JP4590939B2 - Insulating resin film for printed wiring board and method of forming insulating layer using the same - Google Patents

Description

  The present invention relates to an insulating resin film for a printed wiring board for forming an insulating layer and a method for forming an insulating layer using the same in a multilayer printed wiring board produced by alternately stacking wiring layers and insulating layers. is there.

  Conventionally, as a method for producing a multilayer printed wiring board, a prepreg sheet and a copper foil, which are semi-cured by impregnating an epoxy resin into a glass cloth base material as an insulating resin layer, are laminated and pressed on a circuit-formed inner circuit board. There is a known method for establishing interlayer conduction by holes. However, in this method, since the impregnated resin in the prepreg is reflowed by heat and cured under a constant pressure, 1.0 to 1.5 hours are required for uniform curing and molding. Thus, the manufacturing process takes a long time, and the cost is high due to the cost of the multilayer lamination press and the glass cloth prepreg. In addition, through-hole plating enters the outer layer, the conductor layer becomes thick and it becomes difficult to form a fine pattern. The thickness between circuit layers was limited by glass cloth, and it was difficult to make the entire multilayer printed wiring board extremely thin.

  In recent years, as a method for solving such a problem, a manufacturing technique of a build-up type multilayer printed wiring board in which an insulating layer and a wiring layer are alternately stacked on a wiring layer of an inner circuit board has attracted attention. Manufacture of multilayer printed wiring boards in which an insulating resin film is laminated on a circuit-formed inner layer circuit board, heat-cured, and then a wiring layer is formed by plating on the insulating layer having a rough surface on the surface with a roughening agent. A method has been proposed (see, for example, Patent Document 1 and Patent Document 2).

In a multilayer printed wiring board manufacturing method by a build-up method, an insulating resin film is usually laminated on an inner layer circuit board by a pressure vacuum laminator to form an insulating layer. Recently, a fine pattern is often formed on an insulating layer, and the surface of the insulating layer needs to be flattened. Therefore, planar pressing is performed as necessary. In such an apparatus, generally, a pressure vacuum laminator part and a flat press part are an integrated line connected by a pair of upper and lower transport films. The substrate is sandwiched between upper and lower transport films with an insulating resin film temporarily attached to the front and back by an auto-cut laminator, proceeds to a pressure vacuum laminating process and a flat pressing process, and is cooled and discharged from the apparatus.
Japanese Patent Laid-Open No. 09-296156 Japanese Patent Laid-Open No. 11-87927

  However, in the above laminating apparatus, when the pressure vacuum laminator starts evacuation, the substrate sandwiched between the upper and lower transport films is displaced from the normal position due to the effect of sudden pressure reduction, and this substrate is a flat press of the next process. Protruding out of the work may cause a decrease in substrate yield or quality. In addition, the insulating resin film is cut according to the size of the substrate to be processed in advance, and is laminated after being temporarily attached one after another, so that peeling of the support base film after lamination is not automated, and the operator has to manually handle each lot. It is common to work, and low productivity and variations in quality have been problems.

As a supplement, the support base film after lamination has strong adhesion to the insulating resin, and it is not only possible to perform stable peeling with a simple method such as passing an adhesive roll, but the auto peeler that automatically peels the film is expensive and the current situation However, a highly reliable product that can be used as a production facility is not commercially available, and there is a problem that there is no method for efficiently and stably peeling the support base film after lamination.

  The present invention was devised in view of the above problems, and in a method for laminating an insulating resin film for a printed wiring board on a printed circuit board, peeling a support base film and forming an insulating layer on the printed circuit board, To provide an insulating resin film for a printed wiring board capable of efficiently and stably peeling a support base film without introducing expensive equipment such as an auto peeler, and an insulating layer forming method using the same. With the goal.

