JP2020051759A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020051759A5 JP2020051759A5 JP2018178081A JP2018178081A JP2020051759A5 JP 2020051759 A5 JP2020051759 A5 JP 2020051759A5 JP 2018178081 A JP2018178081 A JP 2018178081A JP 2018178081 A JP2018178081 A JP 2018178081A JP 2020051759 A5 JP2020051759 A5 JP 2020051759A5
- Authority
- JP
- Japan
- Prior art keywords
- light
- unit
- foreign matter
- inspection device
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
本発明の一側面によれば、物体の被検面上の異物を検査する異物検査装置であって、前記被検面に検査光を投光する投光部と、前記投光部により前記検査光が投光されることによって生じる前記異物からの散乱光を受光する受光部とを有し、前記投光部の光軸と前記受光部の光軸とが交わる点が、前記被検面のとりうる高さ範囲からずれた位置になるように、前記投光部と前記受光部が配置されていることを特徴とする異物検査装置が提供される。 According to one aspect of the present invention, it is a foreign matter inspection device that inspects a foreign substance on an object to be inspected, and the inspection is performed by a light projecting unit that projects inspection light onto the surface to be inspected and the light projecting unit. The surface to be inspected has a light receiving portion that receives the scattered light from the foreign matter generated by the light being projected, and the point where the optical axis of the light projecting portion and the optical axis of the light receiving portion intersect is the surface to be inspected. so that at a position deviated from the height range that can be taken, the light receiving unit and the light projecting unit foreign matter inspection apparatus characterized by being arranged is provided.
そこで、実施形態では、投光部２５の光軸と受光部２６の光軸とが交わる点が、被検面のとりうる高さ範囲内からずれた位置になるように、投光部２５と受光部２６が配置される。例えば、図９に示されるように、被検面上の投光部２５の光軸から外れた領域で、被検面に平行な方向（Ｙ方向）に、光強度の変化が緩やかな領域に受光部２６の光軸が位置するように、投光部２５と受光部２６が配置される。そうすると、図１０（Ａ）に示されるように、被検面上の撓み（Ｚ１，Ｚ２）に応じて照明領域が被検面と平行方向（ａ，ｂ）にずれてしまっても、Ｙ方向の位置Ａ，Ｂ，Ｃの間で被検面上の受光部の光軸上にある光強度は鈍感に（緩やかに）変化する。そのため、図１０（Ｂ）に示されるように、同じ大きさの異物に対する信号強度のばらつきも小さい。このとき、照明光の強度や異物からの光も小さくなりセンサ上の信号出力は低くなるが、異物の有無の判別に影響がない信号強度が確保されていればよい。照明領域に対する受光部の相対位置を調整する際に発生した、センサ部で検出された異物からの光量の変化は、光源の出力を調整することが可能である。 Therefore, in the embodiment, the optical axis of the light projecting portion 25 intersect point and the optical axis of the light receiving portion 26, so that the position shifted from the height range which can be taken of the test surface, a light projecting portion 25 The light receiving unit 26 is arranged. For example, as shown in FIG. 9, in a region on the test surface deviating from the optical axis of the light projecting unit 25, in a direction parallel to the test surface (Y direction), a region in which the light intensity changes slowly. The light projecting unit 25 and the light receiving unit 26 are arranged so that the optical axis of the light receiving unit 26 is located. Then, as shown in FIG. 10A, even if the illumination region shifts in the direction parallel to the test surface (a, b) according to the deflection (Z1, Z2) on the test surface, the Y direction The light intensity on the optical axis of the light receiving portion on the test surface changes insensitively (slowly) between the positions A, B, and C. Therefore, as shown in FIG. 10B, the variation in signal strength with respect to foreign matter of the same size is small. At this time, the intensity of the illumination light and the light from the foreign matter are also reduced, and the signal output on the sensor is lowered, but it is sufficient that the signal strength that does not affect the determination of the presence or absence of the foreign matter is secured. The output of the light source can be adjusted by changing the amount of light from the foreign matter detected by the sensor unit when adjusting the relative position of the light receiving unit with respect to the illumination region.
