to the right, the relay table holding member 25 slides to the right with respect to the plate portion 23b (arrow B1 shown in FIG. 7). Therefore, the relay table 15 attached to the relay table holding member 25 starts to move from the first position and reaches the second position according to the rotation angle of the rotation shaft 32a of the swing motor 32. Move to the right by the distance ΔX1 (FIG. 7). That is, the movement end position (second position) of the relay table 15 is shifted to the right by ΔX1 from the movement start position (first position).

  On the other hand, while the reference guide side moving unit 23 is moved from the first position to the second position by the back-and-forth moving mechanism 30 (arrow A shown in FIG. 8), the rotation shaft 32a of the swing motor 32 is moved to the neutral position. When the front end side of the swing guide 22 is swung to the left by rotating counterclockwise from the relay table holding member 25, the relay table holding member 25 slides to the left with respect to the plate portion 23b (arrow B2 shown in FIG. 8). For this reason, the relay table 15 starts moving from the first position and reaches the second position to the left by a distance ΔX2 (FIG. 8) corresponding to the rotation angle of the rotation shaft 32a of the swing motor 32. Move to. That is, the movement end position (second position) of the relay table 15 is shifted to the left side by ΔX2 from the movement start position (first position).

  As described above, in the relay table moving mechanism 15M provided in the component mounting device 1 of the present embodiment, the reference table side along the reference guide 21 so that the relay table 15 moves from the first position toward the second position. When the swing guide 22 is swung about the swing shaft 31a while moving the moving portion 23, the relay table holding member 25 moves relative to the reference guide side moving portion 23, and the relay table 15 is moved to the reference guide 21. The second position is reached in a state in which the position is corrected in the direction (X-axis direction) orthogonal to the direction in which the line extends.

  In FIG. 9, the control device 40 provided in the component mounting apparatus 1 is configured to move the substrate holding table 12 in the X axis direction, the Y axis direction, the Z axis direction, and the Z axis rotation direction by the substrate holding table moving mechanism 12M. Control of movement of the component supply table 14 in the X-axis direction and Y-axis direction by the moving mechanism 14M, movement of the relay table 15 in the Y-axis direction, and correction movement in the X-axis direction by the relay table moving mechanism 15M is performed. Further, the control device 40 moves the camera 16 in the X-axis direction by the camera moving mechanism 16M, moves the transfer head 17 in the Y-axis direction and the Z-axis direction by the transfer head moving mechanism 17M, and the mounting head moving mechanism 18M. Each operation control of the movement of the mounting head 18 in the Z-axis direction is performed.

  In FIG. 9, the control device 40 performs imaging control by the camera 16, and image information obtained by imaging by the camera 16 is sent to the control device 40. An input / output device 41 such as a touch panel is connected to the control device 40, and the operator OP can make a necessary input to the component mounting device 1 through the input / output device 41. Further, the operator OP can obtain various types of information regarding the component mounting apparatus 1 through the input / output device 41.

  When the component mounting apparatus 1 mounts the component 4 on the substrate 2, first, the substrate 2 supplied from the outside is held by the substrate holding table 12 (substrate holding step). Then, the posture is adjusted so that the substrate-side terminal portion 2a (thermosetting resin tape 3) is positioned on the rear edge side of the substrate 2, and the lower surface of the substrate-side terminal portion 2a is supported by the backup portion 13 ( Fig. 10 (a) Backup process).

  When the lower surface of the board-side terminal portion 2a is supported by the backup unit 13, the transfer head 17 moves downward above the component supply table 14, and sucks and picks up the component 4. Then, the transfer head 17 moves down above the relay table 15 with the component 4 picked up, and the component 4 is mounted on the relay table 15 positioned at the first position by the relay table moving mechanism 15M. (FIG. 10 (a), transfer step). At this time, the transfer head 17 places the component 4 on the relay table 15 so that the two component marks 4m arranged in the longitudinal direction (X-axis direction) of the component 4 are positioned within a predetermined region. .

  When the component 4 is placed on the relay table 15, the transfer head 17 moves upward, and further moves rearward therefrom, thereby retracting from the upper area of the relay table 15 (imaging area by the camera 16). Then, it moves above the component 4 to be transferred to the relay table 15 (FIG. 10B). When the transfer head 17 is retracted from the upper region of the relay table 15, the camera 16 is driven by the camera moving mechanism 16M and images the two component marks 4m included in the component 4 while moving in the X-axis direction (FIG. 10B). ) Imaging process). The camera 16 sends image information of the two component marks 4m obtained by imaging to the control device 40, and the control device 40 uses the image information of the two component marks 4m sent from the camera 16 to display the component 4 on the relay table 15. Grasp the position of When the position of the component 4 on the relay table 15 in the X-axis direction is deviated from the normal position, the control device 40 calculates the amount of misalignment from the normal position (position deviation calculation step).

