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JP4960916B2 - LIGHTING DEVICE AND LIGHTING DEVICE MANUFACTURING METHOD - Google Patents

LIGHTING DEVICE AND LIGHTING DEVICE MANUFACTURING METHOD Download PDF

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JP4960916B2
JP4960916B2 JP2008090064A JP2008090064A JP4960916B2 JP 4960916 B2 JP4960916 B2 JP 4960916B2 JP 2008090064 A JP2008090064 A JP 2008090064A JP 2008090064 A JP2008090064 A JP 2008090064A JP 4960916 B2 JP4960916 B2 JP 4960916B2
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light emitting
organic light
lighting device
emitting element
holding member
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JP2009240208A (en
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淳司 柿木
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Rohm Co Ltd
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Description

本発明は、照明装置及び照明装置の製造方法に関し、特に、発光素子を用いた植物育成用の照明装置及び照明装置の製造方法に関する。   The present invention relates to a lighting device and a method for manufacturing the lighting device, and more particularly to a lighting device for plant growth using a light emitting element and a method for manufacturing the lighting device.

近年、発光素子として有機EL(EL:Electroluminescence)素子を用いた照明装置が実用化に向けて開発が進められている。一方、植物育成に関して、自然光以外の人工光を利用することが検討されており、人工光として有機EL照明を適用することが知られている(例えば、特許文献1参照)。   In recent years, lighting devices using organic EL (EL) elements as light emitting elements have been developed for practical use. On the other hand, regarding plant growth, it has been studied to use artificial light other than natural light, and it is known to apply organic EL illumination as artificial light (see, for example, Patent Document 1).

従来、植物育成用の照明は電球型又は蛍光灯型をしたものが用いられ、散水用配管や散水口は照明とは別にレイアウトされるのが一般的であった。この場合、照明装置の空間配置の構成によっては散水用配管や散水口を自由にレイアウトすることが困難であった。   Conventionally, lighting for growing plants has been of a light bulb type or a fluorescent lamp type, and the watering pipes and watering ports are generally laid out separately from the lighting. In this case, depending on the configuration of the spatial arrangement of the lighting device, it is difficult to freely lay out the watering pipes and watering ports.

照明装置に有機EL照明を用いた場合、照明装置の厚みを薄くできるので、照明装置の配置方法に自由度が高まる。しかしながら、この場合でも、散水用配管や散水口は別途レイアウトする必要があるという問題があった。  When organic EL illumination is used for the lighting device, the thickness of the lighting device can be reduced, so that the degree of freedom in the method of arranging the lighting device is increased. However, even in this case, there is a problem that the watering pipe and the watering port need to be separately laid out.

一方、有機EL照明は、発光効率が良く、また面で発光するため、白熱灯はもちろん蛍光灯と比べても、単位面積あたりの発熱は極めて小さい。しかしながら、長時間の使用における発熱は無視できず、有機EL素子の寿命が短くなるといった問題があった。
特開2005−80608号公報
On the other hand, organic EL lighting has good luminous efficiency and emits light on its surface, so that heat generation per unit area is extremely small compared to incandescent lamps and fluorescent lamps. However, there is a problem that heat generation in long-time use cannot be ignored and the life of the organic EL element is shortened.
JP 2005-80608 A

本発明の目的は、発光素子を効率よく除熱することができ、発光素子の寿命を改善した照明装置及び照明装置の製造方法を提供することにある。   An object of the present invention is to provide a lighting device and a method for manufacturing the lighting device that can efficiently remove heat from the light emitting device and improve the lifetime of the light emitting device.

本発明の他の目的は、散水ノズル及び所定のセンサを所望の位置に配置することができ、レイアウトの自由度を高めた照明装置及び照明装置の製造方法を提供することにある。   Another object of the present invention is to provide a lighting device and a method for manufacturing the lighting device in which a watering nozzle and a predetermined sensor can be arranged at desired positions, and the degree of freedom in layout is increased.

上記目的を達成するための本発明の一態様によれば、複数の発光素子と、複数の取付孔を有しており、該取付孔に連通した流路を一方の主面に有し、他方の主面上に前記流路と少なくとも互いに対向して配置された前記発光素子を有する保持部材とを備え、隣接する前記発光素子間の領域に前記取付孔が配置されたことを特徴とする照明装置が提供される。   According to one embodiment of the present invention for achieving the above object, the light emitting device includes a plurality of light emitting elements and a plurality of mounting holes, and has a flow path communicating with the mounting holes on one main surface, And a holding member having the light emitting element arranged at least opposite to each other on the main surface, and the mounting hole is arranged in a region between the adjacent light emitting elements. An apparatus is provided.