投光部２５と受光部２６との相対位置の調整は、投光部２５の調整部５１もしくは受光部２６の調整部５２、またはその両方を用いて行うことができる。図１１は、投光部２５の調整部５１を用いて、投光部２５を検査駆動方向（Ｙ方向）に調整する例を示している。制御部Ｃは、投光部２５の光軸と受光部２６の光軸とが交わる点が、被検面のとりうる高さ範囲からずれた位置になるように、調整部５１を制御することができる。図１２は、受光部２６の調整部５２を用いて、受光部２６を検査駆動方向（Ｙ方向）に調整する例を示している。制御部Ｃは、投光部２５の光軸と受光部２６の光軸とが交わる点が、被検面のとりうる高さ範囲からずれた位置になるように、調整部５２を制御することができる。図１３は、投光部２５の平行平板ガラス２４を用いて、投光部２５の光軸の位置を調整する例を示している。ここで、投光部２５は、図１３に示されるように、光路変更部材である平行平板ガラス２４の回転角度を調整することにより、被検面へ至る出射光の光路の変更量を調整する調整部２４ａを含む。制御部Ｃは、投光部２５の光軸と受光部２６の光軸とが交わる点が、被検面のとりうる高さ範囲からずれた位置になるように、調整部２４ａを制御することができる。 The relative position of the light emitting unit 25 and the light receiving unit 26 can be adjusted by using the adjusting unit 51 of the light emitting unit 25, the adjusting unit 52 of the light receiving unit 26, or both. FIG. 11 shows an example in which the light projecting unit 25 is adjusted in the inspection drive direction (Y direction) by using the adjusting unit 51 of the light projecting unit 25. Control unit C, as the point where the optical axis of the light projecting portion 25 and the optical axis of the light receiving portion 26 intersect becomes the position displaced from the height range which can be taken of the test surface, controlling adjusting unit 51 Can be done. FIG. 12 shows an example in which the light receiving unit 26 is adjusted in the inspection driving direction (Y direction) by using the adjusting unit 52 of the light receiving unit 26. Control unit C, as the point where the optical axis of the light projecting portion 25 and the optical axis of the light receiving portion 26 intersect becomes the position displaced from the height range which can be taken of the test surface, controlling adjusting unit 52 Can be done. FIG. 13 shows an example of adjusting the position of the optical axis of the light projecting unit 25 by using the parallel flat glass 24 of the light projecting unit 25. Here, as shown in FIG. 13, the light projecting unit 25 adjusts the amount of change in the optical path of the emitted light reaching the surface to be inspected by adjusting the rotation angle of the parallel flat plate glass 24 which is an optical path changing member. The adjusting unit 24a is included. Control unit C, as the point where the optical axis of the light projecting portion 25 and the optical axis of the light receiving portion 26 intersect becomes the position displaced from the height range which can be taken of the test surface, controlling adjusting unit 24a Can be done.
Claims (12)
前記被検面に検査光を投光する投光部と、
前記投光部により前記検査光が投光されることによって生じる前記異物からの散乱光を受光する受光部と、
を有し、
前記投光部の光軸と前記受光部の光軸とが交わる点が、前記被検面のとりうる高さ範囲からずれた位置になるように、前記投光部と前記受光部が配置されていることを特徴とする異物検査装置。 A foreign matter inspection device that inspects foreign matter on the surface to be inspected.
A light projecting unit that projects inspection light onto the surface to be inspected,
A light receiving unit that receives scattered light from the foreign matter generated by projecting the inspection light by the light projecting unit, and a light receiving unit that receives the scattered light from the foreign matter.
Have,
That the optical axis of the light projecting unit and the optical axis of the light receiving portion intersect said to be the position shifted from the height range which can be taken of the test surface, the light receiving unit and the light projecting unit is arranged A foreign matter inspection device characterized by being
前記投光部の光軸と前記受光部の光軸とが交わる点が前記高さ範囲からずれた位置になるように前記調整部を制御する制御部と、
を有することを特徴とする請求項１に記載の異物検査装置。 An adjusting unit that adjusts the relative position between the light emitting unit and the light receiving unit,
A control unit that controls the adjustment unit so that the point where the optical axis of the light projecting unit and the optical axis of the light receiving unit intersect is located at a position deviated from the height range.
The foreign matter inspection device according to claim 1, wherein the foreign matter inspection device is provided.
前記光路変更部材の回転角度を調整することにより前記光路の変更量を調整する調整部と、
前記投光部の光軸と前記受光部の光軸とが交わる点が前記高さ範囲からずれた位置になるように前記調整部を制御する制御部と、
を有することを特徴とする請求項１に記載の異物検査装置。 The light projecting unit includes a light source, a lens through which the emitted light emitted from the light source passes, and an optical path changing member that changes the optical path of the emitted light that reaches the surface to be inspected through the lens.
An adjusting unit that adjusts the amount of change in the optical path by adjusting the rotation angle of the optical path changing member,
A control unit that controls the adjustment unit so that the point where the optical axis of the light projecting unit and the optical axis of the light receiving unit intersect is located at a position deviated from the height range.
