JP7203136B2 - vacuum lamination method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum lamination method for conveying a laminate molded article into a chamber of a vacuum lamination apparatus using a carrier film for lamination molding.

In the case of a vacuum lamination system that uses a transport film to transport a laminate molded product into a chamber of a vacuum lamination device for lamination molding, the position of the laminate molded product on the transport film may shift when the inside of the chamber is vacuum-sucked. There is When the above positional deviation occurs, the laminate formed by pressure molding often becomes defective. Patent Documents 1 and 2 are known to address the above problem.

Patent Literature 1 describes that a protrusion is formed on the transport film or the upper and lower transport films are temporarily affixed to form a movement preventing portion to prevent the laminate from being dislocated. Further, Patent Document 2 describes that the end portions of a pair of transport films are temporarily adhered by a crimping mechanism to prevent the laminated molded product from being dislocated.

Japanese Unexamined Patent Application Publication No. 2020-29002 Japanese Patent Application Laid-Open No. 2020-44703

However, as in Patent Documents 1 and 2, when forming a movement preventing portion on the transport film around the portion where the laminate is placed or when temporarily bonding the upper and lower transport films, the following problems arise. rice field. That is, in the case where the movement preventing portion or the like is formed at a sufficient distance from the outer periphery of the laminated molded product, the position of the laminated molded product may be displaced inside the movement preventing portion or the like. Further, in the case of forming the movement-preventing part, etc., at the last minute portion near the outer periphery of the laminated molding, the precision of the device for forming the movement-preventing part, etc. is required. Alternatively, when the laminated molded product is placed on the carrier film provided with the movement blocking portion, the laminated molded product may be placed overlapping the movement blocking portion. In addition, when the laminate molded product to be laminated and molded by the vacuum lamination device is changed to a laminate molded product of a different size, it is necessary to adjust or change the device for forming the movement preventing portion. And change was not an easy task.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a vacuum lamination system or a vacuum lamination method that can relatively easily prevent displacement of a laminate molded product with respect to a conveying film. Other problems and novel features will become apparent from the description of the specification and the accompanying drawings.

A vacuum lamination system according to one embodiment is a vacuum lamination system in which a laminate molded product is transported into a chamber of a vacuum lamination apparatus using a transport film for lamination molding, in which an adhesive material adheres to a portion in contact with the laminate molded product. It is characterized in that the laminate molded product is conveyed using the conveying film that has been formed.

The vacuum lamination system of the present invention is a vacuum lamination system in which a laminate molded product is transported into a chamber of a vacuum lamination apparatus using a transport film for lamination molding. Since the laminate is transported using the film, it is possible to relatively easily prevent the laminate from being displaced with respect to the transport film.

It is a schematic explanatory drawing of the vacuum lamination system of this embodiment. It is a figure which shows the example of the carrier film used for the vacuum lamination system of this embodiment. 3A and 3B are cross-sectional views showing AA cross section and BB cross section of FIG. 2; It is a schematic explanatory drawing of the vacuum lamination system of 2nd Embodiment.

A vacuum lamination system 11 of this embodiment will be described with reference to FIG. The vacuum lamination system 11 of the present embodiment uses the transport films F1 and F2 to transport the laminated material and the laminated material constituting the laminated molded product M to the molding position in the chamber C of the vacuum lamination device 12, and the vacuum lamination device Laminate molding is performed at 12 molding positions. The vacuum lamination apparatus 12 is formed with a chamber C capable of vacuum suction when the upper plate 13 and the lower plate 14 are closed, and an elastic membrane 15 (made of silicone rubber or the like) provided on at least one of the plates 13 and 14. A diaphragm made of heat-resistant rubber) is bulged toward the other discs 14 and 13 in the chamber C, and the laminate M is pressurized and laminate-molded.
<Structure of vacuum lamination device of vacuum lamination molding system>

More specifically, in the vacuum lamination apparatus 12 , the lower board 14 faces the upper board 13 . The lower board 14 can be moved toward and away from the upper board 13 by a lifting device (not shown). When the lower platen 14 rises with respect to the upper platen 13 and the space between the upper platen 13 and the lower platen 14 is closed, a chamber C having a predetermined volume that can be vacuumed by the vacuum pump 16 is formed between them. It has become so. A heatable hot plate 17 is attached to the center of the lower surface of the upper board 13 . An elastic film 26 made of heat-resistant rubber such as a silicone rubber film is attached to the entire lower surface of the hot plate 17 of the upper platen 13 . A side wall portion 25 is provided in a portion around the lower surface of the upper board 13 so as to face the side wall portion 19 on the side of the lower board 14 .

