JP2017069237A - Soldering system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering system which achieves space saving soldering.SOLUTION: A soldering system 1 includes an installation part 2 of a transport robot 21 provided in the center of a soldering chamber 10, a flux coating device 6 for coating a printed board 3, transported by the transport robot 21, with flux, a preheater 7 for heating the printed board 3 coated with flux, a soldering device 8 for soldering to the heated printed board 3, and a cooler 9 of the soldered printed board 3. The flux coating device 6, preheater 7 and soldering device 8 are arranged in the range of motion 22 of the transport robot 21. The flux coating device 6 and soldering device 8 are disposed at positions before and after the installation part 2 and preheater 7 in the range of motion 22 of the transport robot 21.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a soldering system for applying and soldering flux to a printed circuit board.

  A soldering apparatus is used when an electronic component is soldered to a printed circuit board. According to the soldering apparatus, a flux application apparatus such as a fluxer, a preheater, a soldering apparatus, a cooling machine, and the like are disposed at predetermined positions. When soldering electronic components to a printed circuit board with a soldering device, apply flux to the soldering area of the printed circuit board, then preheat the printed circuit board with a preheater, and solder the printed circuit board and the electronic components with a soldering device. Then, the printed circuit board is cooled with a cooler to complete the soldering process.

  In relation to this type of soldering apparatus, a soldering system including a flux application apparatus, a preheating apparatus, a soldering apparatus, and a transfer robot is known.

  Patent Document 1 discloses a soldering system in which a flux applying device, a preheating device, and a soldering device are arranged in a workable range of an industrial robot. The soldering apparatus includes a first soldering apparatus and a second soldering apparatus, and uses jet waves having different properties.

  Patent Document 2 discloses a soldering device in which a transfer robot that can move in the vicinity of a pre-heater unit and a jet solder bath is installed, and the jet solder bath is shielded from the transfer robot and the shield is released. .

Japanese Patent No. 3910797 Japanese Patent No. 5279606

  As described above, since a plurality of processing apparatuses are required for the soldering process, a soldering system incorporating each apparatus requires a large space. For this reason, it has been difficult to secure the location of the soldering system in the factory and the location of the operator. In Patent Document 1 described above, the flux application device, the preheating device, and the soldering device are configured in a straight line, and in Patent Document 2 described above, the fluxer unit and the cooling unit are disposed outside the movable range of the transfer robot. However, none of them considered the above-mentioned problems.

  Therefore, the present invention solves such a problem, and an object thereof is to provide a soldering system that realizes a soldering process in a space-saving manner.

The technical means of the present invention taken in order to solve the above-mentioned problems are as follows.
(1) An installation part of a transfer robot provided in the center of the soldering chamber, a flux application device that applies flux to a printed board that is transferred by the transfer robot, a preheater that heats the printed board that has been flux applied, A soldering device for soldering to a printed circuit board; and a cooling device for the soldered printed circuit board. The flux application device, the pre-heater, and the soldering device are disposed within a movable range of the transfer robot, A soldering system in which a flux applying device and a soldering device are disposed at positions that are located back and forth across the installation portion and the preheater. In the present invention, the center includes the center and the periphery of the center.

  (2) The flux application device, preheater, and soldering device are housed in the soldering chamber, and a carry-in portion for carrying the printed circuit board and a carry-out portion for carrying the printed circuit board advance and retreat relative to the solder chamber. The soldering system according to (1), which is provided freely.

  (3) The soldering system according to (2), wherein the carry-in portion and the carry-out portion advance and retreat in parallel.

  (4) The load rail for carrying the printed circuit board into the soldering chamber and the carry-out rail for carrying the printed circuit board out of the soldering chamber are provided, and the widths of the carry-in rail and the carry-out rail are controlled simultaneously. Soldering system.

  According to the soldering system according to the present invention, a soldering system including a flux coating device, a preheater, and a soldering device can be realized in a small space.

It is a schematic plan view which shows the structural example of the soldering system 1 which concerns on this invention. It is a block diagram which shows the structural example of the control system of the soldering system.

