JP2017114138A - Holding member for breaking - Google Patents
Holding member for breaking Download PDFInfo
- Publication number
- JP2017114138A JP2017114138A JP2017064755A JP2017064755A JP2017114138A JP 2017114138 A JP2017114138 A JP 2017114138A JP 2017064755 A JP2017064755 A JP 2017064755A JP 2017064755 A JP2017064755 A JP 2017064755A JP 2017114138 A JP2017114138 A JP 2017114138A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- break
- brittle material
- breaking
- material substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
Description
本発明は半導体ウエハ等の脆性材料基板であって、機能領域（デバイス領域ともいう）を有する基板をブレイクする際に用いられるブレイク用治具を構成するブレイク用押さえ部材に関するものである。 The present invention relates to a break pressing member that constitutes a break jig used when a substrate having a functional region (also referred to as a device region) is a brittle material substrate such as a semiconductor wafer.
特許文献１には、スクライブラインが形成された基板を、スクライブラインが形成された面の裏面から、スクライブラインに沿って面に垂直に押圧することによりブレイクする基板ブレイク装置が提案されている。以下、このようなブレイク装置によるブレイクの概要を示す。ブレイクの対象となる基板には、整列して多数の機能領域が形成されているものとする。分断する場合には、まず基板に機能領域の間に等しい間隔を隔てて縦方向及び横方向にスクライブラインを形成する。そしてこのスクライブラインに沿ってブレイク装置で分断する。図１（ａ）は分断する前のブレイク装置に載置された基板の断面図を示している。本図に示すように、基板１０１に機能領域１０１ａ，１０１ｂとその間にスクライブラインＳ１，Ｓ２，Ｓ３・・・が形成されている。分断する場合には基板１０１の裏面に粘着テープ１０２を貼り付け、その表面に保護フィルム１０３を貼り付ける。そしてブレイク時には図１（ｂ）に示すように受け刃１０５，１０６のちょうど中間にブレイクすべきスクライブライン、この場合にはスクライブラインＳ２を配置し、その上部よりブレード１０４をスクライブラインに合わせて降下させ、基板１０１を押圧する。このようにして一対の受け刃１０５，１０６とブレード１０４との三点曲げによるブレイクが行われていた。 Patent Document 1 proposes a substrate breaking device that breaks a substrate on which a scribe line is formed by pressing it perpendicularly to the surface along the scribe line from the back surface of the surface on which the scribe line is formed. Hereinafter, an outline of the break by such a break device will be described. It is assumed that a large number of functional regions are formed in alignment on the substrate to be broken. In the case of division, first, scribe lines are formed in the vertical direction and the horizontal direction at equal intervals between the functional areas on the substrate. And it breaks with a break device along this scribe line. Fig.1 (a) has shown sectional drawing of the board | substrate mounted in the breaking apparatus before dividing | segmenting. As shown in this figure, functional regions 101a, 101b and scribe lines S1, S2, S3,... In the case of dividing, an adhesive tape 102 is attached to the back surface of the substrate 101, and a protective film 103 is attached to the surface. In the case of a break, a scribe line to be broken, in this case a scribe line S2, is arranged in the middle of the receiving blades 105 and 106 as shown in FIG. The substrate 101 is pressed. In this way, a break by three-point bending between the pair of receiving blades 105 and 106 and the blade 104 has been performed.
このような構成を有する基板ブレイク装置においては、格子状にスクライブが形成されている基板のうち、特に周辺部分をブレイクするときに、ブレードを押し下げて押圧すると、基板は僅かに外側に移動してしまう。このとき基板の端部は浮き上がり易く、基板固定枠に乗り上がったり、真空漏れが生じることがある。このためあらかじめ設定したブレイクバーを降下させる位置とスクライブラインの位置とがずれてしまい、安定してブレイクすることができなくなるという問題点があった。そのためブレイク用のブレードを微小間隔移動させたり、基板を再度位置決めする必要があり、設定に時間がかかるだけでなく、位置ずれとなった場合には機能領域が損傷する可能性があるという問題点があった。 In the substrate breaking device having such a configuration, when the peripheral portion is broken, particularly when the peripheral portion is broken, the substrate moves slightly outward when the blade is pushed down. End up. At this time, the end portion of the substrate easily floats, and may climb on the substrate fixing frame or cause a vacuum leak. For this reason, there is a problem that the position at which the break bar set in advance is shifted from the position of the scribe line, which makes it impossible to break stably. Therefore, it is necessary to move the break blade for a minute interval or reposition the board, which not only takes time to set, but also the functional area may be damaged if it is misaligned. was there.
