JP4567486B2 - Ceramic sintered body joining apparatus and ceramic sintered body joining method - Google Patents

Description

  The present invention relates to an apparatus or a method for joining a plate-like first ceramic sintered body and a second ceramic sintered body having a cylindrical part and a flange part.

  A ceramic joined body obtained by joining a plate-like ceramic sintered body and a ceramic sintered body having a cylindrical portion and a flange portion is used in various fields. For example, a semiconductor manufacturing apparatus holds a semiconductor wafer. In addition, a plate-shaped ceramic sintered body in which a heating wire heater is embedded is joined to a cylindrical ceramic sintered body through which an electric wire for supplying electricity to the heating wire heater is passed.

An apparatus and a method for joining such plate-shaped ceramics and cylindrical ceramics are disclosed (for example, see Patent Document 1).
JP 2003-165777 A

  However, in the conventional joining apparatus and method, a hot press is used for joining the plate-like first ceramic sintered body and the second ceramic sintered body having the upper part of the cylinder and the flange portion. The first ceramic sintered body may warp by about 0.3 to 0.8 mm due to deformation or the like.

  This invention is made | formed in view of the said subject, and when joining the 1st ceramic sintered compact and the 2nd ceramic sintered compact using a hot press, the 1st ceramic sintered compact An object of the present invention is to provide a technique capable of controlling the amount of creep deformation of a sheet.

  The present invention has been made in order to solve the above-mentioned problems. The first feature of the present invention is that a first ceramic sintered body having a disk shape, a second ceramic sintered body having a cylindrical portion and a flange portion. An apparatus for joining a body, (1) a mounting means capable of mounting a first ceramic sintered body and having a convex portion or a concave portion in the center, and (2) a first ceramic sintered body A first pressure transmission means capable of enclosing the second ceramic sintered body placed thereon and capable of transmitting pressure to the flange; and (3) the first pressure transmission means, A first pressurizing means for applying pressure in a direction in which the pressure at the contact surface between the ceramic sintered body and the second ceramic sintered body increases; and (4) the first ceramic sintered body and the second ceramic sintered body. There exists in providing the heating means which can heat a joint surface with a bonded body.

  The pressurizing unit may be a mechanical pressurizing unit such as a hydraulic cylinder, but a non-mechanical pressurizing unit such as a heavy press that can easily control the low pressure is preferable. The heavy metal is preferably made of a metal such as tungsten or molybdenum having a high melting point, excellent heat resistance, and high specific gravity. Further, there is no problem if low pressure control is possible even with a mechanical method.

  The second feature of the present invention includes the first feature, wherein the first ceramic sintered body is disposed in a region other than the convex portion or the concave portion of the mounting means. Direction of approach, direction in which the contact area between the first ceramic sintered body and the region other than the convex portion or concave portion of the mounting means increases, or other than the convex portion or concave portion of the first ceramic sintered body and the mounting means A second pressurizing unit that applies pressure in a direction in which the pressure of the contact surface with the region increases is further provided.

  According to the first feature, when the disk-shaped first ceramic sintered body and the second ceramic sintered body having the cylindrical portion and the flange portion are joined by hot pressing, the mounting provided with the convex portion. If the mounting means is used, a bending moment is generated in the direction in which the peripheral portion of the first ceramic sintered body is lowered, and if the mounting means having a recess is used, the peripheral portion of the first ceramic sintered body is raised. A bending moment is generated in the direction. By utilizing such a bending moment, it is possible to control the amount of creep deformation of the first ceramic sintered body and correct the warp of the first ceramic sintered body.

  According to the 2nd characteristic, the curvature of the 1st ceramic sintered compact can be corrected more effectively by using the 2nd pressurizing means.

  Hereinafter, embodiments and examples of the present invention will be described with reference to the drawings, but the present invention is not limited to these embodiments and examples.

