JP2527709Y2 - Transport parts for semiconductor manufacturing equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a structure of a wafer transfer part.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 4, when a Si wafer 4 is sucked by a fork portion 3 as shown in FIG.
The fork unit 3 is provided with a suction unit 5, and the fork unit 3 is configured to be movable by a movable unit 7 and a main body rail unit 8.
The suction part 5 is a part for adsorbing and desorbing the Si wafer 4 and is the only part that directly contacts the Si wafer 4.

The material of the fork 3 is mainly aluminum,
Stainless steel or the like is used.

[0004]

However, since the above-mentioned conventional transfer parts use metals such as aluminum and stainless steel, the wafer 4 is contaminated with metal, and when the wafer 4 is sucked, the wafer 4 is not contaminated. Is recessed. That is, there is a drawback that the adsorption and desorption of the wafer 4 causes a stress in the adsorption portion of the wafer 4.

[0005]

The transporting parts of the semiconductor manufacturing apparatus of the present invention have flexibility in a portion directly in contact with the wafer, that is, in a fork, an orientation flat aligning portion, and a peripheral portion of the wafer suction such as a suction pen. A high-hardness material is applied to a polymer material, for example, a silicone rubber-based material or a polyimide-based material by coding or bonding. High-hardness materials include diamond, Si ₃ N ₄ ,
A material having an HV of 1000 or more such as SiC or ZrO ₂ is used.

[0006]

According to the structure of the transporting parts of the semiconductor manufacturing apparatus described above, a flexible polymer material is coated with a high-hardness material to eliminate the metal contamination of the wafer such as aluminum and stainless steel. Metal contamination during transport is eliminated. Further, by using a high-hardness material, particles attached to and generated on the back surface of the wafer are reduced. In addition, the use of the flexible polymer material serves to eliminate the dent of the wafer suction portion, and eliminates the stress on the wafer.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a fork of a transport component according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of FIG. 1A-A '.
In the figure, reference numeral 1 denotes a flexible polymer material. Reference numeral 2 denotes a high-hardness material, for example, a diamond thin film or the like made of a polymer material 1
Is coated or bonded. Reference numeral 3 denotes a fork, which is made of aluminum or stainless steel. 4 is
The Si wafer 5 is a wafer suction unit.

Next, the operation of the above-mentioned transport component will be described. According to this embodiment, when the fork 3 holds the Si wafer 4, the Si wafer 4 is sucked by the suction unit 5. At this time, since the polymer material 1 is provided on the surface of the fork 3, even when the Si wafer 4 is warped or distorted, the Si wafer 4 does not change its shape due to the deformation of the polymer material 1. In addition, the suction force of the suction unit 5 can be held without any need for fine adjustment.

[0009]

FIG. 3 is a perspective view of a second embodiment of the present invention. This embodiment is the same as the first embodiment except that the suction pen 6 is formed of a fluororesin.
The same portions are denoted by the same reference numerals, and description thereof will be omitted.

The operation of this embodiment is the same as that of the first embodiment.
The shape of the suction portion of the suction pen 6 is easily changed so as to conform to the shape of the wafer 4, and there is an advantage that stress is not applied to the Si wafer 4.

[0011]

As described above, the present invention is based on the use of a flexible polymer material 1 and a high-hardness material 2 at a portion of the transfer section of a semiconductor manufacturing apparatus which comes into contact with the wafer. Since there is no distortion and the hardness of the contact portion is large, there is an effect of reducing particles and reducing metal contamination.

[Brief description of the drawings]

FIG. 1 is a perspective view of a fork portion according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view taken along line A-A 'of FIG.

FIG. 3 is a perspective view of a suction pen according to another embodiment of the present invention.

FIG. 4 is a perspective view of a fork which is a conventional transport component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 High polymer material 2 High hardness material (diamond thin film etc.) 3 Fork (A or stainless steel) 4 Si wafer 5 Suction part 6 Suction pen 7 Movable part 8 Body rail

Claims (1)

(57) [Scope of request for utility model registration] In a semiconductor manufacturing apparatus, a portion of a transport component of a semiconductor manufacturing apparatus which absorbs a wafer is provided on a flexible polymer material.
A transport part for a semiconductor manufacturing apparatus, wherein a thin film of a high-hardness material is applied.