On the other hand, a hot plate 18 that can be heated is also attached to the center of the upper surface of the lower plate 14 . A frame-shaped side wall portion 19 is attached to the peripheral portion of the upper surface of the lower plate 14 . An elastic film body 15 (diaphragm) is attached so as to cover the upper surface of the hot plate 18 while being sandwiched between the lower surface of the side wall portion 19 and the lower plate 14 . The central molding position of the chamber C can be pressurized with uniform pressure by the elastic membrane 15, but the ends of the chamber C may not be pressurized with uniform pressure. An O-ring 45 is attached to the upper surface of the side wall portion 19 (the surface facing the upper plate 13) so as to surround the chamber C. As shown in FIG. In the portion between one side portion of the side wall portion 25 of the upper platen 13 (the right side in FIG. 1 on the pre-process side) and one side portion of the side wall portion 19 of the lower platen 14, the laminated molded product M is conveyed films F1 and F2. It serves as a carry-in port 27 for carrying in together. The portion between the other side of the side wall portion 25 of the upper platen 13 and the other side portion of the side wall portion 19 of the lower platen 14 (on the side of the post-process and on the left side in FIG. 1) is a laminated product that has undergone pressure molding. M is an outlet 28 through which the conveying films F1 and F2 are discharged.

A pipe line 20 is connected to the hot plate 18 below the elastic membrane 15 or its surroundings, etc. The pipe line 20 is connected to a compressor 22 for pressurization via an opening/closing valve 21 . A pipe line 23 branched from a portion between the opening/closing valve of the pipe line 20 and the compressor 22 is connected to the vacuum pump 16 via the opening/closing valve 24 . Therefore, the lower portion of the elastic membrane 15 can be switched and connected to both the vacuum pump 16 for decompression and the compressor 22 for pressurization by controlling the opening/closing valves 21 and 24 . When the pipe line on the back side of the elastic membrane 15 is connected to the vacuum pump 16, the elastic membrane 15 is in close contact with the hot plate 18, and when it is connected to the compressor 22, the elastic membrane 15 is in the chamber C. It is designed to bulge out inside. The elastic film body 15 and the compressor 22 constitute the pressure means of the vacuum lamination device 12 .

A pipe line 29 connected to the vacuum pump 16 is introduced into the chamber C formed between the upper board 13 and the lower board 14 via an open/close valve 30 provided at the tip of the branched pipe line 23. It is connected. More specifically, the pipe 29 is connected to the pipe 31 connected to the upper plate 13, and the atmosphere in the chamber C is sucked substantially uniformly from the suction port 46 between the entire circumference of the hot plate 17 and the side wall portion 25. is possible.

Note that the vacuum lamination device 12 is not limited to the above as long as the lamination molding M can be pressure-molded at the molding position in the chamber C capable of vacuum suction. As an example, the molding may be laminate-molded in a chamber of a vacuum lamination apparatus by pressurizing means using a combination of an elastic plate other than a diaphragm and a pressurizing cylinder. Alternatively, the laminate molding M may be laminate-molded via the transport films F1 and F2 by pressurizing means that pressurizes only by air pressure (including a relative pressure difference).
<Conveying Mechanism for Laminate Molding in Vacuum Laminate Molding System>

Next, the conveying mechanism 32 for the upper and lower conveying films F1 and F2 of the vacuum lamination system 11 and the laminated molded article M will be described. The conveying mechanism 32 of the vacuum lamination system 11 is provided below one side of the vacuum lamination apparatus 12 (pre-process side and right side in FIG. An unwinding roll 33 for the transport film F1 is provided. The unwinding roll 33 is driven and controlled by a servomotor (not shown). The conveying film F<b>1 set on the unwinding roll 33 and unwound from the unwinding roll 33 is changed in the horizontal direction by the rotatable driven roll 34 . A take-up roll 35 for the lower transport film F1 is provided below the other side of the vacuum lamination device 12 . The take-up roll 35 is driven and controlled by a servomotor (not shown). The direction of the lower transport film F1 coming out of the outlet 28 of the vacuum lamination device 12 is changed by the rotatable driven roll 36, and the film is taken up by the lower take-up roll 35. As shown in FIG.