本発明の他の態様によれば、基板上に陽極層、有機発光層及び絶縁層を形成した後、陰極層を形成する工程と、充填材を封止板に充填した後、封止板を前記基板上にシール材を介して封止する工程と、前記基板の端部をリードピンを有するクリップで挟持して有機発光素子を形成する工程と、保持部材に流路を形成する工程と、前記保持部材に取付孔及びピン挿入孔を形成する工程と、前記リードピンを前記ピン挿入孔に挿入して、前記有機発光素子を前記保持部材に取付けた後、散水ノズルを前記取付孔に取付ける工程とを有することを特徴とする照明装置の製造方法が提供される。   According to another aspect of the present invention, after forming the anode layer, the organic light emitting layer and the insulating layer on the substrate, forming the cathode layer, filling the sealing plate with the filler, Sealing the substrate via a sealing material, forming an organic light emitting element by sandwiching an end of the substrate with a clip having a lead pin, forming a channel in a holding member, A step of forming an attachment hole and a pin insertion hole in the holding member; a step of inserting the lead pin into the pin insertion hole and attaching the water emitting nozzle to the attachment hole after attaching the organic light emitting element to the holding member; The manufacturing method of the illuminating device characterized by having is provided.

本発明の照明装置及び照明装置の製造方法によれば、発光素子を効率よく除熱することができ、発光素子の寿命を改善することが可能となる。また、散水ノズル及び所定のセンサを所望の位置に配置することができ、レイアウトの自由度を高めることが可能となる。   According to the illumination device and the method for manufacturing the illumination device of the present invention, it is possible to efficiently remove heat from the light emitting element, and it is possible to improve the life of the light emitting element. Further, the watering nozzle and the predetermined sensor can be arranged at desired positions, and the degree of freedom in layout can be increased.

以下、図面を参照して本発明の実施の形態による照明装置を説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号を付している。ただし、図面は模式的なものであり、現実のものとは異なり、また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることに留意すべきである。   Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, differ from actual ones, and also include portions having different dimensional relationships and ratios between the drawings.

[第1の実施の形態]
(照明装置の構造)
本発明の第1の実施の形態に係る照明装置は、図1及び図2に示すように、複数の発光素子20と、複数の取付孔21を有しており、取付孔21に連通した流路16を一方の主面に有し、他方の主面上に流路16と少なくとも互いに対向して配置された発光素子20を有する保持部材15とを備え、隣接する発光素子20間の領域に取付孔21が配置される。なお、図1は、図2のI−I線の断面構造図を示し、図2は基板1側から見た構造図である。
[First embodiment]
(Structure of lighting device)
The lighting device according to the first embodiment of the present invention has a plurality of light emitting elements 20 and a plurality of mounting holes 21 as shown in FIGS. A path 16 is provided on one main surface, and a holding member 15 having a light emitting element 20 disposed at least opposite to the flow path 16 is provided on the other main surface, and in a region between adjacent light emitting elements 20. A mounting hole 21 is disposed. 1 is a cross-sectional structural view taken along the line II of FIG. 2, and FIG. 2 is a structural view seen from the substrate 1 side.

本実施の形態によれば、発光素子20は、一対の電極(2,4)に挟まれた有機発光層3を含む有機発光素子20であってもよい。以下において、発光素子20として有機発光素子を適用した例について説明する。   According to the present embodiment, the light emitting element 20 may be the organic light emitting element 20 including the organic light emitting layer 3 sandwiched between the pair of electrodes (2, 4). Hereinafter, an example in which an organic light emitting element is applied as the light emitting element 20 will be described.

有機発光素子20は、封止板10により陽極端子6及び陰極端子7を除いて、陰極層4側の表面が封止されている。有機発光素子20の端部において露出した陽極端子6及び陰極端子7は、クリップ(18,19)により有機発光素子20の端部と共に挟持され、クリップ(18,19)を介してリードピン(13,14)に電気的に接続することができる。   The surface of the organic light emitting element 20 on the cathode layer 4 side is sealed by the sealing plate 10 except for the anode terminal 6 and the cathode terminal 7. The anode terminal 6 and the cathode terminal 7 exposed at the end of the organic light emitting element 20 are sandwiched together with the end of the organic light emitting element 20 by the clips (18, 19), and are connected to the lead pins (13, 19) via the clips (18, 19). 14) can be electrically connected.

保持部材15は、複数の有機発光素子20を保持すると共に、散水ノズル17及び所定のセンサ28を取付けるためのものである。保持部材15は、有機発光素子20を除熱する機能も有する。このため、保持部材15は、伝熱性の高いものであるのがよく、例えば、アルミニウムや銅等の金属からなる。厚さは、例えば、約2〜20mm程度、好ましくは、約5〜15mm程度である。   The holding member 15 is for holding the plurality of organic light emitting elements 20 and attaching the watering nozzle 17 and the predetermined sensor 28. The holding member 15 also has a function of removing heat from the organic light emitting element 20. For this reason, it is good for the holding member 15 to be a thing with high heat conductivity, for example, consists of metals, such as aluminum and copper. The thickness is, for example, about 2 to 20 mm, preferably about 5 to 15 mm.

保持部材15は、ピン挿入孔(22,23)を有していてもよく、ピン挿入孔(22,23)にリードピン(13,14)を挿入することにより有機発光素子20の封止板10側表面を保持部材15の表面に接合させて有機発光素子20を保持することができる。また、保持部材15は、有機発光素子20を接着剤等を介して接合し、保持することもできる。   The holding member 15 may have a pin insertion hole (22, 23), and the lead plate (13, 14) is inserted into the pin insertion hole (22, 23) to thereby seal the sealing plate 10 of the organic light emitting element 20. The organic light emitting element 20 can be held by bonding the side surface to the surface of the holding member 15. The holding member 15 can also hold the organic light emitting element 20 by bonding it with an adhesive or the like.