本発明はこのような問題点に着目してなされたものであって、ブレイクを繰り返しても基板が位置ずれしないようにして基板をブレイクできるようにするためのブレイク用治具を提供することを目的とする。 The present invention has been made paying attention to such problems, and provides a break jig for allowing a substrate to be broken so that the substrate is not displaced even if the break is repeated. Objective.
この課題を解決するために、本発明のブレイク用押さえ部材は、スクライブラインを有する脆性材料基板をブレイクするブレイク用押さえ部材であって、前記脆性材料基板より小さい中央の開口と、周囲より前記中央の開口に向けて、前記脆性材料基板の機能領域のピッチに相当するピッチの突起部及びスリットから成るくし状部と、を有する。本発明のブレイク用押さえ部材は、スクライブラインを有する脆性材料基板をブレイクするブレイク用治具であって、前記脆性材料基板が載置されるベースと、中央に前記脆性材料基板の外形に相当する開口を有し、前記ベース上に載置された前記脆性材料基板を保持する枠状の枠状部材と、前記枠状部材の上部に配置され、前記脆性材料基板を前記枠状部材の周囲より押さえる押さえ部材と、を具備するブレイク用冶具の押さえ部材として使用してもよい。前記ブレイク用冶具は、前記脆性材料基板と同一形状を有し、前記ベース上に配置される弾性部材を有することができ、前記脆性材料基板を弾性部材の上部に載置してもよい。 In order to solve this problem, the break holding member of the present invention is a break holding member for breaking a brittle material substrate having a scribe line, and has a central opening smaller than the brittle material substrate and the center from the periphery. And a comb-like portion composed of a protrusion and a slit having a pitch corresponding to the pitch of the functional region of the brittle material substrate. The break pressing member of the present invention is a breaking jig for breaking a brittle material substrate having a scribe line, and corresponds to the base on which the brittle material substrate is placed and the outer shape of the brittle material substrate at the center. A frame-shaped frame-shaped member that has an opening and holds the brittle material substrate placed on the base; and is disposed on an upper portion of the frame-shaped member, and the brittle material substrate is disposed around the frame-shaped member. You may use as a pressing member of the jig for a break which comprises the pressing member to hold down. The break jig may have the same shape as the brittle material substrate, and may have an elastic member disposed on the base, and the brittle material substrate may be placed on the elastic member.
ここで前記脆性材料基板は、縦方向及び横方向に所定のピッチで形成された機能領域、及び機能領域が中心に位置するように格子状に形成されたスクライブラインを有するものであり、前記ベースは、前記脆性材料基板の機能領域のピッチに相当する間隔で配列された開口を有するものであり、前記弾性部材は、前記ベースの開口に対応する位置に貫通孔を有するものとしてもよい。 Here, the brittle material substrate has functional regions formed at predetermined pitches in the vertical and horizontal directions, and scribe lines formed in a lattice shape so that the functional regions are located at the center. Has openings arranged at intervals corresponding to the pitch of the functional regions of the brittle material substrate, and the elastic member may have a through hole at a position corresponding to the opening of the base.
ここで前記ベースは、前記脆性材料基板と同一形状の突起部を有し、前記ベースの開口は、前記突起部を貫通するものとしてもよい。 Here, the base may have a protrusion having the same shape as the brittle material substrate, and the opening of the base may penetrate the protrusion.
