JPH053481Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a suction chuck plate used to suction-fix or suction-transfer silicon wafers, thin films, and other articles.

[Conventional technology]

Conventionally, articles such as silicon wafers, thin films, wires, nets, etc. have been used as means for fixing the articles when they are subjected to appropriate processing, or as means for transporting the articles (hereinafter referred to as objects to be attracted). A suction chuck plate is used to hold the
A metal sintered body, a ceramic sintered body, or the like is used for this suction chuck plate. These sintered bodies, as shown in cross section in FIG. It is used as an adsorption surface.

[Problem that the invention attempts to solve]

However, since the holes in the conventional suction chuck plate are connected in the lateral direction, leakage is likely to occur when the object 10 to be sucked is smaller than the suction surface 2 as shown in FIG. There was a problem that suction fixation, suction transportation, etc. could not be performed. Furthermore, when a pressing force is applied to the suctioned object 10, such as when cutting the suctioned and held object 10, there is a problem in that compressive deformation tends to occur on the suction surface.
Furthermore, since the pores of conventional filters have a complicated shape, they tend to become clogged with dirt and dust, and are difficult to clean.

The present invention was developed to solve these problems, and even if the object to be attracted is smaller than the suction surface, it can be suction-fixed and suction-transferred well, and even if vertical force is applied to the suction surface. It is an object of the present invention to provide a suction chuck plate that is hard to deform and easy to clean.

[Means for solving problems]

To achieve the above object, the present invention provides a suction chuck plate characterized by sintering a large number of wire rods arranged in parallel and forming a flat surface substantially perpendicular to the wire rods as a suction surface. shall be.

〔Example〕

Hereinafter, the present invention will be described in more detail with reference to embodiments of the present invention shown in the drawings.

FIG. 1 is a sectional view showing a suction holder equipped with a suction chuck plate according to an embodiment of the present invention;
3 is a suction chuck plate, 3A is a suction surface, 4 is a holder for attaching this suction chuck plate 3, 5 is a suction hole connected to a suction source (not shown), and 6 is the back side of the suction chuck plate 3 This is a suction chamber located in almost the entire area. The suction chuck plate 3 is made by sintering wire rods 8 having approximately the same diameter in parallel and sintering them, as shown in FIG. 2 as an enlarged top view and as shown in FIG. It is cut to a desired thickness almost perpendicularly to the wire 8, and at least the upper surface 3A is precisely flat-processed by grinding, lapping, etc. while restoring the pores on the surface to form a suction surface almost perpendicular to the wire 8. That is. With this configuration, a large number of straight holes 9 are formed which communicate the upper and lower flat surfaces 3A, 3B, and each hole 9 is surrounded by a wire rod 8, so that each hole is independent.

Thus, in FIG. 1, by suctioning the suction chamber 6 through the suction hole 5 of the holder 4, each hole 9 of the suction chuck plate 3 is suctioned, and as shown in FIG. Even if a smaller object 10 is adsorbed, the hole 9 blocked by the object 10 will not leak from the adjacent hole, and it will be able to be held by adsorption well. can. In addition, the suction chuck plate 3 having the above structure has a structure in which the wire rods 8 are arranged and sintered in a direction substantially perpendicular to the suction surface 3A, so it has excellent strength in the compression direction, and the suction surface is not subjected to vertical force. Deformation does not easily occur even when applied. Furthermore, since the holes 9 have a straight and simple shape, they are less likely to be clogged with dirt, dust, etc.
Moreover, even if it becomes clogged, it can be easily cleaned.

Here, the material of the wire rod 8 constituting the suction chuck plate 3 is not particularly limited, and any material that can be sintered such as steel, stainless steel, copper, nickel, and titanium can be used. The diameter of the wire rod 8 determines the size, pitch, etc. of the holes 9, and is determined according to the desired hole size.
The thickness is preferably about 50 μm to 2 mm. If this diameter is smaller than 50 μm, the pores 9 will be too small and the cost of the wire 8 will be high. On the other hand, if it is larger than 2 mm, the pore diameter will be too large, and small pores can be reduced by using sintered metal. The advantage of making countless copies is reduced.

[Effect of idea]

As is clear from the above description, the suction chuck plate of the present invention is characterized by sintering a large number of wire rods arranged in parallel and forming a flat surface substantially perpendicular to the wire rods as a suction surface. It has numerous independent holes that communicate from the suction surface to the back surface, which allows it to suction and hold objects smaller than the suction surface, such as small parts, wires, nets, etc. Moreover, it is resistant to compressive deformation, hardly deforming even when the suction surface is pressed, and the pores have a simple shape, so it is difficult to get clogged with dirt and dust, and it is easy to clean. have.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of a suction holder equipped with a suction chuck plate according to an embodiment of the present invention, Fig. 2 is an enlarged top view of the suction chuck plate, and Fig. 3 is viewed from the - arrow in Fig. 2. 4 is an enlarged sectional view of a conventional suction chuck plate. 1... Unusual powder, 3... Suction chuck plate, 3A... Adsorption surface, 4... Holder, 5... Suction hole, 6... Suction chamber, 8... Wire rod, 9... Hole,
10...Substance to be adsorbed.

Claims (1)

[Scope of utility model registration request] A suction chuck plate characterized in that a large number of wire rods are arranged in parallel and sintered, and a flat surface substantially perpendicular to the wire rods is formed to serve as a suction surface.