図2に示すように、有機発光素子20は互いに隣接して配置されており、隣接する有機発光素子20間の領域に取付孔21が配置される。取付孔21には、散水ノズル17及び所定のセンサ28を取付ける。所定のセンサ28としては、例えば、周辺環境の温度や湿度、或いは植物の高さ等を測定するセンサを挙げることができる。また、取付孔21には、適宜、封止栓(略図示)を取付けることもできる。取付孔21は、ネジ状或いは円筒状の形状を有しており、内径は、例えば、約1〜3cm程度である。   As shown in FIG. 2, the organic light emitting elements 20 are disposed adjacent to each other, and the attachment holes 21 are disposed in a region between the adjacent organic light emitting elements 20. The watering nozzle 17 and a predetermined sensor 28 are attached to the mounting hole 21. Examples of the predetermined sensor 28 include a sensor that measures the temperature and humidity of the surrounding environment, the height of a plant, and the like. Moreover, a sealing plug (schematically illustrated) can be appropriately attached to the attachment hole 21. The mounting hole 21 has a screw shape or a cylindrical shape, and the inner diameter is, for example, about 1 to 3 cm.

保持部材15の一方の主面に配置された流路16は、散水用の水を流通させるためのものである。流路16を流れる散水用の水は除熱機能を兼ねており、有機発光素子20で発生する熱を保持部材15を介して除熱する。   The flow path 16 arranged on one main surface of the holding member 15 is for circulating water for watering. The water for water spraying flowing through the flow path 16 also has a heat removal function, and removes heat generated in the organic light emitting element 20 through the holding member 15.

流路16の形状は、特に限定されるものではないが、横断面が略矩形、略半円、或いは略楕円等の形状を有しているのがよい。また、流路16は、保持部材15の他方の主面に配置された有機発光素子20と対向するように格子状に配置するのがよい。これにより、有機発光素子20の発熱を効率よく除熱することができる。流路16は、幅が、例えば、約1〜2cm程度、深さが、保持部材15の厚さに応じて、例えば、約1〜10mm程度であるのがよい。流路16は、取付孔21と連通しており、流路16に流れる水を取付孔21に配置された散水ノズル17を介して外に散水することができる。流路16の開口部は水を封止するために樹脂や金属等からなる板で密封するのがよい。   The shape of the flow path 16 is not particularly limited, but the cross section may have a shape such as a substantially rectangular shape, a substantially semicircular shape, or a substantially oval shape. Further, the flow paths 16 are preferably arranged in a lattice shape so as to face the organic light emitting elements 20 arranged on the other main surface of the holding member 15. Thereby, the heat generated by the organic light emitting element 20 can be efficiently removed. The channel 16 may have a width of, for example, about 1 to 2 cm and a depth of, for example, about 1 to 10 mm depending on the thickness of the holding member 15. The flow path 16 communicates with the mounting hole 21, and water flowing through the flow path 16 can be sprinkled outside through the watering nozzle 17 disposed in the mounting hole 21. The opening of the channel 16 is preferably sealed with a plate made of resin, metal or the like in order to seal water.

本実施の形態によれば、図3に示すように、照明装置30は、例えば、栽培容器29で育成される植物24の上方に配置し、所定のセンサ28を用いて、有機発光素子20から光を照射すると共に、散水ノズル17から散水を行う。   According to the present embodiment, as shown in FIG. 3, the lighting device 30 is disposed, for example, above the plant 24 grown in the cultivation container 29, and the organic light emitting element 20 is used using the predetermined sensor 28. While irradiating light, watering is performed from the watering nozzle 17.

この有機発光素子20では、基板1側から光が取り出されるように構成されているので、基板1は、ガラス基板等の光を透過する透明基板が用いられる。   Since the organic light emitting element 20 is configured such that light is extracted from the substrate 1 side, the substrate 1 is a transparent substrate that transmits light such as a glass substrate.

基板1は、平面視で略矩形の形状を有しているのが好ましい。矩形の少なくとも2辺若しくは2角にそれぞれクリップ(18,19)を介してリードピン(13、14)が配置されている。   The substrate 1 preferably has a substantially rectangular shape in plan view. Lead pins (13, 14) are arranged via clips (18, 19) on at least two sides or two corners of the rectangle, respectively.

陽極層2は、基板1と同様に、光を透過可能で、厚さが、例えば、約150〜160nm程度のITO(インジウム−スズ酸化物)の透明電極からなる。   The anode layer 2 is made of a transparent electrode made of ITO (indium-tin oxide) having a thickness of about 150 to 160 nm, for example, like the substrate 1 and capable of transmitting light.

有機発光層3は、基板1側から、正孔輸送層、発光部及び電子輸送層が順次積層されている。   In the organic light emitting layer 3, a hole transport layer, a light emitting portion, and an electron transport layer are sequentially laminated from the substrate 1 side.

