JP2017080753A - 超音波半田付け方法および超音波半田付け装置 - Google Patents
超音波半田付け方法および超音波半田付け装置 Download PDFInfo
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- 238000005476 soldering Methods 0.000 title claims abstract description 146
- 238000000034 method Methods 0.000 title claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 94
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052709 silver Inorganic materials 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 229910052742 iron Inorganic materials 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 16
- 229910052745 lead Inorganic materials 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims description 41
- 239000000155 melt Substances 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 8
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 2
- WQEVDHBJGNOKKO-UHFFFAOYSA-K vanadic acid Chemical compound O[V](O)(O)=O WQEVDHBJGNOKKO-UHFFFAOYSA-K 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 40
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 27
- 239000004332 silver Substances 0.000 description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 22
- 239000010949 copper Substances 0.000 description 22
- 229910052710 silicon Inorganic materials 0.000 description 22
- 239000010703 silicon Substances 0.000 description 22
- 239000010408 film Substances 0.000 description 21
- 238000002474 experimental method Methods 0.000 description 17
- 239000005355 lead glass Substances 0.000 description 13
- 238000010304 firing Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 239000011135 tin Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000013383 initial experiment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
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- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
また、予め図2の(b)のようにしてプリ半田付けしておき、この上にリボン7を超音波半田付けしてもよい。
・バスバー電極5 銀、約100wt% NTAガラス100wt%
(図1の(b)参照) (〜50wt%)
・半田6
(図2の(b)参照) SAC(スズ、銀、銅) 半田6(スズ、亜鉛、インジウム
の半田 アンチモン、アルミニウム等の金属
の組み合わせ又はその合金(スズー ー亜鉛の合金で、スズ20−40%
程度、残りは添加)
・リボン7 銅の周りをSAC等の 銅の周りを上記半田6で
(図2の(c)参照) 半田でコーティング コーティング(超音波半田付け)
以上のように、本発明では、バスバー電極5がNTAガラスのペースト(NTAペースト)を焼成して形成するため、従来の半田では半田付けが不可ないし極めて困難であるが、本発明の超音波半田付けで、予備加熱した状態で半田6を用いて半田付けすることにより、極めて良好にバスバー電極5の上に超音波半田付けで半田メッキや、リボン7(引出リード線)を半田付けすることが、実験により確かめられた(図7、図8の写真参照)。
1.ペーストの有機溶剤がなくなるように処理(溶剤飛ばし)する。
・超音波発信周波数 60KHz±5KHz
・発信出力 最大15W(実効10W)
・ヒーター温度 200〜500℃ 電源容量200W
(ヒーター部分の温度で、
半田コテ先部分の温度ではない。)