ここで前記押さえ部材は、前記脆性材料基板より小さい中央の開口と、周囲より前記中央の開口に向けて、前記脆性材料基板の機能領域のピッチに相当するピッチの突起部及びスリットから成るくし状部と、を有するものであり、前記枠状部材は、その周囲の上面に前記機能領域のピッチに相当するピッチの溝を有するものとしてもよい。 Here, the pressing member is a comb-like shape including a central opening smaller than the brittle material substrate and protrusions and slits having a pitch corresponding to the pitch of the functional region of the brittle material substrate from the periphery toward the central opening. The frame-shaped member may have grooves having a pitch corresponding to the pitch of the functional region on the upper surface around the frame-shaped member.
ここで前記弾性部材は、前記脆性材料基板と同一形状の一定の厚さを持つ透明の弾性板としてもよい。 Here, the elastic member may be a transparent elastic plate having a certain thickness and the same shape as the brittle material substrate.
このような特徴を有する本発明のブレイク用治具を用いると、脆性材料基板は周囲にブレイク用治具の枠状部材と押さえ部材で位置決めしてブレイクされているため、ブレイクの際にも基板の端部の位置がずれることがなくなる。そのためブレイクを進めていっても何度も位置決めを繰り返すことはなく、脆性材料基板をスクライブラインに沿ってブレイクすることができるという効果が得られる。 When the break jig of the present invention having such a feature is used, the brittle material substrate is positioned and broken by the frame-shaped member and the pressing member of the break jig, so that the substrate is also broken during the break. The position of the end of the lens will not shift. Therefore, even if the break is advanced, positioning is not repeated many times, and an effect that the brittle material substrate can be broken along the scribe line is obtained.
本発明の実施の形態においてブレイクの対象となる基板１０は図２に示すように、製造工程でｘ軸とｙ軸に沿って格子状に一定ピッチで多数の機能領域１１が形成された基板とする。この機能領域１１は例えば、ＬＥＤとしての機能を有する領域とする。そして各機能領域毎に分断してＬＥＤチップとするために、スクライブ装置により各機能領域が中心に位置するように縦方向のスクライブラインＳy1〜Ｓynと、横方向のスクライブラインＳx1〜Ｓxmとが互いに直交するように形成されている。従ってこれらのスクライブラインＳx1〜Ｓxm、Ｓy1〜Ｓynのピッチは機能領域のｘ軸とｙ軸方向のピッチと同一となる。 In the embodiment of the present invention, as shown in FIG. 2, the substrate 10 to be broken is a substrate on which a large number of functional regions 11 are formed at a constant pitch in a lattice pattern along the x-axis and y-axis in the manufacturing process. To do. The functional area 11 is an area having a function as an LED, for example. In order to divide each functional area into LED chips, the scribe lines S y1 to S yn and the horizontal scribe lines S x1 to S yn are arranged so that each functional area is centered by a scribing device. xm are formed so as to be orthogonal to each other. Accordingly, the pitch of these scribe lines S x1 to S xm and S y1 to S yn is the same as the pitch of the functional area in the x-axis and y-axis directions.
次に基板１０をブレイクする際に用いられる本実施の形態のブレイク用治具について説明する。図３Ａ，図３Ｂは本実施の形態のブレイク用治具１を示す斜視図である。図３Ｂに示すように、ブレイク用治具は正方形状のベース２０とその上部に配置される弾性部材３０と、図３Ａに示す弾性部材３０の周囲を保持する枠状部材４０、及び枠状部材４０とほぼ同一の外径を有する押さえ部材５０とを有している。ブレイク用治具１は基板１０を固定し、その上部より図示しないブレードによって基板をブレイクする際に用いられる。 Next, the breaking jig of the present embodiment used when breaking the substrate 10 will be described. 3A and 3B are perspective views showing the breaking jig 1 according to the present embodiment. As shown in FIG. 3B, the breaking jig includes a square base 20, an elastic member 30 disposed on the square base 20, a frame-like member 40 that holds the periphery of the elastic member 30 shown in FIG. 3A, and a frame-like member 40 and a pressing member 50 having substantially the same outer diameter. The breaking jig 1 is used to fix the substrate 10 and break the substrate from above with a blade (not shown).