A rotatable peeling follower roll 37 is provided between the unwinding roll 33 and the follower roll 34, and only the peeling film F1c of the conveying film F1 is peeled by the peeling follower roll 37. Then, the release film F1c is wound up by the take-up roll 38 for the release film F1c. In this embodiment, the winding roll 38 is in contact with the unwinding roll 33 due to its own weight, and is rotated in a driven state as the unwinding roll 33 rotates. The take-up roll 38 may be rotated by a motor.

A supply stage S1 for the laminated molding M is provided at a portion where the lower transport film F1 is fed in the horizontal direction. In this embodiment, on the supply stage S1, the laminate molded product M is placed on the lower transport film F1 by the carry-in device 39 having a holder such as a suction tool. At this time, the laminated molded product M may be a product in which a substrate, a semiconductor, or the like to be molded and a film as a laminated material are set from the beginning, or may be laminated on the supply stage S1.

On one side of the vacuum lamination device 12 and above a portion between the vacuum lamination device 12 and the supply stage S1, a feed roll 40 for the upper transport film F2 is provided. The unwinding roll 40 is also driven and controlled by a servomotor (not shown). The upper conveying film F1 set on the unwinding roll 40 and unwound from the unwinding roll 40 is overlapped with the lower conveying film F1 by the rotatable driven roll 41, and the transport direction is changed in the horizontal direction. . The upper and lower conveying films F1 and F2 are fed into the chamber C from the carry-in port 27 of the vacuum lamination apparatus 12 with the laminate M sandwiched therebetween.

A take-up roll 42 for the upper transport film F2 is provided above the other side of the vacuum lamination device 12 . The take-up roll 42 is driven and controlled by a servomotor (not shown). Then, the upper transport film F2 coming out of the outlet 28 of the vacuum lamination device 12 is separated from the lower transport film F1 by the rotatable driven roll 43 and transported upward by the upper take-up roll. 42 is wound up. In the present invention, the upper transport film F2 is not essential, and the purpose of preventing adhesion of the molten resin to the vacuum lamination device 12 is to cover the laminated molded product M with a cover film having a larger area than the laminated molded product M. can be achieved.

After passing through the inlet 27, the chamber C, and the outlet 28 of the vacuum lamination device 12, the upper transport film F2 is removed and the lower transport film F1 is transported horizontally. A take-out stage S2 is provided for taking out the molded laminated product M to the outside. A carry-out device 44 having a suction tool is provided above the take-out stage S2, and the laminate M is taken out for the subsequent process. The lower transport film F1 is then changed in direction by the driven roll 36 and wound up on the take-up roll 35 as described above.

The unwinding rolls 33, 40 and the winding rolls 35, 42 of the transport mechanism 32 are not limited to those driven by servo motors, and may be driven by other electric motors. Alternatively, a servomotor may be used only for driving the winding rolls 35 and 42, and a torque motor or the like may be used for the unwinding rolls 33 and 40 for applying tension in the opposite direction. Further, part of the transport mechanism 32 is a film transport device that grips the sides of the transport films F1 and F2 and moves them from right to left in FIG. Alternatively, the take-up rolls 35 and 42 may not use servomotors. Further, one or two flattening press apparatuses for the purpose of further flattening the surface of the laminate M may be installed in the post-process of the vacuum lamination apparatus 12 .
<Conveyor film used in vacuum lamination molding system>

The carrier film F1 used in the vacuum lamination system and the vacuum lamination method of the present embodiment is also called a carrier film, and has an adhesive material attached to the part that contacts the laminate M. Specifically, the transport film F1 includes a core material film F1a made of a thermoplastic resin such as polyethylene terephthalate or polyethylene. The core material film F1a is also called a base film, and is preferably made of a thermoplastic resin as described above from the viewpoint of cost. The core material film F1a is not limited to a single layer, and may be provided with other resin layers such as a fluorine resin coating layer. The thickness of the core film F1a is not limited to this, but is preferably 0.05 mm to 0.30 mm as an example.

