JP4525180B2 - Vacuum lamination apparatus and method for forming insulating layer using the same - Google Patents

Description

  The present invention relates to a vacuum lamination apparatus for forming an insulating layer on a printed circuit board in a multilayer printed wiring board manufactured by alternately stacking wiring layers and insulating layers, and a method for forming an insulating layer using the same. It is.

  Conventionally, as a method for producing a multilayer printed wiring board, a prepreg sheet and a copper foil, which are semi-cured by impregnating an epoxy resin into a glass cloth base material as an insulating resin layer, are laminated and pressed on a circuit-formed inner circuit board. There is a known method for establishing interlayer conduction by holes. However, in this method, since the impregnated resin in the prepreg is reflowed by heat and cured under a constant pressure, 1.0 to 1.5 hours are required for uniform curing and molding. Thus, the manufacturing process takes a long time, and the cost is high due to the cost of the multilayer lamination press and the glass cloth prepreg. In addition, through-hole plating enters the outer layer, the conductor layer becomes thick and it becomes difficult to form a fine pattern. The thickness between circuit layers was limited by glass cloth, and it was difficult to make the entire multilayer printed wiring board extremely thin.

  In recent years, as a method for solving such a problem, a manufacturing technique of a build-up type multilayer printed wiring board in which an insulating layer and a wiring layer are alternately stacked on a wiring layer of an inner circuit board has attracted attention. Manufacture of multilayer printed wiring boards in which an insulating resin film is laminated on a circuit-formed inner layer circuit board, heat-cured, and then a wiring layer is formed by plating on the insulating layer having a rough surface on the surface with a roughening agent. A method has been proposed (see, for example, Patent Document 1 and Patent Document 2).

In a multilayer printed wiring board manufacturing method by a build-up method, an insulating resin film is usually laminated on an inner layer circuit board by a pressure vacuum laminator to form an insulating layer. Recently, a fine pattern is often formed on an insulating layer, and the surface of the insulating layer needs to be flattened. Therefore, planar pressing is performed as necessary. In such an apparatus, generally, a pressure vacuum laminator part and a flat press part are an integrated line connected by a pair of upper and lower transport films. The substrate is sandwiched between upper and lower transport films with an insulating resin film temporarily attached to the front and back by an auto-cut laminator, proceeds to a pressure vacuum laminating process and a flat pressing process, and is cooled and discharged from the apparatus.
Japanese Patent Laid-Open No. 09-296156 Japanese Patent Laid-Open No. 11-87927

  However, in the above laminating apparatus, when the pressure vacuum laminator starts evacuation, the substrate sandwiched between the upper and lower transport films is displaced from the normal position due to the effect of sudden pressure reduction, and this substrate is a flat press of the next process. Protruding out of the work may cause a decrease in substrate yield or quality. In addition, the insulating resin film is cut according to the size of the substrate to be processed in advance, and is laminated after being temporarily attached one after another, so that peeling of the support base film after lamination is not automated, and the operator has to manually handle each lot. It is common to work, and low productivity and variations in quality have been problems.

As a supplement, the support base film after lamination has strong adhesion to the insulating resin, and it is not only possible to perform stable peeling with a simple method such as passing an adhesive roll, but the auto peeler that automatically peels the film is expensive and the current situation However, a highly reliable product that can be used as a production facility is not commercially available, and there is a problem that there is no method for efficiently and stably peeling the support base film after lamination.

  The present invention has been devised in view of the above problems, and an insulating resin film having an insulating layer formed on a support base film is laminated on a wiring circuit board, and the supporting base film is peeled off to insulate the insulating layer on the wiring circuit board. In a laminating apparatus for forming a film, a laminating apparatus capable of efficiently and quality-stable peeling of a support base film without introducing expensive equipment such as an auto peeler and an insulating layer forming method using the laminating apparatus are provided. The purpose is to do.

