JP4440186B2 - Soldering device - Google Patents

Description

  The present invention relates to a soldering apparatus that performs a soldering process on a printed wiring board on which electronic components are mounted.

  As a method of soldering an electronic component to a printed wiring board, partial soldering for bringing an electronic component into contact with a molten solder or a soldered surface of a printed wiring board on which an electronic component is mounted is a solder tank. There is collective flow soldering in which molten solder is brought into contact with the soldered portions of all electronic components by dipping in the solder. Further, there is a reflow soldering method in which electronic components are mounted on a printed wiring board to which molten solder has been applied in advance and the electronic components are soldered to the printed circuit board by remelting the solder.

  On the other hand, there are Sn-Pb eutectic solder (hereinafter referred to as eutectic solder) and lead-free solder as solder types. Conventionally, when soldering printed circuit boards, depending on the soldering method and type of solder It was necessary to prepare several types of soldering devices.

  Therefore, as a soldering device that enables a plurality of soldering methods in one unit, a collective flow soldering function (with a time difference depending on the transport means), a partial soldering function, and a function of removing electronic components that have already been soldered (For example, refer patent document 1).

  There are two types of electronic components to be mounted on a printed wiring board, one having a long lead wire (hereinafter, a long lead electronic component) and one having a short lead wire (hereinafter, a short lead electronic component). When the printed wiring board on which the long lead electronic component is mounted is batch-flow soldered by the solder processing apparatus described in Patent Document 1, when the printed wiring board is conveyed by the conveying means, the lead wire is blown from the blower body or the solder tank. There was a problem of interference. Further, since the solder processing apparatus has no means for replacing the solder tank, a solder processing apparatus is required for each type of solder used, such as eutectic solder or lead-free solder.

Japanese Patent Laid-Open No. 10-193091

Since the conventional soldering apparatus is configured as described above, there is a problem that it is not possible to perform batch flow soldering of long lead electronic components.
Furthermore, there is a problem that collective flow soldering using eutectic solder and lead-free solder cannot be performed with one apparatus.

  The present invention has been made to solve the above-described problems, and is a versatile device that enables electronic component lead lengths and batch flow soldering corresponding to a plurality of types of solder with a single device. An object is to provide a soldering apparatus.

A soldering apparatus according to the present invention includes a workpiece conveyance unit that conveys a printed wiring board on which electronic components are mounted, a solder tank unit that is disposed below the workpiece conveyance unit and has a chamber that stores molten solder, and a printed wiring board. A blowout body for a long lead that is selected when the lead length of an electronic component mounted on a printed wiring board is long and is detachable from the chamber, and a printed wiring board A slot for the short lead, which is selected when the lead length of the electronic component mounted on the printed wiring board is short, and is detachable from the chamber. An elevator part that holds the solder tank part and moves up and down, and the work conveying part and the elevator part are attached with a blower for a long lead to the chamber. If the printed wiring board is transported, the transportation is stopped when the printed wiring board is positioned immediately above the blowout port, and the soldered part of the printed wiring board comes into contact with the molten solder ejected from the blowout port. Then, raise the solder tank part and perform batch flow soldering.After finishing the collective flow soldering, lower the solder tank part to the position where the solder tank part does not interfere with the lead of the electronic component, and then reattach the printed wiring board. When the blow lead body for short lead is attached to the chamber, the printed wiring board is transported and printed on the molten solder that is ejected from the blow outlet when the printed wiring board reaches directly above the blow outlet. The soldered part of the wiring board is brought into contact and batch flow soldering is performed. At this time, the printed wiring board is conveyed without stopping. .

According to the present invention, the long lead electronic component and the short lead electronic component corresponding to each of the long lead electronic component and the short lead electronic component are provided. There is an effect that batch flow soldering according to the size can be performed.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below. 1 is a side view showing a soldering apparatus according to Embodiment 1 of the present invention. In FIG. 1, the direction in which the printed wiring board, which is a workpiece, is conveyed is a horizontal direction on the paper surface, and this direction is the X-axis direction. A direction perpendicular to the paper surface is defined as a Y-axis direction, and a height direction of the apparatus is defined as a Z-axis direction. The three axes shall be orthogonal to each other.
1 is roughly divided into a solder tank unit 100, a workpiece transfer unit 200, an elevator unit 300 for adjusting the height of the solder tank unit 100, and a solder tank transfer unit 400.