  Hereinafter, a soldering system 1 according to an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the soldering system 1 is a system for soldering a printed circuit board 3 and includes a soldering chamber 10. The soldering chamber 10 is a housing having an opening for loading and unloading the printed circuit board 3 on its side. On the side of the soldering chamber 10, a carry-in unit 4 that conveys the printed circuit board 3 and a carry-out unit 5 that conveys the printed circuit board 3 are provided side by side. The carry-in unit 4 and the carry-out unit 5 are respectively provided in the soldering chamber. 10 can be moved forward and backward. The soldering chamber 10 has a flux coating device 6 that applies flux to the printed circuit board 3, a preheater 7 that heats the printed circuit board 3 that has been flux-coated, and soldering that solders the heated printed circuit board 3. A device 8 and a cooling device 9 for cooling the soldered printed circuit board 3 are provided.

  The carrying-in part 4 is a housing | casing which has the opening 41a on the upper surface. In the carry-in unit 4, a pair of printed-circuit board carrying-in rails 41 extending from the carry-in unit 4 into the soldering chamber 10, a pusher 42 for pushing out the printed board 3 disposed between the carry-in rails 41, and a pusher A plunger (not shown) for driving 42 is provided.

  The pair of carry-in rails 41 carries the printed circuit board 3 into the soldering chamber 10 from the carry-in unit 4. The carry-in rail 41 has a support portion having an L-shaped cross section, and this support portion supports the lower surface of the printed circuit board 3. The pair of carry-in rails 41 are provided in parallel and advance and retreat with respect to the soldering chamber 10. The pair of carry-in rails 41 are screwed together with the screw shaft 41A, and the width of the carry-in rail 41 can be adjusted corresponding to the width of the printed circuit board 3 according to the rotation of the screw shaft 41A. The screw shaft 41A is formed with a pair of forward (right) screws and reverse (left) screws (not shown) corresponding to the pair of carry-in rails 41, and between the pair of carry-in rails 41 according to the rotation of the screw shaft 41A. The width of can be made narrower or wider. A screw adjustment portion 41B for rotating the screw shaft 41A is provided on the side wall outside the carry-in portion 4, and the screw adjustment portion 41B is attached to one end portion of the screw shaft 41A.

  When the operator rotates the screw adjustment portion 41B, the screw shaft 41A rotates, and the positions of the pair of carry-in rails 41 change accordingly. As a result, the width of the carry-in rail 41 is adjusted.

  The pusher 42 projects upward from the bottom in the carry-in portion 4 to the height of the carry-in rail 41. The initial position of the pusher 42 is located between the pair of carry-in rails 41 and in the vicinity of the position farthest from the soldering chamber 10 in one end of the carry-in rail 41. When the plunger (not shown) drives the pusher 42, the pusher 42 can move into the soldering chamber 10 as indicated by a two-dot chain line in the drawing.

  The carry-out unit 5 is a housing having a lid 51a that opens and closes on the upper surface. The carry-out part 5 is provided on the side of the soldering chamber 10 in parallel with the carry-in part 4. In the carry-out part 5, a pair of carry-out rails 51 for conveying a printed circuit board extending from the carry-out part 5 into the soldering chamber 10, a pusher 52 for pushing out the printed circuit board 3 placed on the carry-out rail 51, and a pusher 52 are provided. A plunger (not shown) for driving is provided.

  The pair of unloading rails 51 unload the printed circuit board 3 from the soldering chamber 10 to the unloading unit 5. The carry-out rail 51 has a support portion having an L-shaped cross section, and this support portion supports the lower surface of the printed circuit board 3. The pair of carry-out rails 51 are provided in parallel and advance and retreat with respect to the soldering chamber 10. The pair of carry-out rails 51 are provided in parallel with the pair of carry-in rails 41. The pair of carry-out rails 51 are screwed together with the screw shaft 41A, and the width of the carry-out rail 51 can be adjusted corresponding to the width of the printed circuit board 3 according to the rotation of the screw shaft 41A. The screw shaft 41A is formed with a pair of forward (right) screws and reverse (left) screws (not shown) corresponding to the pair of carry-out rails 51, and between the pair of carry-out rails 51 according to the rotation of the screw shaft 41A. The width of can be made narrower or wider. The adjustment method of the width of the carry-out rail 51 is the same as the adjustment of the width of the carry-in rail 41. When the operator rotates the screw adjustment portion 41B, the screw shaft 41A rotates, and accordingly the position of the pair of carry-out rails 51 Both change. Thereby, the width of the carry-out rail 51 is adjusted.