In order to achieve the above object, according to the first aspect of the present invention, in claim 1, at least a surface of the insulating resin film in which the insulating resin layer is formed on the support base film is a surface of the printed circuit board . superposed so as to face the ends of the effective region outside the predetermined region and the insulating resin layer of the printed circuit board from the temporary attachment, the automatic cutting laminator unit 10 for cutting the insulating resin film in a predetermined size, wherein A loader unit 20 that forms an adhesive layer with a nozzle applicator on the support base film of the insulating resin film temporarily attached to the printed circuit board, and the adhesive layer is formed on the temporarily attached insulating resin film. wherein the wiring circuit unit 30 unrolled conveying film overlaying the conveying film on a substrate in the state, the insulating resin layer A vacuum pressure laminator unit 40 are laminated at a predetermined temperature on the surface of the line circuit board and the insulating layer, a planar press unit 50 for smoothing the insulating layer formed on a surface of the printed circuit board, wherein A transport film take-up unit 60 for peeling the transport film, the adhesive layer, and the support base film from the printed circuit board while leaving the insulating layer on the surface of the printed circuit board, and the printed circuit board on which the insulating layer is formed it is obtained by a vacuum lamination apparatus characterized by comprising a unloader unit 70 for housing.

  According to a second aspect of the present invention, there is provided a method for forming an insulating layer, characterized in that an insulating layer is formed on a printed circuit board using the vacuum lamination apparatus according to the first aspect.

By using the vacuum laminating apparatus of the present invention, it is possible to prevent misalignment of the wiring circuit board when laminating the insulating resin film cut to a predetermined size on the wiring circuit board, and to introduce expensive equipment such as an auto peeler. The insulating base layer can be efficiently formed on the printed circuit board by peeling off the supporting base film by an inexpensive method associated with a normal laminating operation.
Further, since the peeled support base film is wound and collected together with the transport film, the occupied space is small, and the burden of disposal work is reduced. That is, it is excellent in productivity and economy, and the insulating layer can be stably formed with quality, yield and the like.

FIG. 1 is a schematic configuration diagram showing an embodiment of a vacuum laminating apparatus of the present invention.
The vacuum laminating apparatus according to the present invention includes an insulating resin film in which an insulating resin layer is formed on a support base film, which will be described later, such that the surface having the insulating resin layer is overlapped with the surface of the printed circuit board, An auto-cut laminator unit 10 that temporarily cuts the insulating resin film into a predetermined size after temporarily sticking a predetermined region outside the effective region and an end of the insulating resin layer, and the insulating material temporarily attached to the wired circuit board An adhesive layer forming unit 20 for forming an adhesive layer with a nozzle applicator on the support base film of the resin film, and the printed circuit board in a state where the adhesive layer is formed on the temporarily-insulated insulating resin film conveying film and unit 30 unwinding conveying film superposed, the insulating resin layer is laminated at a predetermined temperature on the surface of the printed circuit board State a vacuum pressure laminator unit 40 to the insulating layer, a planar press unit 50 for smoothing the insulating layer formed on a surface of the printed circuit board, leaving the insulating layer on the surface of the printed circuit board in those equipped with conveying film winding unit 60 for peeling the to the transport film and the adhesive layer and the support base film from the printed circuit board, the unloader unit 70 for accommodating a printed circuit board on which the insulating layer is formed, the It is. In particular, an auto-cut laminator unit 10 that temporarily attaches a resin film having an insulating resin layer formed on a support base film onto a printed circuit board and cuts it to a predetermined size, and a predetermined resin film that is temporarily attached onto the printed circuit board. A loader unit 20 capable of forming an adhesive layer with a nozzle applicator with a predetermined width at a position, and a transport film winding unit 60 for peeling the transport film, the adhesive layer, and the support base film from the printed circuit board are provided. Is a feature.