次に各部材についてより詳細に説明する。ベース２０は透明部材で構成され、その内部は空洞となっている。ベース２０の上面の中央には、基板１０と同一の長方形状の薄い突起部２１が設けられており、突起部２１の表面には長方形の淵に沿って環状に多数の開口２２が設けられる。この全ての開口２２は連通してベース２０の側方に設けられるダクト２３と連結されている。又開口２２の内側には、ｘ軸及びｙ軸方向に配列された多数の開口２４が設けられる。これらの開口２４は内部で全て連通しており、外部の側方にダクト２５と連結している。これらのダクト２３，２５は図示しない真空吸着装置に接続される。 Next, each member will be described in more detail. The base 20 is made of a transparent member, and the inside thereof is a cavity. At the center of the upper surface of the base 20, a thin protrusion 21 having the same rectangular shape as that of the substrate 10 is provided, and on the surface of the protrusion 21, a large number of openings 22 are provided annularly along a rectangular ridge. All the openings 22 communicate with each other and are connected to a duct 23 provided on the side of the base 20. A large number of openings 24 arranged in the x-axis and y-axis directions are provided inside the openings 22. All of these openings 24 communicate with each other inside, and are connected to the duct 25 on the outer side. These ducts 23 and 25 are connected to a vacuum suction device (not shown).
次に弾性部材３０はこの突起部２１と同一形状で一定の厚さを有するゴム等の弾性部材であり、周囲の４つの辺に沿って設けられた貫通孔３１と、その内側に格子状に配列された多数の貫通孔３２とが設けられている。貫通孔３１は前述した開口２２に対応する位置に設けられ、貫通孔３２は各開口２４に対応する位置に設けられている。従って弾性部材３０を突起部２１の真上にそのまま載せたときに、貫通孔３１と開口２２、貫通孔３２と開口２４の各位置が夫々一致するものとなる。この弾性部材３０は載置される基板１０のスクライブラインの位置を下方から確認できるようにするために、透明部材であることが好ましい。 Next, the elastic member 30 is an elastic member such as rubber having the same shape as the protrusion 21 and having a certain thickness, and includes a through hole 31 provided along the four surrounding sides and a lattice shape inside thereof. A number of arranged through holes 32 are provided. The through hole 31 is provided at a position corresponding to the opening 22 described above, and the through hole 32 is provided at a position corresponding to each opening 24. Therefore, when the elastic member 30 is placed directly on the protruding portion 21, the positions of the through hole 31 and the opening 22, and the through hole 32 and the opening 24 coincide with each other. The elastic member 30 is preferably a transparent member so that the position of the scribe line of the substrate 10 to be placed can be confirmed from below.
ベース２０の開口２２は基板１０を突起部２１及び弾性部材３０の真上に正確に位置合わせして配置したときに、縦方向の両端のスクライブラインＳy1，Ｓyn及び横方向の両端のスクライブラインＳx1とＳxmの外側に位置する。これらの開口２２と貫通孔３１はスクライブラインに沿ってブレイクしたときに、各ＬＥＤチップの外側の基板１０の端材となる部分を吸引するために用いられる。 The opening 22 of the base 20 has the scribe lines S y1 , S yn at both ends in the vertical direction and the scribe lines at both ends in the horizontal direction when the substrate 10 is accurately aligned and arranged directly above the protrusion 21 and the elastic member 30. Located outside lines S x1 and S xm . These openings 22 and through-holes 31 are used for sucking a portion that becomes an end material of the substrate 10 outside each LED chip when breaking along the scribe line.
又ベース２０の開口２４は、基板１０を突起部２１及び弾性部材３０の真上に正確に位置合わせして配置したときに、基板１０に形成されているスクライブラインＳx2〜Ｓx(m-1)，Ｓy2〜Ｓy(n-1)が隣接する開口２４の中間を通り、且つ基板１０の各機能領域１１が夫々各開口２４に対応する位置に設けられる。 Further, the openings 24 of the base 20 are arranged so that the scribe lines S x2 to S x (m− ) formed on the substrate 10 are positioned when the substrate 10 is positioned so as to be accurately positioned right above the protrusions 21 and the elastic member 30. 1) , S y2 to S y (n−1) pass through the middle of the adjacent openings 24, and each functional region 11 of the substrate 10 is provided at a position corresponding to each opening 24.