In order to solve the above-described problems, the present invention provides a printed wiring board used in the manufacture of a printed wiring board having at least a wiring circuit board and an insulating layer on at least one surface of the wiring circuit board. Insulating resin film for a plate, an insulating resin layer is formed on one surface of the support base film, an adhesive layer is formed on the other surface, the adhesive layer corresponds to outside the region of the insulating layer, The insulating resin film for a printed wiring board is formed at an end portion in the flow direction of the support base film.
Further, in claim 2, it is used when an insulating layer is formed using a pressure vacuum laminator that performs lamination in a state where the upper and lower sides of the printed circuit board are sandwiched between transport films. Insulating resin film for printed wiring board.
According to a third aspect of the present invention, there is provided the insulating resin film for a printed wiring board according to any one of the first or second aspect, wherein the adhesive layer is formed of a hot melt adhesive.
Moreover, in Claim 4, the softening point of the said hot-melt-type adhesive agent is minus 30 degreeC or more and less than plus 30 degreeC rather than the lamination temperature at the time of laminating | stacking the said insulating resin film for printed wiring boards on a wiring circuit board. The insulating resin film for a printed wiring board according to any one of claims 1 to 3, wherein the insulating resin film is in a range.
Moreover, in Claim 5, the thickness of the said adhesive layer and the thickness of an insulating resin layer are the same, The insulating resin film for printed wiring boards as described in any one of Claim 1 thru | or 4 characterized by the above-mentioned It is what.
According to a sixth aspect of the present invention, a printed wiring board having at least a wiring circuit board and an insulating layer on at least one surface of the wiring circuit board includes at least the following steps (a) to (e): This is a method for forming an insulating layer using an insulating resin film for a printed wiring board.
(A) A step of temporarily attaching an insulating resin film for a printed wiring board, in which an insulating resin layer is formed on one surface of the support base film and an adhesive layer is formed on the other surface, to a printed circuit board.
(B) The process of sticking the film for conveyance to the contact bonding layer of the insulating resin film for printed wiring boards on a printed circuit board.
(C) A step of applying vacuum and pressure.
(D) A step of heating and pressurizing.
(E) The process of peeling an conveyance film, an adhesive layer, and a support base film, and forming an insulating layer on a printed circuit board.
Further, in claim 7, the insulating resin film for a printed wiring board has an insulating resin layer formed on one surface of a support base film, an adhesive layer formed on the other surface, and the adhesive layer The method for forming an insulating layer using an insulating resin film for a printed wiring board according to claim 6, wherein the insulating base film is formed at an end portion in the flow direction of the support base film, which corresponds to outside the region of the insulating layer. It is.

By using the insulating resin film for a printed wiring board of the present invention, an expensive facility such as an auto peeler can be used to peel off the support base film after lamination, which has not been able to be performed efficiently and stably in quality. Without introducing the above, it can be performed by an inexpensive method associated with a normal stacking operation.
In addition, since the peeled support base film is wound and collected together with the transport film,
The occupied space is small and the burden of disposal work is reduced. That is, it is excellent in productivity and economy, and the insulating layer can be stably formed with quality, yield and the like.

FIG. 1A is a schematic plan view showing an embodiment of an insulating resin film for a printed wiring board according to the present invention, and FIG. 1B shows the insulating resin film for a printed wiring board of FIG. The schematic structure sectional drawing cut | disconnected by the -A 'line | wire is shown, respectively.
The insulating resin film 10 for a printed wiring board according to the present invention has an insulating resin layer 12 formed on one surface of a support base film 11 and an adhesive layer 13 formed on the other surface. When the insulating layer is formed on the printed circuit board, the support base film 11 can be easily peeled off from the insulating resin layer 12 after the printed resin board insulating resin film is laminated on the printed circuit board.

In order to maintain appropriate adhesiveness between the support base film 11 and the transport film and the pattern shape of the adhesive layer and to achieve easy peeling from the insulating resin layer 12, the adhesive layer 13 has a softening point on the printed wiring board. The hot-melt type adhesive is used in a range of minus 30 ° C. or more and less than plus 30 ° C. than the lamination temperature (press temperature) when the insulating resin film 10 is laminated on the printed circuit board. The lamination temperature here refers to the press temperature of a vacuum pressure laminator or a flat press described later.
Further, when the insulating resin film for a printed wiring board is wound in a roll shape, the adhesive layer 13 is an end of the supporting base film 11 outside the region of the insulating resin layer 12 so that the supporting base film 11 can be easily wound without being stepped. The adhesive layer 13 and the insulating resin layer 12 do not overlap with each other so that the film thickness of the adhesive layer 13 and the insulating resin layer 12 is substantially the same.

Hereinafter, a method for forming an insulating layer on a printed circuit board using the insulating resin film for a printed wiring board of the present invention will be described.
First, the insulating resin layer 12 is formed by a method such as applying a resin solution on one surface of the support base film 11 by roll coating or attaching a resin film. Further, an adhesive layer 13 is formed in a strip shape in the flow direction of the film at the end corresponding to the outside of the region of the insulating resin layer 12 on the other surface of the support base film 11, and wound into a roll shape through a protective film, and printed The winding roll 121 (refer FIG. 2) of the insulating resin film for wiring boards is produced.
Here, as the support base film 11, resin films such as polyethylene, polyvinyl chloride, polyethylene terephthalate, and polycarbonate can be used. As the resin of the insulating resin layer 12, an epoxy resin, an acrylic resin, a polyimide resin, a polyamideimide resin, a polycyanate resin, or the like can be used.