The foreign matter inspection device according to claim 1, wherein the foreign matter inspection device is provided.
前記制御部は、前記被検面に前記平坦度に従う変形があっても前記判定の所定の精度が確保されるように前記調整部による調整量を決定することを特徴とする請求項４に記載の異物検査装置。 Further having a processing unit that processes the light receiving result of the light receiving unit and determines the presence or absence of the foreign matter.
The fourth aspect of claim 4, wherein the control unit determines an adjustment amount by the adjustment unit so that a predetermined accuracy of the determination is ensured even if the surface to be inspected is deformed according to the flatness. Foreign matter inspection device.
前記検査光の一部を遮光する遮光部材と、
前記遮光部材の位置を調整する遮光調整部と、
を更に有し、
前記制御部は、更に、前記検査光が前記パターンの位置に到達しないように前記遮光調整部を制御することを特徴とする請求項２乃至６のいずれか１項に記載の異物検査装置。 The object is a mask for an exposure apparatus on which a pattern is formed.
A light-shielding member that blocks a part of the inspection light,
A light-shielding adjustment unit that adjusts the position of the light-shielding member,
With more
The foreign matter inspection device according to any one of claims 2 to 6, wherein the control unit further controls the light blocking adjustment unit so that the inspection light does not reach the position of the pattern.
前記露光装置内に配置された光透過性の板状部材の表面に付着した異物を検査する請求項１乃至８のいずれか１項に記載の異物検査装置を含むことを特徴とする露光装置。 An exposure apparatus that projects a mask pattern onto a substrate to expose the substrate.
The exposure apparatus according to any one of claims 1 to 8, wherein the exposure apparatus includes the foreign matter inspection apparatus according to any one of claims 1 to 8, which inspects foreign matter adhering to the surface of a light-transmitting plate-shaped member arranged in the exposure apparatus.
前記工程で前記露光された基板を現像する工程と、
を含み、前記現像された基板から物品を製造することを特徴とする物品製造方法。 A step of exposing a substrate using the exposure apparatus according to any one of claims 9 to 11.
The step of developing the exposed substrate in the step and
A method for producing an article, which comprises the present invention and comprises producing an article from the developed substrate.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018178081A JP7292842B2 (en) | 2018-09-21 | 2018-09-21 | Foreign Matter Inspection Apparatus, Exposure Apparatus, and Article Manufacturing Method |
| TW108130577A TWI845542B (en) | 2018-09-21 | 2019-08-27 | Foreign matter inspection device, exposure device and article manufacturing method |
| KR1020190110470A KR102582877B1 (en) | 2018-09-21 | 2019-09-06 | Foreign matter checking apparatus, exposure apparatus, and article manufacturing method |
| CN201910873185.XA CN110941138B (en) | 2018-09-21 | 2019-09-17 | Foreign matter inspection device, exposure device, and article manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018178081A JP7292842B2 (en) | 2018-09-21 | 2018-09-21 | Foreign Matter Inspection Apparatus, Exposure Apparatus, and Article Manufacturing Method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020051759A JP2020051759A (en) | 2020-04-02 |
| JP2020051759A5 true JP2020051759A5 (en) | 2021-10-14 |
| JP7292842B2 JP7292842B2 (en) | 2023-06-19 |
Family
ID=69905842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018178081A Active JP7292842B2 (en) | 2018-09-21 | 2018-09-21 | Foreign Matter Inspection Apparatus, Exposure Apparatus, and Article Manufacturing Method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7292842B2 (en) |
| KR (1) | KR102582877B1 (en) |
| CN (1) | CN110941138B (en) |
| TW (1) | TWI845542B (en) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06235624A (en) * | 1992-12-15 | 1994-08-23 | Hitachi Ltd | Inspecting method and apparatus for transparent sheet |
| JPH06288902A (en) * | 1993-03-31 | 1994-10-18 | Sony Corp | Attenuated total reflactance type thin film evaluating device |
| JPH0815169A (en) * | 1994-06-28 | 1996-01-19 | Canon Inc | Foreign matter inspection apparatus and manufacture of semiconductor device using the same |
| US7046353B2 (en) * | 2001-12-04 | 2006-05-16 | Kabushiki Kaisha Topcon | Surface inspection system |
| JP4217692B2 (en) * | 2005-04-20 | 2009-02-04 | キヤノン株式会社 | Foreign matter inspection apparatus, foreign matter inspection method, exposure apparatus, and device manufacturing method |