次に図３Ａに示すように、枠状部材４０は平板状の部材であって、その中央に基板１０及び弾性部材３０と同一の矩形の開口４１が設けられている。枠状部材４０の周囲には、弾性部材３０を中央の開口４１に保持したときにｘ軸と平行な貫通孔３１，３２の中心線に沿ってｘ軸に平行に一定の深さの多数の溝４２ａ，４２ｂが形成されている。又弾性部材３０をその開口４１に保持したときにｙ軸に平行な貫通孔３１，３２の中心線に沿ってｙ軸に平行に一定の深さの多数の溝４３ａ，４３ｂが形成されている。そして枠状部材４０の厚さは、ベース２０の突起部２１、弾性部材３０及び基板１０の厚さの和に相当するものとする。 Next, as shown in FIG. 3A, the frame-like member 40 is a flat plate-like member, and the same rectangular opening 41 as the substrate 10 and the elastic member 30 is provided at the center thereof. Around the frame-shaped member 40, there are a large number of constant depths parallel to the x-axis along the center lines of the through holes 31 and 32 parallel to the x-axis when the elastic member 30 is held in the central opening 41. Grooves 42a and 42b are formed. Further, when the elastic member 30 is held in the opening 41, a plurality of grooves 43a and 43b having a certain depth are formed in parallel to the y axis along the center lines of the through holes 31 and 32 parallel to the y axis. . The thickness of the frame-shaped member 40 corresponds to the sum of the thicknesses of the protruding portion 21 of the base 20, the elastic member 30, and the substrate 10.
次に押さえ部材５０は外形が枠状部材４０とほぼ同一の薄い平板であり、中央に枠状部材４０の開口４１よりもやや小さい開口５１が設けられる。そして周囲により開口５１の縁に向けてスリットと突起が交互に設けられたくし状部５２ａ，５２ｂ，５３ａ，５３ｂが形成されている。くし状部のスリット及び突起のピッチはブレイクの対象となる基板１０のスクライブラインＳx1〜Ｓxm，Ｓy1〜Ｓynのピッチと同一で、一定の幅を有するものとする。 Next, the pressing member 50 is a thin flat plate whose outer shape is substantially the same as that of the frame-shaped member 40, and an opening 51 that is slightly smaller than the opening 41 of the frame-shaped member 40 is provided at the center. Combs 52a, 52b, 53a, 53b are formed in which slits and protrusions are alternately provided toward the edge of the opening 51 around the periphery. Slits and pitch of the protrusions of the comb scribe line S x1 to S xm of the substrate 10 to be break, the same as the pitch of the S y1 to S yn, shall have a constant width.
そして枠状部材４０と押さえ部材５０とを外周を一致させて重ね合わせたときに、くし状部５２ａ〜５３ｂのスリットと、枠状部材４０の溝４２ａ〜４３ｂとが夫々対応する構造となっている。そして枠状部材４０の開口に基板１０を保持したときに、基板１０のスクライブラインの延長線が枠状部材４０の溝及び押さえ部材５０のスリットの中心を通る位置となっている。 When the frame-shaped member 40 and the pressing member 50 are overlapped with the outer periphery being matched, the slits of the comb-shaped portions 52a to 53b and the grooves 42a to 43b of the frame-shaped member 40 correspond to each other. Yes. When the substrate 10 is held in the opening of the frame-shaped member 40, the extension line of the scribe line of the substrate 10 is a position that passes through the groove of the frame-shaped member 40 and the center of the slit of the pressing member 50.
さてブレイク用治具１を用いて基板１０をブレイクする場合について説明する。まず基板１０を図２に示すようにスクライブする。スクライブはスクライビングホイールを転動させる刃先スクライブであってもよく、レーザ光を用いたレーザスクライブであってもよい。 Now, a case where the substrate 10 is broken using the breaking jig 1 will be described. First, the substrate 10 is scribed as shown in FIG. The scribe may be a blade scribe that rolls a scribing wheel, or a laser scribe using a laser beam.