FIG. 1 shows a ceramic sintered body joining apparatus of Example 1. As shown in FIG. 1, the sintered ceramic joining device 100 includes a disc-shaped primary plate (first ceramic sintered body) 101 having a diameter d1 of 340 mm, a cylindrical portion, and a diameter d2 of 80 mm. An apparatus for joining a shaft (second ceramic sintered body) 102 having a flange part,
(1) A floor plate (mounting means) 103 capable of mounting a primary plate and having a convex portion having a diameter d3 and a height h1;
(2) a load cylinder (first pressure transmission means) 105 that can surround the shaft 102 and can transmit a load to the flange (flange) 102a of the shaft;
(3) heavy load (first pressurizing means) 106 for applying a load to the load cylinder 105;
(4) a punch 107 disposed between the heavyweight 106 and the load cylinder 105 and capable of transmitting the load of the heavyweight 106 to the load cylinder 105;
(5) heavy load (second pressurizing means) 121 for applying a load to the primary plate 101 around the flange 102a;
(6) a pressure transmission plate 122 disposed between the heavyweight 121 and the primary plate 101 around the flange 102a, and capable of transmitting the load of the heavyweight 121 to the primary plate 101;
(7) A heater (heating means) 108 capable of heating the joint surface between the flat portion of the primary plate 101 and the flange 102a is provided.

  The ceramic sintered body joining apparatus 100 according to the first embodiment supplies power to the heater 108, the metal container 110, and gas in the metal container 110, and exhausts the gas in the container 110. And a molded heat insulating material 112 are further provided inside the metal container 110.

  It is preferable to use a floor plate 103 made of a non-carbon material, a load cylinder 105, a punch 107, and a pressure transmission plate 122. By using these as non-carbon materials, generation of carbon-based gas can be prevented, and discoloration of the ceramic sintered body surface caused by the generation of carbon-based gas can be suppressed. Further, the pressure transmission plate 122 can avoid that the heavy load 121 is adhered to the primary plate 101.

  Furthermore, it is more preferable to use a sheath (box) made of a non-carbon material that can contain the floor plate 103, the load cylinder 105, and the pressure transmission plate 122. In this case, the heater 108 is disposed outside the sheath. By using such a sheath, it is possible to more reliably prevent the carbon-based gas from touching the surface of the ceramic sintered body, and more reliably prevent discoloration of the surface of the ceramic sintered body.

As the non-carbon material, for example, boron nitride (BN), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), or the like can be used.

<Creation of primary plate>
First, creation of the primary plate will be described. A Mo coil-like heating element was embedded in an AlN raw material to which 5% by weight of yttria was added, and press-molded to prepare a molded body having a diameter of 350 mm and a thickness of 50 mm. This molded body was subjected to a maximum temperature of 1910 ° C. (2183 K), a maximum temperature keeping time of 6 hours, and a pressure of 200 kg / cm ² (1.96 × 10 ⁷ Pa) in a nitrogen atmosphere of 0.5 kg / cm ² G (49 kPa). Hot press baked. A primary plate was prepared from the fired body using a surface grinder and a cylindrical grinder.

<Creation of shaft>
Next, the creation of the shaft will be described. AlN raw material added with 5% by weight of yttria is filled in a rubber mold with a core set, CIP (cold isostatic press) molding is performed at a pressure of 5 tons, and the shrinkage ratio during firing is assigned. This was dry-processed and fired in a nitrogen atmosphere of 0.5 kg / cm ² G (49 kPa) to obtain a shaft having an inner diameter of 59 mm, an outer diameter of 80 mm, and a length of 170 mm.

<Bonding of primary plate and shaft>
The yttrium nitrate was applied to the joint interface between the primary plate and the shaft thus prepared, the joint between the primary plate and the shaft was positioned, and dried for 1 hour with a dryer at 100 ° C. (373 K).

Next, as shown in FIG. 1, the primary plate 101, the shaft 102, etc. are set in the metal container 110, and after exhausting the gas in the container 110 by the gas exhaust sealing device 111, nitrogen is sealed. The nitrogen is 0.5 kg / cm ² · G. Further, stalwarts 106 heavy Satoshi load applied to the flange 102a is 0.6 kg / cm ^2, stalwarts 121 weigh the load applied to the primary plate 101 is 0.01 kg / cm ^2. The power supply device 109 is energized to cause the heater 108 to generate heat, and the joint surface between the primary plate 101 and the shaft 102 is heated.

<Heat schedule>
FIG. 2 shows the heat schedule of the heater. As shown in the figure, in a nitrogen atmosphere of 0.5 kg / cm ² G (49 kPa), the temperature is increased from room temperature to 150 ° C./hr, and when it reaches 250 ° C., the temperature is maintained for 1 hour, and then again 150 ° C. / Increase the temperature in hr, reach 1200 ° C, increase the temperature at 400 ° C / hr, hold it for 1 hour when it reaches 1800-1900 ° C, then lower the temperature at 200 ° C / hr and reach 1200 ° C, The temperature is lowered at 400 ° C./hr, and the process ends when the temperature reaches 50 ° C.