The vacuum laminating apparatus of the present invention is a laminating apparatus for forming an insulating layer by transferring an insulating resin layer of an insulating resin film having an insulating resin layer formed on a support base film onto a printed circuit board on which a wiring layer or the like has been previously formed. It is.
Hereinafter, each unit constituting the vacuum laminating apparatus will be described.
The auto-cut laminator unit 10 is an apparatus that cuts an insulating resin film having an insulating resin layer formed on a support base film, which will be described later, into a predetermined size and affixes it at a predetermined position on a printed circuit board. Commercially available auto-cut laminators for dry film such as those manufactured by Somaru Corporation can be used.

First, an insulating resin film for use in the auto-cut laminator unit 10 is separately prepared. The insulating resin layer 112 is formed by a method such as applying a resin solution on one surface of the support base film 111 made of a PET film or the like by roll coating or affixing a resin film, and rolls it through a protective film. The winding roll 11 of winding and the insulating resin film 110 is produced (refer Fig.2 (a) and (b)).
Specifically, a commercially available insulating resin film (ABF-GX, manufactured by Ajinomoto Co., Inc.) can be used.

Next, a printed circuit board 120 (see FIGS. 3A and 3B) having an effective area 121 on which a wiring layer or the like is formed in advance is conveyed to the auto-cut laminator unit 10 by the roller conveyor 15.
In the auto-cut laminator unit 10, the winding roll 11 of the insulating resin film 110 in which the insulating resin layer 112 is formed is loaded on the support base film 111, and the protective film is wound by the protective film winding roll 13. Thereafter, the tip of the insulating resin film 110 is adsorbed by the air adsorbing roll 12.
Further, the air suction roll 12 rotates and the insulating resin layer 112 of the insulating resin film 110 and the printed circuit board 120 come into contact with each other. At that time, the end of the insulating resin layer 112 is temporarily attached to a predetermined portion outside the effective area 121 of the printed circuit board 120 by heating and pressure bonding. Next, the roller conveyor 15 and the air suction roll 12 work together to send the wiring circuit board 120, cut the insulating resin film 110 at a predetermined position, and the wiring on which the insulating resin film 110 cut to a predetermined size is temporarily attached. The circuit board 120a can be manufactured (see FIG. 4).

The loader unit 20 forms the adhesive layer 113 with the nozzle applicator 21 with a predetermined width on the end of the support base film 111 outside the effective area 121 of the printed circuit board 120 to which the insulating resin film 110 of a predetermined size is temporarily attached. Then, the printed circuit board 120b is manufactured (see FIG. 5).
The adhesive layer 113 may be formed anywhere on the support base film 111. However, in consideration of the influence on the insulating resin thickness in the laminating process, the adhesive layer 113 may be formed uniformly on the entire surface of the support base film, or the wiring circuit board 120 may be effectively used. A method of forming the straight line outside the region 121 can be given. However, the method of uniformly forming the adhesive layer on the entire surface of the supporting base film requires expensive equipment such as a roll coater and uses a large amount of adhesive, which is not preferable because of high production costs. On the other hand, the method of forming the adhesive layer linearly outside the effective area 121 of the printed circuit board 120 uses a high-viscosity adhesive with a small amount of seepage in the laminating process when a relatively simple device called a nozzle applicator is used. It is preferable because it is possible.

  According to this method, the adhesive can be applied linearly outside the effective area 121 of the printed circuit board 120 by using the movement of the printed circuit board by conveyance, which is efficient. Further, the nozzle applicator is particularly preferable because the tip nozzle is small, so that the degree of freedom in design for changing the application position is high and the spread of the adhesive can be easily adjusted by adjusting the discharge amount of the adhesive. ITW Dynatech Co., Ltd., Sanki Co., Ltd., Nordson Co., Ltd., etc. can be used for the nozzle applicator used by this invention. About an attachment position, as shown in FIG. 1, it fixes to the upper and lower ends of the roller conveyor 15. As shown in FIG.