  The solder tank unit 100 includes a solder tank 10 having a chamber structure, a blower body 4 and 5 which will be described later, a pump 6 for supplying the molten solder 11 to the blower bodies 4 and 5 and the like. In the solder tank 10, in order to perform soldering of the printed wiring board 1, solder that has been melted by heater heating (hereinafter, melted solder 11) is stored.

  The work conveyance unit 200 has grooves for fitting the end portions on the printed wiring board 1 side to two parallel conveyor frames. The printed wiring board 1 fitted to the transport conveyor 3 is transported in the transport direction (X-axis direction). Accordingly, the workpiece transfer unit 200 determines the position of the printed wiring board 1 that is a workpiece in the X coordinate, and accurately places the printed wiring board 1 at the soldering position directly above the solder tank 100, so that the surface to be soldered is provided. Are batch flow soldered.

The elevator section 300 has a jack mechanism that supports the solder tank section 100 and changes its height (Z direction) position. An air cylinder, a hydraulic type, an electric actuator or other actuator mechanism may be used.
The elevator section 300 adjusts the height of the solder tank section 100 so that the soldered surface of the printed wiring board is evenly immersed in the molten solder 11 of the solder tank 10 and soldered accurately. Further, as will be described later, by reducing the height of the solder tank portion 100, it is possible to avoid interference between the solder tank 10 and the blower body and the lead wire.

The solder tank transport unit 400 includes a flat support plate that contacts the lower part of the elevator unit 300, and a moving unit 9 such as a wheel attached to the lower surface of the support plate. By sliding the moving means 9 on the rail provided at a predetermined position on the floor surface (ground surface), the elevator section 300 and the solder tank section 100 thereon can be moved along the rail. Therefore, it is possible to position the solder tank 100 with respect to the workpiece transfer unit 200 and to smoothly perform the replacement work of the solder tank 10 described later.
Instead of a combination of rails and wheels, a moving means that can move in any direction on a floor surface (XY plane) such as a caster may be used.

  2 is a side view of the printed wiring board 1 in FIG. 1, FIG. 2 (a) shows a printed wiring board on which short lead electronic components are mounted, and FIG. 2 (b) is on which long lead electronic components are mounted. A printed wiring board is shown. Hereinafter, an electronic component having a lead length of 3 mm or more (long lead 16) from the lower surface of the printed wiring board 1 is a long lead electronic component, and an electronic component having a lead length of less than 3 mm (short lead 15) is a short lead electronic component. And

  Next, the configuration of the solder tank unit 100 will be described in detail. FIG. 3 is a cross-sectional side view of the main part showing the blower body 4 for a long lead electronic component attached to the solder tank 10 in FIG. The blower body 4 of FIG. 3 is used for the collective flow soldering processing operation of the printed wiring board on which the long lead electronic component of FIG. 2B is mounted.

  In FIG. 3, the solder tank 10 includes a blower body 4 and a pump 6 that supplies molten solder 11 to the blower body 4. A concave portion between the blower body 4 and the pump 6 in FIG. 3 is a solder supply path 14 from the pump 6 to the blower body 4, and is a part belonging to the solder tank 10 in configuration.

The blower body 4 has a chamber structure having a bottom surface that opens as a supply port for the molten solder 11 and has an upper surface. On the upper surface of the blower body 4, a blowout port 12 (substantially rectangular in FIG. 3) of a size that can accommodate the printed wiring board 1 is provided. The molten solder 11 is ejected from the blowout port 12 to form a jet wave, and the soldered surface of the printed wiring board 1 is brought into contact with the jet wave to perform collective flow soldering. The outlet 12 plays a role of adjusting the shape of the jet wave to a desired shape.
Moreover, the blower body 4 is provided with the attachment part 4a of the shape which bent the outer peripheral part outward, and the screw hole is drilled in the attachment part 4a.

  On the other hand, the solder tank 10 is provided with a mounting portion 10a projecting inward, and is similarly provided with a screw hole. The blower body 4 is covered on the mounting part 10a of the solder tank 10 so that the mounting part 4a overlaps, and the screw 7 is inserted into both screw holes and fastened to fix the blower body 4 to the solder tank 10. To do.

