JP2532948B2 - Electronic component mounting device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus that mounts a plurality of electronic components on a single substrate with the same mounting pattern.

(B) Conventional Technology In recent years, the process of mounting electronic components on a printed circuit board has been automated by an electronic component mounting device. Such an electronic component mounting device is shown in FIG. In the figure,
(1) is a component supply unit that sends out tapes (2) in which electronic components are stored in a row at equal intervals from a tape reel (3), and a plurality of them are arranged on a slidable component supply table (4). There is. (5) is an intermittently rotating turntable, and (6), (6) ... are component suction tools provided around the turntable, which are suction stations (7) indexed by the intermittent rotation of the turntable (5). ), The electronic component is sucked from the tape (2) of the component supply unit (1). (8) is a positioning tool for centering the sucked electronic component (9), (10) is a mounting station where the suction tool (6) releases the electronic component (9) and mounts it on the printed circuit board (11), (12) holds the substrate (11),
XY Indicates an XY table that moves horizontally, and finds the electronic component mounting position on the board (11).

In such an electronic component mounting apparatus, a plurality of boards having the same mounting pattern may be obtained from one printed board. In this case, mounting data including part data relating to the type of electronic component and mounting position data relating to the relative mounting position of the electronic component as shown in FIG. 5, and a component mounting pattern based on this mounting data are formed at any position on the board. As shown in FIG. 6, the offset data indicating whether or not to perform is developed in units of the offset data, and along this, the component mounting is performed for each split board as shown in FIG.

C) Problems to be Solved by the Invention The main factors that determine the mounting time per printed circuit board in such an electronic component mounting device are the moving distance of the XY table on which the printed circuit board is installed and the reel containing the electronic components. Although the movement pitch of the component supply table for installing the components can be increased, in the conventional method, the component supply table must be moved by the number of the divided substrates in order to mount each divided substrate, and it is necessary to form one component per printed circuit board. There is a disadvantage that the mounting time becomes longer as the number of split boards to be processed increases.

D) Means for Solving the Problems The present invention has been made in view of the above-mentioned points, and when mounting a plurality of electronic components on a printed circuit board in succession, part data relating to the type of electronic component and A pattern storage unit that stores mounting data including mounting position data relating to relative mounting positions of electronic components in correspondence with step numbers, and a component mounting pattern based on the mounting data stored in the pattern storage unit on one printed circuit board. When forming a plurality of parts on the top, a pattern position storage unit that stores offset data indicating in what order on the board the component mounting pattern is formed, and an electronic component mounting described by the mounting data and the offset data. A first expanding means for expanding the position to an absolute position on the board in units of offset data; Based on the absolute position data developed by the first or second developing means, and second developing means for developing the electronic component mounting position described by the offset data and the offset data to the absolute position on the board in mounting data units. In addition, it has a control means for controlling the component supply table, the component suction tool, and the XY table so as to mount the electronic component on the substrate.

E) Function The data development method can be changed depending on the number of split boards formed on one printed board.

F) Embodiment FIG. 1 is a block diagram of a control system of the electronic component mounting apparatus of the present invention, and the same hardware configuration as that of FIG. 3 is used. In the figure, (13) shows mounting data consisting of part data relating to types of electronic components and mounting position data relating to relative mounting positions of electronic components, and component mounting patterns based on the mounting data at any position on the printed circuit board. A RAM storing offset data indicating whether to form each step number, (14) includes a first expansion program for expanding the data in the RAM (13) in units of offset data, and the RAM (13). A program ROM that stores a second expansion program for expanding the data in each of the mounting data units, (15) selects one expansion program from the above first and second expansion programs, and follows the program. The RAM (1
Simulate the actual mounting time when the data in 3) is expanded based on the first and second expansion programs described above, and expand the expansion program that takes a short time. Here, the simulation of the mounting time is the maximum movement time of the component supply table (4), the turntable (5) and the XY table (12) at each step of the developed data, the component suction time, the component The maximum centering time and the component mounting time of the above are performed for the data expanded by the respective expansion programs, and the selection comparison is performed. (16) is above
It is an input device for inputting and setting mounting data and preset data to the RAM (13) and also gives a selection instruction to the selection expanding means (15). The expansion program may be selected directly by an instruction from the input device (16) without simulation. (17) is a component supply table (4), a turntable (5), a vacuum suction tool (6) (6), an XY table (12), based on the selectively expanded data.
A control unit for controlling the positioning tool (8) is shown, and an electronic component is mounted on the printed circuit board (11) under the control of this control unit (17).