  That is, although not shown, the screw shaft 41 </ b> A is provided with a pair of forward (right) screws and reverse (left) screws corresponding to the pair of carry-in rails 41, and a pair of carry-out rails 51. Since the forward (right) screw and the reverse (left) screw are provided, when the operator rotates the screw adjustment portion 41B, the screw shaft 41A rotates, and the widths of the carry-in rail 41 and the carry-out rail 51 are the same at the same time. Only changes. Thereby, the width of the carry-in rail 41 and the carry-out rail 51 is simultaneously controlled and adjusted according to the width of the printed board 3 to be conveyed.

  The pusher 52 projects upward from the bottom in the soldering chamber 10 to the height of the carry-out rail 51 at the initial position. The initial position of the pusher 52 is located between the pair of carry-out rails 51 and in the vicinity of one end of the carry-out rail 51. When the plunger (not shown) drives the pusher 52, the pusher 52 can move into the carry-out portion 5 as indicated by a two-dot chain line in the drawing.

  In the center of the soldering chamber 10, an installation unit 2 for the transfer robot 21 is provided, and the transfer robot 21 is installed. For example, a vertical articulated robot or the like is used as the transfer robot 21. The movable range 22 of the transfer robot 21 is a region between the arc-shaped maximum operation region and the arc-shaped minimum operation region of the arm of the transfer robot 21. The transport robot 21 has a grip portion (not shown) for gripping the printed circuit board 3. This gripping part receives the printed circuit board 3 that has entered the solder chamber 10 by the carry-in rail 41. The transport robot 21 sends the printed circuit board 3 to the flux application device 6 while holding the printed circuit board 3. The transport robot 21 sends the printed circuit board 3 coated with the flux by the flux coating device 6 to the preheater 7. The transfer robot 21 sends the printed circuit board 3 heated by the preheater 7 to the soldering device 8. The transport robot 21 sends the printed circuit board 3 soldered by the soldering device 8 to the carry-out rail 51.

  The flux application device 6 is disposed in the movable range 22 of the transport robot 21 centering on the installation unit 2 of the transport robot 21 and is installed in the vicinity of the carry-in rail 41. The flux application device 6 applies the flux to the printed circuit board 3 conveyed by the conveyance robot 21. An organic solvent is used for the flux. For example, IPA (isopropyl alcohol) or the like is used. The flux coating device 6 may be provided with a plurality of coating devices. In that case, it is possible to use properly for lead-containing solder and for lead-free solder, properly use depending on the type of the printed circuit board 3, and depending on the type of flux.

  The pre-heater 7 is disposed in a movable range 22 of the transfer robot 21 with the installation unit 2 of the transfer robot 21 as the center. The preheater 7 is adjacent to the flux application device 6 and the soldering device 8. The preheater 7 is provided in a region between the carry-in rail 41 and the carry-out rail 51. The pre-heater 7 heats the printed circuit board 3 to dry the flux applied to the printed circuit board 3 by the flux applying device 6 and raises the printed circuit board 3 uniformly to a predetermined temperature. When the printed circuit board 3 is heated in this way, the solder is likely to adhere to a predetermined portion of the printed circuit board 3. As the preheater 7, for example, a halogen heater is used. The halogen heater is capable of rapidly heating the printed circuit board 3 to a set temperature.

  The soldering device 8 is disposed in the movable range 22 of the transfer robot 21 with the installation unit 2 of the transfer robot 21 as the center, and is installed in the vicinity of the carry-out rail 51. As the soldering device 8, for example, a jet soldering device is used. The soldering device 8 forms solder at a predetermined location on the printed circuit board 3. The soldering device 8 jets molten solder that has been pumped by a pump (not shown) to the printed circuit board 3.

  As an example of the present invention, when the soldering device 8 is constituted by a jet soldering device, an inert gas such as N2 can be supplied to the solder bath for containing the molten solder in order to suppress the oxidation of the molten solder. .

  This inert gas is supplied to a space serving as a reservoir for an ineffective gas constituted by a solder liquid surface and an inert gas cover (not shown) that covers the solder bath. The jet soldering apparatus can be configured to discharge the inert gas toward the printed circuit board 3 from the opening of the inert gas cover provided around the nozzle for jetting molten solder.

  In this case, since the discharged inert gas becomes a high temperature of about 240 ° C. in this example due to the molten solder, there is an effect of heating the soldered portion of the printed circuit board 3 and its periphery. Therefore, when soldering to a predetermined location of the printed circuit board 3, heat can be applied to the soldered location of the printed circuit board 3 and its surroundings by the high-temperature inert gas discharged from the periphery of the nozzle.