正孔輸送層は、陽極層2から注入された正孔を円滑に発光部に輸送するためのものであり、厚さが、例えば、約60nm程度のNPB(N,N−ジ(ナフタリル)−N,N−ジフェニル−ベンジデン)からなる。   The hole transport layer is for smoothly transporting holes injected from the anode layer 2 to the light emitting part, and has a thickness of, for example, NPB (N, N-di (naphthalyl)-) of about 60 nm. N, N-diphenyl-benzidene).

電子輸送層は、陰極層4から注入された電子を円滑に発光部に輸送するためのものであり、厚さが、例えば、約35nm程度のAlq(アルミニウムキノリノール錯体)からなる。 The electron transport layer is for smoothly transporting electrons injected from the cathode layer 4 to the light emitting portion, and is made of, for example, Alq 3 (aluminum quinolinol complex) having a thickness of about 35 nm.

発光部は、注入された正孔及び電子が再結合して発光するためのものであり、例えば発光種であるクマリン化合物(C545T)が約1%ドーピングされた厚さが、例えば、約30nm程度のAlqからなる。 The light emitting part is for recombination of injected holes and electrons to emit light, and has a thickness doped with, for example, about 1% of a coumarin compound (C 545 T) as a light emitting species, for example, about It consists of Alq 3 of about 30 nm.

なお、有機発光層3は、上記、正孔輸送層、電子輸送層以外の層、例えば、正孔注入層、電子注入層等を用いて構成しても良い。   In addition, you may comprise the organic light emitting layer 3 using layers other than the said positive hole transport layer and an electron carrying layer, for example, a positive hole injection layer, an electron injection layer, etc.

陰極層4は、厚さが、例えば、約150nm程度のアルミニウムからなる。   The cathode layer 4 is made of aluminum having a thickness of about 150 nm, for example.

絶縁層5は、酸化ケイ素や窒化ケイ素等の無機材料や、ポリイミド等の有機材料を用いることができる。   The insulating layer 5 can be made of an inorganic material such as silicon oxide or silicon nitride, or an organic material such as polyimide.

シール材(8,9)は、有機発光素子20内への水分の浸入を防ぐためのものであり、UV硬化樹脂やエポキシ系接着樹脂等の樹脂を用いる。
封止板10は、陽極層2、陰極層4、および有機発光層3を保護し、これらを封止するためのものである。封止板10の材質としては、ガラス、ステンレススチール(SUS)や銅等の金属、或いはセラミック等が挙げられる。
The sealing materials (8, 9) are for preventing moisture from entering the organic light emitting element 20, and use a resin such as a UV curable resin or an epoxy adhesive resin.
The sealing plate 10 protects the anode layer 2, the cathode layer 4, and the organic light emitting layer 3, and seals them. Examples of the material of the sealing plate 10 include glass, metals such as stainless steel (SUS) and copper, and ceramics.

充填材11は、有機発光層3で発生したジュール熱を封止板10側に伝え、放熱させるためのものである。充填材11としては、UV硬化樹脂やエポキシ系樹脂等の樹脂を用いることが好ましい。   The filler 11 is for transmitting Joule heat generated in the organic light emitting layer 3 to the sealing plate 10 side to dissipate heat. As the filler 11, it is preferable to use a resin such as a UV curable resin or an epoxy resin.

リードピン(13、14)は、基板1を保持部材15に取り付けると共に、有機発光素子20と外部電極端子(図示略)とを電気的に接続するためのものである。リードピン(13、14)は、保持部材15から絶縁するために絶縁膜(図示略)で被覆されていることが好ましい。リードピン(13、14)の材質としては、ばね性を有する金属からなるのがよい。例えば、無酸素銅、真鍮、燐青銅、銀メッキ銅等が挙げられる。   The lead pins (13, 14) are for attaching the substrate 1 to the holding member 15 and electrically connecting the organic light emitting element 20 and external electrode terminals (not shown). The lead pins (13, 14) are preferably covered with an insulating film (not shown) in order to insulate from the holding member 15. The material of the lead pins (13, 14) is preferably made of a metal having a spring property. For example, oxygen-free copper, brass, phosphor bronze, silver-plated copper and the like can be mentioned.

クリップ(18,19)は、基板1の端部を挟持すると共に、陽極端子6及び陰極端子7とリードピン(13,14)を電気的に接続するためのものである。クリップ(18,19)は、リードピン(13,14)と一体的に接合されていることが好ましい。クリップ(18,19)の材質としては、ばね性を有する金属からなるのがよく、例えば、銅、真鍮、ニッケルメッキ鋼鉄等が挙げられる。   The clips (18, 19) sandwich the end of the substrate 1 and electrically connect the anode terminal 6 and the cathode terminal 7 to the lead pins (13, 14). The clips (18, 19) are preferably joined integrally with the lead pins (13, 14). The material of the clip (18, 19) is preferably made of a metal having a spring property, and examples thereof include copper, brass, nickel-plated steel and the like.

なお、リードピン(13,14)は、ハンダを介して陽極端子6及び陰極端子7と接続することもできる。   The lead pins (13, 14) can be connected to the anode terminal 6 and the cathode terminal 7 through solder.

