JP3244860B2 - Board mounting mechanism - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film forming apparatus such as a sputtering apparatus, and more particularly to a substrate mounting mechanism used for an in-line type sputtering apparatus for a magnetic disk.

[0002]

2. Description of the Related Art A conventional board mounting mechanism is shown in FIGS. 7 and 8, in which a rectangular frame 1 has a plurality of thin vertical wires 2 and a plurality of thin horizontal wires 3 as well. Further, the rear ends of the pair of wire members 5 and 6 are welded to the vertical wire 2 so as to be distributed across the horizontal wire 3. A V-shaped bent portion 5 is provided at each end of the pair of wire members 5 and 6.
a and 6a are formed, and the interval between them is slightly larger than the diameter of the center hole 7a of the substrate 7. When the center hole 7a of the substrate 7 engages with the bent portions 5a and 6a, a pair of wire members is formed. The substrates 5 and 6 bend, and the elastic force causes the substrate 7 to be mounted on the pair of wire members 5 and 6. Reference numeral 8 denotes a reinforcing ring member for restoring the pair of bent wire members 5 and 6.

In such a substrate mounting mechanism, a pair of wire members 5 and 6 are provided at four places, and
Is mounted on a pair of wire members 5, 6, the substrate 7 is mounted on one wire member 5, 6, and then the other substrate 7 is mounted on another wire member 5, 6. That is, the substrate 7 was sequentially mounted on the wire members 5 and 6.

[0004]

In the conventional substrate mounting mechanism, the substrate 7 is sequentially mounted on the wire members 5 and 6 as described above. For this reason, there has been a problem that the working efficiency when attaching and detaching the substrate 7 to and from the wire members 5 and 6 is deteriorated.

SUMMARY OF THE INVENTION An object of the present invention is to solve the conventional problems and to provide a substrate mounting mechanism for improving the work efficiency when detaching a substrate.

[0006]

In order to achieve the above object, one of the substrate mounting mechanisms of the present invention comprises a rectangular frame, and a plurality of stages mounted vertically on the rectangular frame at predetermined intervals. A plurality of substrate holding members, a plurality of bent wires having one end laterally attached to each of the plurality of substrate holding members at predetermined intervals, and the other end of each of the plurality of bent wires A substrate holding part having a groove at the top mounted on the substrate holding part, and a substrate which is held by dropping a portion on the center hole side into the groove at the top of the substrate holding part.

Another one of the substrate mounting mechanisms of the present invention is a rectangular frame, a plurality of substrate holding members vertically attached to the rectangular frame at predetermined intervals, and
A plurality of bent wires each having one end laterally attached at a predetermined interval to each of the plurality of substrate holding members, and a groove at an upper portion attached to the other end of each of the plurality of bent wires. The board holding part to hold, the board held by dropping the part of the center hole side into the groove at the top of the board holding part, and the transfer groove at equal intervals with the wire to prepare for mounting the board in the horizontal direction While holding in line,
It has a substrate delivery member having delivery grooves in multiple stages also in the front-rear direction, and a transfer robot capable of moving the substrate delivery member up and down and back and forth.

[0008]

According to one aspect of the present invention, the substrate is held by dropping a portion on the center hole side of the substrate into a groove above the substrate holding portion.

In another aspect of the present invention, when the transfer robot conveys the substrate delivery member, the substrate held in the lateral and front-rear delivery grooves of the substrate transfer member moves. Therefore, after the substrate held in the lateral transfer groove is dropped and held in the upper groove of the substrate holding portion attached to a plurality of wires, the substrate is transferred by the transfer robot. The member is moved to the upper stage or the lower stage, and the portion on the center hole side of the substrate is dropped and held in the upper groove of the substrate holding portion attached to the next wire. By repeating such an operation, the central hole side portion of the substrate is dropped and held in the upper grooves of all the substrate holding portions.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an elevational view of the board mounting mechanism according to the embodiment of the present invention, and FIG. 2 is a right side view thereof. In these figures, a plurality of substrate holding members 12 are vertically mounted on a rectangular frame 11 at predetermined intervals at predetermined intervals, and the plurality of substrate holding members 1 are attached.
Each of 2 has a plurality of wires 1 bent in a U-shape.
One end of 3 is attached in the horizontal direction at a predetermined interval.
At the other end of each of the plurality of bent wires 13, a substrate holding portion 14 having a groove 14 a curved upward is attached, and a central hole of the substrate 15 is provided in the curved groove 14 a above the substrate holding portion 14. The portion on the 15a side is dropped and held. 3 and 4 are detailed diagrams thereof.

In such an embodiment, the center hole 1 of the substrate 15 is inserted into the curved groove 14a at the top of the substrate holding portion 14.
The substrate 15 is held by dropping the portion on the 5a side.