  The soldering portion heated by the pre-heater 7 is likely to drop in temperature before being transferred to the soldering device 8 and being soldered. In particular, when there are many soldering locations on the printed circuit board 3, the time difference between the time when the preheating is completed and the soldering is increased, and a temperature difference is likely to occur at the soldering locations, resulting in poor soldering quality. It becomes stable.

  Heat can be applied to the soldered portion of the printed circuit board 3 and its surroundings by the high-temperature inert gas discharged from the periphery of the nozzle, so that a decrease in temperature can be compensated. Since the temperature drop can be compensated, instability of the soldering quality accompanying the temperature drop can be prevented, and the soldering quality can be kept constant.

  The inert gas may be supplied to the solder bath at a high temperature by a known means, or the pipe for supplying the inert gas may be passed through the molten solder so as to pass through the solder bath. You may make it arrange | position to.

  The cooling device 9 is installed in the vicinity of the soldering device 8, and is provided under the carry-out rail 51 in the soldering chamber 10 in the present embodiment. The cooling device 9 may be disposed in the movable range 22 of the transfer robot 21 around the installation unit 2 of the transfer robot 21. The cooling device 9 has a cooling fan (not shown). The cooling device 9 cools the printed circuit board 3 soldered by the soldering device 8.

  In the present embodiment, the position (upward in the figure) where the carry-in part 4 is provided with respect to the carry-out part 5 is the front, and the position (downward in the figure) where the carry-out part 5 is provided with respect to the carry-in part 4 is the rear. At this time, the flux application device 6 and the soldering device 8 are accommodated in the movable range 22 of the transfer robot 21 in the soldering chamber 10 and are disposed at positions that move back and forth across the installation portion 2 of the transfer robot 21 and the preheater 7. Is done.

  More specifically, a flux application device 6 is provided in front of the preheater 7. A soldering device 8 is provided behind the preheater 7. A cooling device 9 is provided behind the preheater 7. A flux application device 6 is provided in front of the installation unit 2 of the transfer robot 21. A soldering device 8 is provided behind the installation unit 2 of the transfer robot 21. That is, the flux application device 6, the preheater 7, and the soldering device 8 are arranged in this order in the clockwise direction around the installation portion 2 of the transfer robot 21. The flux applying device 6, the preheater 7, and the soldering device 8 may be located on concentric circles or may not be located on concentric circles.

  If the flux applying device 6, the preheater 7, and the soldering device 8 are arranged in the movable range 22 of the transfer robot 21 with the installation unit 2 as the center, these devices may not be arranged as described above. . For example, the flux applying device 6, the preheater 7, the soldering device 8, and the cooling device 9 may be arranged clockwise or counterclockwise in this order, or arranged in a plurality of rows.

  In this embodiment, since the printed circuit board 3 is conveyed in the order of the carry-in rail 41, the flux applying device 6, the preheater 7, the soldering device 8, the cooling device 9, and the carry-out rail 51, the arrangement of the present embodiment is adopted. Thus, the printed circuit board 3 can be transported by the shortest path within the movable range 22 of the transport robot 21. Therefore, the soldering system 1 incorporating the flux applying device 6, the preheater 7 and the soldering device 8 can be realized in a small space, and the efficiency of the soldering work can be improved.

  A control unit 20 shown in FIG. 2 is provided in the soldering chamber 10. A carry-in rail 41, a carry-out rail 51, pushers 42 and 52, a flux application device 6, a preheater 7, a soldering device 8, a cooling device 9, a transport robot 21, and an operation unit 40 are connected to the control unit 20. When the operator operates the operation unit 40, the control unit 20 controls the conveyance speed of the carry-in rail 41 and the carry-out rail 51, the timing of conveying the printed circuit board 3, the temperature of the flux that the flux application device 6 has, and the amount of flux applied The temperature of the preheater 7, the temperature of the molten solder of the soldering device 8, the solder jet velocity, the ON / OFF of a cooling fan (not shown) included in the cooling device 9, the operation of the transport robot 21, and the like are controlled.

  In this example, the cooling fan is controlled only for ON and OFF, but the cooling temperature may be set and controlled as necessary. In that case, the printed circuit board 3 can be cooled with a desired temperature profile.