  The adhesive used for forming the adhesive layer is preferably a hot-melt adhesive that solidifies immediately after forming the adhesive layer and does not leave a tack on the surface. Among them, those having a high melt viscosity are particularly preferable because they are excellent in adhesiveness and mechanical properties and have a small amount of seepage during the lamination process. Regarding the softening point of hot-melt adhesive, if pressure is applied in the lamination process if it is too low, the adhesive spreads too much and oozes out of the substrate, causing the upper and lower transport films to adhere and hinder the transport process. Therefore, it is preferably in the range of minus 30 ° C. or more and less than plus 30 ° C. with respect to the lamination temperature (pressing temperature) described later.

  Hot melt adhesives include H-629A (softening point 120 ° C.) manufactured by Toyo Petrolite Co., Ltd., Nanostack A (softening point 111 ° C.) manufactured by Sanyo Chemical Industries, Ltd., Jet Melt manufactured by Sumitomo 3M Co., Ltd. EC3760 (softening point 81 ° C.), Asahi Chemical Synthesis Co., Ltd. Asahimelt RK960 (softening point 98 ° C.), Daicel Chemical Industries, Ltd. Liquimelt 1354 (softening point 100 ° C.), Hitachi Chemical Polymer Co., Ltd. Hibon 9881H Examples thereof include hot-melt adhesives for soft packaging materials such as (softening point 85 ° C.).

  The printed circuit board 120b on which the adhesive layer 113 is formed is fed to the transport film unwinding unit 30 by the roller conveyor 15, and the transport film 131 fed from the transport film feeding roll 31 is a guide roller. At 32, the printed circuit board 120c is formed so as to be overlapped with the adhesive layer 113 on the support base film 111 of the printed circuit board 120b and sandwiched by the transport film 131 (see FIG. 6).

The printed circuit board 120c sandwiched by the transport film 131 moves to the film transport system interlocked with the roll conveyor 15, and is sent to the pressure vacuum laminator unit 40 and the flat press unit 50.
In the vacuum pressure laminator unit 40 , the insulating resin layer 112 on the support base film 111 is laminated on the wiring circuit board 120 at a predetermined temperature. In the flat press unit 50, the insulating resin layer 112 formed on both surfaces of the wiring circuit board 120. smoothing processing is Ru is carried out. The printed circuit board sent out from the flat press unit 50 is cooled by a cooling fan for several tens of seconds, the insulating resin layer 112 is cured, and is sent to the transport film winding unit 60.

  In the transport film winding unit 60, the transport film 131, the adhesive layer 113, and the support base film 111 are peeled off from the printed circuit board (see FIG. 7), wound on a winding roll 61, and insulated on both surfaces of the printed circuit board 120. A printed circuit board 120d (see FIG. 8) on which the layer 112a is formed can be obtained, and the printed circuit board 120d on which the insulating layer 112a is formed is conveyed by a roller conveyor and stored in the unloader unit 70.

  As described above, the adhesive layer 113 is for bonding the support base film 111 and the transport film 131 and transporting the support base film 111 and the printed circuit board with the transport film 131. When the insulating layer 112a is formed on the printed circuit board by peeling the substrate from the printed circuit board, the adhesive strength between the transport film 131 and the supporting base film 111 is greater than the adhesive strength between the supporting base film 111 and the insulating resin layer 112. By doing so, it is preferable from the viewpoint of cost that the width of the adhesive layer 113 be as small as possible.

According to the method for forming an insulating layer using the vacuum laminating apparatus of the present invention, it is possible to prevent the positional deviation of the insulating resin film when laminating the insulating resin film cut into a predetermined size on the printed circuit board, and an auto peeler or the like. Without introducing expensive equipment, an insulating layer can be efficiently formed on the printed circuit board by peeling off the support base film by an inexpensive method associated with a normal laminating operation.
Further, since the peeled support base film is wound and collected together with the transport film, the occupied space is small, and the burden of disposal work is reduced. That is, it is excellent in productivity and economy, and the insulating layer can be stably formed with quality, yield and the like.

