JP2613846B2 - Chip type electronic component with electrode sheet piece - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component with a piece of an electrode sheet.

[0002]

2. Description of the Related Art Conventionally, a large number of chip-type electronic components are mounted on a flexible substrate on which a circuit pattern is printed.

FIG. 7A is a view for explaining a method of mounting a chip type electronic component (chip type light emitting diode) 220 on a flexible substrate 200, and FIG.
FIG. 4 is a diagram showing a state in which a chip-type electronic component 220 is attached.

[0004] As shown in FIG.
In order to mount the chip-type electronic component 220 thereon, first, a pair of electrode patterns 2 provided on the flexible substrate 200 is provided.
A conductive adhesive (not shown) is applied on
The electrode portions 221 and 22 of the chip-type electronic component 220 are further placed thereon.
1 is connected and dried by a drier to cure the conductive adhesive.

Next, a UV-curable (ultraviolet-curable) insulating adhesive 240 is applied onto the chip-type electronic component 220 so as to seal the chip-type electronic component 220, and then placed in a UV furnace and irradiated with ultraviolet rays. And cure.

Here, the UV-curable type is used as the insulating adhesive 240 because, in the case of this conventional example, the chip-type electronic component 220 to be sealed is a light emitting diode. This is because it needs to be transparent.

Conventionally, a large number of chip-type electronic components are mounted on the flexible substrate 200 by sequentially connecting and fixing each chip-type electronic component to each mounting position on the flexible substrate 200 by the above-described method. .

[0008]

However, the above conventional example has the following problems. The method of mounting the chip-type electronic component 220 on the flexible substrate 200 involves a large number of mounting steps, resulting in poor workability, and requires a long time for drying, UV irradiation, and the like, resulting in a long manufacturing time.

It is necessary to fix the chip-type electronic components 220 to a large number of places on the flexible substrate 200 one by one with the above-described poor workability, and the workability as a whole is poor. No

The insulating adhesive 240 has no force for pressing the chip-type electronic component 220 against the flexible substrate 200, and the electrode patterns 201 and 201 of the flexible substrate 200 are not provided.
01 and the electrode portions 221 and 221 of the chip-type electronic component 220
The connection and fixation are performed only by the conductive adhesive. Therefore, the strength of the connecting / fixing portion is weak. The flexible substrate 200 has flexibility, and is often mounted or stored in a curved state. In such a case, the connection of the connection / fixing portion may be disconnected.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide an electrode sheet piece which can be easily mounted on another substrate, has high strength, is suitable for various kinds of small-quantity production, and is easy to manufacture. It is to provide a chip-type electronic component.

[0012]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a chip-type electronic component having at least two electrode portions exposed on the surface thereof, and a film made of a synthetic resin. An electrode sheet piece printed with an electrode pattern to be connected to each of the electrode portions of the component and having a length and a width of about several times or less the length and width of the chip-type electronic component; and a synthetic resin film. A press sheet large enough to cover the electronic component,
The chip-type electronic component is placed on the electrode sheet piece, and each electrode portion is connected to each electrode pattern by a conductive adhesive, and the pressing sheet is placed thereon, and the both side portions are covered with the conductive sheet. By being fixed to the electrode sheet piece, it is sandwiched and fixed between the electrode sheet piece and the holding sheet, and a portion of each electrode pattern provided on the electrode sheet piece drawn out from the chip-type electronic component is connected to another substrate. And

The present invention also provides a hot-melt type conductive adhesive material on a connection portion of each electrode pattern provided on the electrode sheet piece to another substrate, and a connection portion of the electrode sheet piece. On both sides, connection reinforcements were formed by applying a hot melt type insulating adhesive.

[0014]

The chip-type electronic component is not only bonded and fixed to the electrode sheet piece by the conductive adhesive, but is also constantly pressed toward the electrode sheet piece by the pressing sheet, so that the fixing is reliable. Even if the electrode sheet piece bends or deforms, no conduction failure occurs between the electrode portion of the chip-type electronic component and the electrode pattern.

The mounting and fixing of the chip-type electronic component with the electrode sheet piece to another substrate is easy and reliable because it is a connection between the planar electrode sheet piece and the other substrate. For this reason, one type of chip-type electronic component with a piece of electrode sheet is mass-produced, and it is easy to connect and fix a required number of such electronic components to required portions of another substrate. Even small-scale products can be easily handled.

In particular, a hot-melt type conductive adhesive is applied on the connection portion of each electrode pattern provided on the electrode sheet piece, and a hot-melt type insulating adhesive is applied on both sides of the connection portion. When the portion is provided, the connection can be easily and firmly made electrically and mechanically by simply applying heat to the connection portion when connecting to another substrate.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a view showing a chip-type electronic component with an electrode sheet piece according to one embodiment of the present invention, wherein FIG. 1 (a) is a perspective view, FIG. 1 (b) is a plan view, and FIG. 1 (c) is a right side view. FIG. 3D is a sectional view taken along the line AA of FIG.

