JP2010129953A - Led lamp and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lamp having an improved structure through which heat is dissipated more easily. <P>SOLUTION: Provided is an LED lamp A1 that includes an LED41, a heat dissipation member 10 for supporting the LED 41, an insulating layer 20 layered on the heat dissipation member 10, and a metal wiring layer 31 which is layered on the surface of the insulating layer 20 and conducted with the LED41. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an LED lamp that uses a light emitting diode (hereinafter referred to as LED) as a light source and can be used as an alternative to a fluorescent lamp, and a method for manufacturing the LED lamp.

  FIG. 6 shows a cross-sectional view of an example of a conventional LED lamp in which an LED is used as a light source (see, for example, Patent Document 1). The LED lamp X shown in the figure includes a plate-shaped substrate 91, a plurality of LEDs 92 mounted on the substrate 91, a tube 93 that accommodates the substrate 91, and a terminal 94. A wiring pattern (not shown) connected to the plurality of LEDs 92 and the terminals 94 is formed on the substrate 91. This LED lamp X is configured such that a plurality of LEDs 92 can emit light by fitting a terminal 94 into an insertion port of a socket of a general fluorescent lamp lighting fixture.

  The general fluorescent lamp luminaire is a luminaire widely used mainly for indoor general illumination. For example, in Japan, a commercial 100 V power source is used, and a straight tube fluorescent lamp defined in JIS C7617 or A lighting fixture to which a ring-shaped fluorescent lamp defined in JIS C7618 is attached.

  However, in the LED lamp X, heat is generated when the plurality of LEDs 92 emit light. For this reason, the temperatures of the substrate 91 and the LED 92 are unduly increased, and the wiring pattern on the surface of the substrate 91 and the LED 92 may be damaged.

Japanese Utility Model Publication No. 06-54103

  The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide an LED lamp having a structure that facilitates heat dissipation and a method for manufacturing the LED lamp.

  The LED lamp provided by the 1st side surface of this invention is an LED lamp provided with the LED light emitting element, Comprising: The heat dissipation member for supporting the said LED light emitting element, and the insulation laminated | stacked on the surface of the said heat dissipation member And a metal wiring layer laminated on the surface of the insulating layer and electrically connected to the LED light emitting element.

  According to such a configuration, the heat generated in the LED light emitting element is transmitted to the heat radiating member through the metal wiring layer and the insulating layer, and is dissipated from the heat radiating member to the outside of the light emitting element. Therefore, since the heat generated in the LED light emitting element can be quickly dissipated, it is possible to provide an LED lamp having a structure that facilitates heat dissipation.

In a preferred embodiment of the present invention, the insulating layer is composed of SiO _2. According to such a configuration, since the insulating layer is made of SiO ₂ , it is possible to suitably insulate the metal wiring layer and the heat radiating member and to conduct heat from the metal wiring layer to the heat radiating member.

  In a preferred embodiment of the present invention, the LED light emitting device includes an LED module having the LED light emitting device, a lead on which the LED light emitting device is mounted, and a package resin covering the LED light emitting device and the lead. The back surface of is joined to the metal wiring layer. According to such a configuration, the heat generated in the LED light emitting element is transmitted to the heat radiating member through the metal wiring layer and the insulating layer via the lead, and thus heat can be suitably conducted from the LED light emitting element to the heat radiating member. .

  The LED lamp provided by the 2nd side surface of this invention is an LED lamp provided with the LED light emitting element, Comprising: The heat radiating member for supporting the said LED light emitting element, It is provided in contact with the said heat radiating member, An insulating base film layer, and a substrate having at least a metal wiring layer formed on the base film layer, wherein the LED light-emitting element is electrically connected to the metal wiring layer. .

  According to such a configuration, heat generated in the LED light emitting element is transmitted to the heat radiating member through the metal wiring layer of the substrate and the base film layer of the substrate, and is dissipated from the heat radiating member to the outside of the light emitting element. Therefore, since the heat generated in the LED light emitting element can be quickly dissipated, it is possible to provide an LED lamp having a structure that facilitates heat dissipation.

  In a preferred embodiment of the present invention, the base film layer is made of polyimide. According to such a structure, since the base film layer is comprised with the polyimide, a metal wiring layer and a heat radiating member can be insulated suitably, and heat can be suitably conducted from a metal wiring layer to a heat radiating member.