  If the adhesive layer 13 is tacky after the adhesive layer is formed, the insulating resin film after coating cannot be wound, and even if it can be used, the adhesive adheres to the transport roller and contaminates the substrate. This is not preferable because it reduces workability and yield. Therefore, the adhesive used in the present invention is preferably a hot-melt adhesive that solidifies immediately after forming the adhesive layer and does not leave tack on the surface. Among them, those having a high melt viscosity are particularly preferable because they are excellent in adhesiveness and mechanical properties and have a small amount of seepage during the lamination process. If the softening point of the hot melt adhesive is too low, if pressure is applied during the lamination process, the adhesive spreads too far and oozes out of the substrate, causing the upper and lower transport films to adhere and hinder the transport process. It is not preferable. Moreover, when the softening point is too high, the adhesive is not sufficiently melted, and it is not preferable because sufficient adhesiveness cannot be obtained when the support base film 11 is peeled off.

The softening point of the hot-melt adhesive may be in the range of minus 30 ° C. or more and less than plus 30 ° C. than the lamination temperature (press temperature) when the insulating resin film 10 for printed wiring board is laminated on the printed circuit board. preferable.
Specific examples of commercially available products include H-629A (softening point 120 ° C.) manufactured by Toyo Petrolite Co., Ltd., Nanostack A (softening point 111 ° C.) manufactured by Sanyo Chemical Industries, Ltd., Sumitomo 3M Co., Ltd. Jetmelt EC3760 (Softening point 81 ° C.), Asahi Chemical Synthesis Co., Ltd. Asahi Melt RK960 (softening point 98 ° C.), Daicel Chemical Industries, Ltd. Liquimelt 1354 (softening point 100 ° C.), Hitachi Chemical Polymer Co., Ltd. Hibon 9881H (softening point) 85 [deg.] C.) and other hot-melt adhesives for soft packaging materials.

  A method of forming the adhesive layer 13 in a straight line is preferable when a relatively simple apparatus called a hot melt gun is used because a high-viscosity adhesive with a small amount of seepage can be used in the lamination step. Commercial products include ITW Dynatech Co., Ltd., Sanki Co., Ltd., Nordson Co., Ltd. and the like.

  The adhesive layer is preferably formed immediately after the insulating resin layer is applied and dried. After the insulating resin layer is dried, the above-mentioned hot melt gun (for example, RIBON COATING GUN: manufactured by Sanki Co., Ltd.) is applied to the uncoated areas on both sides of the insulating resin layer on the support base film opposite to the insulating resin layer. Etc.) to form the adhesive layer in a straight line. An efficient insulating resin layer can be formed by interlocking film transport with insulating resin coating. The thickness of the adhesive layer is preferably the same as that of the insulating resin layer in consideration of workability when winding up the insulating resin film and influence on the thickness of the insulating resin in the laminating process. After forming the adhesive layer, the insulating resin film for a printed wiring board is wound by laminating a protective film of PE or PP in order to protect the insulating resin layer from drying and moisture absorption. The purpose of this protective film is to protect the insulating resin layer, but it also serves to prevent adhesion between the supporting base films. Therefore, the back side of the laminate surface is pre-treated with a release resin such as silicone resin, paraffins, waxes, etc. Preferably there is.

  Next, an auto-cut laminator unit 110, a loader unit 120, a transport film unwinding unit 130, a vacuum pressure laminator unit 140, a flat press unit 150, a transport film winding unit 160, and an unloader unit 170 shown in FIG. The winding roll 111 of the insulating resin film for printed wiring boards is set in the auto cut laminator unit 110 of the laminating apparatus.

Next, the printed circuit board 20 (see FIGS. 3A and 3B) having the effective area 21 in which the wiring layer and the like are formed in advance is conveyed to the auto-cut laminator unit 110 by the roller conveyor 121.
In the auto-cut laminator unit 110, an insulating resin film winding roll 111 in which the insulating base layer 12 and the adhesive layer 13 are provided on the support base film 11 described above is loaded up and down. After being wound up, the tip of the insulating resin film 10 for printed wiring board is adsorbed by the air adsorbing roll 112.
Further, the air adsorbing roll 112 rotates and the insulating resin layer 12 of the printed wiring board insulating resin film 10 and the printed circuit board 20 come into contact with each other. At that time, the end of the insulating resin layer 12 is temporarily attached to a predetermined portion outside the effective area 21 of the printed circuit board 20 by heating and pressure bonding. Next, the roller conveyor 121 and the air suction roll 112 are interlocked to feed the printed circuit board 20, cut the printed wiring board insulating resin film 10 at a predetermined position, and the printed wiring board insulating resin cut to a predetermined size. A printed circuit board 20a to which the film 10 is temporarily attached is produced (see FIG. 4).

