JP4136240B2 - Electronic component mounting structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure for attaching an electronic component to a substrate.
[0002]
[Prior art]
Conventionally, solder or the like has been used to fix a chip-type electronic component to a circuit pattern formed by etching a copper foil provided on a flexible substrate. In the case of a circuit pattern formed by printing a silver paste or the like on a flexible substrate, there is a problem in adhesiveness with solder, and therefore a hot melt type conductive adhesive has been used instead of solder.
[0003]
In addition, since the flexible substrate bends, in order to reinforce the fixing by the solder or the conductive adhesive, an UV curable adhesive may be overcoated on the electronic component.
[0004]
In any of the above fixing methods, when the number of electronic components to be mounted on the flexible substrate is large, the flexible substrate on which the electronic component is placed is used for a heating furnace for melting solder (or conductive adhesive) or for curing the adhesive. By passing through a UV irradiation furnace, fixing of a large number of electronic components placed on the flexible substrate is completed at the same time, which is efficient. However, when the number of electronic components attached to the flexible substrate is small, the manufacturing process is still the same, and the manufacturing efficiency is adversely affected.
[0005]
In order to solve the above problems, individual electronic components may be attached to the flexible substrate one by one without using a heating furnace or the like.
[0006]
That is, as shown in FIG. 6 (a), a flexible substrate 100 formed with bending surfaces 103, 103 that can be bent by cutting out the periphery of electrode patterns 101, 101 provided on the surface, and electrode portions 111 at both ends. , 111 and a clamping member 120 having elastic clamping pieces 121, 121 for clamping between both electrode portions 111, 111 of the electronic component 110, as shown in FIG. The electronic component 110 is placed on the flexible substrate 100, and the bending surfaces 103 and 103 are pushed up and bent by the elastic clamping pieces 121 and 121 of the clamping member 120 to be wound around both the electrode portions 111 and 111 of the electronic component 110. At the same time, the electronic component 110 is elastically clamped and fixed by elastic clamping pieces 121 and 121 from the outside. This method is preferable because the electronic component can be easily and reliably attached to the substrate.
[0007]
However, when the electronic component 110 to be fixed becomes smaller, for example, when its planar dimension is about 1.6 × 0.8 mm, the dimension of the clamping member 120 is also reduced, and the elastic clamping pieces 121 and 121 are also reduced. The elastic sandwiching pieces 121 and 121 cannot be elastic, and cannot be firmly fixed. On the other hand, since the electrode parts 111 and 111 of this type of electronic component 110 are solder-plated, good electrical contact cannot be maintained unless a high load is applied to the electrode patterns 101 and 101 in contact therewith. . For these reasons, when the electronic component 110 is downsized, the fixing structure cannot be used.
[0008]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and its purpose is to attach electronic components to a substrate easily, surely and simply by a mechanical fixing method for each single item even if the electronic components are downsized. An object of the present invention is to provide a structure for mounting an electronic component to a substrate.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, an electronic component mounting structure according to the present invention fixes a substrate formed with an electrode pattern, an electronic component provided with an electrode portion, and an electrode portion of the electronic component. And fixing members provided on both sides of the fixing member disposed on the back surface of the substrate in a state where the electrode pattern is in contact with the electrode portion of the electronic component placed on the substrate. Bend to the upper surface of the electronic component, and the two fixing pieces of the fixing member are bent so that the foldable portion of the substrate is wound around the electrode portion between the electrode portion and the fixing piece. The electronic component is fixed to the substrate by fixing the tips of the two fixing pieces as they are.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an exploded perspective view of an essential part of a structure for mounting an electronic component to a substrate according to an embodiment of the present invention. As shown in the figure, in this embodiment, the substrate 10 and the electronic component 30 are configured to be mechanically and electrically connected and fixed by a fixing member 40. Each component will be described below.
[0011]
The substrate 10 is a flexible substrate in which a pair of electrode patterns 13 and 13 are formed on the surface of a synthetic resin film, for example, a flexible sheet 1 made of PET or the like. By forming notches 15 and 15 of the book, tongue-shaped bent surfaces (electrode pattern forming portions) 17 and 17 are provided.
[0012]
Each electrode pattern 13 is formed by screen printing a silver paste together with a circuit pattern 14 drawn from each electrode pattern 13. Although not shown, an insulating layer is printed on the circuit pattern 14 excluding the electrode pattern 13. The electrode pattern 13 and the circuit pattern 14 may be printed by other methods, or may be formed by copper bonding etching.
[0013]
Next, the electronic component 30 is a chip-type resistor in this embodiment, and is configured by providing electrode portions 33 and 33 on opposite side surfaces of the substantially rectangular parallelepiped main body 31. The dimensions of the electronic component 30 are, for example, 1.6 × 0.8 mm when viewed from directly above.
[0014]
Next, the fixing member 40 is configured by forming two fixing pieces 41 and 41 on both sides of the base portion 42 by bending the opposite sides of the metal plate formed in a rectangular shape upward.
[0015]
In order to attach the electronic component 30 to the substrate 10, first, the electronic component 30 is placed on the substrate 10. At this time, the electrode portions 33 and 33 of the electronic component 30 abut on the electrode patterns 13 and 13 of the substrate 10.