  In a preferred embodiment of the present invention, the LED light emitting device includes an LED module including the LED light emitting device, a lead for mounting the LED light emitting device on a surface thereof, and a package resin that covers the LED light emitting device and the lead. The back surface of is joined to the metal wiring layer. According to such a configuration, the heat generated in the LED light emitting element is transmitted to the heat radiating member through the metal wiring layer and the insulating layer via the lead, and thus heat can be suitably conducted from the LED light emitting element to the heat radiating member. .

  In a preferred embodiment of the present invention, the substrate is a flexible wiring substrate. According to such a configuration, since the flexible wiring board has the metal wiring layer and the insulating layer, the step of separately manufacturing the metal wiring layer and the insulating layer in the manufacturing process of the LED lamp can be omitted. It can be easily manufactured.

  The LED lamp manufacturing method provided by the third aspect of the present invention is provided with a plurality of LED light emitting elements, a heat radiating member for supporting the LED light emitting elements, and in contact with the heat radiating member. And a flexible wiring board having a metal wiring layer formed on the base film layer, the step of forming the heat dissipation member in a predetermined shape, A step of mounting a plurality of LED light emitting elements on a long base material that is the basis of the flexible wiring board, in which a metal wiring layer is formed in advance as a wiring pattern, and a base material on which the LED light emitting elements are mounted Cutting to the length of the heat radiating member, and mounting the flexible wiring board formed by cutting the heat radiating member to the heat radiating member. It is characterized in.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 and 2 are views showing an example of an LED lamp according to the first embodiment of the present invention. FIG. 1 is a perspective view of main parts of an LED lamp, and FIG. 2 is a cross-sectional view of main parts taken along line II-II in FIG. The LED lamp A1 includes a heat radiating member 10, an insulating layer 20, metal wiring layers 31, 32, an LED module 40, a cap 50, and a terminal 60. This LED lamp A1 is accommodated in a cylindrical case (not shown), and is used by being attached to a general fluorescent lamp luminaire as an alternative to a fluorescent lamp, for example.

  The heat radiating member 10 is for supporting the LED module 40 by mounting the LED module 40 and dissipating heat generated in the LED module 40. The heat radiating member 10 is made of, for example, Al, and is formed in an elongated substantially plate shape extending along a predetermined direction. The heat dissipating member 10 has a flat upper surface 11. A plurality of recesses 12 are formed on the side surface of the heat dissipation member 10. The recess 12 is formed over the entire length of the heat dissipation member 10 along the longitudinal direction of the heat dissipation member 10. The recess 12 is formed to increase the surface area of the heat dissipation member 10. The concave portion 12 can be formed by providing a convex portion on a mold used when the heat radiating member 10 is formed. The heat radiating member 10 is formed with a plurality of air holes 13 penetrating along the longitudinal direction of the substrate 10. The vent hole 13 is also formed to increase the surface area of the heat dissipation member 10.

An insulating layer 20 is laminated on the upper surface 11 of the heat radiating member 10 so as to cover the upper surface 11. The insulating layer 20 is for electrically insulating the heat radiating member 10 and the metal wiring layers 31 and 32. The insulating layer 20 is made of, for example, SiO ₂ . The thickness of the insulating layer 20 is, for example, about 100 μm. The insulating layer 20 can be formed using, for example, a CVD method or a PVD method typified by sputtering.

  A wiring pattern made of Cu, for example, is formed on the upper surface 21 of the insulating layer 20. The wiring pattern is composed of metal wiring layers 31 and 32 that are separated from each other. The metal wiring layers 31 and 32 are respectively formed by being laminated on the upper surface 21 of the insulating layer 20. The metal wiring layers 31 and 32 are obtained by forming a film made of Cu on the upper surface 21 of the insulating layer 20 and etching the film. A protective layer 33 is formed on the metal wiring layers 31 and 32 to cover them. The metal wiring layers 31 and 32 are electrically insulated from the heat dissipation member 10 by the insulating layer 20.