<Thickness measurement point>
FIG. 3 shows film thickness measurement points. As shown in the figure, the film thickness is measured at the center point P1, eight points P2 to P9 that equally divide the circumference with a radius of 70 mm, and nine points P10 to P18 that equally divide the circumference with a radius of 140 mm. Points.

Table 1 shows the measured values in Example 1. An eddy current film thickness measuring device (manufactured by Fischer, model number: MP-3C with EA-9) was used for measuring the film thickness. In addition, the diameter d3 of the convex part of the floor plate 103 was 120 mm, and the height h1 was 0.1 mm.

The primary film thickness T1 indicates the distance (unit: mm) from the surface of the plate before joining the shaft to the electrode mesh embedded in the plate.
The primary difference T2 indicates a value (unit: mm) obtained by subtracting the primary film thickness T1 at the point P1 from the primary film thickness T1 at the point Px.
The secondary film thickness T3 indicates the distance (unit: mm) from the surface of the plate after shaft joining to the electrode mesh embedded in the plate,
The secondary difference T4 indicates a value (unit: mm) obtained by subtracting the secondary film thickness T3 at the point P1 from the secondary film thickness T2 at the point Px.
The change amount T5 indicates a value (unit: mm) obtained by subtracting the primary film thickness T2 at the point Px from the secondary film thickness T4 at the point Px.

As shown in Table 1,
Primary difference T2: maximum value 0.100mm, minimum value -0.035mm,
Secondary difference T4: maximum value 0.04mm, minimum value -0.060mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.135 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.100 mm. The difference between the maximum value and the minimum value of the primary difference T2 indicates the film thickness variation before the shaft joining, and the difference between the maximum value and the minimum value of the secondary difference T4 is the film thickness variation after the shaft joining. It shows. As shown in Table 1, in Example 1, the film thickness variation after shaft joining is small.

Further, as shown in Table 1, when the radius R is limited to the points P2 to P9 having 70 mm, the primary difference T2: maximum value 0.05 mm, minimum value −0.035 mm,
Secondary difference T4: maximum value 0.01 mm, minimum value −0.060 mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.085 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.070 mm.

Furthermore, if the radius R is limited to points P10 to P18 having a radius of 140 mm, the primary difference T2 is a maximum value of 0.100 mm, a minimum value of 0.015 mm,
Secondary difference T4: maximum value 0.040 mm, minimum value −0.060 mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.085 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.100 mm.

  4A is a diagram in which the distance from the plate surface before shaft joining in Example 1 to the electrode mesh embedded in the plate is plotted, and FIG. 4B is the diagram after shaft joining in Example 1. FIG. It is the figure which plotted the distance from the plate surface to the electrode mesh embed | buried in the inside of a plate. As shown in FIGS. 4A and 4B, the film thickness variation after the shaft joining is smaller than before the shaft joining.

In Example 2, the diameter d3 of the convex portion of the floor plate 103 was 140 mm, and the height h1 was 0.2 mm. Others are the same as in the first embodiment. Table 2 shows the measured values in Example 2.

As shown in Table 2,
Primary difference T2: maximum value 0.370mm, minimum value 0.000mm,
Secondary difference T4: maximum value 0.196 mm, minimum value 0.000 mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.370 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.196 mm. As shown in Table 2, also in Example 2, the film thickness variation after shaft joining is small.

Further, as shown in Table 2, when the radius R is limited to the points P2 to P9 having 70 mm, the primary difference T2: maximum value 0.190 mm, minimum value 0.06 mm,
Secondary difference T4: maximum value 0.136 mm, minimum value 0.02 mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.130 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.116 mm.

Furthermore, if the radius R is limited to points P10 to P18 having a radius of 140 mm, the primary difference T2 is a maximum value of 0.370 mm, a minimum value of 0.270 mm,
Secondary difference T4: maximum value 0.196 mm, minimum value 0.086 mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.100 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.110 mm.

  FIG. 5A is a diagram plotting the distance from the plate surface before shaft joining in Example 2 to the electrode mesh embedded in the plate, and FIG. 5B is the diagram after shaft joining in Example 2. It is the figure which plotted the distance from the plate surface to the electrode mesh embed | buried in the inside of a plate. As shown in FIGS. 5A and 5B, the film thickness variation is smaller after the shaft joining than before the shaft joining.

