JP2020028883A5

JP2020028883A5 -

Info

Publication number: JP2020028883A5
Application number: JP2018149667A
Authority: JP
Filing date: 2018-08-08
Publication date: 2021-09-16
Anticipated expiration: 2038-08-08

Claims

In a laser processing method for laser processing an object to be processed whose processing area is larger than the scanning area where the laser beam is scanned.
The object to be machined is held in a first driving device that moves in the first direction, and is held.
Next, the laser beam that passes through the galvano scanner and the fθ lens and irradiates the processed object with the galvano scanner while moving the processed object in the first direction by the first driving device. When scanning the object to be processed by reciprocating it in the first direction and the opposite direction of the first direction.
The moving speed of the machining object is Vt, the scanning speed of the laser beam is Vs, and the machining object is moved at the moving speed Vt on the same straight line as a part of the scheduled machining line of the machining object. Then, the laser beam is continuously reciprocated three times or more at the scanning speed Vs to irradiate the laser beam.
_{The linear velocity V 0} of the scanning of the laser beam is controlled by the control unit so as to be relatively constant, and among the reciprocating scanning by the scanning velocity Vs, the galvano scanner outward scanning speed of the outward scanning is set to Vs _1. Galvano scanner for return scan If the return scan speed is Vs ₂ ,
The linear velocity V ₀ in the outbound scan is
V ₀ = Vs ₁ −Vt,
The linear velocity V ₀ in the return scan is
V ₀ = Vs ₂ + Vt,
Since the linear velocity V ₀ is controlled to be relatively constant,
Vt = (Vs ₁ −Vs ₂ ) / 2 ,
Laser processing method.

In a laser processing method for laser processing an object to be processed whose processing area is larger than the scanning area where the laser beam is scanned.
The object to be machined is held in a first driving device that moves in the first direction, and is held.
Next, the laser beam that passes through the galvano scanner and the fθ lens and irradiates the processed object with the galvano scanner while moving the processed object in the first direction by the first driving device. When scanning the object to be processed by reciprocating it in the first direction and the opposite direction of the first direction.
The moving speed of the machining object is Vt, the scanning speed of the laser beam is Vs, and the machining object is moved at the moving speed Vt on the same straight line as a part of the scheduled machining line of the machining object. Then, the laser beam is continuously reciprocated three times or more at the scanning speed Vs to irradiate the laser beam.
Linear velocity V of scanning the laser beam ₀₀ Is controlled by the control unit so as to be relatively constant, and among the reciprocating scans at the scanning speed Vs, the galvano scanner outward scanning speed of the outward scanning is Vs. ₁₁ Galvano scanner for return scan Return scan speed Vs ₂₂ Then
The galvano scanner has a return scanning speed Vs of the galvano scanner. ₂₂ The galvano scanner outward scanning speed Vs ₁₁ Is fast, Vs ₁₁ > Vs ₂₂ And
The scanning speed Vs of the galvano scanner is more than twice as fast as the moving speed Vt, and Vs> 2Vt.
Laser processing method.

In the reciprocating scanning, a scanning locus is formed by the reciprocating operation of the galvano scanner along the scheduled machining line.
The number of reciprocating movements is 3 or more and an odd number.
The laser processing method according to claim 1 or 2.

In the control unit, the reciprocating scanning by the galvano scanner and the movement at a constant speed in one direction along the first direction by the first driving device are coordinated and combined to obtain the scanning locus. It has a stepped shape in the depth direction of laser machining.
The laser processing method according to claim 3.

Wherein, in the processing end area of the machining start point and the machining end point by the laser beam, and generates and scans the scanning trajectory to scan overlap to be without a step of cross-section of the workpiece To control,
The laser processing method according to claim 4.

The galvanometer scanner or al of the laser beam is scanned so as to generate the scanning trajectory so as to pass through the center of the fθ lens,
The scanning locus is within the locus passing range of the fθ lens, and when the maximum scanning diameter of the fθ lens is Ds and the locus passing range width is A,
A = Ds * sinπ / 4 * 0.06
The scanning is performed so as to generate the scanning locus under the condition of
The laser processing method according to any one of claims 3 to 5.

