JP2578761B2 - Electronic component mounting device and mounting method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for positioning an electronic component mounting machine.

2. Description of the Related Art Conventionally, in a chip-type electronic component mounting apparatus, as shown in FIG. 3, an adhesive or cream solder 8 is applied to a printed board on an XY table, and an electronic component 7 is positioned and mounted. , But until now, the XY
It had only one kind of rising acceleration, maximum speed and falling acceleration of the table.

However, in the above-described method, the types of chip-type electronic components are diversified, and when a large-sized one is mounted, if the conventional XY table is used, the position is determined by the inertia of the electronic component 7. May be deviated from the initially mounted position (FIG. 3 (a)) (FIG. 3 (b)). In addition, XY
If the positioning speed of the table is reduced, the tact time of the machine is reduced, and there is a problem that the productivity is reduced.

The present invention has been made in view of the above problems, and provides an electronic component mounting apparatus in which an XY table is set to rise at various accelerations.

Means for Solving the Problems In order to solve the above problems, an electronic component mounting apparatus according to the present invention includes a supply unit that supplies a chip-type electronic component, and the supply unit mounts the chip-type electronic component on a printed circuit board. Mounting head and X for positioning and holding printed circuit board
A control unit for controlling a command speed for driving the XY table, and setting the XY table rising acceleration and the deceleration of the stop for each electronic component to be mounted; Positioning of the XY table with respect to each electronic component taken out from the supply means at the acceleration / deceleration set by the control unit until the electronic component is mounted on the printed circuit board. It is configured to perform an operation.

The electronic component mounting method includes a step of storing a plurality of movement acceleration / deceleration patterns in an XY table, a step of designating any of the movement acceleration / deceleration patterns for each mounted component in a mounting program, Removing the electronic component from a predetermined position according to the mounting program;
Moving the XY table to the position specified by the mounting program with the acceleration / deceleration pattern specified in the mounting program in advance for the extracted electronic component; and Mounting the electronic component at a predetermined position on the printed circuit board held by the XY table, and mounting the electronic component having the large set acceleration / deceleration before the small electronic component. It is characterized by the following.

In the configuration described above, the moving acceleration / deceleration patterns of the plurality of XY tables are stored, and one of the moving acceleration / deceleration patterns is specified for each mounted component in the mounting program, and the mounting program is After taking out the electronic component from the predetermined position, and moving the XY table to the position specified by the mounting program in the acceleration / deceleration pattern specified for the taken out electronic component,
The electronic component is mounted on a printed circuit board held on the XY table positioned in the above step. This makes it possible to arbitrarily set the movement acceleration / deceleration of the XY table with respect to an arbitrary mounting position. In the case of mounting a small chip-type electronic component, the movement acceleration / deceleration of the XY table is increased. In the case of mounting a large chip-type component, by reducing the movement acceleration / deceleration, it is possible to prevent the displacement caused by the inertia of the component due to the movement of the XY table.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a supply unit for supplying a chip-type electronic component 2, reference numeral 3 denotes a mounting head for sucking the electronic unit 2 from the supply unit 1, and reference numeral 5 denotes a mounting head for mounting the printed circuit board 4 on a predetermined position. An XY table 6 for positioning is a control device for controlling the electronic component mounting machine composed of the above elements.

As shown in FIG. 2, two types of speed waveforms are stored in the control device 6 as command speeds for driving the XY table 5, and these two speed waveforms are stored in accordance with the size of mounted components.
The XY table 5 is driven by using different types of command speeds.

The command speed shown in FIG. 2 (a) rises sharply in order to speed up the machine tact, that is, a large acceleration
This is the command speed given to the Y table 5 and used when relatively small components are not mounted on the board. Second
FIG. 2 (b) is used when the XY table 5 is driven with a gentle rise and small acceleration as compared with FIG. 2 (a), and a large component is mounted on the board. The switching of the command speed is performed in an implementation program (hereinafter referred to as an NC program) not described in the control device 6.
It is specified for each component mounting position.