As shown in FIG. 1, the chip-type electronic component 1 with an electrode sheet piece has a chip-type light emitting diode 40 placed on an electrode sheet piece 10 and a pressing sheet 50 placed thereon. , 51 are heat-welded to the electrode sheet piece 10 so that the chip-type light emitting diode 4 is formed.
0 is sandwiched and fixed between the electrode sheet piece 10 and the pressing sheet 50. Hereinafter, each component will be described.

FIG. 2 shows a chip type light emitting diode 40.
FIG. As shown in the figure, the chip type light emitting diode 40 has a light emitting portion 41 and a pair of electrode portions 43, 43 exposed on the outer surface thereof.

Next, FIG. 3 is a view showing a method of manufacturing the electrode sheet piece 10. That is, in order to manufacture the electrode sheet piece 10,
First, as shown in FIG. 1A, a thermoplastic synthetic resin film 11 is prepared, and a silver paste is screen-printed thereon to form a pair of electrode patterns 13,13. At this time, the opposing ends of the pair of electrode patterns 13 are referred to as chip mounting portions 13a.

Next, as shown in FIG. 1B, an anisotropic hot-melt type conductive adhesive 15 is applied thereon so as to cover the entire pair of electrode patterns 13 and 13. Here, the anisotropic hot-melt type conductive adhesive 15 means that the coating does not have conductivity only by being applied, and only the heated and pressurized portion has conductivity only in the pressing direction. It has the property of.

Next, as shown in FIG. 1C, a hot melt type insulating adhesive is applied to the four corners of the portion where the conductive adhesive 15 is applied to provide a connection reinforcing portion 17.

Then, if this film 11 is cut,
The electrode sheet piece 10 shown in FIG. 4 is completed.

In the electrode sheet piece 10 shown in FIG. 4, the opposing portions of the electrode patterns 13, 13 are the chip mounting portions 13a, 13a as described above, and the opposite portions are the connection portions 13b, 13b to other substrates. 13b. And 4
The connection reinforcing portions 17 at the corners are respectively connected to the connecting portions 13b, 1b.
3b. Film welds 19, 19 to which the conductive adhesive 15 is not applied are provided at the center of both sides of the film 11. Electrode sheet piece 1
0 on both sides, a chip-type electronic component 1 with a piece of electrode sheet.
There are provided four concave portions 21 used for positioning when connecting to the other substrate.

The length and width of the electrode sheet piece 10 are as follows:
The chip type light emitting diode 40 is configured to have a dimension of about 3 to 4 times the length and width.

Next, as shown in FIG. 1, the pressing sheet 50 is made of a thermoplastic synthetic resin film made of a transparent material and is formed in a rectangular shape having a size to cover the chip type light emitting diode 40. It is configured by cutting.

Next, a method of manufacturing the chip-type electronic component 1 with the electrode sheet piece will be described. That is, first, the chip type light emitting diode 40 shown in FIG. 2 is placed at the center of the electrode sheet piece 10 shown in FIG. At this time, the chip type light emitting diode 4
0 are electrode patterns 1 respectively.
3, 13 are located on the chip mounting portions 13a, 13a.

As shown in FIG. 1, a pressing sheet 50 is put on the chip type light emitting diode 40, and both side portions 51, 51 of the pressing sheet 50 are attached to the film welding portions 19, 19 of the electrode sheet piece 10. Strongly welded and fixed (fixed) by ultrasonic heating welding. Reference numerals 51a and 51a indicate the welded portions.

Thus, the chip type light emitting diode 40
Are sandwiched between the electrode sheet piece 10 and the pressing sheet 50.

Next, while pressing the upper portion of the chip type light emitting diode 40 via the pressing sheet 50 and simultaneously heating and pressing the portion of the lower surface of the electrode sheet piece 10 in contact with the chip type light emitting diode 40 for a predetermined time, Of the portions to which the hot-melt type conductive adhesive 15 is applied, only the portion in contact with the lower surface of the chip-type light emitting diode 40 conducts only in the pressing direction (thickness direction). Accordingly, the two electrode portions 43, 43 (see FIG. 2) of the chip light emitting diode 40 are electrically connected to the electrode patterns 13, 13, respectively. At the same time, this chip type light emitting diode 40
Is mechanically bonded to the electrode sheet piece 10 by the conductive adhesive 15.

In the chip-type electronic component 1 with the electrode sheet piece manufactured as described above, the chip-type light emitting diode 40 is connected to the electrode sheet piece 10 by the conductive adhesive 15.
In addition to being fixed to the electrode sheet piece 10 by the pressing sheet 50, the fixing is ensured.