  When the control device 40 grasps the position of the component 4 on the relay table 15, the relay table moving mechanism 15M moves the relay table 15 from the first position to the second position (FIG. 10C). Process). As a result, the component 4 on the relay table 15 is positioned above the backup unit 13, that is, directly below the mounting head 18. When the control device 40 moves the relay table 15 from the first position to the second position, the ball screw 30B is rotationally driven by the ball screw drive motor 30M to move the relay table 15 from the first position to the second position. Rotating the rotating shaft 32a of the swing motor 32 while moving the swing guide 32 to swing the swing guide 22 in the horizontal plane. At this time, the control device 40 corrects the positional deviation amount in the X-axis direction of the component 4 on the relay table 15 calculated by the rotational angle (including the rotational direction) of the rotation shaft 32a of the swing motor 32 in the positional deviation calculation step. The operation of the oscillating motor 32 is controlled so that the angle can be adjusted. As a result, when the component 4 placed on the relay table 15 reaches the second position, the positional deviation in the X-axis direction is corrected (FIG. 10C). Moreover, the transfer head 17 descend | falls from the upper direction of the components 4 which should be mounted in the relay table 15 next, and adsorbs the components 4 (FIG.10 (c)).

  When the relay table 15 is positioned at the second position, the mounting head 18 is lowered, the component suction portion 18K is brought into contact with the component 4 on the relay table 15, and the component 4 is sucked (FIG. 11A). . At the same time, the transfer head 17 rises and picks up the component 4 on the component supply table 14 (FIG. 11A).

  When the mounting head 18 picks up the component 4 on the relay table 15, the mounting head 18 moves up to pick up the component 4 (pickup process), and the relay table moving mechanism 15M moves the relay table 15 to the first position. As a result, the component 4 picked up by the mounting head 18 is positioned above the backup unit 13 and above the board-side terminal unit 2a (thermosetting resin tape 3) (FIG. 11B). . During this time, the transfer head 17 moves above the relay table 15 moved to the first position (FIG. 11B).

  When the relay table 15 is moved to the first position, the mounting head 18 is lowered, and the picked-up component 4 is pressed against the board-side terminal portion 2a (thermosetting resin tape 3) (FIGS. 11C and 12). Process). At the same time, the transfer head 17 places (transfers) the picked-up component 4 on the relay table 15 located at the first position (FIG. 11C). As described above, in the component mounting apparatus 1 according to the present embodiment, the mounting head 18 mounts the component 4 on the board-side terminal portion 2a and the transfer head 17 transfers the next component 4 to the relay table 15. It is to be done in parallel.

  When the pressing of the component 4 to the substrate 2 by the mounting head 18 is continued for a predetermined pressing duration, the control device 40 releases the suction of the component 4 and raises the mounting head 18. As a result, the mounting operation of each component 4 on the substrate 2 is completed. When the operation of mounting the component 4 on the board 2 is completed, the board holding table moving mechanism 12M moves the board holding table 12 to separate the board 2 from the backup unit 13. Then, the board transport mechanism (not shown) carries the board 2 out of the component mounting apparatus 1. If the board | substrate 2 is carried out, the board | substrate 2 newly supplied from the outside will be hold | maintained with the board | substrate holding table 12, and the above-mentioned series of processes will be performed repeatedly.

  As described above, in the component mounting apparatus 1 according to the present embodiment, the relay table 15 to which the component 4 supplied from the component supply table 14 is transferred has the first position where the component 4 is transferred; The transferred component 4 is movable between a second position where the component 4 is positioned above the backup unit 13. The component 4 is transferred by the transfer head 17, and the component 4 is mounted by the mounting head. 18, the transfer operation for transferring the component 4 supplied from the component supply table 14 to the relay table 15 and the mounting operation for picking up the component 4 from the relay table 15 and mounting them on the substrate 2 are performed simultaneously. This can be done and the tact can be improved. In addition, the mounting head 18 only needs to be moved up and down, and a mechanism for moving the mounting head 18 in the horizontal plane is not necessary, so that the manufacturing cost of the component mounting apparatus 1 can be reduced.