次に図４に断面図を示すように、あらかじめブレイク装置のテーブル６０の上面にブレイク用治具１のベース２０を配置する。そしてベース２０の突起部２１上に弾性部材３０を配置し、その上に基板１０をスクライブラインが形成されている面を下にして積み重ねる。そしてベース２０の突起部２１上に弾性部材３０と基板１０とが載置された状態で、その外側に枠状部材４０を載置し、次いで押さえ部材５０を載置する。このとき枠状部材４０の下面は直接ベース２０の突起部２１以外の周囲に接触するように配置される。こうすればスクライブラインが各開口２２の中間に位置するように位置決めされることとなる。さて押さえ部材５０と枠状部材４０には四方にねじ溝が設けられており、ねじによってベース２０に連結して固定する。 Next, as shown in the cross-sectional view of FIG. 4, the base 20 of the breaking jig 1 is disposed in advance on the upper surface of the table 60 of the breaking device. Then, the elastic member 30 is disposed on the protruding portion 21 of the base 20, and the substrate 10 is stacked thereon with the surface on which the scribe line is formed facing down. Then, in a state where the elastic member 30 and the substrate 10 are placed on the protruding portion 21 of the base 20, the frame-like member 40 is placed on the outer side, and then the pressing member 50 is placed. At this time, the lower surface of the frame-shaped member 40 is disposed so as to directly contact the periphery of the base 20 other than the protrusions 21. If it carries out like this, it will position so that a scribe line may be located in the middle of each opening 22. FIG. Now, the holding member 50 and the frame-like member 40 are provided with screw grooves in four directions, and are connected and fixed to the base 20 with screws.
このとき押さえ部材５０の開口５１は枠状部材４０の開口４１よりも少し小さいため、くし状部５２ａ〜５３ｂの突起が基板１０の周囲に覆い被さるように位置することとなる。そして図示しない真空吸着装置を動作させてダクト２３より基板１０の周囲を吸引し、ダクト２５より基板の各機能領域を吸引することによって基板１０を保持する。 At this time, since the opening 51 of the pressing member 50 is slightly smaller than the opening 41 of the frame-like member 40, the protrusions of the comb-shaped parts 52 a to 53 b are positioned so as to cover the periphery of the substrate 10. Then, a vacuum suction device (not shown) is operated to suck the periphery of the substrate 10 from the duct 23 and suck the respective functional areas of the substrate from the duct 25 to hold the substrate 10.
このとき下方から透明のベース２０及び弾性部材３０を介してＣＣＤカメラや赤外線カメラ等で基板１０のスクライブラインを確認し、上部よりブレイク装置のブレード６１によって基板１０のスクライブラインの真上から押下してブレイクする。そうすればブレード６１は押さえ部材５０のスリットや枠状部材４０の溝４２ａ，４２ｂ，４３ａ，４３ｂに相当する位置で押し下げられることとなる。従ってブレード６１は押さえ部材５０や枠状部材４０に接触することなく、基板１０をブレイクすることができる。又基板１０の端部は押さえ部材５０のいずれかのくし状部の突起の先端によって押さえられているため、ブレイク時にも分断した基板の位置がずれることがなく、元の位置に留まる。そしてスクライブラインＳx1〜Ｓxmに沿ってブレイクを繰り返すことによって細長い分断片とすることができる。ｘ軸方向のブレイクを終えるとスクライブラインＳy1〜Ｓynに沿ってブレイクを繰り返すことによって個別のＬＥＤチップを生成することができる。 At this time, the scribe line of the substrate 10 is confirmed by a CCD camera, an infrared camera, or the like through the transparent base 20 and the elastic member 30 from below, and is pressed from right above the scribe line of the substrate 10 by the blade 61 of the break device. Break. Then, the blade 61 is pushed down at positions corresponding to the slits of the pressing member 50 and the grooves 42a, 42b, 43a, 43b of the frame-like member 40. Therefore, the blade 61 can break the substrate 10 without contacting the pressing member 50 or the frame-shaped member 40. Moreover, since the edge part of the board | substrate 10 is hold | suppressed by the front-end | tip of the protrusion of any comb-shaped part of the holding member 50, the position of the board | substrate divided | segmented at the time of a break does not shift | deviate, but it stays in the original position. Then, by repeating the break along the scribe lines S x1 to S xm , it is possible to obtain elongated pieces. When the break in the x-axis direction is finished, individual LED chips can be generated by repeating the break along the scribe lines S y1 to S yn .