  The LED module 40 is supported by the heat dissipation member 10. The LED module 40 includes an LED 41, metal leads 42 and 43 that are spaced apart from each other, a wire 44, and a resin package 45. As shown in FIG. 1, a plurality of LED modules 40 are arranged so as to be aligned along the longitudinal direction of the heat dissipation member 10. Each LED module 40 is installed so that the main emission direction of the LED 41 faces the direction orthogonal to the upper surface 11 of the heat radiating member 10.

  The LED 41 has a structure in which, for example, an n-type semiconductor and a p-type semiconductor and an active layer (none of which is shown) sandwiched between them are stacked. For example, when the LED 41 is made of a GaN-based semiconductor, the LED 41 can emit blue light.

  The LED 41 includes two electrodes. These electrodes are formed on the lower surface and the upper surface of the LED 41. The LED 41 is mounted on the surface of the lead 42. The back surface of the lead 42 is bonded to the metal wiring layer 31. Thereby, the electrode on the lower surface of the LED 41 is electrically connected to the metal wiring layer 31. On the other hand, the electrode on the upper surface of the LED 41 is connected to the lead 43 via the wire 44. The lead 43 is bonded to the metal wiring layer 32. Thereby, the electrode on the upper surface of the LED 41 is electrically connected to the metal wiring layer 32.

  The resin package 45 is for protecting the LED 41 and the wire 44. The resin package 45 is formed using, for example, a silicon resin that has translucency with respect to light emitted from the LED 41. If a fluorescent material that emits yellow light when excited by blue light is mixed in the resin package 45, white light can be emitted from the LED module 40. In place of the fluorescent material that emits yellow light, fluorescent materials that emit green light and red light may be mixed.

  The cap 50 is connected to both ends of the heat dissipation member 10 in the longitudinal direction, and holds the terminal 60. The terminal 60 is electrically connected to one of the metal wiring layers 31 and 32, respectively. By fitting each terminal 60 into the socket of the phosphor lighting fixture, power can be supplied to the LED module 40 and the LED 41 can emit light.

  Next, the operation of the LED lamp A1 will be described.

  According to the first embodiment, when the LED lamp A1 is turned on, heat is generated in the LED 41. The heat generated in the LED 41 is transmitted to the metal wiring layer 31 through the lead 42. The heat transferred to the metal wiring layer 31 is transferred to the heat dissipation member 10 through the insulating layer 20. The heat dissipating member 10 has a wide contact area with the outside due to the recess 12 and the plurality of vent holes 13, so that the transmitted heat can be quickly released to the outside.

  For this reason, the LED lamp A1 has a structure that preferably transmits heat generated by the LED 41 to the heat radiating member 10 and further releases the heat transferred to the heat radiating member 10 to the outside air. Therefore, the LED lamp A1 can suppress the temperature of the LED module 40 from rising excessively, and can supply stable illumination that is unlikely to fail.

  Further, in the LED lamp A1 described above, the heat dissipation member 10 serves as a substrate for mounting the LED module 40. Therefore, it is not necessary to prepare a substrate for mounting the LED module 40 separately from the heat dissipation member 10. Therefore, it can contribute to the reduction of parts cost.

  In the LED lamp of the first embodiment, the LED 41 is configured to be electrically connected to the metal wiring layer 31 via the lead 42. Instead, as shown in FIG. Alternatively, it may be mounted on the metal wiring layer 31 and made conductive.

  Referring to FIG. 3, the LED 41 is mounted by being directly bonded to the metal wiring layer 31 without the lead 42, and the wire 44 connected to the electrode on the upper surface of the LED 41 is directly connected to the metal wiring layer 32. Wire bonded. The LED 41 and the wire 44 are covered with a potting resin 46 formed by potting a translucent resin made of, for example, epoxy.

  According to the LED lamp A <b> 2 shown in FIG. 3, the heat generated in the LED 41 is immediately transferred to the metal wiring layer 31, and the heat transferred to the metal wiring layer 31 is transferred to the heat dissipation member 10 through the insulating layer 20. Therefore, compared with the LED lamp A1 of the first embodiment in which the heat generated in the LED 41 is transmitted through the lead 42, the heat is transmitted to the heat radiating member 10 more quickly and effectively. Can be increased.