  Further, the relay table moving mechanism 15M provided in the component mounting apparatus 1 in the present embodiment swings the swing guide 22 provided substantially in parallel with the reference guide 21, thereby extending the relay table 15 to the reference guide 21. Since the position of the relay table 15 is corrected with a simple configuration that is moved in the direction orthogonal to the direction (X-axis direction), the weight of the relay table moving mechanism 15M and thus the component mounting apparatus 1 can be reduced. Is possible.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, in the above-described embodiment, the swing guide 22 has the swing shaft 31a when the front end side (second position side) end of the swing guide 22 is moved in the correction direction (X-axis direction). However, the mechanism for swinging the swing guide 22 using the swing shaft 31a as a fulcrum may have other configurations. For example, the swing guide 22 may be swung by moving the front end side of the swing guide 22 in the left-right direction with a cylinder arranged so that the piston rod extends in the horizontal direction. Alternatively, the swing guide 22 may be swung around the swing shaft 31a by an actuator such as a motor provided on the swing shaft 31a side. However, in the configuration in which the swing guide 22 is swung by the actuator provided on the swing shaft 31a side, a large driving force for swinging the swing guide 22 is required, so that the size of the actuator may be increased. From this point, it is preferable that the swing guide 22 is configured to swing when the front end side (second position side) is driven as shown in the above-described embodiment. The table moving mechanism 15M can be made compact.

  Further, in the above-described embodiment, the forward / backward moving mechanism 30 that moves the relay table 15 between the first position and the second position causes the ball screw 30B and the ball screw drive motor to rotationally drive the ball screw 30B. The relay table 15 may be moved by another mechanism such as a rodless cylinder.

  In the above-described embodiment, the mounting head 18 is moved in the Z-axis direction (elevating operation) by the mounting head moving mechanism 18M. However, the mounting head 18 is moved in the Z-axis direction. You can do it.

  Provided is a component mounting apparatus capable of simultaneously performing a transfer operation for transferring a component supplied from a component supply unit to a relay table and a mounting operation for picking up a component from the relay table and mounting the component on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 2a Board | substrate side terminal part (terminal part)
4 parts 12 substrate holding table 13 backup unit 14 parts supply table (component supply unit)
DESCRIPTION OF SYMBOLS 15 Relay table 15M Relay table moving mechanism 17 Transfer head 18 Mounted head 21 Reference guide 22 Swing guide 23 Reference guide side moving part 24 Swing guide side moving part 25 Relay table holding member 31a Swing shaft

Claims (4)

A substrate holding table for holding the substrate;
A backup unit that supports the lower surface side of the terminal part of the substrate held by the substrate holding table;
A component supply unit for supplying components;
A relay table disposed between the backup unit and the component supply unit;
A transfer head for transferring the component supplied from the component supply unit to the relay table;
The relay table is moved between a first position where the parts are transferred by the transfer head and a second position where the parts transferred by the transfer head are positioned above the backup unit. A relay table moving mechanism,
A component mounting apparatus comprising: a mounting head for picking up the component from the relay table positioned at the second position and mounting the component on the terminal unit by moving up and down above the backup unit .   The relay table moving mechanism includes a reference guide that extends in the horizontal direction and guides the movement of the relay table from the first position to the second position, and is substantially parallel to the reference guide. A swing guide pivotally connected to a swing shaft extending in the vertical direction, a reference guide side moving portion movably provided along the reference guide, and along the swing guide A swing guide side moving portion that is movably provided, and is connected to the swing guide side moving portion, holds the relay table, and extends in a direction in which the reference guide extends with respect to the reference guide side moving portion. A relay table holding member relatively movable in a direction orthogonal to the reference guide side moving portion along the reference guide so that the relay table moves from the first position toward the second position. The When the swing guide is swung with the swing shaft as a fulcrum while being moved, the relay table holding member moves relative to the reference guide side moving portion so that the relay table extends in the direction in which the reference guide extends. The component mounting apparatus according to claim 1, wherein the second position is reached in a state in which the position is corrected in an orthogonal direction.   The swing guide swings about the swing shaft as a fulcrum by moving an end of the swing guide on the second position side in a direction perpendicular to the direction in which the reference guide extends. The component mounting apparatus according to claim 2.   The mounting of the component on the terminal portion by the mounting head and the transfer of the component to the relay table by the transfer head are performed in parallel. The component mounting device described.

Images