さてスクライブラインＳx1，Ｓxm，Ｓy1，Ｓynに沿ってブレイクしたときに端材が生じるが、枠状部材４０，押さえ部材５０によって保持されており、更に端材も開口２２，貫通孔３１を介して真空吸着装置によって吸着されているため、位置ずれは生じない。このようにブレイク時にほとんど分断片の位置ずれが生じないため、ブレイク作業を確実に実行することができる。 Well scribe line S x1, S xm, S y1 , but along the S yn is end member when break occurs, the frame member 40 is held by the pressing member 50, further offcuts also opening 22, through holes Since it is adsorbed by the vacuum adsorbing device via 31, no displacement occurs. As described above, since the positional deviation of the fragments hardly occurs at the time of the break, the break operation can be surely executed.
尚この実施の形態ではベース２０に基板１０と同一形状の突起部２１を設けているが、弾性部材３０が十分厚ければ突起部を必ずしも設ける必要はない。 In this embodiment, the base 20 is provided with the protrusion 21 having the same shape as the substrate 10. However, if the elastic member 30 is sufficiently thick, the protrusion is not necessarily provided.
又この実施の形態では、格子状に機能領域が形成された基板のブレイクについて説明しているが、機能領域については限定されるものではない。又本発明はＬＴＣＣ基板、アルミナ、窒化アルミ、チラン酸バリウム、窒化珪素、シリコーン樹脂等の種々の脆性材料基板にも適用することができる。 In this embodiment, the break of the substrate in which the functional areas are formed in a lattice shape is described, but the functional areas are not limited. The present invention can also be applied to various brittle material substrates such as LTCC substrates, alumina, aluminum nitride, barium titanate, silicon nitride, and silicone resins.
本発明は保護すべき領域を有する脆性材料基板をスクライブしブレイクする際に、端部をブレイクしても位置ずれすることなくブレイクすることができるため、基板のブレイク装置に有効に適用することができる。 In the present invention, when a brittle material substrate having a region to be protected is scribed and broken, even if the end portion is broken, it can be broken without being displaced. it can.
１０ 脆性材料基板
１１ 機能領域
２０ ベース
２１ 突起部
２２，２４ 開口
２３，２５ ダクト
３０ 弾性部材
３１，３２ 貫通孔
４０ 枠状部材
４１ 開口
４２ａ，４２ｂ，４３ａ，４３ｂ 溝
５０ 押さえ部材
５１ 開口
５２ａ〜５２ｄ くし状部
DESCRIPTION OF SYMBOLS 10 Brittle material board | substrate 11 Functional area | region 20 Base 21 Protrusion part 22,24 Opening 23,25 Duct 30 Elastic member 31,32 Through-hole 40 Frame-shaped member 41 Opening 42a, 42b, 43a, 43b Groove 50 Holding member 51 Opening 52a-52d Comb
Claims (1)
A break holding member for breaking a brittle material substrate having a scribe line, corresponding to a central opening smaller than the brittle material substrate and a pitch of a functional region of the brittle material substrate from the periphery toward the central opening And a comb-shaped portion composed of slit-shaped protrusions and slits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017064755A JP2017114138A (en) | 2017-03-29 | 2017-03-29 | Holding member for breaking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017064755A JP2017114138A (en) | 2017-03-29 | 2017-03-29 | Holding member for breaking |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015252262A Division JP6126194B2 (en) | 2015-12-24 | 2015-12-24 | Break jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2017114138A true JP2017114138A (en) | 2017-06-29 |
Family
ID=59233021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017064755A Pending JP2017114138A (en) | 2017-03-29 | 2017-03-29 | Holding member for breaking |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2017114138A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200112655A (en) | 2019-03-20 | 2020-10-05 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | BREAKING APPARATUS and BREAKING METHOD for BRITTLE MATERIAL SUBSTRATE |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5264872A (en) * | 1975-11-24 | 1977-05-28 | Ibm | Apparatus for holding semiconductor wafers |
| JPS61251146A (en) * | 1985-04-30 | 1986-11-08 | Nec Kansai Ltd | Manufacture of semiconductor pellet |