Next, the printed circuit board 20a on which both sides of the insulating resin film 10 for printed wiring board are temporarily attached is conveyed to the loader unit 120 by the roller conveyor 121. The printed circuit board 20 a is sent on the loader unit 120 to the transport film sending unit 130 that is linked to the roller conveyor 121. In the transport film delivery unit 130, the transport film 31 delivered from the transport film delivery roll 131 is superposed on the adhesive layer 13 of the printed circuit board 20 a by the guide roller 132 and is transported to the vacuum pressurization laminator unit 140 and the flat press unit 150. Is done.

  Next, in the vacuum pressurization laminator unit 140 and the flat press unit 150, the insulating resin layer 12 of the insulating resin film 10 for printed wiring board is applied to the wiring circuit board at a predetermined temperature (softening point of hot melt adhesive plus 30 ° C. or lower). The insulating resin layer 12 formed on both surfaces of the printed circuit board 20 is smoothed, and several tens of printed circuit boards are sent out from the flat press unit 150. Cooled by a cooling fan for 2 seconds, the insulating resin layer 12 is cured and sent to the transport film winding unit 160.

  Next, in the transport film winding unit 160, the transport film 31, the adhesive layer 13, and the support base film 11 are separated from the printed circuit board via the transport film winding guide roller 163 (see FIG. 6), and a winding roll. 161 is wound to obtain a printed circuit board 20c in which insulating layers 12a are formed on both surfaces of the printed circuit board 20 (see FIG. 7).

  Furthermore, a multilayer wiring circuit board, an interposer, and the like can be easily obtained by repeating the formation of wiring layers, vias, and the above insulating layer on the insulating layer 12a of the printed circuit board 20c by a desired number of times.

Specific examples of the present invention will be described below.
First, a commercially available insulating resin film (ABF-SH9K, resin thickness: 45 μm, winding number: 50 m) in which a semi-cured insulating resin layer and a protective film made of an epoxy resin are formed on a support base film 11 made of a PET film having a thickness of 38 μm. , Width: 480 mm, manufactured by Ajinomoto Co., Inc.), cut and remove the protective film at 4 cm from both ends of the insulating resin film, and peel and remove the insulating resin layer within 4 cm from both ends of the insulating resin film with adhesive tape And the insulating resin film in which the insulating resin layer 12 was formed in one surface of the support base film 11 was produced. Next, hot-melt adhesive (H-276H (softening point 92 ° C.) manufactured by Toyo Petrolite Co., Ltd.) and RIBON COATINGGUN (manufactured by Sanki Co., Ltd.) are applied to both ends of the other surface of the support base film 11 The adhesive layer 13 having a width of 1 cm and a thickness of 45 μm was formed by adjusting the discharge amount and the coating speed. The adhesive layer 13 was formed at a position 2 cm from both ends of the support base film 11 to produce an insulating resin film 10 for a printed wiring board.

Next, the insulating resin film 10 for a printed wiring board was wound around a plastic tube and loaded into an auto-cut laminator unit (manufactured by Somaru Corp.) 110.
Next, on both sides of a 510 × 340 mm wiring circuit board 20 produced by patterning a 0.6 mm thick glass epoxy inner circuit board (E-679F, conductor thickness 18 μm, manufactured by Hitachi Chemical Co., Ltd.) The insulating resin film for printed wiring boards cut into a size of 480 mm × 320 mm in length was temporarily attached. Temporary bonding conditions were a pressure bonding temperature of 70 ° C., a pressure bonding time of 5 seconds, and a laminating roll at room temperature with no load.

  Next, both sides are laminated simultaneously with a vacuum pressure laminator unit 130 consisting of a vacuum pressure laminator (B & T-500: manufactured by Nichigo Morton Co., Ltd.) at a temperature of 110 ° C. for 40 seconds, and then Nichigo Morton Co., Ltd. ) A flat press unit 150 made of the product was pressed at both sides simultaneously at a temperature of 90 ° C. for 60 seconds and cooled by a cooling fan for 60 seconds. In the state after lamination, the adhesive layer did not ooze out, and the insulating resin layer thickness on the pattern circuit was not affected.

  Next, in the transport film winding unit 160, the transport film 31, the adhesive layer 13, and the support base film 11 are peeled from the printed circuit board via the transport film winding guide roller 163 (see FIG. 6). It wound up on the roll 161, formed the insulating layer 12a on both surfaces of the wiring circuit board 20, and obtained the wiring circuit board 20c (refer FIG. 7).