An adhesive material F1b containing silicone as a main component is adhered in layers to one surface of the core material film F1a of the transport film F1. Here, the "adhesive material containing silicone as a main component" is a material obtained by adding various additives to silicone rubber and silicone resin. In the following specification, "adhesive material containing silicone as a main component" is referred to as silicone-based adhesive material F1b. The silicone-based adhesive material F1b is also generally called a silicone adhesive. The compounding ratio of the silicone rubber in the silicone-based pressure-sensitive adhesive material F1b is, but not limited to, 30 to 80% by weight as an example. The adhesive material that can be used in the present invention may be a urethane-based adhesive material other than silicone rubber, an acrylic adhesive material, or a fluorine-based adhesive material, or a combination thereof. The thickness of the layered adhesive material F1b is not limited to this, but is preferably 0.005 mm to 0.080 mm, more preferably 0.018 mm to 0.050 mm. The adhesive strength of the silicone-based adhesive material F1b of the present embodiment is determined by adjusting the crosslinking method of the silicone rubber and the mixing ratio of the silicone rubber and the silicone resin. More specifically, although not limited to this, as an example, the adhesive strength to the glass smooth surface is 0.1 gf 25 mm to 10.0 gf 25 mm, further 0.5 gf 25 mm to 5.0 gf 25 mm. is even more preferred.

Further, one surface of the layer of the silicone-based adhesive material F1b (the surface opposite to the surface to which the silicone-based adhesive material F1b and the core film F1a are attached) is made of a thermoplastic resin such as polyethylene terephthalate or polyethylene. A release film is placed. Although the release film is not essential in the present invention, when unwinding from the state of the film roll F1d,
It has a function of promoting the unseparation of the layer of the adhesive material F1b from the core film F1a and the two being unwound satisfactorily as an integrated laminated film. As described above, the transport film F1 is formed by laminating the core film F1a, the silicone-based adhesive material F1b attached to the core film F1a, and the release film F1c. is set on the unwinding roll 33 of the conveying mechanism 32 in the state of the film roll F1d wound with .
<Form of Adhesive Material for Transfer Film>

As shown in FIGS. 2(a) and 3(a), the transport film F1 of the present embodiment has a silicone-based adhesive material F1b adhered to the entire surface of the core film F1a in a substantially uniform layer. has a smooth surface. However, as shown in FIG. 2(b), the silicone-based adhesive material F1b may be adhered to the entire surface in a layered manner, and projections of the silicone-based adhesive material F1b may be formed in a grid pattern on the layered portion. . Further, as shown in FIG. 2(c), the silicone-based adhesive material F1b is attached to the entire surface, and a large number of projections of the silicone-based adhesive material F1b such as circular and polygonal are formed to provide an embossed surface. Anything is fine. Further, as shown in FIG. 2(d), the silicone-based adhesive material F1b is not adhered to the portion where the laminated molded product M on both sides is not placed or contacted, and the laminated molded product M on the central side is placed. A layered or embossed silicone-based adhesive material F1b having a smooth surface may be adhered only to the portion to be contacted. The surface roughness of the silicone-based adhesive material F1b is appropriately adjusted. FIG. 3(a) shows the AA cross section of FIG. 2(a), and the rear surface M1 of the placed laminated molded product M such as a semiconductor wafer and the surface of the silicone-based adhesive material F1b are substantially in contact with each other. It has become.

In addition, as shown in FIGS. 2(e), (f), (g), (h), and FIG. 3(e), the transport film F1 includes a core film f1a with a silicone-based adhesive material applied to a portion of its surface. F1b may be attached. FIG. 2(e) shows linear projections of the silicone-based adhesive material F1b. The direction in which the ridges of the silicone-based adhesive material F1b are formed may be the same as or in the opposite direction to the transport direction of the transport film F1. In FIG. 2(f), protrusions of the silicone-based adhesive material F1b are formed in a grid pattern on the core film F1a. Further, in FIG. 2(g), the core film F1a is provided with an embossed surface in which a large number of protrusions of the silicone-based adhesive material F1b having circular or polygonal shapes are formed. FIG. 2(h) shows a core material film F1a on which a silicone-based adhesive material F1b is randomly adhered. Also in each of the above examples, the surface roughness of the silicone adhesive material F1b is appropriately adjusted. In these FIGS. 2(e), (f), (g), and (h), a part of the core material film F1a such as polyethylene terephthalate is exposed on the surface. Therefore, the transport film F1 of FIGS. 2(e), (f), (g), and (h) may be able to reduce the usage amount of the silicone adhesive material F1b. FIG. 3(e) shows the BB cross section of FIG. 2(e), and the rear surface M1 of the stacked molded product M such as a semiconductor wafer is a protruding portion of the silicone-based adhesive material F1b. A gap D is formed between the back surface M1 and the surface of the core material film F1a other than the supported portion.