[0016]
Next, the fixing member 40 is pushed up from the bottom of the substrate 10 to bring the base portion 42 into close contact with the lower surface of the substrate 10 so that the two fixing pieces 41 and 41 are moved over the substrate 10 and the bent surfaces 17 and 17 are pushed up from below. Stand up. The state at this time is shown in FIG.
[0017]
Next, as shown in FIG. 3, the upper portions of both the fixing pieces 41, 41 are bent upward of the electronic component 30 using a jig (not shown). As a result, the bending surfaces 17 and 17 are pressed together with the fixed pieces 41 and 41 so as to surround the electrode portions 33 and 33, and the electrode portions 33 and 33 are strongly clamped from above and below, so that the electrode patterns 13 and 13 and the electrode portions 33 and 33 are The electrical connection between 33 and mechanical fixation are performed firmly and reliably. At this time, the tips of the fixed pieces 41, 41 face each other at a very close position.
[0018]
Then, by irradiating the tip portions of the fixed pieces 41, 41 which are close to each other and facing each other, the fixed pieces 41, 41 are welded and fixed as shown in FIG. 4 (fixed portions A, A). . FIG. 5 is a perspective view showing the state at that time. In this embodiment, two fixing portions A and A are provided by irradiating laser light at two locations. Note that the number of the fixing portions A and A may be one, or three or more, and may be formed linearly on the entire opposing sides of both the fixing pieces 41 and 41. The laser beam welding is preferable because the focus can be focused on one point and heat can be concentrated on that point, so that welding can be performed without adversely affecting the electronic component 30. However, in some cases, welding may be performed using other means. In short, it is sufficient if the fixing pieces 41 and 41 can be firmly fixed.
[0019]
Rather than using the elasticity of both fixed pieces 41 and 41 as described above, the upper and lower portions of the electrode portions 33 and 33 can be mechanically and reliably bent by bending the upper portions of both fixed pieces 41 and 41 to the upper side of the electronic component 30. Since it is strongly clamped, the electrical connection and mechanical fixation between the electrode patterns 13 and 13 and the electrode portions 33 and 33 are firmly and reliably performed. In addition, if the upper portions of both the fixing pieces 41, 41 are simply bent, the tips of both the fixing pieces 41, 41 may open over time and the fixing strength may be weakened. Since 41 are fixed together, the position where both fixing pieces 41 and 41 are bent does not change, and the fixing strength is always strong and reliable.
[0020]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are achieved. For example, the following various modifications are possible.
[0021]
(1) Although the fixed resistor is used as the electronic component in the above embodiment, other various electronic components such as a capacitor and a diode may be used. Further, the shape of the electronic component is not limited to that of the above embodiment, and may be various shapes other than a rectangular parallelepiped shape. Needless to say, the shape of the fixing member and the shape of the electrode pattern formed on the substrate can be variously modified.
[0022]
(2) As shown in FIG. 7, the size of the electrode patterns 13 and 13 may be reduced so as to contact only the lower surfaces (or the lower surface and the side surfaces) of the electrode portions 33 and 33 of the electronic component 30. . On the contrary, it may be formed only in a portion that contacts the upper surface of the electrode portions 33 and 33.
[0023]
(3) For further reinforcement, solder or adhesive may be used in combination.
[0024]
【The invention's effect】
As described above in detail, according to the present invention, even if the electronic component is downsized, the electronic component can be easily and surely and simply attached to the substrate by a mechanical fixing method without using a heating furnace or a UV furnace. It has an excellent effect that it can be attached.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a structure for attaching an electronic component 30 to a substrate 10. FIG.
FIG. 2 is an explanatory diagram of a method for attaching the electronic component 30 to the substrate 10;
FIG. 3 is an explanatory diagram of a method for attaching the electronic component 30 to the substrate 10;
4 is a cross-sectional view of a structure for attaching an electronic component 30 to a substrate 10. FIG.
FIG. 5 is a perspective view of a structure for attaching an electronic component 30 to a substrate 10;
6A and 6B are diagrams showing a conventional attachment structure of an electronic component 110 to a substrate 100, in which FIG. 6A is an exploded perspective view and FIG. 6B is a perspective view.
7 is a perspective view showing another substrate 10. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Flexible sheet 10 Board | substrate 13, 13 Electrode pattern 14 Circuit pattern 15, 15 Notch 17, 17 Bending surface (foldable part)
30 Electronic component 31 Main body 33, 33 Electrode portion 40 Fixing member 41, 41 Fixing piece 42 Base

Claims (2)

A substrate formed with an electrode pattern;
An electronic component provided with an electrode part;
A fixing member provided on both sides with fixing pieces for fixing the electrode part of the electronic component;
While the electrode pattern is in contact with the electrode part of the electronic component placed on the substrate, both the fixing pieces of the fixing member arranged on the back surface of the substrate are folded over the substrate and folded to the upper surface of the electronic component, and fixed at that time Both the fixed pieces of the member are bent so that the bendable portion of the substrate is wound around the electrode portion between the electrode portion and the fixed piece, and the tips of the two fixed pieces are fixed to each other in this state. A structure for mounting an electronic component to a board, characterized in that is fixed to the board. Structure for mounting a substrate of an electronic component according to claim 1 Symbol mounting, wherein the sticking is welded.

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