尚、半田コテ先部分24の温度は、図示外の温度計で計測する(例えば熱電対を半田コテ先部分24に埋め込んでおき実測する。そして、この実測値をもとに第2の所定温度に自動調整する)。
尚、S5及びS7の印刷を行い、両者を同時に焼成してもよい。
図13の(a)のAg 100%、NTA 0% 平均約17.0%
図13の(b)のAg 50%、NTA 50% 平均約17.0%
図13の(c)のAg 0%、NTA 100% 平均約17.2%
試作実験結果は、バスバー電極のパターンを印刷する材料として、図13の(a)と、図13の(b)とでは太陽電池を作成したときの変換効率が平均約17.0%でほぼ同じ結果が得られ、更に、図13の(c)では変換効率が平均約17.2%が得られた。これら図13の(a)から(c)のいずれもほぼ同じ変換効率の範囲内か、あるいは図13の(c)のNTA 100%が若干高い変換効率であることが初期実験結果から判明する。尚、NTAガラスは、バナジウム、バリウム、鉄から構成され、特に鉄は内部的に強く結合して当該内部に留まっており、他の材料と混合してもその結合性は極めて小さい性質を有すること(特許第5333976号等参照)、更に既述した本発明の高電子濃度領域とリード線との間の経路(経路1と、経路2とが並列)の改善によると推測される。
・NTA 100% Ag 0%
・NTA 90% Ag 10%
・NTA 80% Ag 20%
・NTA 70% Ag 30%
とし、これらで太陽電池を作成し、各測定結果(効率)は図示の通りであった。尚、初期実験であるので、測定結果には図示のようにかなりのバラツキがあるが、16.9から17.5の範囲内に収まっており、NTA 100%でバスバー電極15を作成(つまり、Agなしで作成)して太陽電池を製造した場合でも、NTA 70%(あるいは、更に80%、90%)に比して同程度ないし若干高い効率が得られ、NTA 100%でも使えることが判明した(発明者らはこの事実を発見した)。
2:裏面電極
3:窒化膜
4:フィンガー電極
5:バスバー電極
6:半田
7:リボン
71:銅
72:プリ半田
21:予備加熱台
22:超音波半田コテ
23:超音波発信機及びヒーター
24:半田コテ先部分
11:シリコン基板
12:高電子濃度領域(拡散ドーピング)
13:絶縁膜(窒化シリコン膜)
14:電子取出口(フィンガー電極)
15:バスバー電極
16:裏面電極
17:リード線
Claims (10)
- 基板上の任意部分にペーストを塗布して焼結した部分に半田付けする半田付け方法において、
Ag、Cu、Pbを含まないペーストを任意部分に塗布して焼結した基板あるいは該基板上のペースト部分を、半田の溶融温度よりも低い第1の所定温度に予備加熱する予備加熱ステップと、
前記予備加熱ステップで予備加熱した第1の所定温度の前記基板のペースト部分に、当接する半田コテ先部分に超音波を印加した状態で供給した半田が溶融する、超音波を印加しないときに半田が溶融する温度よりも低い、第2の所定温度に調整した状態で、前記半田コテ先部分を前記ペースト部分に当接してあるいは当接しながら移動して当該ペースト部分に半田付けする超音波半田付けステップと
を有することを特徴とする超音波半田付け方法。 - 前記第1の所定温度を、室温以上から前記第2の所定温度の範囲内の温度としたことを特徴とする請求項1記載の超音波半田付け方法。
- 前記第2の所定温度を、超音波を印加しないときに半田が溶融する温度よりも10から40℃低い範囲内の温度としたことを特徴とする請求項1ないし請求項2のいずれかに記載の超音波半田付け方法。
- 前記Ag,Cu、Pbを含まないペーストとして、Ag,Cu、Pbを含まなくかつバナジン酸塩ガラスを100wt%、あるいはCu,Pbを含まなくかつAgを0以上から50wt%を含み残りをバナジン酸塩ガラス、としたNTAペーストとしたことを特徴とする請求項1から請求項3のいずれかに記載の超音波半田付け方法。
- 前記半田は、少なくともSn、Zn、Clを含むことを特徴とする請求項1から請求項4のいずれかに記載の超音波半田付け方法。
- 前記超音波半田付けステップで半田付けする際に、ペースト部分に当該ペースト中の有機溶剤が残留しないように予め乾燥あるいは加熱乾燥したことを特徴とする請求項1から請求項5のいずれかに記載の超音波半田付け方法。
- 前記基板上に塗布するペースト部分が、可及的に滑らかになるようにして焼結したことを特徴とする請求項1から請求項6のいずれかに記載の超音波半田付け方法。
- 前記超音波は、20KHzから150KHzの周波数としたことを特徴とする請求項1から請求項7のいずれかに記載の超音波半田付け方法。
- 前記基板上のペーストを塗布する部分を、太陽電池の電極の部分としたことを特徴とする請求項1から請求項8のいずれかに記載の超音波半田付け方法。
- 基板上の任意部分にペーストを塗布して焼結した部分に半田付けする半田付け装置において、
Ag、Cu、Pbを含まないペーストを任意部分に塗布して焼結した基板あるいは該基板上のペースト部分を、半田の溶融温度よりも低い第1の所定温度に予備加熱する予備加熱手段と、
前記予備加熱手段で予備加熱した第1の所定温度の前記基板のペースト部分に、当接する半田コテ先部分に超音波を印加した状態で供給した半田が溶融する、超音波を印加しないときに半田が溶融する温度よりも低い、第2の所定温度に調整した状態で、前記半田コテ先部分を前記ペースト部分に当接してあるいは当接しながら移動して当該ペースト部分に半田付けする超音波半田付け手段と
を備えたことを特徴とする超音波半田付け装置。
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