  FIG. 4 is a cross-sectional view of an essential part showing an LED lamp according to a second embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  The LED lamp A3 of the second embodiment differs from the LED lamp A1 of the first embodiment in that a flexible wiring board 70 is provided in place of the insulating layer 20 and the metal wiring layers 31 and 32. That is, in this LED lamp A3, the film-like flexible wiring board 70 is provided on the upper surface 11 of the heat dissipation member 10.

  The flexible wiring board 70 includes a base film layer 71, metal wiring layers 72 and 73 spaced apart from each other, and a cover coat layer 74, which are integrally laminated to form a film as a whole. is there. The base film layer 71 is a portion made of, for example, polyimide and functioning as an electrical insulating layer. The metal wiring layers 72 and 73 are parts made of Cu or the like and function as a wiring pattern. The cover coat layer 74 is made of an electrically insulating material, and is for protecting the metal wiring layers 72 and 73.

  The flexible wiring board 70 has a predetermined region 75 where the cover coat layer 74 does not cover the metal wiring layers 72 and 73, and the metal wiring layers 72 and 73 are exposed to the outside in this region 75. The metal wiring layers 72 and 73 exposed to the outside in this region 75 are used as external terminals, for example. In addition, the LED module 40 is mounted on the metal wiring layers 72 and 73 exposed to the outside in the region 75. That is, as shown in FIG. 4, the lead 42 of the LED module 40 is connected to the metal wiring layer 72. On the other hand, the lead 43 is connected to the metal wiring layer 73.

  According to the LED lamp A3 of the second embodiment, heat is generated in the LED 41 when the LED lamp A3 is turned on. The heat generated in the LED 41 is transmitted to the metal wiring layer 72 of the flexible wiring board 70 through the lead 42. The heat transferred to the metal wiring layer 72 is transferred to the heat dissipation member 10 through the base film layer 71. The heat radiating member 10 quickly releases the transmitted heat to the outside.

  Therefore, like the LED lamp A1 of the first embodiment, the LED lamp A3 preferably has a structure in which the heat generated by the LED 41 is preferably transmitted to the heat radiating member 10 and the heat transmitted to the heat radiating member 10 is easily released to the outside air. Thereby, there exists an effect similar to LED lamp A1 of 1st Embodiment. In the LED lamp A3 of the second embodiment, the LED 41 may be directly mounted on the metal wiring layer 72 as shown in the modification of the first embodiment.

  Next, the manufacturing method of LED lamp A3 is demonstrated with reference to FIG.

  First, the heat radiating member 10 is produced. For example, a plate-shaped or bar-shaped aluminum member is cut into a predetermined size, and the recess 12 is formed by a mold or the like. Thereby, the heat radiating member 10 having a shape as shown in FIG.

  Next, a long base material 76 that is a source of the flexible wiring board 70 is prepared. The base material 76 is in the form of a film in which a plurality of portions to be the flexible wiring board 70 are continuously connected, and is wound around, for example, a reel member 77 as shown in FIG. The base material 76 has a laminated structure composed of the base film layer 71, the metal wiring layers 72 and 73, and the cover coat layer 74 in advance, and a predetermined wiring pattern is also formed by the metal wiring layers 72 and 73. It is.

  Next, as shown in FIG. 5C, the LED module 40 is mounted on the base material 76. In this case, the LED module 40 is surface-mounted at a predetermined position of the exposed metal wiring layers 72 and 73 in a portion to be the flexible wiring board 70. In this surface mounting, a reflow process is performed. For example, after solder is printed on predetermined positions of the metal wiring layers 72 and 73 and the LED module 40 is disposed on the printed portions, the solder is melted by heating in a reflow furnace, whereby the LED module 40 is applied to the surface of the substrate 76. Implement. The base material 76 on which the LED module 40 is mounted may be wound in a reel shape.

  Next, as shown in FIG. 5D, the base material 76 is cut at the cutting position C to the length in the longitudinal direction of the heat radiating member 10. The base material 76 may be cut before the LED module 40 is mounted on the base material 76.

  Thereafter, the portion to be the flexible wiring board 70 formed by cutting is attached to the upper surface 11 of the heat radiating member 10 with an adhesive or the like, as shown in FIG. And the cap 50 with which the terminal 60 was hold | maintained at the both ends of the longitudinal direction of the thermal radiation member 10 is mounted | worn. Through these steps, the LED lamp A3 shown in FIG. 4 is manufactured.