First, a commercially available insulating resin film (ABF-SH9K, resin thickness: 45 μm, winding number: 50 m) in which a semi-cured insulating resin layer and a protective film made of an epoxy resin are formed on a support base film 11 made of a PET film having a thickness of 38 μm. , Width: 480 mm, manufactured by Ajinomoto Co., Inc.), cut and remove the protective film at 4 cm from both ends of the insulating resin film, and peel and remove the insulating resin layer within 4 cm from both ends of the insulating resin film with adhesive tape And the insulating resin film in which the insulating resin layer 12 was formed in one surface of the support base film 11 was produced.
Next, a hot melt adhesive (jet melt EC3760 (softening point 81 ° C.) manufactured by Toyo Petrolite Co., Ltd.) and RIBON COATINGGUN (manufactured by Sanki Co., Ltd.) is applied to both ends of the other surface of the support base film 11. The adhesive layer 13 having a width of 1 cm and a thickness of 45 μm was formed by adjusting the discharge amount and the coating speed. The adhesive layer 13 was formed at a position 2 cm from both ends of the support base film 11 to produce an insulating resin film 10 for a printed wiring board.

Next, the insulating resin film 10 for a printed wiring board was wound around a plastic tube and loaded into an auto-cut laminator unit (manufactured by Somaru Corp.) 110.
Next, on both sides of a 510 × 340 mm wiring circuit board 20 produced by patterning a 0.6 mm thick glass epoxy inner circuit board (E-679F, conductor thickness 18 μm, manufactured by Hitachi Chemical Co., Ltd.) The insulating resin film for printed wiring boards cut into a size of 480 mm × 320 mm in length was temporarily attached. Temporary bonding conditions were a pressure bonding temperature of 70 ° C., a pressure bonding time of 5 seconds, and a laminating roll at room temperature with no load.

  Next, both sides are laminated simultaneously with a vacuum press laminator unit 130 consisting of a vacuum press laminator (B & T-500: manufactured by Nichigo Morton Co., Ltd.) at a temperature of 100 ° C. for 40 seconds, and then Nichigo Morton Co., Ltd. ) A flat press unit 150 made of the product was pressed at both sides simultaneously at a temperature of 90 ° C. for 60 seconds and cooled by a cooling fan for 60 seconds. In the state after lamination, the adhesive layer did not ooze out, and the thickness of the insulating resin on the pattern circuit was not affected.

  Next, in the transport film winding unit 160, the transport film 31, the adhesive layer 13, and the support base film 11 are peeled from the printed circuit board via the transport film winding guide roller 163 (see FIG. 6). It wound up on the roll 161, formed the insulating layer 12a on both surfaces of the wiring circuit board 20, and obtained the wiring circuit board 20c (refer FIG. 7).

First, a commercially available insulating resin film (ABF-SH9K, resin thickness: 45 μm, number of turns: a semi-cured insulating resin layer 12 made of an epoxy resin and a protective film formed on a support base film 11 made of a PET film having a thickness of 38 μm. 50m, width: 480mm, manufactured by Ajinomoto Co., Inc.), cut and remove the protective film 4cm from both ends of the insulating resin film, and peel off the insulating resin layer within 4cm from both ends of the insulating resin film with adhesive tape The insulating resin film in which the insulating resin layer 12 was formed on one surface of the support base film 11 was removed.
Next, a hot-melt adhesive (Rikimelt 1202 (softening point 107 ° C.) manufactured by Daicel Chemical Industries, Ltd.) and RIBON COATINGGUN (manufactured by Sanki Co., Ltd.) is used at both ends of the other surface of the support base film 11. Adjust the discharge amount and application speed to 4 in 1cm width.
An adhesive layer 13 having a thickness of 5 μm was formed. The adhesive layer 13 was formed at a position 2 cm from both ends of the support base film 11 to produce an insulating resin film 10 for a printed wiring board.

Next, the insulating resin film 10 for a printed wiring board was wound around a plastic tube and loaded into an auto-cut laminator unit (manufactured by Somaru Corp.) 110.
Next, on both sides of a 510 × 340 mm wiring circuit board 20 produced by patterning a 0.6 mm thick glass epoxy inner circuit board (E-679F, conductor thickness 18 μm, manufactured by Hitachi Chemical Co., Ltd.) The insulating resin film for printed wiring boards cut into a size of 480 mm × 320 mm in length was temporarily attached. Temporary bonding conditions were a pressure bonding temperature of 70 ° C., a pressure bonding time of 5 seconds, and a laminating roll at room temperature with no load.

  Next, both sides are laminated simultaneously with a vacuum press laminator unit 130 consisting of a vacuum press laminator (B & T-500: manufactured by Nichigo Morton Co., Ltd.) at a temperature of 100 ° C. for 40 seconds, and then Nichigo Morton Co., Ltd. ) A flat press unit 150 made of the product was pressed at both sides simultaneously at a temperature of 90 ° C. for 60 seconds and cooled by a cooling fan for 60 seconds. In the state after lamination, the adhesive layer did not ooze out, and the insulating resin layer thickness on the pattern circuit was not affected.

