JP4585828B2 - 制御装置およびその製造方法 - Google Patents
制御装置およびその製造方法 Download PDFInfo
- Publication number
- JP4585828B2 JP4585828B2 JP2004293183A JP2004293183A JP4585828B2 JP 4585828 B2 JP4585828 B2 JP 4585828B2 JP 2004293183 A JP2004293183 A JP 2004293183A JP 2004293183 A JP2004293183 A JP 2004293183A JP 4585828 B2 JP4585828 B2 JP 4585828B2
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- circuit board
- metal case
- metal
- resin
- module
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- Expired - Lifetime
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- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 139
- 239000002184 metal Substances 0.000 claims description 139
- 125000006850 spacer group Chemical group 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 description 39
- 239000011347 resin Substances 0.000 description 39
- 238000007789 sealing Methods 0.000 description 26
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000000956 alloy Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004078 waterproofing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 made of aluminum Chemical compound 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 241000221535 Pucciniales Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
〔参考例1〕
。これらEMC特性を向上する為に、回路基板2上でもコンデンサやインダクタンス等を使用したり、回路パターンを最適化する等して対応しているが、こういった工夫をより有効なものにする為に、本モジュール装置1やその他の装置の動作に影響されない安定した基準アース14を回路基板2内に引き込む事が有効である。
〔参考例2〕
〔参考例3〕
〔参考例4〕
。
〔実施例5〕
〔参考例6〕
Claims (4)
- 制御回路を形成する複数の電子部品と、
前記制御回路に電気的に接続され、外部にも接続可能なコネクタ端子と、
前記コネクタ端子と前記複数の電子部品とが設置された基板と、
前記基板と接続された金属部材と、
前記複数の電子部品と前記基板と前記コネクタ端子とをモールドする絶縁体と、
前記基板と前記金属部材を電気的に接続する金属スペーサを備え、
前記金属スペーサは、前記絶縁体の中で前記基板に固定され、前記複数の電子部品と前記基板と前記コネクタ端子と共にモールドされ、当該金属スペーサの周囲に円盤状の突起を設ける、制御装置。 - 前記金属スペーサと前記金属部材とがネジにより固定される、請求項1記載の制御装置。
- 複数の電子部品と外部に接続可能なコネクタ端子とを配線が形成された基板に接続して制御回路を形成し、
絶縁体によって、前記複数の電子部品と前記基板と前記コネクタ端子とをモールドし、
前記制御回路と金属部材とを電気的に接続する金属スペーサを設け、
前記金属スペーサは、前記絶縁体の中で前記基板に固定され、前記複数の電子部品と前記基板と前記コネクタ端子と共にモールドされ、当該金属スペーサの周囲に円盤状の突起を設ける、制御装置の製造方法。 - 前記制御回路と金属部材とを電気的に接続した後に、
前記絶縁体の少なくとも一部を挟む様に、前記ネジによって前記金属部材に固定する、請求項3記載の制御装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004293183A JP4585828B2 (ja) | 2004-10-06 | 2004-10-06 | 制御装置およびその製造方法 |
US11/243,319 US7359212B2 (en) | 2004-10-06 | 2005-10-05 | Control device and method of manufacturing thereof |
DE602005019961T DE602005019961D1 (de) | 2004-10-06 | 2005-10-06 | Steuervorrichtung und Verfahren zu deren Herstellung |
EP05021840A EP1646271B1 (en) | 2004-10-06 | 2005-10-06 | Control device and method of manufacturing thereof |
US12/039,472 US7924572B2 (en) | 2004-10-06 | 2008-02-28 | Control device and method of manufacturing thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004293183A JP4585828B2 (ja) | 2004-10-06 | 2004-10-06 | 制御装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006108398A JP2006108398A (ja) | 2006-04-20 |
JP4585828B2 true JP4585828B2 (ja) | 2010-11-24 |
Family
ID=35686509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004293183A Expired - Lifetime JP4585828B2 (ja) | 2004-10-06 | 2004-10-06 | 制御装置およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7359212B2 (ja) |
EP (1) | EP1646271B1 (ja) |
JP (1) | JP4585828B2 (ja) |
DE (1) | DE602005019961D1 (ja) |
Families Citing this family (48)
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CN1802883A (zh) * | 2003-07-03 | 2006-07-12 | 株式会社日立制作所 | 组件装置及其制造方法 |
JP2006032490A (ja) * | 2004-07-13 | 2006-02-02 | Hitachi Ltd | エンジン制御回路装置 |
JP4548199B2 (ja) * | 2005-04-22 | 2010-09-22 | 株式会社デンソー | 電子回路装置の製造方法 |
JP4209423B2 (ja) * | 2005-12-16 | 2009-01-14 | パナソニックEvエナジー株式会社 | 二次電池用の制御装置及び二次電池の出力制御方法 |
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JP4909712B2 (ja) * | 2006-11-13 | 2012-04-04 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
DE102007002323B4 (de) * | 2007-01-16 | 2008-11-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Waschbares Elektronik-Flachsystem mit freien Anschlusskontakten zur Integration in ein textiles Material oder Flexmaterial |
JP2009010014A (ja) * | 2007-06-26 | 2009-01-15 | Yanmar Co Ltd | 電子制御装置の取り付け構成 |
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EP3761768B1 (en) * | 2019-07-04 | 2023-04-12 | Hosiden Corporation | Waterproof electronic component and method for assembling the same |
DE102021200061A1 (de) | 2021-01-07 | 2022-07-07 | Zf Friedrichshafen Ag | Elektronikmodul, Verfahren zum Herstellen eines Elektronikmoduls und Kontrollvorrichtung |
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JPH0858275A (ja) * | 1994-08-05 | 1996-03-05 | Internatl Business Mach Corp <Ibm> | Icカードの製造方法及びそのicカードの接続方法並びにicカード |
JPH08213774A (ja) * | 1994-10-21 | 1996-08-20 | Robert Bosch Gmbh | 電気機器とその製造方法 |
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Also Published As
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DE602005019961D1 (de) | 2010-04-29 |
EP1646271B1 (en) | 2010-03-17 |
US7924572B2 (en) | 2011-04-12 |
US20080165511A1 (en) | 2008-07-10 |
JP2006108398A (ja) | 2006-04-20 |
EP1646271A2 (en) | 2006-04-12 |
EP1646271A3 (en) | 2007-11-07 |
US7359212B2 (en) | 2008-04-15 |
US20060077643A1 (en) | 2006-04-13 |
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