(動作原理)
第1の実施の形態に係る照明装置の動作原理は以下の通りである。
(Operating principle)
The operation principle of the lighting apparatus according to the first embodiment is as follows.

まず、外部電極から有機発光素子20のリードピン(13,14)及び陽極端子6並びに陰極端子7を介して、陽極層2及び陰極層4の間に一定の電圧が印加される。これにより、陽極層2から正孔輸送層を介して発光部に正孔が注入されるとともに、陰極層4から電子輸送層を介して発光部に電子が注入される。そして、発光部に注入された正孔と電子とが再結合することによって、光を発光する。発光された光は、基板1を介して外部に出射され、植物24を照射する。一方、散水用の水は、所定のタイミングで流路16に送水され、散水ノズル17より植物24に散水される。   First, a constant voltage is applied between the anode layer 2 and the cathode layer 4 from the external electrode via the lead pins (13, 14), the anode terminal 6, and the cathode terminal 7 of the organic light emitting element 20. Thereby, holes are injected from the anode layer 2 into the light emitting part through the hole transport layer, and electrons are injected from the cathode layer 4 into the light emitting part through the electron transport layer. Then, the holes and electrons injected into the light emitting portion recombine to emit light. The emitted light is emitted to the outside through the substrate 1 and irradiates the plant 24. On the other hand, water for watering is sent to the flow path 16 at a predetermined timing, and watered to the plant 24 from the watering nozzle 17.

(製造方法)
第1の実施の形態に係る照明装置の製造方法は、図4及び図5に示すように、基板1上に陽極層2、有機発光層3及び絶縁層5を形成した後、陰極層4を形成する工程と、充填材11を封止板10に充填した後、封止板10を基板1上にシール材(8,9)を介して封止する工程と、陽極端子6及び陰極端子7をリードピン(13,14)を有するクリップ(18,19)で挟持して有機発光素子20を形成する工程と、保持部材15に流路16を形成する工程と、保持部材15に取付孔21及びピン挿入孔(22,23)を形成する工程と、リードピン(13,14)をピン挿入孔(22,23)に挿入して、有機発光素子20を保持部材15に取付けた後、散水ノズル17を取付孔21に取付ける工程とを有する。
(Production method)
As shown in FIGS. 4 and 5, the manufacturing method of the lighting device according to the first embodiment forms the anode layer 2, the organic light emitting layer 3, and the insulating layer 5 on the substrate 1, and then forms the cathode layer 4. A step of forming, a step of sealing the sealing plate 10 on the substrate 1 with a sealing material (8, 9) after the filler 11 is filled in the sealing plate 10, and an anode terminal 6 and a cathode terminal 7 Are sandwiched by clips (18, 19) having lead pins (13, 14) to form the organic light emitting device 20, a step of forming the flow path 16 in the holding member 15, a mounting hole 21 in the holding member 15 and After forming the pin insertion holes (22, 23) and inserting the lead pins (13, 14) into the pin insertion holes (22, 23) and attaching the organic light emitting element 20 to the holding member 15, the watering nozzle 17 And attaching to the attachment hole 21.

以下に、製造工程を詳述する。   Below, a manufacturing process is explained in full detail.

(a)まず、図4(a)に示すように、基板1上の陽極層2をパターニング、エッチングした後、真空蒸着法等により、正孔輸送層、発光部、及び電子輸送層を順に成膜して有機発光層3を形成する。次いで、CVD(Chemical Vapor Deposition)法等により酸化ケイ素からなる絶縁層5を形成した後、陰極層4をスパッタリング等により成膜する。 (A) First, as shown in FIG. 4A, after the anode layer 2 on the substrate 1 is patterned and etched, a hole transport layer, a light-emitting portion, and an electron transport layer are sequentially formed by vacuum deposition or the like. The organic light emitting layer 3 is formed by filming. Next, after forming the insulating layer 5 made of silicon oxide by a CVD (Chemical Vapor Deposition) method or the like, the cathode layer 4 is formed by sputtering or the like.

(b)次に、図4(b)に示すように、充填材11及びシール材(8,9)を塗布した後、陽極端子6及び陰極端子7を除いて封止板10を基板1に貼り合わせて封止する。 (B) Next, as shown in FIG. 4B, after applying the filler 11 and the sealing material (8, 9), the sealing plate 10 is applied to the substrate 1 except for the anode terminal 6 and the cathode terminal 7. Adhere and seal.

(c)次に、図4(c)に示すように、基板1の端部を陽極端子6及び陰極端子7を介して、表面が樹脂(略図示)等により被覆されたリードピン(13、14)を有するクリップ(18,19)で挟みつけて固定し、有機発光素子20を作製する。 (C) Next, as shown in FIG. 4 (c), the lead pins (13, 14) whose surfaces are covered with a resin (illustrated) or the like through the anode terminal 6 and the cathode terminal 7 as shown in FIG. The organic light emitting device 20 is manufactured by sandwiching and fixing the clip with clips (18, 19).

(d)次に、図5(d)に示すように、例えば、アルミニウムからなる保持部材15の表面に、フライス加工やレーザー加工、或いはフォトリソグラフィを用いたエッチング等により、例えば、横断面が略矩形状の流路16を格子状に形成する。 (D) Next, as shown in FIG. 5D, for example, the cross section of the surface of the holding member 15 made of aluminum is substantially reduced by, for example, milling, laser processing, or etching using photolithography. The rectangular flow paths 16 are formed in a lattice shape.