In particular, since the pressing sheet 50 constantly presses the chip type light emitting diodes 40 toward the electrode sheet piece 10, even if the electrode sheet piece 10 is bent or deformed, the electrode portion of the chip type light emitting diode 40 is not affected. No conduction failure occurs between the electrode patterns 43, 43 and the electrode patterns 13, 13.

In order to actually manufacture the chip-type electronic component 1 with the electrode sheet piece, a large number of patterns shown in FIG. 3C are simultaneously printed on one large thermoplastic resin film, and these are printed. The chip type light emitting diode 40 and the holding sheet 50 are respectively placed on the upper side, and the both sides 51, 51 of the holding sheet 50 are ultrasonically heated and welded to the resin film.
Finally, the resin film is cut to manufacture a large number of chip-type electronic components 1 with electrode sheet pieces.

Next, a method of attaching the chip type electronic component 1 with the electrode sheet piece to another substrate will be described. Here, FIG. 5 is a rear view showing another flexible substrate 60 on which the chip-type electronic component 1 with the electrode sheet piece is mounted.

As shown in FIG.
Numeral 0 is provided with a hole 63 having a predetermined size at a predetermined position of a thermoplastic synthetic resin film 61. This hole 6
Reference numeral 3 denotes a size and a shape through which the chip-type light-emitting diode 40 of the chip-type electronic component 1 with the electrode sheet piece shown in FIG. 1A is inserted, and the four corners of FIG. A concave portion 65 having a shape corresponding to the concave portion 21 provided in the electrode sheet 10 of the chip-type electronic component 1 with the electrode sheet piece shown in FIG.

On the other hand, on both sides of the hole 63 on the back surface of the flexible substrate 60, circuit patterns 65, 65 are formed by applying and drying a silver paste, and anisotropic hot melt type is further formed thereon. Conductive adhesive 6
7, 67 are printed, and a hot-melt type insulating adhesive 69 is printed on both sides of the conductive adhesives 67, 67.

In order to connect the chip-type electronic component 1 with a piece of electrode sheet to the flexible substrate 60, first, as shown in FIG.
Is mounted such that the chip-type light emitting diodes 40 project from the holes 63 from the back surface side of the flexible substrate 60. At this time, both connection portions 13b, 13b (see FIG. 1) of the electrode sheet piece 10 of the chip-type electronic component 1 with the electrode sheet piece and the circuit patterns 65, 65 of the flexible substrate 60.
5 (see FIG. 5) are connected with the conductive adhesives 15 and 67 interposed therebetween, and at the same time, the connection reinforcing portions 17 (see FIG. 1) at the four corners of the chip-type electronic component 1 with electrode sheet pieces are insulated from the flexible substrate 60. Contacts the adhesive 69 (see FIG. 5).

The entire contact surface between the electrode sheet piece 10 of the chip-type electronic component 1 with the electrode sheet piece 1 and the flexible substrate 60 (portions C and C shown in FIG. 6) is heated and pressed from above and below by a hot press. As a result, both connection portions 13b, 13b of the electrode sheet piece 10 are electrically and electrically connected to the circuit patterns 65, 65 of the flexible substrate 60, respectively.
Connected mechanically. At the same time, the connection reinforcing portion 17 of the electrode sheet piece 10 also becomes the insulating adhesive 69 of the flexible substrate 60.
Is heat-sealed and fixed. Since the insulating adhesive 69 is thermoplastic and the connection reinforcing portion 17 is also made of a thermoplastic insulating adhesive, the thermal welding of both is strong.

That is, the chip-type electronic component 1 with the electrode sheet piece can be heated and pressed simply by bonding both ends of the electrode sheet piece 10 to the back surface of the flexible substrate 60.
Electrical and mechanical connection and fixing can be easily and securely performed.

As described above, since the chip-type electronic component 1 with the electrode sheet piece is easily and securely attached to another substrate, the chip-type electronic component 1 with the electrode sheet piece having the above-mentioned shape and structure can be mass-produced. In this case, if the necessary number is connected and fixed to a required portion of another substrate by the connection method described above, the mounting can be easily and reliably performed, and the chip type electronic component with the electrode sheet piece can be easily mounted on a different substrate. Even if the mounting position of 1 is changed, it can easily cope with this. Therefore, even if the substrate on which the chip-type electronic component 1 with the electrode sheet piece is mounted is a product of a wide variety and a small quantity, this can be easily handled.

Further, since the chip type light emitting diode 40 is constantly pressed toward the electrode sheet piece 10 by the pressing sheet 50, even if the electrode sheet piece 10 or the flexible board 60 to which the electrode sheet piece 10 is attached is deformed by bending.
There is no problem such as disconnection of the connection of the chip type light emitting diode 40 to the electrode sheet piece 10.

When a voltage is applied to the pair of circuit patterns 65, 65 (see FIG. 5) of the flexible substrate 60, the chip type light emitting diode 40 is energized and emits light. Presser sheet 5
0 is radiated to the outside.