2(b) and 2(c), the laminated molded article M is laminate-molded in the vacuum lamination apparatus 12 when the gap D is formed between the back surface M1 of the laminated molded article M and the surface of the core film F1a. In many cases, the release between the carrier film F1 and the laminate M is improved when the laminate is taken out. However, depending on the material of the laminate M and the hardness of the adhesive material, when the gap D is large, only the protruding portions of the silicone-based adhesive material F1b are strongly pressed during lamination molding, resulting in uneven pressure. In some cases, the optimal carrier film F1 is selected according to the laminate M. In addition, the adhesive strength of the silicone-based adhesive material F1b itself, the relationship between surface roughness and releasability is similarly selected.

The transport film F1 to which the adhesive material (silicone-based adhesive material F1b) containing the silicone rubber of the present invention as a main component is adhered is more expensive than a transport film made of only polyethylene terephthalate, which is generally distributed. Therefore, in the present invention, it is used only for the lower transport film F1 on which the laminate M is placed. As the upper transport film F2, a transport film F2 made only of general polyethylene terephthalate is used. The weight of the laminate M is exerted on the lower transport film F1, and the coefficient of friction between the upper surface of the transport film F1 and the lower rear surface M1 of the laminate M has the greatest influence on the displacement of the laminate M. is large.

However, depending on the type of laminate M, a transport film having a silicone adhesive material F1b adhered to the upper and lower transport films F1 and F2 may be used. In the case of using the transport film to which the silicone-based adhesive material F1b is attached as the upper transport film F2, the silicone-based adhesive material F1b is attached to the lower surface of the core film during horizontal transport, and the silicone-based adhesive material It is used in a state where the F1b and the laminate M are in contact with each other. Alternatively, depending on the laminate M, a transport film having the silicone-based adhesive material F1b attached only to the upper transport film F2 may be used. Used for at least one of the transport films F1 and F2.
<Vacuum Lamination Method for Vacuum Lamination Molding System>

Next, the vacuum lamination method of the vacuum lamination system 11 of this embodiment will be described with reference to FIG. The transport film F1 to which the silicone-based adhesive material F1b is attached before starting lamination molding is set on the unwinding roll 33 of the transport mechanism 32, and the film roll F1d is unwound from the unwinding roll 33 and sent to the vacuum lamination device. 12 and set to be taken up on a take-up roll 35 . Only the release film F1c of the conveying film F1 unwound from the unwinding roll 33 is separated from the layers of the core material film F1a and the silicone-based adhesive material F1b at the portion of the follower roll 37 for release, and folded back to form a release film. It is set to be taken up by the take-up roll 38 . The upper transport film F2 is also set so that the film roll F2a is set on the unwinding roll 40, unwound from the unwinding roll 40, passes through the vacuum lamination device 12, and is wound on the winding roll .

The remaining transport film F1 from which the peeling film F1c has been peeled off is folded back at the portion of the driven roll 34 and moved to the mounting stage S1 in a state in which the layer of the silicone-based adhesive material F1b is laminated on the core film F1a. be done. On the mounting stage S1, the loading device 39 is used to mount the laminate M on the layer of the silicone-based adhesive material F1b. Although the laminate molded article M to be laminate-molded in the present embodiment is not particularly limited, it is intended for an article that is likely to cause misalignment during transportation or vacuum suction in the chamber C of the vacuum lamination device 12 . Therefore, the object is a laminate molded product having a light weight or a smooth back surface with a small coefficient of friction. In particular, in the case of wafers, wafers with an average roughness Ra of 0.2 μm or less on the back surface are easy to slip, so they are targeted. In addition, the number of laminated moldings to be laminated and molded at one time is not limited. is formed little by little, it is effective to use the transport film F1 of the present invention because the adjustment is difficult when using the apparatus as described in Patent Document 1 or Patent Document 2 above.