Next, the operation will be described.
First, Fig. 2 (a) in the NC program stored in
It is assumed that the small parts are mounted using the command speed shown in Fig. 2 and the mounting of the large parts using the command speed shown in Fig. 2 (b) is performed after the mounting of all the small parts is completed. .

First, the mounting head 3 sucks the first small electronic component 2 from the supply unit 1 and simultaneously positions the XY table 5 at the command speed shown in FIG. The part 2 is attached to the. This operation is repeated for all the small chip electronic components 2 to perform the mounting operation. Next, when the NC program reaches a block of large parts, the command speed at which the control device 6 drives the XY table 5 is changed as shown in FIG. 2 (b), and the acceleration of the XY table 5 is reduced. To perform the positioning operation. By reducing the acceleration, the mounted large-sized chip electronic component can be prevented from being displaced by its own inertia.

As described above, the chip-type electronic components 2, 2 'are sequentially mounted on the printed circuit board 4.

Effect of the Invention As described above, the present invention holds a printed circuit board and enables variable setting of a rising acceleration and a stop deceleration.
By providing the Y table and the control unit, it is possible to eliminate the displacement due to the inertia of the chip-type electronic component mounted on the printed circuit board.

Furthermore, in the case of connecting multiple mounting machines and sharing the mounting parts to produce printed circuit boards, in order to respond to high-mix low-volume production, fixing the mounting parts in charge at each equipment etc. Even when large parts must be installed in the equipment in the previous process, X
Since the movement acceleration / deceleration of the -Y table can be set, it is possible to cope with the situation by simply setting the movement acceleration / deceleration for each component to a small value in the mounting program in the equipment in a later process.

[Brief description of the drawings]

FIG. 1 is a schematic view of an electronic component mounting apparatus according to an embodiment of the present invention, FIGS. 2 (a) and 2 (b) are acceleration diagrams according to the embodiment, and FIGS. 3 (a) and 3 (b) are chips. FIG. 4 is a plan view showing a displacement of a mold electronic component. 2 ... chip type electronic parts, 3 ... mounting head, 4 ... printed circuit board, 5 ... XY table.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Akira Mori 1006 Kadoma, Kadoma Matsushita Electric Industrial Co., Ltd. (56) References JP-A-61-161800 (JP, A)

Claims (2)

(57) [Claims] 1. Supply means for supplying chip-type electronic components;
The supply means controls a mounting head for mounting the chip-type electronic component on a printed circuit board, an XY table for positioning and holding the printed circuit board, and a command speed for driving the XY table. A control unit for setting a rising acceleration and a deceleration of a stop for each electronic component to be mounted, and mounting the electronic component on a printed circuit board for each electronic component taken out by the supply means. An electronic component mounting apparatus configured to perform an XY table positioning operation on the electronic component at an acceleration / deceleration set by the control unit. 2. A supply means for supplying a chip-type electronic component;
The supply means controls a mounting head for mounting the chip-type electronic component on a printed circuit board, an XY table for positioning and holding the printed circuit board, and a command speed for driving the XY table. A control unit for setting a rising acceleration and a deceleration of a stop for each electronic component to be mounted, and mounting the electronic component on a printed circuit board for each electronic component taken out from the supply means A method for mounting an electronic component in an electronic component mounting apparatus configured to perform an XY table positioning operation on the electronic component at an acceleration / deceleration set in the control unit, comprising: XY A step of storing a plurality of movement acceleration / deceleration patterns in a table; and specifying one of the movement acceleration / deceleration patterns for each mounted component in a mounting program. A step of taking out the electronic component from a predetermined position in accordance with the mounting program, and specifying the XY table with the acceleration / deceleration pattern previously specified in the mounting program for the taken out electronic component by the mounting program Moving the electronic component to a predetermined position on the printed circuit board held on the XY table after the positioning in the above-mentioned step. A component mounting method characterized in that electronic components having large acceleration / deceleration are mounted before small electronic components.