| JP4996116B2 (en) * | 2006-03-20 | 2012-08-08 | 株式会社堀場製作所 | Defect inspection equipment |
| JP4869129B2 (en) * | 2007-03-30 | 2012-02-08 | Ｈｏｙａ株式会社 | Pattern defect inspection method |
| JP5078583B2 (en) * | 2007-12-10 | 2012-11-21 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Macro inspection device and macro inspection method |
| JP2011174817A (en) * | 2010-02-24 | 2011-09-08 | Canon Inc | Foreign matter inspection system, exposure system, and device manufacturing method |
| JP5506555B2 (en) * | 2010-06-11 | 2014-05-28 | キヤノン株式会社 | Foreign matter inspection apparatus, exposure apparatus using the same, and device manufacturing method |
| JP5520737B2 (en) | 2010-07-30 | 2014-06-11 | 株式会社日立ハイテクノロジーズ | Defect inspection apparatus and defect inspection method |
| JP2012119512A (en) * | 2010-12-01 | 2012-06-21 | Hitachi High-Technologies Corp | Substrate quality evaluation method and apparatus therefor |
| JP5824780B2 (en) * | 2011-11-30 | 2015-12-02 | 株式会社ブイ・テクノロジー | Transparent film inspection apparatus and inspection method |
| JP5820735B2 (en) * | 2012-01-27 | 2015-11-24 | 昭和電工株式会社 | Surface inspection method and surface inspection apparatus |
| JP5647716B2 (en) * | 2013-07-24 | 2015-01-07 | 株式会社リューズ | A simple telecentric lens device for micro unevenness inspection machine |
| JP2016057180A (en) * | 2014-09-10 | 2016-04-21 | 東レエンジニアリング株式会社 | Substrate inspection device |
| JP2016125968A (en) * | 2015-01-07 | 2016-07-11 | 旭硝子株式会社 | Check device and method for checking |
| JP6613029B2 (en) * | 2015-01-16 | 2019-11-27 | キヤノン株式会社 | Foreign matter inspection apparatus, exposure apparatus, and device manufacturing method |
| JP7170491B2 (en) * | 2018-10-12 | 2022-11-14 | キヤノン株式会社 | Foreign matter detection device, exposure device, and article manufacturing method |
-
2018
- 2018-09-21 JP JP2018178081A patent/JP7292842B2/en active Active
-
2019
- 2019-08-27 TW TW108130577A patent/TWI845542B/en active
- 2019-09-06 KR KR1020190110470A patent/KR102582877B1/en active IP Right Grant
- 2019-09-17 CN CN201910873185.XA patent/CN110941138B/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011145232A5 (en) | ||
| JP2011040549A5 (en) | ||
| KR20180041736A (en) | Detection device, imprint device, article manufacturing method, illumination optical system and detection method | |
| JP2011040547A5 (en) | ||
| JP2017513041A (en) | Imaging system in reflection mode using coherent diffractive imaging method and micro pinhole and aperture system | |
| JP2011040548A5 (en) | ||
| KR20170103418A (en) | Pattern lighting appartus and method thereof | |
| TWI656410B (en) | Exposure device, exposure method, and article manufacturing method | |
| JP2020051759A5 (en) | ||
| US9921488B2 (en) | Maskless exposure method and a maskless exposure device for performing the exposure method | |
| JPS6336526A (en) | Wafer exposure equipment | |
| TWI397780B (en) | Exposure apparatus, exposure method, and device fabrication method | |
| KR102634513B1 (en) | Foreign substance detection apparatus, exposure apparatus and manufacturing method of article | |
| TWI655511B (en) | Exposure apparatus, exposure method, and method of manufacturing the same | |
| TWI845542B (en) | Foreign matter inspection device, exposure device and article manufacturing method | |
| JP2017003617A5 (en) | ||
| JP6361970B2 (en) | Inspection method of structure for nanoimprint and manufacturing method thereof | |
| JP2020003737A (en) | Exposure equipment and method for production of article | |
| KR100550521B1 (en) | Facing exposure apparatus and glass arranger and arranging method of the same | |
| JP4493428B2 (en) | Foreign matter inspection apparatus and foreign matter inspection method | |
| JP6528994B2 (en) | Inspection method of structure for nanoimprint and method of manufacturing the same | |
| TWI688820B (en) | Impurity removal assembly of light-transmitting thin film on mask glass substrate | |
| JP6313552B2 (en) | Measuring device, stage device, exposure device, and article manufacturing method | |
| JP4199754B2 (en) | Pattern exposure method | |
| JP6532332B2 (en) | EXPOSURE APPARATUS AND EXPOSURE METHOD, AND ARTICLE MANUFACTURING METHOD |