When the previous lamination molding is completed in the vacuum lamination device 12, the lower platen 14 is lowered and the chamber C is opened. Next, the servo motor (not shown) of the take-up roll 35 for the transport film F1 on the lower side of the transport mechanism 32 is driven, and the lower transport film F1 is let out from the film roll F1d, and the other side (the post-process side in FIG. 1) is driven. left side in the case). Accordingly, the laminate M placed on the supply stage S1 is transported into the chamber C of the vacuum lamination device 12 together with the transport film F1 on the lower side. At this time, the upper conveying film F2 is also unwound from the film roll F2a by driving the servomotor of the take-up roll 42 and is pulled and moved toward the other side. Then, from the portion of the driven roll 41, the upper conveying film F2 is superimposed on the laminate M on the lower conveying film F1, and the upper and lower conveying films F1 and F2 are transported at the same speed at the inlet of the vacuum lamination device 12. 27 together with the laminate M. At this time, the unwinding roll 33 for the lower transporting film F1 and the unwinding roll 40 for the upper transporting film F2 apply torque in the direction of winding the transporting films F1 and F2 onto the film rolls F1d and F2a by means of servo motors. It is desirable to keep the upper and lower transport films F1 and F2 under tension.

When the upper and lower transport films F1 and F2 are moved by one pitch and the laminate M is transported to the molding position in the chamber C of the vacuum lamination device 12, transport by the upper and lower transport films F1 and F2 is stopped. At this time, even if an inertial force in the forward direction acts on the laminate M due to the shock caused by the stop of the lower transport film F1, the portion of the upper surface of the transport film F1 that is in contact with the laminate M is not affected. At least a part thereof is made of the silicone-based adhesive material F1b, and has an adhesive effect on the rear surface M1 of the laminated molded product M, so that the laminated molded product M is prevented from being dislocated.

When the laminated molding M is set at the molding position, the lower platen 14 is lifted by the operation of a lifting device (not shown) to form a chamber C between the lower platen 14 and the upper platen 13 . Then, the open/close valves 24 and 30 are controlled, and the air in the chamber C is sucked by the vacuum pump 16 and decompressed (evacuated) to a predetermined pressure. At this time, in the case of the conventional transport film made of only polyethylene terephthalate, the air current generated in the chamber C and the accompanying vibration of the transport films F1 and F2 cause the laminate M to move from the initial molding position to another position. In some cases, a “positional deviation” in which the image moves without being moved occurs. However, in the present invention, at least part of the portion of the upper surface of the lower transport film F1 that is in contact with the laminate M is made of the silicone-based adhesive material F1b. Even if vibration occurs, the displacement is prevented. Similarly, the positional displacement of the laminate M due to swelling of the elastic film body 15 during pressurization is also prevented.

In the vacuum lamination device 12, the temperature of the hot plates 17 and 18 is set to, for example, 100° C. to 180° C., and pressurized air is sent from the compressor 22 through the conduit 20 to the back side of the elastic film 15 to heat the elastic film. 15 is expanded, and pressure molding of the laminate M is performed for a predetermined time through the transport films F1 and F2. However, the heat resistance temperature of the silicone rubber is higher than the temperature of the hot plates 17 and 18, and the deterioration of the silicone-based adhesive material F1b of the transfer film F1 does not adversely affect the lamination molding. After the pressure molding is completed, the vacuum inside the chamber C is broken, and then the lower platen 14 is lowered to open the chamber C. As shown in FIG. By driving the winding rolls 35 and 42 for the upper and lower conveying films F1 and F2, the upper and lower conveying films F1 and F2 and the formed laminate M are sent from the exit 28 of the vacuum lamination device 12 to the other side. Then, the upper transport film F2 is peeled off at the portion of the driven roll 34, and the lower transport film F1 and the laminate M are sent to the take-out stage S2 and stopped.