| US6150240A (en) * | 1998-07-27 | 2000-11-21 | Motorola, Inc. | Method and apparatus for singulating semiconductor devices |
| WO2003002471A1 (en) * | 2001-06-28 | 2003-01-09 | Mitsuboshi Diamond Industrial Co., Ltd | Device and method for breaking fragile material substrate |
| JP2003007651A (en) * | 2001-06-22 | 2003-01-10 | Apic Yamada Corp | Dicing jig |
| JP2003089538A (en) * | 2001-06-28 | 2003-03-28 | Mitsuboshi Diamond Industrial Co Ltd | Breaking device and breaking method for brittle material substrate |
-
2017
- 2017-03-29 JP JP2017064755A patent/JP2017114138A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5264872A (en) * | 1975-11-24 | 1977-05-28 | Ibm | Apparatus for holding semiconductor wafers |
| JPS61251146A (en) * | 1985-04-30 | 1986-11-08 | Nec Kansai Ltd | Manufacture of semiconductor pellet |
| US6150240A (en) * | 1998-07-27 | 2000-11-21 | Motorola, Inc. | Method and apparatus for singulating semiconductor devices |
| JP2003007651A (en) * | 2001-06-22 | 2003-01-10 | Apic Yamada Corp | Dicing jig |
| WO2003002471A1 (en) * | 2001-06-28 | 2003-01-09 | Mitsuboshi Diamond Industrial Co., Ltd | Device and method for breaking fragile material substrate |
| JP2003089538A (en) * | 2001-06-28 | 2003-03-28 | Mitsuboshi Diamond Industrial Co Ltd | Breaking device and breaking method for brittle material substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200112655A (en) | 2019-03-20 | 2020-10-05 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | BREAKING APPARATUS and BREAKING METHOD for BRITTLE MATERIAL SUBSTRATE |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5187421B2 (en) | Breaking method for brittle material substrate | |
| KR101914298B1 (en) | Apparatus and method for processing glass window of display | |
| JP6111827B2 (en) | Break jig | |
| JP6119551B2 (en) | Elastic support plate, breaking device and dividing method | |
| US8030180B2 (en) | Method of manufacturing a semiconductor device | |
| KR20150044367A (en) | Breaking apparatus and dividing method | |
| US7358153B2 (en) | Method for cutting junction board, and chip | |
| CN104552628A (en) | Expander, breaking apparatus and dividing method | |
| JP6213134B2 (en) | Elastic support plate, breaking device and dividing method | |
| JP2017114138A (en) | Holding member for breaking | |
| JP5991133B2 (en) | Breaking jig for brittle material substrate and breaking method | |
| JP6126194B2 (en) | Break jig | |
| JP2000124158A (en) | Semiconductor wafer and semiconductor device | |
| JPH10100475A (en) | Array of chip having beveled structure | |
| JP7340838B2 (en) | Wafer breaking method and breaking device | |
| KR20220142494A (en) | A support device for supporting a substrate, a method of processing the substrate, and a semiconductor substrate | |
| JP2010175592A (en) | Optical element | |
| JP4214790B2 (en) | Dicing method | |
| JP4211892B2 (en) | Semiconductor wafer | |
| JP2013058653A (en) | Method for dividing plate-like object | |
| JPH1083974A (en) | Dividing method for semiconductor substrate | |
| JP2005228909A (en) | Method of manufacturing ceramic wafer | |
| JP5101940B2 (en) | Semiconductor wafer printing method | |
| JP2020151929A (en) | Break device and break method for brittle material substrate | |
| KR20030060146A (en) | Method of forming stacked sample of transmission electron microscope |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170405 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180115 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180123 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180309 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180731 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190212 |