Next, a substrate mounting mechanism according to another embodiment of the present invention is shown in FIGS. Another embodiment is obtained by adding another configuration to the above-described embodiment shown in FIGS. That is, the delivery grooves 16a are arranged in a line in the horizontal direction at equal intervals with the wire 13, and at the same time, the delivery grooves 1a are also arranged in the front-rear direction.
A substrate transfer member 16 having multiple stages 6a is attached to a transfer robot 17, and the transfer robot 17 moves the substrate transfer member 16 in the up-down direction and the front-back direction. The substrate 15 is held in the transfer groove 16a of the substrate transfer member 16, and the substrate 15
Are prepared for mounting.

In such another embodiment, the substrate 15 held in the lateral transfer groove 16a is placed in the groove 14a on the upper part of the substrate holding portion 14 attached to the plurality of wires 13 so that the center of the substrate 15 is After dropping and holding the portion on the side of the hole 15a, the transfer robot 16 moves the substrate transfer member 16 to the upper or lower stage, and the upper portion of the substrate holding portion 14 attached to the next upper or lower wire 13 is moved. The portion of the substrate 15 on the side of the center hole 15a is dropped and held in the groove 14a. By repeating such an operation, the portion of the substrate 15 on the side of the center hole 15a is dropped and held in the upper groove 14a of all the substrate holding portions 14.

In this embodiment, the transfer grooves 16a are provided in the substrate transfer member 16 in accordance with the number of the substrate holding portions 14 attached to the respective stages of the substrate hold member 12, and 1
Although the transfer of the substrate is performed step by step, the transfer robot 17 can move the substrate transfer member 16 in the left-right direction, and the transfer groove 16 is formed.
The number of “a” may be reduced to half, and the substrate may be transferred in half at each stage.

As shown in each of the above-described embodiments, a portion of the substrate 15 on the side of the center hole 15a is dropped into and held in the upper grooves 14a of all the substrate holding portions 14, and thin films are formed on both surfaces of the substrate 15. As a result, the substrate 15 did not drop during and after the formation of the thin film, and good film quality characteristics were obtained.

[0016]

According to the first aspect of the present invention, the substrate is held by dropping the central hole side portion of the substrate into the upper groove of the substrate holding portion as described above. In addition to the simple operation, the substrate does not drop during and after the formation of the thin film, so that good film quality characteristics can be obtained. The invention of claim 2 is
By repeating the operation of moving the substrate transfer member to the upper or lower stage by the transfer robot, the center hole side of the substrate is dropped into the upper groove of all substrate holding parts, and the substrate is held. Therefore, the effect of improving work efficiency when holding the substrate is added to the above-described effect.

[Brief description of the drawings]

FIG. 1 is an elevation view of an embodiment of the present invention.

FIG. 2 is a side view of an embodiment of the present invention.

FIG. 3 is an elevational view showing a main part of the embodiment of the present invention in detail.

FIG. 4 is a side view showing a main part of the embodiment of the present invention in detail.

FIG. 5 is an elevation view showing a part of another embodiment of the present invention;

FIG. 6 is a side view of another embodiment of the present invention.

FIG. 7 is a perspective view of a conventional substrate mounting mechanism.

FIG. 8 is a sectional view of a main part of a conventional substrate mounting mechanism.

[Explanation of symbols]

 11 ... frame 12 ... board holding member 13 ... wire 14 ... board holding section 14 a ... groove of board holding section 15 ... ····························································································· Transfer robot

Continuation of front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C23C 14/00-14/58 G11B 5/85

Claims (2)

(57) [Claims] 1. A rectangular frame, a plurality of substrate holding members vertically attached to the rectangular frame at a predetermined interval in a plurality of stages, and a plurality of substrate holding members each having a predetermined interval. A plurality of bent wires having one ends attached in the lateral direction, a substrate holding portion having an upper groove attached to the other end of each of the plurality of bent wires, and a groove in an upper portion of the substrate holding portion. And a substrate which is held by dropping a portion on the side of the center hole into the substrate mounting mechanism. 2. A rectangular frame, a plurality of substrate holding members vertically mounted on the rectangular frame at predetermined intervals, and a predetermined distance between each of the plurality of substrate holding members. A plurality of bent wires each having one end attached in the lateral direction, a substrate holding portion having a groove at an upper portion attached to the other end of each of the plurality of bent wires, and a groove at an upper portion of the substrate holding portion. The board with the center hole side dropped into it and the transfer grooves are arranged in a row in the horizontal direction at equal intervals with the wire to prepare for mounting the board, and the transfer grooves are also multi-staged in the front and rear direction And a transfer robot capable of moving the substrate transfer member up and down and back and forth.