(e)次に、図5(e)に示すように、保持部材15に、ドリル加工やレーザー加工等により取付孔21及びピン挿入孔(22,23)を形成する。 (E) Next, as shown in FIG. 5 (e), the attachment hole 21 and the pin insertion holes (22, 23) are formed in the holding member 15 by drilling, laser processing, or the like.

(f)最後に、図5(f)に示すように、ピン挿入孔(22,23)にリードピン(13,14)を差し込んで有機発光素子20を保持部材15に固定した後、取付孔21に散水ノズル17を嵌入し、図1に示す照明装置30が完成する。 (F) Finally, as shown in FIG. 5 (f), the lead pins (13, 14) are inserted into the pin insertion holes (22, 23) to fix the organic light emitting element 20 to the holding member 15, and then the mounting holes 21. The watering nozzle 17 is inserted into the illuminating device 30 to complete the lighting device 30 shown in FIG.

本実施の形態によれば、所定のセンサ28を用いて、有機発光素子20から光を照射すると共に、散水ノズル17から散水を行うので、光の照射及び給水を適宜制御することが可能となり、良好な植物の育成ができる。   According to the present embodiment, since the predetermined sensor 28 is used to irradiate light from the organic light emitting element 20 and to spray water from the watering nozzle 17, it becomes possible to appropriately control light irradiation and water supply. Good plant growth is possible.

また、散水用の水が流路16を流れるので、これにより保持部材15を介して有機発光素子20を効率よく除熱することができる。   In addition, since water for watering flows through the flow path 16, the organic light emitting element 20 can be efficiently removed through the holding member 15.

また、隣接する有機発光素子20間に取付孔21を配置したので、散水ノズル17及び所定のセンサ28を容易に取付けることが可能となり、製造工程を簡略化することができる。   Moreover, since the attachment hole 21 is arrange | positioned between the adjacent organic light emitting elements 20, it becomes possible to attach the watering nozzle 17 and the predetermined sensor 28 easily, and can simplify a manufacturing process.

本実施の形態に係る照明装置及び照明装置の製造方法によれば、有機発光素子20を効率よく除熱することができ、有機発光素子20の寿命を改善することが可能となる。また、散水ノズル17及び所定のセンサ28を所望の位置に配置することができ、レイアウトの自由度を高めることが可能となる。   According to the lighting device and the method for manufacturing the lighting device according to the present embodiment, it is possible to efficiently remove heat from the organic light emitting element 20 and improve the life of the organic light emitting element 20. Further, the watering nozzle 17 and the predetermined sensor 28 can be arranged at desired positions, and the degree of freedom in layout can be increased.

[第2の実施の形態]
本発明の第2の実施の形態に係る照明装置は、図6に示すように、複数の発光素子20と、複数の取付孔21を有しており、取付孔21に連通した流路16を一方の主面に有し、他方の主面上に流路16と少なくとも互いに対向して配置された発光素子20を有する保持部材15とを備え、隣接する発光素子20間の領域に取付孔21が配置される。流路26は、一方の主面上に配置された配管25内に形成されており、配管25は格子状に配置される。その他の構成は、第1の実施の形態と同様であるので説明は省略する。
[Second Embodiment]
As shown in FIG. 6, the lighting device according to the second embodiment of the present invention has a plurality of light emitting elements 20 and a plurality of mounting holes 21, and a flow path 16 communicating with the mounting holes 21. The holding member 15 having the light emitting element 20 provided on one main surface and disposed on the other main surface so as to be opposed to each other at least is provided, and a mounting hole 21 is provided in a region between the adjacent light emitting elements 20. Is placed. The flow path 26 is formed in the piping 25 arrange | positioned on one main surface, and the piping 25 is arrange | positioned at a grid | lattice form. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

配管25は、散水用の水を流通させるためのものである。配管25の形状は、特に限定されないが、横断面形状が、例えば、略円筒形、略楕円枠形、若しくは略矩形枠であるのがよく、保持部材15の他方の主面に配置された有機発光素子20と対向するように格子状に配置するのがよい。配管25の材質としては、導電性を有するものがよく、例えば、アルミニウム、銅等の金属や樹脂等を用いることができる。   The pipe 25 is for circulating water for watering. The shape of the pipe 25 is not particularly limited, but the cross-sectional shape may be, for example, a substantially cylindrical shape, a substantially elliptical frame shape, or a substantially rectangular frame, and the organic material disposed on the other main surface of the holding member 15. It is preferable that the light emitting elements 20 be arranged in a grid so as to face the light emitting elements 20. The material of the pipe 25 is preferably conductive, and for example, a metal such as aluminum or copper, a resin, or the like can be used.

配管25は、樹脂や金属等からなる固定部材27により保持部材15上に固定するのが好ましい。   The pipe 25 is preferably fixed on the holding member 15 by a fixing member 27 made of resin or metal.