FIG. 6 shows a ceramic sintered body joining apparatus of Example 3. As shown in FIG. 6, in Example 3, a floor plate 104 having a concave portion is used instead of the floor plate 103 having a convex portion. The diameter d4 of the recess was 180 mm, and the depth h2 was 0.1 mm. Others are the same as in the first embodiment. Table 3 shows the measured values in Example 3.

As shown in Table 3,
Primary difference T2: maximum value 0.0mm, minimum value -0.165mm,
Secondary difference T4: maximum value 0.0mm, minimum value -0.12mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.165 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.12 mm. As shown in Table 3, also in Example 3, the film thickness variation after the shaft joining is small.

Further, as shown in Table 3, when the radius R is limited to the points P2 to P9 having 70 mm, the primary difference T2: maximum value −0.035 mm, minimum value −0.1 mm,
Secondary difference T4: maximum value 0.0 mm, minimum value −0.07 mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.065 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.07 mm.

Further, if the radius R is limited to points P10 to P18 having a radius of 140 mm, the primary difference T2 is the maximum value -0.065 mm, the minimum value -0.165 mm,
Secondary difference T4: maximum value 0.0mm, minimum value -0.12mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.1 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.12 mm.

  FIG. 7A is a diagram in which the distance from the plate surface before shaft joining in Example 3 to the electrode mesh embedded in the plate is plotted, and FIG. 7B is a diagram after shaft joining in Example 3. It is the figure which plotted the distance from the plate surface to the electrode mesh embed | buried in the inside of a plate. As shown in FIGS. 7A and 7B, the film thickness variation after the shaft joining is smaller than that before the shaft joining.

  As described above, in Example 3, warpage can be corrected at the time of shaft joining by using a plate having a concave portion and a plate having a high center and a low periphery.

In the fourth embodiment, a floor plate 103 having a convex portion is used. The diameter d3 of the convex portion was 140 mm, and the height h1 was 0.2 mm. In addition, splittable heavyweights 121a to 121d as shown in FIG. 8 are used. In the fourth embodiment, the heavy load 121a is placed only on the points P9, P17, and P18 that need to be corrected. Others are the same as in the first embodiment. Table 4 shows the measured values in Example 4.

As shown in Table 4,
Primary difference T2: maximum value 0.225mm, minimum value -0.035mm,
Secondary difference T4: maximum value 0.040 mm, minimum value −0.060 mm,
The difference between the maximum value and the minimum value of the primary difference T2: 0.260 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.100 mm. Also in Example 4 where the plate is partially warped, as shown in Table 4, the film thickness variation after the shaft joining is small.

Further, as shown in Table 4, when the radius R is limited to the points P2 to P9 having 70 mm, the primary difference T2 is the maximum value 0.05 mm, the minimum value −0.035 mm,
Secondary difference T4: maximum value 0.01 mm, minimum value −0.060 mm,
Difference between the maximum value and the minimum value of the primary difference T2: 0.085 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.070 mm.

Further, if the radius R is limited to the points P10 to P18 having a radius of 140 mm, the primary difference T2 is a maximum value of 0.225 mm, a minimum value of 0.015 mm,
Secondary difference T4: maximum value 0.040 mm, minimum value −0.060 mm,
The difference between the maximum value and the minimum value of the primary difference T2: 0.210 mm,
The difference between the maximum value and the minimum value of the secondary difference T4 was 0.100 mm.

  FIG. 9A is a diagram plotting the distance from the plate surface before shaft joining in Example 4 to the electrode mesh embedded in the plate, and FIG. 9B is the diagram after shaft joining in Example 4. It is the figure which plotted the distance from the plate surface to the electrode mesh embed | buried in the inside of a plate. As shown in FIGS. 9 (A) and 9 (B), before the shaft is joined, there are many points where T4 is 0 to 0.1 mm on the circumference of radius R = 140 mm, and T4 is 0.1 to 0. There are no 2 mm points, and there are 2 points where T4 exceeds 0.2 mm. However, after the shaft is joined, all T4 on the circumference having a radius R = 140 mm exists between −0.06 mm and 0.04 mm.