In a laser processing apparatus that laser-processes an object to be processed whose processing area is larger than the laser scanning area that scans the laser beam.
A drive stage that moves in the first direction at a moving speed of Vt while holding the object to be machined,
A laser emitting unit that emits the laser beam and
The scanning direction of the laser beam emitted from the laser emitting portion is changed, and the laser beam is scanned so as to reciprocate in the first direction and the opposite direction of the first direction with respect to the processing object. A galvano scanner that scans at speed Vs and
An fθ lens that transmits the laser light emitted from the galvano scanner and irradiates the processed object at a predetermined angle.
The drive of the drive stage and the galvano scanner is controlled, and the drive stage moves the object to be processed in the first direction, while the galvano scanner uses the galvano scanner via the galvano scanner and the fθ lens. When the object to be processed is irradiated with laser light for scanning, the moving speed of the object to be processed is Vt, the scanning speed of the laser light is Vs, and the object to be processed is moved at the moving speed Vt. At the same time, a control unit that controls to irradiate the laser beam by continuously reciprocating the laser beam three or more times at the scanning speed Vs on the same straight line as a part of the scheduled machining line of the object to be processed. And have
When controlled by the control unit
_{The linear velocity V 0} of the scanning of the laser beam is controlled to be relatively constant, and among the reciprocating scans at the scanning speed Vs, the galvano scanner outward scanning speed of the outward scanning is set to Vs ₁ and the return scanning is performed. If the return scanning speed of the galvano scanner is Vs ₂ ,
The linear velocity V ₀ in the outbound scan is
V ₀ = Vs ₁ −Vt,
The linear velocity V ₀ in the return scan is
V ₀ = Vs ₂ + Vt,
Since the linear velocity V ₀ is controlled to be relatively constant,
Vt = (Vs ₁ −Vs ₂ ) / 2 ,
Laser processing equipment.

In a laser processing apparatus that laser-processes an object to be processed whose processing area is larger than the laser scanning area that scans the laser beam.
A drive stage that moves in the first direction at a moving speed of Vt while holding the object to be machined,
A laser emitting unit that emits the laser beam and
The scanning direction of the laser beam emitted from the laser emitting portion is changed, and the laser beam is scanned so as to reciprocate in the first direction and the opposite direction of the first direction with respect to the processed object. A galvano scanner that scans at speed Vs and
An fθ lens that transmits the laser light emitted from the galvano scanner and irradiates the processed object at a predetermined angle.
The drive of the drive stage and the galvano scanner is controlled, and the drive stage moves the object to be processed in the first direction, while the galvano scanner uses the galvano scanner via the galvano scanner and the fθ lens. When the object to be processed is irradiated with laser light for scanning, the moving speed of the object to be processed is Vt, the scanning speed of the laser light is Vs, and the object to be processed is moved at the moving speed Vt. At the same time, a control unit that controls to irradiate the laser beam by continuously reciprocating the laser beam three or more times at the scanning speed Vs on the same straight line as a part of the scheduled machining line of the object to be processed. And have
When controlled by the control unit
Linear velocity V of scanning the laser beam ₀₀ Is controlled to be relatively constant, and among the reciprocating scans at the scanning speed Vs, the galvano scanner outward scanning speed of the outward scanning is Vs. ₁₁ Galvano scanner for return scan Return scan speed Vs ₂₂ Then
The galvano scanner has a return scanning speed Vs of the galvano scanner. ₂₂ The galvano scanner outward scanning speed Vs ₁₁ Is fast, Vs ₁₁ > Vs ₂₂ And
The scanning speed Vs of the galvano scanner is more than twice as fast as the moving speed Vt, and Vs> 2Vt.
Laser processing equipment.

The drive stage is an X-axis drive stage in which the object to be machined is held and moved along the X-axis, which is the first direction.
The laser processing device is
A processing head having the galvano scanner and the fθ lens, and
The machining head includes a Z-axis drive stage that moves the machining head in the direction of the Z-axis that intersects the X-axis.
The Z-axis drive stage is attached, and further includes a Y-axis drive stage for moving the machining head and the Z-axis drive stage in the direction of the X-axis and the Y-axis intersecting the Z-axis.
The control unit also controls the drive of the Z-axis drive stage and the Y-axis drive stage, respectively.
The laser processing apparatus according to claim 7 or 8.

The control unit cooperatively controls the drive stage and the galvano scanner to perform the reciprocating scanning, generates a predetermined scanning locus, and scans the object to be processed into a cut product having a predetermined shape. do,
The laser processing apparatus according to any one of claims 7 to 9.

The control unit controls the galvano scanner while controlling the X-axis drive stage and the Y-axis drive stage so that the laser beam can scan the scheduled machining line having an arbitrary shape at a constant speed and in one direction. Control so that the relative linear velocity is constant while reciprocating on the same scheduled machining line within the scanning area.
The laser processing apparatus according to claim 9.

The laser emitting unit is a laser oscillator that oscillates the laser beam at an ultrashort pulse of picoseconds to femtoseconds and a maximum frequency of 1 MHz or more.
The laser processing apparatus according to any one of claims 7 to 11.

The fθ lens is an fθ lens having an F value of 45 or more and 110 or less.
The laser processing apparatus according to any one of claims 7 to 12.