本実施の形態に係る照明装置の製造方法は、配管25を形成する方法が第1の実施の形態における製造方法と異なる点であり、他は第1の実施の形態と同様であるので、重複した説明は省略する。   The manufacturing method of the lighting device according to the present embodiment is different from the manufacturing method according to the first embodiment in the method of forming the pipe 25, and the others are the same as those in the first embodiment. The description which was made is abbreviate | omitted.

本実施の形態に係る照明装置の製造方法において、横断面形状が、例えば、内径約1cm程度、厚み約0.1cm程度の略円筒形のアルミニウムからなる配管25を保持部材15の表面に格子状に形成する。次いで、配管25の側面から枝分かれした配管25を取付孔21に連通するように形成する。そして、配管25を樹脂からなる固定部材27で固定することにより、図6に示す照明装置30Aを製造することができる。   In the method for manufacturing the lighting device according to the present embodiment, a pipe 25 made of substantially cylindrical aluminum having a cross-sectional shape of, for example, an inner diameter of about 1 cm and a thickness of about 0.1 cm is formed on the surface of the holding member 15 in a lattice shape. To form. Next, the pipe 25 branched from the side surface of the pipe 25 is formed so as to communicate with the mounting hole 21. And the illumination device 30A shown in FIG. 6 can be manufactured by fixing the piping 25 with the fixing member 27 made of resin.

本実施の形態によれば、流路26の形成に配管25を用いるので、製造工程を簡略化することができる。   According to the present embodiment, since the pipe 25 is used to form the flow path 26, the manufacturing process can be simplified.

本実施の形態に係る照明装置及び照明装置の製造方法によれば、有機発光素子20を効率よく除熱することができ、有機発光素子20の寿命を改善することが可能となる。また、散水ノズル17及び所定のセンサ28を所望の位置に配置することができ、レイアウトの自由度を高めることが可能となる。   According to the lighting device and the method for manufacturing the lighting device according to the present embodiment, it is possible to efficiently remove heat from the organic light emitting element 20 and improve the life of the organic light emitting element 20. Further, the watering nozzle 17 and the predetermined sensor 28 can be arranged at desired positions, and the degree of freedom in layout can be increased.

[その他の実施の形態]
以上、上述した第1及び第2の実施の形態によって本発明を詳細に説明したが、当業者にとっては、本発明が本明細書中に説明した第1及び第2の実施の形態に限定されるものではないということは明らかである。本発明は、特許請求の範囲の記載により定まる本発明の趣旨及び範囲を逸脱することなく修正及び変更形態として実施することができる。従って、本明細書の記載は、例示説明を目的とするものであり、本発明に対して何ら制限的な意味を有するものではない。以下、上述した第1及び第2の実施の形態を一部変更した変更形態について説明する。
[Other embodiments]
The present invention has been described in detail with the first and second embodiments described above. However, for those skilled in the art, the present invention is limited to the first and second embodiments described in the present specification. Obviously it is not. The present invention can be implemented as modifications and changes without departing from the spirit and scope of the present invention defined by the description of the scope of claims. Therefore, the description of the present specification is for illustrative purposes and does not have any limiting meaning to the present invention. Hereinafter, a modified embodiment in which the first and second embodiments described above are partially modified will be described.

上述した第1の実施の形態に係る照明装置において、発光素子20として有機発光素子を用いた説明をしたが、発光ダイオード(LED:Light Emitting Diode)やレーザーダイオード(LD:Laser Diode)であってもよい。   In the illuminating device according to the first embodiment described above, an explanation has been given using an organic light emitting element as the light emitting element 20, but a light emitting diode (LED: Light Emitting Diode) or a laser diode (LD: Laser Diode) Also good.

本発明の第1の実施の形態に係る照明装置の模式的断面構造図。1 is a schematic cross-sectional structure diagram of a lighting device according to a first embodiment of the present invention. 図1の模式的底面図。FIG. 2 is a schematic bottom view of FIG. 1. 本発明の第1の実施の形態に係る照明装置の使用の一例を示す模式的側面図。The typical side view which shows an example of use of the illuminating device which concerns on the 1st Embodiment of this invention. 本発明の第1の実施の形態に係る照明装置の製造方法の説明図であって、(a)基板1上に陽極層2、有機発光層3及び絶縁層5を形成した後、陰極層4を形成する工程図、(b)充填材11を封止板10に充填した後、封止板10を基板1上にシール材(8,9)を介して封止する工程図、(c)基板1の端部をリードピン(13,14)を有するクリップ(18,19)で挟持する工程図。It is explanatory drawing of the manufacturing method of the illuminating device which concerns on the 1st Embodiment of this invention, Comprising: (a) After forming the anode layer 2, the organic light emitting layer 3, and the insulating layer 5 on the board | substrate 1, the cathode layer 4 (B) a process diagram for sealing the sealing plate 10 on the substrate 1 with a sealing material (8, 9) after filling the sealing material 10 with the filler 11; and (c). Process drawing which clamps the edge part of the board | substrate 1 with the clip (18, 19) which has a lead pin (13, 14). 本発明の第1の実施の形態に係る照明装置の製造方法の説明図であって、(d)保持部材15に流路16を形成する工程図、(e)保持部材15に取付孔21及びピン挿入孔(22,23)を形成する工程図、(f)リードピン(13,14)をピン挿入孔(22,23)に挿入して、有機発光素子20を保持部材15に取付けた後、散水ノズル17を取付孔21に取付ける工程図。It is explanatory drawing of the manufacturing method of the illuminating device concerning the 1st Embodiment of this invention, Comprising: (d) Process drawing which forms the flow path 16 in the holding member 15, (e) The attachment hole 21 and the holding member 15 and Process drawing for forming pin insertion holes (22, 23), (f) After inserting the lead pins (13, 14) into the pin insertion holes (22, 23) and attaching the organic light emitting element 20 to the holding member 15, The process figure which attaches the watering nozzle 17 to the attachment hole 21. FIG. 本発明の第2の実施の形態に係る照明装置の模式的断面構造図。The typical cross-section figure of the illuminating device which concerns on the 2nd Embodiment of this invention.