  As described above, in the fourth embodiment, the warp can be partially corrected at the time of joining the shafts by placing a heavy part of the plate that is largely warped upward only on the part that is greatly warped. it can.

1 is a schematic diagram showing a ceramic sintered body joining apparatus of Example 1. FIG. It is a graph which shows a heat schedule. It is a figure which shows a film thickness measurement point. (A) is the figure which plotted the distance from the plate surface before the shaft joining in Example 1 to the electrode mesh embed | buried in the inside of a plate, (B) is a plate from the plate surface after the shaft joining in Example 1 to a plate It is the figure which plotted the distance to the electrode mesh embed | buried inside. (A) is the figure which plotted the distance from the plate surface before the shaft joining in Example 2 to the electrode mesh embed | buried in the inside of a plate, (B) is a plate from the plate surface after the shaft joining in Example 2 to a plate It is the figure which plotted the distance to the electrode mesh embed | buried inside. 6 is a schematic diagram illustrating a ceramic sintered body joining apparatus of Example 3. FIG. (A) is the figure which plotted the distance from the plate surface before the shaft joining in Example 3 to the electrode mesh embed | buried in the inside of a plate, (B) is a plate from the plate surface after the shaft joining in Example 3 to a plate It is the figure which plotted the distance to the electrode mesh embed | buried inside. It is a figure which shows the separable heavyweight of Example 4. FIG. (A) is the figure which plotted the distance from the plate surface before the shaft joining in Example 4 to the electrode mesh embed | buried in the inside of a plate, (B) is a plate from the plate surface after the shaft joining in Example 4 to a plate It is the figure which plotted the distance to the electrode mesh embed | buried inside.

Explanation of symbols

100 ... Ceramic sintered body joining device,
101 ... Primary plate (first ceramic sintered body),
102 ... shaft (second ceramic sintered body),
103, 104 ... floor plate (placement means), 105 ... load cylinder (first pressure transmission means),
106 ... heavyweight (first pressurizing means),
107 ... punch,
108 ... heater (heating means), 109 ... power supply,
110 ... Metal container, 111 ... Gas exhaust sealing device,
121... Heavyweight (second pressurizing means)
122 ... Pressure transmission plate.

Claims (4)

An apparatus for joining a disk-shaped first ceramic sintered body and a second ceramic sintered body having a cylindrical part and a flange part,
A mounting means capable of mounting the first ceramic sintered body and having a convex portion or a concave portion in the center;
First pressure transmitting means capable of surrounding the second ceramic sintered body placed on the first ceramic sintered body and transmitting pressure to the flange;
First pressure means for applying pressure to the first pressure transmission means in a direction in which the pressure at the contact surface between the first ceramic sintered body and the second ceramic sintered body increases;
A ceramic sintered body joining apparatus comprising: heating means capable of heating a joining surface between the first ceramic sintered body and the second ceramic sintered body.   A direction in which the first ceramic sintered body approaches the region other than the convex portion or the concave portion of the placing means, the first ceramic sintered body, Direction in which the contact area between the body and the region other than the convex portion or the concave portion of the placing means increases, or the contact surface between the first ceramic sintered body and the region other than the convex portion or the concave portion of the placing means The ceramic sintered body joining apparatus according to claim 1, further comprising a second pressurizing unit that applies pressure in a direction in which the pressure increases. A method of joining a disk-shaped first ceramic sintered body and a second ceramic sintered body having a cylindrical part and a flange part,
A step of placing the first ceramic sintered body on a placing means having a convex portion or a recessed portion in the center, and placing the second ceramic sintered body on the first ceramic sintered body. When,
The pressure of the contact surface between the first ceramic sintered body and the second ceramic sintered body is increased while heating the joint surface between the first ceramic sintered body and the second ceramic sintered body. Pressurizing in a rising direction, and bonding the sintered ceramic body.   While heating the joint surface between the first ceramic sintered body and the second ceramic sintered body, the first ceramic sintered body around the flange is applied to the first ceramic sintered body. The direction in which the body approaches the region other than the convex portion or the concave portion of the placing means, the direction in which the contact area between the first ceramic sintered body and the region other than the convex portion or the concave portion of the placing means increases. The method for joining ceramic sintered bodies according to claim 3, wherein pressure is applied in a direction in which the pressure of the contact surface between the first ceramic sintered body and the region other than the convex portion or concave portion of the placing means increases. .

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