JP2000331138A - Non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin non-contact IC card the surface of which hardly become uneven. SOLUTION: This non-contact IC card is provided with a core sheet 12 composed of a resin material and having a through hole 14, a planar coil formed on one surface of the sheet 12 and having terminal sections 54a and 54b both of which are positioned in the hole 14, and a semiconductor element 56 housed in the hole 14 from the other surface side of the sheet 12 so that the electrode terminal forming surface of the element 56 may be faced to the coil 54 and having electrode terminals 58 which are electrically connected to both terminal sections 54a and 54b of the coil 54. The IC card is also provided with over sheets 62 which are composed of a resin material and cover both surfaces of the core sheet 12 respectively in a state where the semiconductor element 56 is housed in the through hole 14 of the sheet 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC in which an oversheet is integrally mounted on both surfaces of a semiconductor element and a core sheet on which a planar coil is mounted.
About the card.

[0002]

2. Description of the Related Art A schematic configuration of a conventional non-contact type IC card 50 will be described with reference to FIG. The core sheet 52 is formed of a polyimide resin. And the core sheet 52
Is formed on one surface thereof. The semiconductor element 56 is mounted on one surface of the core sheet 52 such that the surface on which the electrode terminals 58 are formed (electrode terminal formation surface) faces one surface of the core sheet 52.
Reference numeral 8 is electrically connected to the terminal portions 54a and 54b of the planar coil 54. Then, the oversheet 62 on which the adhesive layer 60 is formed is mounted on both surfaces of the core sheet 52, and the oversheet 62 and the core sheet 52 are integrally formed by heating and pressing with a hot press.

[0003]

However, the above-described structure has a structure in which the semiconductor element 56 is mounted on the surface of the core sheet 52 and the oversheet 62 is further laminated on and under the core sheet 52. There is a problem that the card becomes thick. There is also a problem that the semiconductor element 56 mounted on the surface of the core sheet 52 causes unevenness on the surface of the non-contact type IC card 50.
Further, since the expensive polyimide resin is used for the core sheet 52, there is also a problem that the product unit price of the non-contact type IC card 50 becomes high.

Accordingly, an object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a non-contact type IC card which is thin and has less irregularities on its surface.

[0005]

According to a first aspect of the present invention, there is provided a non-contact type IC card according to the first aspect, comprising a core sheet made of a resin material and having a through hole, and one of the core sheets. A flat coil in which both terminal portions are located in the through-hole, and are accommodated in the through-hole from the other surface side of the core sheet, such that the electrode terminal forming surface faces the flat coil side, A semiconductor element in which an electrode terminal is electrically connected to the two terminal portions of the planar coil, and an oversheet which is made of a resin material and covers both surfaces of the core sheet in which the semiconductor element is accommodated in the through hole. It is characterized by having.

According to this, since the semiconductor element is accommodated in the through hole provided in the core sheet, the thickness of the non-contact type IC card can be reduced, and the surface of the non-contact type IC card is less likely to have irregularities. Further, the unit price of the product can be reduced by making the resin material a polyethylene resin which is cheaper than the polyimide resin. Further, by adopting a structure in which the sealing material is filled in the through-hole, the semiconductor element can be reinforced, and the semiconductor element becomes strong against bending and impact. Further, each terminal portion of the planar coil to which the electrode terminal of the semiconductor element is connected may have a structure extending over the through hole, or a structure extending into the through hole and not extending over the through hole. You can also

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a non-contact type IC according to the present invention will be described.
Preferred embodiments of the card will be described in detail with reference to the accompanying drawings. First, the structure of the non-contact type IC card 10 will be described with reference to FIGS. The same components as those of the conventional example are denoted by the same reference numerals, and detailed description thereof will be omitted.
The core sheet 12 is made of a resin material, and has a through hole 14 formed therein. Here, as the resin material, if a polyethylene resin such as PET, which is cheaper than a polyimide resin, is used,
The cost of the non-contact type IC card 10 can be reduced, which is preferable. One surface of the core sheet 12 (the lower surface in FIG. 4)
, A planar coil 54 is formed. Plane coil 5
4 is made of a metal material such as aluminum or copper, and both terminal portions 54 a and 54 b are arranged in the through hole 14. More specifically, in the present embodiment, each of the terminal portions 54a and 54b of the planar coil 54 is disposed so as to extend over the through hole 14, and at least the electrode terminals 58 of the semiconductor element 56 are provided.
Is plated with gold or the like.

In the semiconductor element 56, the surface on which the electrode terminals 58 are formed (the surface on which the electrode terminals are formed) is inserted into the through-hole 14 from the other surface (the upper surface in FIG. 4) of the core sheet 12.
The pair of electrode terminals 58 are electrically connected to the terminal portions 54a and 54b of the planar coil 54 by ultrasonic bonding. Here, if a thin semiconductor element 56 of about 50 microns is used, the core sheet 1 made of PET material having a thickness of about 75 microns is generally used.
2, so that no convex portion is formed on the surface of the manufactured non-contact type IC card 10. Further, the thickness of the non-contact type IC card 10 can be reduced. In order to prevent unevenness, it is desirable that the thickness of the core sheet 12 and the thickness of the semiconductor element 56 (thickness including the electrode terminals 58) be equal.