  In the above manufacturing process, the LED module 40 can be mounted on the flexible wiring board 70 after the flexible wiring board 70 is mounted on the heat dissipation member 10. However, since the heat dissipating member 10 is made of Al and is not suitable for the reflow process heated at a high temperature, in this manufacturing method, before the flexible wiring board 70 is attached to the heat dissipating member 10 as described above. The LED module 40 is mounted on the flexible wiring board 70.

  Thus, according to the manufacturing method described above, the use of the flexible wiring board 70 facilitates the manufacture of the LED lamp. That is, in the LED lamp A1 of the first embodiment, work such as film formation and etching and work for forming the protective layer 33 have occurred to form the insulating layer 20 and the metal wiring layers 31 and 32. In LED lamp A3 of 2nd Embodiment, those operations can be omitted by using flexible wiring board 70. Therefore, the manufacturing time and manufacturing process can be shortened.

  The LED lamp according to the present invention is not limited to the embodiment described above. The specific configuration of each part of the LED lamp according to the present invention can be varied in design in various ways. For example, the shape of the heat dissipation member 10 is not limited to the shape described above. The insulating layer 20 does not need to cover the entire upper surface 11 of the heat radiating member 10 and may expose a part of the upper surface 11 of the heat radiating member 10.

It is a perspective view which shows the LED lamp concerning 1st Embodiment of this invention. It is principal part sectional drawing in alignment with the II-II line of FIG. It is principal part sectional drawing which shows the modification of the LED lamp concerning 1st Embodiment. It is principal part sectional drawing which shows the LED lamp concerning 2nd Embodiment of this invention. It is a figure for demonstrating the manufacturing method of a LED lamp. It is sectional drawing which shows an example of the conventional LED lamp.

Explanation of symbols

A1, A2, A3 LED lamp 10 Heat dissipation member 12 Recess 13 Air vent 20 Insulating layer 31, 32 Metal wiring layer 33 Protective layer 40 LED module 41 LED
42, 43 Lead 44 Wire 45 Resin package 50 Cap 60 Terminal 70 Flexible wiring board 71 Base film layer 72, 73 Metal wiring layer 74 Cover coat layer

Claims (8)

An LED lamp having an LED light emitting element,
A heat dissipating member for supporting the LED light emitting element;
An insulating layer laminated on the surface of the heat dissipation member;
A metal wiring layer laminated on the surface of the insulating layer and electrically connected to the LED light emitting element;
An LED lamp, comprising: The LED lamp according to claim 1, wherein the insulating layer is made of SiO ₂ . An LED module having the LED light emitting element, a lead for mounting the LED light emitting element on a surface thereof, and a package resin covering the LED light emitting element and the lead;
The LED lamp according to claim 1, wherein a back surface of the lead is bonded to the metal wiring layer. An LED lamp having an LED light emitting element,
A heat dissipating member for supporting the LED light emitting element;
A base film layer provided in contact with the heat dissipating member and having electrical insulation, and a substrate having at least a metal wiring layer formed on the base film layer,
The LED lamp is characterized in that the LED light emitting element is electrically connected to the metal wiring layer.   The LED lamp according to claim 4, wherein the base film layer is made of polyimide. An LED module having the LED light emitting element, a lead for mounting the LED light emitting element on a surface thereof, and a package resin covering the LED light emitting element and the lead;
The LED lamp according to claim 4 or 5, wherein a back surface of the lead is bonded to the metal wiring layer.   The LED lamp according to claim 4, wherein the substrate is a flexible wiring substrate. A plurality of LED light emitting elements, a heat radiating member for supporting the LED light emitting elements, a base film layer provided in contact with the heat radiating member and having electrical insulation, and a metal wiring formed on the base film layer A flexible wiring board having a layer, and a manufacturing method of an LED lamp comprising:
Forming the heat dissipation member in a predetermined shape;
A step of mounting a plurality of LED light emitting elements on a long base material that is the base of the flexible wiring board, in which a metal wiring layer is formed in advance as a wiring pattern;
Cutting the base material on which the LED light emitting element is mounted into the length of the heat dissipation member;
Attaching the flexible wiring board formed by cutting to the heat dissipation member;
A method for manufacturing an LED lamp, comprising:

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