  Furthermore, a multilayer wiring circuit board, an interposer, and the like can be easily obtained by repeating the formation of wiring layers, vias, and the above insulating layer on the insulating layer 112a of the printed circuit board 120d a desired number of times.

It is a schematic block diagram which shows one Example of the vacuum lamination apparatus of this invention. (A) is a perspective view which shows an example of the winding film which wound up the insulating resin film. (B) is a schematic cross-sectional view of an insulating resin film obtained by cutting the perspective view of (a) along the line A-A ′. (A) is a schematic plan view which shows an example of a printed circuit board. (B) is a schematic cross-sectional view of a printed circuit board obtained by cutting the schematic plan view of (a) along the line B-B ′. 2 is a schematic cross-sectional view showing a printed circuit board 120a in which an insulating resin film 110 is laminated on both surfaces of the printed circuit board 120. FIG. It is a schematic structure sectional view showing wiring circuit board 20b which formed adhesive layer 113 on support base film 111 of wiring circuit board 120a. It is a schematic structure sectional view showing wiring circuit board 120c which laminated conveyance film 131 on both sides of wiring circuit board 120b. It is explanatory drawing which shows the state which has peeled the conveyance film, the contact bonding layer, and the support base film from the printed circuit board 120c. 2 is a schematic cross-sectional view showing a printed circuit board 120d in which insulating layers 112a are formed on both surfaces of the printed circuit board 120. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Auto cut laminator unit 11 ... Insulation resin film winding roll 12 ... Air adsorption roll 13 ... Protective film winding roll 20 ... Loader unit 21 ... Nozzle applicator 30 ... Conveyance film sending unit 31 ... ... Conveyance film feed roll 32 ... Guide roll 40 ... Vacuum pressure laminator units 41, 51 ... Press lower plate 42, 52 ... Press upper plate 50 ... Flat press unit 60 ... Conveyance film winding unit 61 ... ... Conveyance film winding roll 62 ... Nip roll 63 ... Conveying film winding guide roller 70 ... Unloader unit 71 ... Belt conveyor 110 ... Insulating resin film 111 ... Support base film 112 ... Insulating resin layer 112a ... ... insulating layer 113 ... contact Layer 120... Wired circuit board 120 a... Wired circuit board 120 b after temporarily attaching the insulating resin film... Wired circuit board 120 c after forming the adhesive layer. Printed circuit board 21 ... Effective area 31 ... Conveying film

Claims (2)

At least an insulating resin film having an insulating resin layer formed on a support base film is overlapped so that the surface with the insulating resin layer faces the surface of the printed circuit board, and a predetermined area outside the effective area of the printed circuit board and the An auto-cut laminator unit (10) that cuts the insulating resin film into a predetermined size after temporarily attaching an end portion of the insulating resin layer, and the support base film of the insulating resin film temporarily attached to the wired circuit board above, a loader unit for forming an adhesive layer at the nozzle applicator (20), conveying of superimposing the transfer film onto the wiring circuit board in the state where the adhesive layer is formed on the insulating resin film that is temporarily attached a film unwinding unit (30), said insulating resin layer by laminating at a predetermined temperature on the surface of the printed circuit board to the insulating layer State a vacuum pressure laminator unit (40), wherein the wiring circuit plane pressing unit formed on a surface of the substrate performs the smoothing of the insulating layer (50), leaving the insulating layer on the surface of the printed circuit board in a conveying film and the adhesive layer transport film take-up unit and a support base film is peeled off from the printed circuit board (60), and unloader unit (70) for accommodating a printed circuit board on which the insulating layer is formed, A vacuum laminating apparatus comprising: A method for forming an insulating layer, comprising: forming an insulating layer on a printed circuit board using the vacuum lamination apparatus according to claim 1.

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