On both surfaces of the core sheet 12 in which the semiconductor elements 56 are accommodated in the through holes 14, an oversheet 62 formed of a resin material having an adhesive layer 60 on one surface is provided with an adhesive layer 60. Are arranged so as to be located on the core sheet 12 side, and are heated and pressed by a hot press to be integrated with the core sheet 12. Here, it is preferable to use a polyethylene resin, which is less expensive than a polyimide resin, like the core sheet 12 as the resin material.

Next, a manufacturing process of the non-contact type IC card 10 will be described with reference to FIGS. As a first step, a through hole 14 is formed in the core sheet 12 (see FIG. 1). Note that the shape and size of the through hole 14 are
In consideration of the outer shape of No. 6, the size is determined so that the semiconductor element 56 can be accommodated. Further, in order to minimize irregularities on the surface of the non-contact type IC card 10, the thickness of the core sheet 12 is determined in consideration of the thickness of the semiconductor element 56, and is substantially equal to the thickness of the semiconductor element 56. It is desirable to have the same thickness. As a second step, a metal foil 16 such as copper or aluminum is adhered to one surface (the lower surface in FIG. 1) of the core sheet 12 (see FIG. 2).

As a third step, the metal foil 16 is etched in a predetermined pattern to form a planar coil 54 on one surface of the core sheet 12. As an example, the planar shape of the planar coil 54 may be a shape shown in FIG. In particular, the planar coil 54 of the present embodiment has a structure in which the respective terminal portions 54a and 54b are also bridged through the through-holes 14 as shown in FIG. 6, for example, as shown in FIG. It is also possible to adopt a structure in which the terminal portions 54a and 54b extend into the through-hole 14 without extending over the through-hole 14. Further, the terminal portions 54a and 54b may be plated with gold or the like as necessary. As a fourth step, the electrode terminal formation surface is inserted into the through-hole 14 by the planar coil 54.
The semiconductor element 56 is accommodated in a state facing the side (see FIG. 3). The pair of electrode terminals 58 formed on the electrode terminal forming surface are accommodated in the terminal portions 54 a and 54 b of the planar coil 54.
This is performed while positioning so as to come into contact with the substrate. Then, each electrode terminal 5 of the semiconductor element 56 is formed by ultrasonic bonding.
8 and the terminal portions 54a and 54b of the planar coil 54 are electrically connected. As a fifth step, an oversheet 62 formed of a polyethylene-based resin and having an adhesive layer 60 on only one side is placed on both sides of the core sheet 12 in which the semiconductor elements 56 are accommodated in the through holes 14 by heat. It is bonded by a method such as pressing (see FIG. 4). Thus, the non-contact type IC card 10 shown in FIG. 4 is manufactured.

Further, between the fourth step and the fifth step,
When a step of filling the sealing material 18 in the through hole 14 is provided,
As shown in FIG. 8, the non-contact type IC card 20 in which the periphery of the semiconductor element 56 is reinforced by the sealing material 18 can be obtained.

[0013]

When the non-contact type IC card according to the present invention is used, since the semiconductor element is accommodated in the through hole provided in the core sheet, the thickness of the non-contact type IC card can be reduced.
By making the thickness of the core sheet and the thickness of the semiconductor element uniform, irregularities are less likely to occur on the surface of the non-contact type IC card. Further, by using a polyethylene-based resin, which is cheaper than a polyimide-based resin, for the core sheet, the product unit price can be reduced. Further, if the inside of the through hole is filled with a sealing material, the semiconductor element can be reinforced, and there is an effect that the semiconductor element becomes strong against bending and impact.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram for explaining a manufacturing process of a non-contact type IC card according to an embodiment of the present invention (first process).

FIG. 2 is an explanatory diagram for explaining a second step.

FIG. 3 is an explanatory diagram for describing third and fourth steps.

FIG. 4 is an explanatory diagram for explaining a fifth step.

FIG. 5 is a plan view for explaining a positional relationship between a planar coil and a through hole of the non-contact type IC card of FIG. 1;

FIG. 6 is an enlarged view of the vicinity of the through hole of FIG. 5;

FIG. 7 is an enlarged view of the vicinity of the through hole of the non-contact type IC card in which both terminal portions of the planar coil project into the through hole.

FIG. 8 is an explanatory diagram for explaining a configuration of another embodiment of the non-contact type IC card according to the present invention.

FIG. 9 is an explanatory diagram for explaining a configuration of an example of a conventional non-contact type IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Non-contact type IC card 12 Core sheet 14 Through-hole 54 Planar coil 54a, 54b Terminal part 56 Semiconductor element 58 Electrode terminal 62 Oversheet

Claims (5)

[Claims] 1. A core sheet made of a resin material and having a through hole, a planar coil formed on one surface of the core sheet and having both terminal portions located in the through hole, and the other surface of the core sheet From the side, the electrode terminal forming surface is housed in the through hole so as to face the flat coil side,
A semiconductor element having electrode terminals electrically connected to the two terminal portions of the planar coil; and an oversheet made of a resin material, wherein the semiconductor element covers both surfaces of the core sheet housed in the through hole. A non-contact type IC card comprising: 2. The non-contact type IC card according to claim 1, wherein said resin material is a polyethylene resin. 3. The non-contact type IC according to claim 1, wherein a sealing material is filled in the through hole.
card. 4. The non-contact type IC card according to claim 1, wherein each terminal of the planar coil is bridged over the through hole. 5. The non-contact IC card according to claim 1, wherein each terminal of the planar coil extends into the through hole.