Although the flexible substrate 60 is used in the above embodiment, an ordinary hard substrate may be used.

In the above embodiment, the electrode portions 43 of the chip type light emitting diode 40 and the electrode sheet
Although the hot melt type conductive adhesive 15 is used to connect the chip mounting portions 13a, 13a, other types of conductive adhesive such as thermosetting may be used. Similarly, instead of the conductive adhesive 15 applied on the connection portions 13b, 13b of the electrode sheet piece 10, another type of conductive adhesive such as thermosetting may be used.

In the above embodiment, an example using the chip type light emitting diode 40 has been described. However, the present invention is not limited to this, and can be used for other types of chip type electronic parts such as chip type capacitors. In this case, the pressing sheet 50 does not have to be transparent.

The fixing between the electrode sheet piece 10 and the pressing sheet 50 is not limited to the ultrasonic heating welding, but may be welding by other heating means or bonding with an adhesive.

[0047]

As described above in detail, the chip-type electronic component with the electrode sheet piece according to the present invention has the following excellent effects. The chip-type light emitting diode is not only bonded and fixed to the electrode sheet piece by a conductive adhesive, but is also constantly pressed toward the electrode sheet piece by the pressing sheet, so that the fixing is reliable. Even if the LED is bent or deformed, conduction failure does not occur between the electrode portion of the chip-type light emitting diode and the electrode pattern.

This chip-type electronic component with a piece of electrode sheet has a simple structure and is easy to manufacture.

The mounting and fixing of the chip-type electronic component with the electrode sheet piece to another substrate is easy and reliable because it is a connection between the planar electrode sheet piece and another substrate. For this reason, one type of chip-type electronic component with a piece of electrode sheet is mass-produced, and it is easy to connect and fix a required number of such electronic components to required portions of another substrate. Even small-scale products can be easily handled.

In particular, a hot melt type conductive adhesive is applied on the connection portion of each electrode pattern provided on the electrode sheet piece, and a hot melt type insulative adhesive material is applied on both sides of the connection portion. If a part is provided,
At the time of connection to another substrate, it can be easily and firmly electrically and mechanically connected only by applying heat to the connection portion.

[Brief description of the drawings]

FIG. 1 is a view showing a chip-type electronic component with an electrode sheet piece according to one embodiment of the present invention. FIG. 1 (a) is a perspective view, FIG. 1 (b) is a plan view, and FIG. () Is a right side view, and (d) is a cross-sectional view taken along the line AA in (b) of FIG.

FIG. 2 is a perspective view showing a chip-type light emitting diode 40.

FIG. 3 is a view showing a method of manufacturing the electrode sheet piece 10;

FIG. 4 is a plan view of the electrode sheet piece 10;

FIG. 5 is a rear view showing another flexible substrate 60 on which the chip-type electronic component 1 with an electrode sheet piece is mounted.

FIG. 6 is a perspective view showing a state where the chip-type electronic component with electrode sheet pieces 1 is connected to the flexible substrate 60.

FIG. 7A is a view for explaining a conventional method for mounting a chip-type electronic component 220 on a flexible substrate 200, and FIG.
It is a figure which shows the state which attached.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 chip electronic component with electrode sheet piece 10 electrode sheet piece 11 film 13, 13 electrode pattern 13 a, 13 a chip mounting part 13 b, 13 b connection part 15 conductive adhesive 17 connection reinforcing part 40 chip type light emitting diode 43, 43 electrode part 50 Presser sheet 60 Flexible board (other board)

Claims (2)

(57) [Claims] 1. A chip-type electronic component having at least two electrode portions exposed on its surface, and a film made of a synthetic resin, and an electrode pattern connected to each electrode portion of the chip-type electronic component is printed on the film. An electrode sheet piece whose length and width are several times smaller than the length and width of the chip-type electronic component, and a press sheet made of synthetic resin film and covering the chip-type electronic component. The chip-type electronic component is placed on the electrode sheet piece, and each of the electrode portions is connected to each of the electrode patterns by a conductive adhesive, and the pressing sheet is placed thereon, and both side portions thereof are covered. By being fixed to the electrode sheet piece, it is sandwiched and fixed between the electrode sheet piece and the pressing sheet, and is pulled out from the chip-type electronic component of each electrode pattern provided on the electrode sheet piece. Electrode sheet Katazuki chip-type electronic component, wherein a portion has a connecting portion to the other substrate. 2. A hot-melt type conductive adhesive is applied on a connection portion of each electrode pattern provided on the electrode sheet piece to another substrate, and is applied to both sides of the connection portion of the electrode sheet piece. The chip-type electronic component with an electrode sheet piece according to claim 1, wherein a connection reinforcement portion formed by applying a hot melt type insulating adhesive is formed.