Next, the component mounting process of the present invention will be described with reference to the process explanatory diagram of FIG. First, the operator uses the input device (16) to input the mounting data indicating the repeated pattern for creating the split board and the offset data indicating the split board position on the printed board to the RAM (13) as shown in FIG. Enter in such a form (). Then, in response to an instruction from the input device (16), the selective expansion means (15) expands the data in the RAM (13) by the first and second expansion programs as shown in FIGS. 6 and 7, respectively. In this case, the wearing time is calculated (,). In this way, one of the calculated data with the shorter mounting time is selected (). After that, the control unit (17) uses the selected data and the component supply table drive unit (1
8), turntable drive unit (19), vacuum suction tool drive unit (20), XY table drive unit (21) positioning drive unit (22)
To operate the electronic components (9) on the printed circuit board (11).
(9) ... is mounted (). The mounting order when mounting using the development data of FIG. 6 is as shown in FIG. 8, and the mounting order when mounting using the development data of FIG. 7 is as shown in FIG.

In this embodiment, two split boards are formed on one printed board, but this can be done in the same way even if the number of split boards is increased to three or four.

G) Effect of the Invention As described above, the electronic component mounting apparatus of the present invention changes the data development method depending on the number of split boards formed on one printed board, so that it can be applied to various printed boards. As a result, a mounting method with a short mounting time is implemented, and it is expected that the efficiency of electronic component mounting will be improved.

[Brief description of drawings]

FIG. 1 is a block diagram showing a main part of an electronic component mounting apparatus of the present invention, FIG. 2 is an explanatory view for explaining a mounting operation, FIG. 3 is a perspective view showing a hardware configuration of the electronic component mounting apparatus, and FIG. FIG. 5 is a top view of the split board, FIG. 5 is a schematic diagram of the form of data input in the RAM, FIGS. 6 and 7 are schematic diagrams of the form of developed data, FIG. 8 and FIG. 9 are electronic component parts. It is explanatory drawing explaining the mounting order. (1) (1) …… Parts supply unit, (2) (2) ……
Parts tape, (3) (3) ... Tape reel, (4) ...
… Parts supply table, (5) …… turntable,
(6) (6) …… Parts suction tool, (7) …… Parts suction station, (8) …… Positioning tool, (10) …… Parts mounting station, (11) …… Printed circuit board, (12)… … XY
Table, (13) …… RAM, (14) …… ROM, (15) ……
Selective expansion means, (16) ... Input device, (17) ... Control section.

Claims (1)

(57) [Claims] 1. A required component supply unit is indexed to a component extraction position by moving a component supply table on which a plurality of component supply units are mounted, and an electronic component is sucked from this component supply unit by a component suction tool to mount the component. In the electronic component mounting device that transports the electronic component to the position and mounts the electronic component on the substrate position indexed by the movement of the XY table, when mounting a plurality of the above electronic components on the printed circuit board in succession, A pattern storage unit that stores mounting data, which is composed of mounting data including relative mounting positions of parts data and electronic components, corresponding to a step number, and a component mounting pattern based on the mounting data stored in the pattern storage unit. When forming multiple parts on one printed circuit board, form the above component mounting pattern at any position on the circuit board. Pattern position storage unit that stores offset data indicating whether or not to be formed in order of step numbers, and first expansion that expands the electronic component mounting position described by the mounting data and the offset data to an absolute position on the substrate in offset data units. Means, a second expanding means for expanding the electronic component mounting position described by the mounting data and the offset data to an absolute position on the substrate in units of mounting data, and the first or second expanding means. An electronic component mounting apparatus comprising: a component supply table, a component suction tool, and control means for controlling an XY table so as to mount an electronic component on the substrate based on absolute position data.