  Next, in the transport film winding unit 160, the transport film 31, the adhesive layer 13, and the support base film 11 are peeled from the printed circuit board via the transport film winding guide roller 163 (see FIG. 6). It wound up on the roll 161, formed the insulating layer 12a on both surfaces of the wiring circuit board 20, and obtained the wiring circuit board 20c (refer FIG. 7).

This example is an example for comparison.
<Comparative Example 1>
First, a commercially available insulating resin film (ABF-SH9K, resin thickness: 45 μm, number of turns: a semi-cured insulating resin layer 12 made of an epoxy resin and a protective film formed on a support base film 11 made of a PET film having a thickness of 38 μm. 50m, width: 480mm, manufactured by Ajinomoto Co., Inc.), cut and remove the protective film 4cm from both ends of the insulating resin film, and peel off the insulating resin layer within 4cm from both ends of the insulating resin film with adhesive tape The insulating resin film in which the insulating resin layer 12 was formed on one surface of the support base film 11 was removed.
Next, a hot melt adhesive (Hybon 9851 (softening point 78 ° C.), manufactured by Hitachi Chemical Co., Ltd.) and RIBON COATINGGUN (manufactured by Sanki Co., Ltd.) is used at both ends of the other surface of the support base film 11. Then, by adjusting the discharge amount and the coating speed, an adhesive layer 13 having a width of 1 cm and a thickness of 45 μm was formed. The adhesive layer 13 was formed at a position 2 cm from both ends of the support base film 11.

Next, the insulating resin film 10 for a printed wiring board was wound around a plastic tube and loaded into an auto-cut laminator unit (manufactured by Somaru Corp.) 110.
Next, on both sides of the 510 × 340 mm wiring circuit board 20 produced by patterning a 0.6 mm thick glass epoxy inner layer circuit board (CCL-HL-832, conductor thickness 18 μm, manufactured by Mitsubishi Gas Chemical Co., Ltd.). The insulating resin film for printed wiring boards cut into a size of width 480 mm × length 320 mm was temporarily attached. Temporary bonding conditions were a pressure bonding temperature of 70 ° C., a pressure bonding time of 5 seconds, and a laminating roll at room temperature with no load.

Next, both sides are laminated simultaneously with a vacuum press laminator unit 130 consisting of a vacuum press laminator (B & T-500: manufactured by Nichigo Morton Co., Ltd.) at a temperature of 100 ° C. for 40 seconds, and then Nichigo Morton Co., Ltd. Flat press unit 150 made of)
At 90 ° C., both sides were pressed simultaneously at a temperature of 90 ° C. for 60 seconds and cooled with a cooling fan for 60 seconds. In the state after lamination, the adhesive layer oozes out so much that it oozes out on the transport film and also on the insulating resin layer on the pattern circuit, resulting in variations in the insulating resin thickness.

  Next, when the transport film 31, the adhesive layer 13, and the support base film 11 are peeled from the printed circuit board by the transport film winding unit 160, the support base film 11 has a good adhesive force with the transport film 31. Could not be peeled off.

This example is an example for comparison.
<Comparative example 2>
First, a commercially available insulating resin film (ABF-SH9K, resin thickness: 45 μm, winding number: 50 m) in which a semi-cured insulating resin layer 12 made of resin and a protective film are formed on a support base film 11 made of a PET film having a thickness of mm. , Width: 480 mm, manufactured by Ajinomoto Co., Inc.), cut and remove the protective film at 4 cm from both ends of the insulating resin film, and peel and remove the insulating resin layer within 4 cm from both ends of the insulating resin film with adhesive tape And the insulating resin film in which the insulating resin layer 12 was formed in one surface of the support base film 11 was produced.
Next, a hot melt adhesive (Asahimelt NP-320 (softening point 170 ° C.) manufactured by Asahi Kagaku Co., Ltd.) and RIBON COATINGGUN (manufactured by Sanki Co., Ltd.) are attached to both ends of the other surface of the support base film 11. The adhesive layer 13 having a width of 1 cm and a thickness of 45 μm was formed by adjusting the discharge amount and the coating speed. The adhesive layer 13 was formed at a position 2 cm from both ends of the support base film 11.

Next, the insulating resin film 10 for a printed wiring board was wound around a plastic tube and loaded into an auto-cut laminator unit (manufactured by Somaru Corp.) 110.
Next, on both sides of the 510 × 340 mm wiring circuit board 20 produced by patterning a 0.6 mm thick glass epoxy inner layer circuit board (CCL-HL-832, conductor thickness 18 μm, manufactured by Mitsubishi Gas Chemical Co., Ltd.). The insulating resin film for printed wiring boards cut into a size of width 480 mm × length 320 mm was temporarily attached. Temporary bonding conditions were a pressure bonding temperature of 70 ° C., a pressure bonding time of 5 seconds, and a laminating roll at room temperature with no load.