[Operation example of soldering system 1]
Next, an operation example of the soldering system 1 will be described. It is assumed that the operator performs various settings using the operation unit 40 and the control unit 20 operates each unit.

  As shown in FIG. 1, the operator carries the printed circuit board 3 into the carry-in rail 41 from the opening 41 a of the carry-in unit 4. When the operator rotates the screw adjustment portion 41B so that the width of the carry-in rail 41 matches the size of the printed circuit board 3, the screw shaft 41A rotates, and the widths of the carry-in rail 41 and the carry-out rail 51 simultaneously change by the same amount. With this configuration, the width of the carry-in rail 41 and the carry-out rail 51 can be collectively adjusted according to the width of the printed circuit board 3. An operator adjusts the width of the grip portion of the transport robot 21 according to the width of the printed circuit board 3.

  The pusher 42 pushes out the printed circuit board 3, and the printed circuit board 3 is carried into the soldering chamber 10 as indicated by a one-dot chain line in the drawing. The transfer robot 21 approaches the carry-in rail 41. The pusher 42 further pushes the printed circuit board 3 and passes the printed circuit board 3 to the gripping portion of the transport robot 21. The transport robot 21 transports the printed circuit board 3 onto the flux application device 6. In the flux applying device 6, the flux is applied to a predetermined portion of the printed circuit board 3.

  The transport robot 21 transports the printed circuit board 3 coated with the flux by the flux coating device 6 to the preheater 7. The preheater 7 dries the flux applied to the printed circuit board 3 and heats the printed circuit board 3 to a predetermined temperature. The transport robot 21 transports the printed circuit board 3 heated to a predetermined temperature by the preheater 7 to the soldering device 8.

  A soldering device 8 performs soldering on a predetermined portion of the printed circuit board 3. The transfer robot 21 delivers the soldered printed circuit board 3 to the carry-out rail 51.

  A cooling fan (not shown) of the cooling device 9 cools the printed circuit board 3 subjected to the soldering process. In this example, the cooling device 9 cools the printed circuit board 3 for a predetermined time. The cooling time can be arbitrarily set by the operator according to the product. Further, the temperature may be controlled so that the printed circuit board 3 is cooled to a predetermined temperature. Even in this case, the cooling temperature can be arbitrarily set by the operator.

  After the printed circuit board 3 is cooled to a predetermined temperature, the pusher 52 pushes the printed circuit board 3 and moves it on the carry-out rail 51. When the printed circuit board 3 moves to the carry-out unit 5, the soldering process by the soldering system 1 is completed.

  In the present embodiment, the carry-in unit 4 and the carry-out unit 5 have different configurations, and are provided on the same side of the soldering chamber 10 so that the carry-in rail 41 and the carry-out rail 51 are parallel to each other. It is not limited to this. For example, the carry-in unit 4 and the carry-out unit 5 may be provided on different side surfaces of the soldering chamber 10 so as to be movable forward and backward with respect to the soldering chamber 10.

  You may provide the conveyance part which has the function of the carrying-in part 4 and the carrying-out part 5, and can move forward / backward with respect to the soldering chamber 10. FIG. In that case, a pair of parallel conveyance rails may carry the printed circuit board 3 into the soldering chamber 10 and carry the printed circuit board 3 out of the soldering chamber 10. Moreover, it is good also as a structure which does not provide the carrying-in part 4 and the carrying-out part 5, but can take in / out the printed circuit board 3 directly in the soldering chamber 10. FIG.

  In the present embodiment, the pair of carry-in rails 41 and the pair of carry-out rails 51 are configured such that the widths thereof are simultaneously controlled and changed, but the present invention is not limited thereto. The carry-in rail 41 and the carry-out rail 51 may be screwed into different screw shafts and controlled separately. Moreover, even if a pair of carrying-in rail 41 does not change a position together, it is good also as a structure in which one of a pair of carrying-in rail 41 is being fixed, and the other changes a position with rotation of the screw shaft 41A. The pair of carry-out rails 51 may also be configured such that one of the pair of carry-out rails 51 is fixed and the other is changed in position with the rotation of the screw shaft 41A without changing the position of both.

  In the present embodiment, the operator adjusts the widths of the carry-in rail 41 and the carry-out rail 51 by manually rotating the screw shaft 41A using the screw adjustment unit 41B, but the present invention is not limited thereto. For example, the operator may automatically adjust the width of the carry-in rail 41 and the carry-out rail 51 corresponding to the width of the printed circuit board 3 when the operator inputs the width of the printed circuit board 3 through the operation unit 40.

