JP2023047464A - コンタクトユニット及び検査治具 - Google Patents
コンタクトユニット及び検査治具 Download PDFInfo
- Publication number
- JP2023047464A JP2023047464A JP2021156392A JP2021156392A JP2023047464A JP 2023047464 A JP2023047464 A JP 2023047464A JP 2021156392 A JP2021156392 A JP 2021156392A JP 2021156392 A JP2021156392 A JP 2021156392A JP 2023047464 A JP2023047464 A JP 2023047464A
- Authority
- JP
- Japan
- Prior art keywords
- block
- flexible substrate
- speed signal
- conductive pattern
- contact unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 239000002184 metal Substances 0.000 claims description 15
- 230000000052 comparative effect Effects 0.000 description 19
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000010409 thin film Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021156392A JP2023047464A (ja) | 2021-09-27 | 2021-09-27 | コンタクトユニット及び検査治具 |
| CN202280053181.7A CN117795351A (zh) | 2021-09-27 | 2022-09-08 | 接触单元及检查治具 |
| PCT/JP2022/033645 WO2023047962A1 (ja) | 2021-09-27 | 2022-09-08 | コンタクトユニット及び検査治具 |
| TW111134140A TW202319749A (zh) | 2021-09-27 | 2022-09-08 | 接觸單元及檢查治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021156392A JP2023047464A (ja) | 2021-09-27 | 2021-09-27 | コンタクトユニット及び検査治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023047464A true JP2023047464A (ja) | 2023-04-06 |
| JP2023047464A5 JP2023047464A5 (zh) | 2024-09-30 |
Family
ID=85720585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021156392A Pending JP2023047464A (ja) | 2021-09-27 | 2021-09-27 | コンタクトユニット及び検査治具 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2023047464A (zh) |
| CN (1) | CN117795351A (zh) |
| TW (1) | TW202319749A (zh) |
| WO (1) | WO2023047962A1 (zh) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912399A (en) * | 1987-06-09 | 1990-03-27 | Tektronix, Inc. | Multiple lead probe for integrated circuits in wafer form |
| JP3028067B2 (ja) * | 1997-01-16 | 2000-04-04 | 日本電気株式会社 | 多ピン高周波プローブ |
| US8410806B2 (en) * | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
| US9207259B2 (en) * | 2011-06-10 | 2015-12-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe card for probing integrated circuits |
| JP6630117B2 (ja) * | 2015-03-27 | 2020-01-15 | 株式会社ヨコオ | コンタクトユニット及び検査治具 |
| IT201700017037A1 (it) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura per applicazioni ad alta frequenza |
| US11300589B2 (en) * | 2017-07-24 | 2022-04-12 | Yokowo Co., Ltd. | Inspection jig |
| JP2019109103A (ja) * | 2017-12-18 | 2019-07-04 | 株式会社ヨコオ | 検査治具 |
| JP2019109101A (ja) * | 2017-12-18 | 2019-07-04 | 株式会社ヨコオ | 検査治具 |
| JP7336176B2 (ja) * | 2017-12-18 | 2023-08-31 | 株式会社ヨコオ | 検査治具 |
-
2021
- 2021-09-27 JP JP2021156392A patent/JP2023047464A/ja active Pending
-
2022
- 2022-09-08 TW TW111134140A patent/TW202319749A/zh unknown
- 2022-09-08 CN CN202280053181.7A patent/CN117795351A/zh active Pending
- 2022-09-08 WO PCT/JP2022/033645 patent/WO2023047962A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| TW202319749A (zh) | 2023-05-16 |
| CN117795351A (zh) | 2024-03-29 |
| WO2023047962A1 (ja) | 2023-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240919 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240919 |