  Next, both sides are laminated simultaneously with a vacuum pressure laminator unit 130 consisting of a vacuum pressure laminator (B & T-500: manufactured by Nichigo Morton Co., Ltd.) at a temperature of 120 ° C. for 40 seconds, and then Nichigo Morton Co., Ltd. ) Both sides of the flat press unit 150 made of the product were simultaneously pressed at a temperature of 120 ° C. for 60 seconds and cooled by a cooling fan for 60 seconds. In the state after lamination, the adhesive layer did not ooze out, and the insulating resin layer on the pattern circuit was not affected.

  Next, when the transport film 31, the adhesive layer 13, and the support base film 11 are peeled from the printed circuit board via the transport film winding guide roller 163 in the transport film winding unit 160, the support base film 11 is transported. Adhesive strength with 31 was not sufficient and could not be peeled off satisfactorily.

This example is an example for comparison.
<Comparative Example 3>
First, a commercially available insulating resin film (ABF-SH9K, resin thickness: 45 μm, number of turns: a semi-cured insulating resin layer 12 made of an epoxy resin and a protective film formed on a support base film 11 made of a PET film having a thickness of 38 μm. 50m, width: 480mm, Ajinomoto Co., Inc.)
The protective film is cut and removed at 4 cm from both ends of the insulating resin film, and the insulating resin layer within 4 cm from the both ends of the insulating resin film is peeled and removed with an adhesive tape. An insulating resin film on which the insulating resin layer 12 was formed was produced.
Next, a hot melt adhesive (H-276H (softening point 92 ° C.) manufactured by Toyo Petrolite Co., Ltd.) and RIBON COATINGGUN (Sanki Co., Ltd.) are provided at the center and both ends of the other surface of the support base film 11. The adhesive layer 13 having a width of 1 cm and a thickness of 45 μm was formed by adjusting the discharge amount and the application speed. The adhesive layer 13 was formed at a total of three locations, 2 cm from the both ends of the support base film 11 and the center.

Next, the insulating resin film 10 for a printed wiring board was wound around a plastic tube and loaded into an auto-cut laminator unit (manufactured by Somaru Corp.) 110.
Next, on both sides of a 510 × 340 mm wiring circuit board 20 produced by patterning a 0.6 mm thick glass epoxy inner circuit board (E-679F, conductor thickness 18 μm, manufactured by Hitachi Chemical Co., Ltd.) The insulating resin film for printed wiring boards cut into a size of 480 mm × 320 mm in length was temporarily attached. Temporary bonding conditions were a pressure bonding temperature of 70 ° C., a pressure bonding time of 5 seconds, and a laminating roll at room temperature with no load.

  Next, both sides are laminated simultaneously with a vacuum press laminator unit 130 consisting of a vacuum press laminator (B & T-500: manufactured by Nichigo Morton Co., Ltd.) at a temperature of 100 ° C. for 40 seconds, and then Nichigo Morton Co., Ltd. ) A flat press unit 150 made of the product was pressed at both sides simultaneously at a temperature of 90 ° C. for 60 seconds and cooled by a cooling fan for 60 seconds. In the state after lamination, the thickness of the insulating resin at that portion was not uniform over a wide range due to the influence of the adhesive layer at the center.

  Next, when the transport film 31, the adhesive layer 13, and the support base film 11 are separated from the printed circuit board via the transport film winding guide roller 163 by the transport film winding unit 160, the support base film 11 is an insulating resin. It was peeled well from the layer 12. Moreover, the support base film 11 after peeling was wound with the transport film while being adhered to the transport film 31.

From the results of Examples 1 to 3, according to the insulating resin film for a printed wiring board of the present invention, the support base film can be efficiently peeled without impairing the quality of the substrate.
From the results of Example 4 (Comparative Example 1), when the softening point of the hot-melt adhesive forming the adhesive layer is 30 ° C. or more lower than the lamination temperature, the bleeding of the adhesive spreads to the region of the insulating resin layer. It was confirmed that the thickness of the insulating layer on the circuit board was affected.
On the other hand, from the result of Example 5 (Comparative Example 2), when the softening point of the hot-melt adhesive forming the adhesive layer is higher by 30 ° C. or more than the lamination temperature, the adhesive is not sufficiently melted to the transport film. It was confirmed that adhesive strength could not be obtained and peeling of the support base film became unstable.
Furthermore, from the results of Example 6 (Comparative Example 3), it was confirmed that when the adhesive layer was formed in the region of the insulating resin layer, the insulating layer thickness on the printed circuit board became non-uniform over a wide range.