  The present invention is extremely suitable when applied to an apparatus for soldering an electronic component to a printed circuit board.

DESCRIPTION OF SYMBOLS 1 Soldering system 2 Installation part 4 Carry-in part 5 Carry-out part 6 Flux application apparatus 7 Preheater 8 Soldering apparatus 10 Soldering chamber 41 Carry-in rail 42, 52 Pusher 51 Carry-out rail

The technical means of the present invention taken in order to solve the above-mentioned problems are as follows.
(1) An installation part of a transfer robot provided in the center of the soldering chamber, a flux application device that applies flux to a printed board that is transferred by the transfer robot, a preheater that heats the printed board that has been flux applied, A soldering device for soldering to a printed circuit board, a cooling device for the soldered printed circuit board, a carry-in rail for passing the printed circuit board to the transfer robot, and a carry-out rail for receiving the printed circuit board from the transfer robot , at least a flux applying device , preheater and soldering device is arranged on a movable region of the transfer robot, the cooling device is disposed beneath the unloading rail, the flux coating device and the soldering device is disposed an installation unit and preheater in pressed-free position Soldering system. In the present invention, the center includes the center and the periphery of the center.

(2) a flux coating apparatus, preheater and soldering apparatus, while being accommodated in the soldering chamber, unloading unit for conveying the loading unit and the printed circuit board for transporting the printed circuit board, the side of the soldering chamber The soldering system according to (1), which is provided in the above.

(3) The soldering system according to (2), wherein the carry-in part and the carry-out part are positioned in parallel.

(4) The soldering system according to (2), wherein the carry-in rail extends from the carry-in portion into the soldering chamber, and the carry-out rail extends from the carry-out portion into the soldering chamber.
(5) The soldering system according to (3) or (4) , wherein the widths of the carry-in rail and the carry-out rail are controlled simultaneously.

According to the soldering system according to the present invention, a soldering system including a flux application device, a preheater , a soldering device, and a cooling device can be realized in a small space.

The technical means of the present invention taken in order to solve the above-mentioned problems are as follows.
(1) An installation part of a transfer robot provided in the center of the soldering chamber, a flux application device that applies flux to a printed board that is transferred by the transfer robot, a preheater that heats the printed board that has been flux applied, A soldering device for soldering to a printed circuit board, a cooling device for the soldered printed circuit board, a carry-in rail for passing the printed circuit board to the transfer robot, and a carry-out rail for receiving the printed circuit board from the transfer robot, at least a flux applying device The preheater and the soldering device are disposed within the movable range of the transfer robot, the flux applying device, the preheater and the soldering device are accommodated in the soldering chamber, and the flux applying device and the soldering device are sandwiched between the installation portion and the preheater. There are disposed, unloaded carrying rails Lumpur, parallel provided to extend in the soldering chamber from the same side of the soldering chamber, the cooling apparatus is disposed under the unloading rail Ruhanda with system. In the present invention, the center includes the center and the periphery of the center.

(2) Soldering system according to unloading unit for conveying the loading unit and the printed circuit board for transporting the print substrate is provided on the side of the soldering chamber (1).

Claims (4)

A transfer robot installed in the center of the soldering chamber;
A flux application device for applying flux to a printed circuit board conveyed by the conveyance robot;
A preheater for heating the printed circuit board coated with flux;
A soldering device for soldering to the heated printed circuit board;
A soldering device for cooling the printed circuit board,
The flux application device, the pre-heater and the soldering device are disposed within a movable range of the transfer robot,
A soldering system in which the flux applying device and the soldering device are disposed at positions in the movable range of the transfer robot that move back and forth across the installation portion and the preheater. The flux application device, the preheater and the soldering device are:
While housed in the soldering chamber,
A carry-in part for carrying the printed circuit board and a carry-out part for carrying the printed circuit board,
The soldering system according to claim 1, wherein the soldering system is provided so as to freely advance and retreat with respect to the solder chamber.   The soldering system according to claim 2, wherein the carry-in part and the carry-out part advance and retreat in parallel. A carry-in rail for carrying the printed circuit board into the soldering chamber;
An unloading rail for unloading the printed circuit board from the soldering chamber;
The soldering system according to claim 3, wherein widths of the carry-in rail and the carry-out rail are controlled simultaneously.

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