Then, the laminate molded product M is taken out by the carry-out device 44 . At this time, the silicone-based adhesive material F1b adhered to the core film F1a of the transport film F1 has a slight adhesiveness and has an optimum peeling force (adhesive force) for releasing the laminate M from the mold. Since the core material film F1a of F1 and the laminated molded product M are not firmly adhered, the laminated molded product M is not damaged and can be released satisfactorily from the mold. Paradoxically speaking, an adhesive material having the optimum type, shape, thickness, etc., is selected from the balance of the positional deviation prevention performance, lamination molding performance, and release performance of the laminated molded product M, and is used for the transport film F1. be done.

In relation to the above, the conveying film F1 having the silicone-based adhesive material F1b of the present embodiment adhered in a layer on the entire pressurized surface is effective not only for preventing the positional displacement of the laminated molded product M but also for molding the laminated molded product M. Sometimes. Specifically, the hardness (JIS-K 6353 durometer type A hardness) of the silicone adhesive material F1b can be selected between 15 and 80 as an example, although not limited to this. Therefore, when the hardness A is low, it may contribute to the improvement of embedding properties of the molten resin film in the concave portion of the laminate M on the substrate or wafer side. This is particularly effective when the recesses or grooves of the substrate or wafer are narrow or deep. When only the lower transport film F1 is the transport film F1 to which the silicone-based adhesive material F1b is adhered in a layered manner, the side of the substrate or wafer having the recesses or grooves faces the transport film F1. pressure molding is performed. In the case where both sides of the substrate or the like have the recesses or grooves, the upper and lower transport films F1 and F2 may be formed with a silicone-based adhesive material such as a silicone rubber layer to improve embedding properties.

Next, the vacuum lamination system 51 of the second embodiment will be described with reference to FIG. 4, focusing on differences from the present embodiment shown in FIG. However, the same reference numerals are used for the same parts as in FIG. In the second embodiment, the upper and lower carrier films F1 and F2 are generally carrier films made only of polyethylene terephthalate or the like. Then, the pressure-sensitive adhesive of the vacuum lamination system 51 is applied to the surface of the conveying film F1 corresponding to the core material film F1a unwound from the unwinding roll 33 of the conveying mechanism 32 of the laminated molded product, which is in contact with the laminated molded product M. The application device 52 applies an adhesive material such as the silicone-based adhesive material F1b. The type of the adhesive application device 52 is not limited, and an appropriate one is selected from various devices such as a die coater and a roll type.

The part where the adhesive material such as the silicone-based adhesive material F1b is applied to the carrier film F1 such as polyethylene terephthalate, which is the core film F1a, may be applied entirely or partially as shown in each example of FIG. may be applied to The transfer film F1 coated with the adhesive material is moved to the mounting stage S1 for the laminate M after passing through the number of pitches (the number of laminate moldings) required for drying. In the second embodiment, the time required for lamination molding in the vacuum lamination device 12 (including the time to evacuate the chamber C, etc.) is about 1 minute, and the adhesive material is deposited for about 2 minutes corresponding to 2 pitches. is dried. In order to accelerate the drying of the adhesive material, if necessary, a heating and drying device 53 for the adhesive material may be arranged at a position facing the conveying path of the conveying film F1.

According to the second embodiment, although the equipment cost of the vacuum lamination system 51 itself including the adhesive coating device 52 is increased, it is possible to use a general carrier film such as inexpensive polyethylene terephthalate, so that a separate Even if the adhesive material is prepared and applied, the running cost can be reduced in many cases.

Although the present invention is not enumerated one by one, it is not limited to the present embodiment described above, and modifications made by those skilled in the art based on the spirit of the present invention and combinations of parts of the above embodiments It goes without saying that this also applies to things.

11, 51 vacuum lamination system 12 vacuum lamination device 32 transfer mechanism C chamber F1 lower transfer film F1a core material film F1b silicone adhesive material F1c release film F2 upper transfer film M laminate molding

Claims (2)

In a vacuum lamination method in which a laminated product is conveyed into a chamber of a vacuum lamination device using a conveying film for lamination molding,
A vacuum lamination method in which a laminate molded article is conveyed using a conveying film having an adhesive material adhered to a portion in contact with the laminate molded article. In a vacuum lamination method in which a laminated product is conveyed into a chamber of a vacuum lamination device using an upper conveying film and a lower conveying film to perform lamination molding,
A vacuum lamination method in which a laminate is transported using a carrier film having an adhesive material adhered to a portion that abuts against the laminate as only the carrier film on which the laminate is placed on the lower side.

Images