符号の説明Explanation of symbols

1・・・基板
2・・・陽極層
3・・・有機発光層
4・・・陰極層
5・・・絶縁層
6・・・陽極端子
7・・・陰極端子
8,9・・・シール材
10・・・封止板
11・・・充填材
13,14・・・リードピン
15・・・保持部材
16,26・・・流路
17・・・散水ノズル
18,19・・・クリップ
20・・・有機発光素子
21・・・取付孔
22,23・・・ピン挿入孔
24・・・植物
25・・・配管
27・・・固定部材
28・・・センサ
29・・・栽培容器
30,30A・・・照明装置
DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Anode layer 3 ... Organic light emitting layer 4 ... Cathode layer 5 ... Insulating layer 6 ... Anode terminal 7 ... Cathode terminal 8, 9 ... Sealing material DESCRIPTION OF SYMBOLS 10 ... Sealing plate 11 ... Filler 13, 14 ... Lead pin 15 ... Holding member 16, 26 ... Flow path 17 ... Watering nozzle 18, 19 ... Clip 20 ... -Organic light emitting element 21 ... Mounting holes 22, 23 ... Pin insertion hole 24 ... Plant 25 ... Pipe 27 ... Fixing member 28 ... Sensor 29 ... Cultivation container 30, 30A ..Lighting devices

Claims (6)

複数の発光素子と、
複数の取付孔を有しており、該取付孔に連通した流路を一方の主面に有し、他方の主面上に前記流路と少なくとも互いに対向して配置された前記発光素子を有する保持部材と
を備え、隣接する前記発光素子間の領域に前記取付孔が配置されたことを特徴とする照明装置。
A plurality of light emitting elements;
It has a plurality of mounting holes, has a flow channel communicating with the mounting holes on one main surface, and has the light emitting element disposed on the other main surface so as to face the flow channel at least mutually. And a holding member, wherein the mounting hole is disposed in a region between the adjacent light emitting elements.
前記発光素子は、一対の電極に挟まれた有機発光層を含む有機発光素子であることを特徴とする請求項1に記載の照明装置。   The lighting device according to claim 1, wherein the light emitting element is an organic light emitting element including an organic light emitting layer sandwiched between a pair of electrodes. 前記取付孔に配置された散水ノズル及び所定のセンサを更に備えたことを特徴とする請求項1又は2に記載の照明装置。   The lighting device according to claim 1, further comprising a watering nozzle disposed in the mounting hole and a predetermined sensor. 前記流路は、横断面が溝状の形状を有し、格子状に配置されたことを特徴とする請求項1〜3のいずれか1項に記載の照明装置。   The lighting device according to claim 1, wherein the flow path has a groove-like cross section and is arranged in a lattice shape. 前記流路は、前記一方の主面上に配置された配管内に形成されており、該配管は格子状に配置されたことを特徴とする請求項1〜3のいずれか1項に記載の照明装置。   The said flow path is formed in the piping arrange | positioned on said one main surface, This piping is arrange | positioned at the grid | lattice form, The any one of Claims 1-3 characterized by the above-mentioned. Lighting device. 基板上に陽極層、有機発光層及び絶縁層を形成した後、陰極層を形成する工程と、
充填材を封止板に充填した後、前記封止板を前記基板上にシール材を介して封止する工程と、
前記基板の端部をリードピンを有するクリップで挟持して有機発光素子を形成する工程と、
保持部材に流路を形成する工程と、
前記保持部材に取付孔及びピン挿入孔を形成する工程と、
前記リードピンを前記ピン挿入孔に挿入して、前記有機発光素子を前記保持部材に取付けた後、散水ノズルを前記取付孔に取付ける工程と
を有することを特徴とする照明装置の製造方法。
Forming a cathode layer after forming an anode layer, an organic light emitting layer and an insulating layer on a substrate;
After filling the sealing plate with the filler, sealing the sealing plate on the substrate via a sealing material;
Forming an organic light emitting device by sandwiching the end of the substrate with a clip having a lead pin;
Forming a flow path in the holding member;
Forming a mounting hole and a pin insertion hole in the holding member;
And a step of attaching a watering nozzle to the attachment hole after the lead pin is inserted into the pin insertion hole and the organic light emitting element is attached to the holding member.
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