(A) is a schematic plan view which shows one Example of the insulating resin film for printed wiring boards of this invention. (B) is a schematic cross-sectional view taken along the line A-A ′ of the schematic plan view of (a). It is a perspective view which shows one Example of the winding film which wound up the insulating resin film for printed wiring boards of this invention. (A) is a schematic plan view which shows an example of a printed circuit board. (B) is a schematic cross-sectional view of the schematic plan view of a) taken along line B-B ′. FIG. 2 is a schematic cross-sectional view showing an example of a printed circuit board 20a in which the printed circuit board insulating resin films of the present invention are laminated on both surfaces of the printed circuit board 20; It is a schematic structure sectional view showing wiring circuit board 20b which laminated a conveyance film on wiring circuit board 20a. It is explanatory drawing which shows the state which has peeled the conveyance film, the contact bonding layer, and the support base film from the printed circuit board 20b. 3 is a schematic cross-sectional view showing an example of a printed circuit board 20c in which an insulating layer 12a is formed on the printed circuit board 20. FIG. It is a schematic block diagram which shows an example of the lamination apparatus used for laminating | stacking the insulating resin film for printed wiring boards of this invention on a wiring circuit board, and forming an insulating layer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Insulating resin film 11 for printed wiring boards ... Support base film 12 ... Insulating resin layer 12a ... Insulating layer 13 ... Adhesive layer 20 ... Wiring circuit board 20a ... Insulating resin film temporary attachment for printed wiring boards Subsequent printed circuit board 20b ... printed circuit board 20c after carrying film lamination ... printed circuit board 21 after insulating layer formation ... effective area 31 ... carried film 110 ... auto-cut laminator unit 111 ... printed wiring board Insulating resin film take-up roll 112 …… Air adsorption roll 113 …… Protective film take-up roll 120 …… Loader unit 130 …… Convey film feed unit 131 …… Convey film feed roll 132 …… Guide roll 140 …… Vacuum Pressurized laminator units 141, 151... Press lower plate 142, 52 ... Press upper plate 150 ... Flat press unit 160 ... Conveyance film winding unit 161 ... Conveying film winding roll 162 ... Nip roll 163 ... Conveying film winding guide roller 170 ... Unloader unit 171 ... belt conveyor

Claims (7)

At least with a printed circuit board,
An insulating resin film for a printed wiring board used for manufacturing a printed wiring board having an insulating layer on at least one surface of the printed circuit board,
An insulating resin layer is formed on one surface of the support base film, and an adhesive layer is formed on the other surface, and the adhesive layer corresponds to the outside of the region of the insulating layer, and the end in the flow direction of the support base film An insulating resin film for a printed wiring board, wherein the insulating resin film is formed on a portion.   2. The insulating resin film for a printed wiring board according to claim 1, wherein the insulating resin film is used for forming an insulating layer using a pressure vacuum laminator that performs lamination in a state where the upper and lower sides of the printed circuit board are sandwiched between transport films. .   The insulating resin film for printed wiring boards according to claim 1, wherein the adhesive layer is formed of a hot-melt adhesive. The softening point of the hot melt adhesive is in the range of minus 30 ° C. or more and less than plus 30 ° C. than the lamination temperature when the insulating resin film for printed wiring board is laminated on the printed circuit board. The insulating resin film for printed wiring boards according to any one of claims 1 to 3.   The insulating resin film for a printed wiring board according to any one of claims 1 to 4, wherein the adhesive layer has the same thickness as the insulating resin layer. At least with a printed circuit board,
In a printed wiring board having an insulating layer on at least one surface of the printed circuit board, an insulating resin film for a printed wiring board comprising at least the following steps (a) to (e) is used: A method for forming an insulating layer.
(A) A step of temporarily attaching an insulating resin film for a printed wiring board, in which an insulating resin layer is formed on one surface of the support base film and an adhesive layer is formed on the other surface, to a printed circuit board.
(B) The process of sticking the film for conveyance to the contact bonding layer of the insulating resin film for printed wiring boards on a printed circuit board.
(C) A step of applying vacuum and pressure.
(D) A step of heating and pressurizing.
(E) The process of peeling an conveyance film, an adhesive layer, and a support base film, and forming an insulating layer on a printed circuit board.   The insulating resin film for a printed wiring board has an insulating resin layer formed on one surface of a support base film and an adhesive layer formed on the other surface, and the adhesive layer corresponds to outside the region of the insulating layer. The method for forming an insulating layer using an insulating resin film for a printed wiring board according to claim 6, wherein the insulating base film is formed at an end in the flow direction of the support base film.

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