The pump 6 is supplied with the molten solder 11 from the solder tank 10 into its own cylinder, and pushes the molten solder 11 within its own cylinder when the pressing portion slides within the own cylinder. The extruded molten solder 11 reaches the blower body 4 through the solder supply path 14. The molten solder 11 sent out by the pump 6 is ejected from the blower body 4 and is returned to the solder tank 10 after being ejected. In this process, jet waves are formed.
The molten solder 11 overflowing from the outlet 12 is supplied to the pump 6 from the upper part of the pump 6.

FIG. 4 is a side cross-sectional view of the main part showing the blowout body 5 for a short lead attached to the solder tank 10 in FIG. The blower body 5 of FIG. 4 is used for collective flow soldering processing of a printed wiring board on which the short lead electronic component of FIG. 2A is mounted.
In FIG. 4, a slot-like blowing port 13 having a length wider than the width (Y-axis direction) of the printed wiring board 1 is provided on the upper surface of the blowing body 5. Other configurations are the same as those in FIG.

Next, the operation will be described. First, a method for soldering a long lead electronic component will be described with reference to FIGS. FIG. 5 is a perspective view showing the blower body 4 for the long lead electronic component attached to the solder tank 10 in FIG.
As the blower body, a blower body 4 as illustrated in FIGS. 3 and 5 is attached to the solder tank. Then, the printed wiring board 1 is fitted and fixed to the transfer conveyor 3 of the workpiece transfer unit 200.

Subsequently, the printed wiring board 1 as a work to be soldered is carried in from the carry-in entrance, and then the conveyor 3 conveys the printed wiring board 1.
The conveyed printed wiring board 1 stops immediately above the solder tank 10. At this time, the height (Z direction) position of the solder tank 10 is set by the elevator mechanism 8 so as not to interfere with the long lead 16 of the electronic component 2 mounted on the printed wiring board 1.

Next, the solder tank 10 is raised by the elevator mechanism 8 to a position where the molten solder 11 contacts the soldered surface (back surface) of the printed wiring board 1. The printed wiring board 1 comes into contact with a jet wave ejected from the blowout port 12 on the solder tank 10, and in this process, molten solder is supplied to the soldered portion and batch flow soldering is performed.
After the soldering of the printed wiring board 1 is finished, after the solder tank 10 is lowered to a predetermined position (at least the long lead 16 does not interfere with the solder tank 10 and the outlet 12) by the elevator mechanism 8, the printed wiring board 1 is It is carried out from the carry-out port by the carrying conveyor 3.

In the present invention, the solder tank 10 and the long lead 16 are connected by the elevator mechanism 8 that moves the solder tank 10 up and down while performing batch flow soldering by temporarily stopping the blowout port 12 and the conveyor 3 larger than the printed wiring board 1. To prevent interference.
Note that flux is applied in advance to the soldered surface of the printed wiring board 1 and preheating is performed. These processes are performed in a process preceding the carry-in port of the soldering apparatus.

Next, a method for soldering a short lead electronic component will be described with reference to FIGS. FIG. 6 is a perspective view showing a case where the blow lead body 5 for a short lead attached to the solder tank 10 in FIG. 1 is seen from a slightly upper surface.
As the blower body, a blower body 5 for flow soldering as illustrated in FIGS. 4 and 6 is attached to the solder tank 10. Then, the printed wiring board 1 is fitted and fixed to the transfer conveyor 3 of the workpiece transfer unit 200.

Subsequently, the printed wiring board 1 which is a work to be soldered is carried in from the carry-in entrance, and the conveyor 3 conveys the printed wiring board 1.
When the printed wiring board 1 reaches directly above the solder tank 10, it contacts the jet wave ejected from the blowout port 13 on the solder tank 10, and in this process, the molten solder 11 is supplied to the soldered portion and batch flow soldering is performed. Is done. At this time, the transport conveyor 3 is transported in the direction of the arrow in FIG. 6 without stopping.
After the printed wiring board 1 is soldered, the printed wiring board 1 is unloaded from the carry-out port.

In the short lead electronic component, since the short lead 15 does not interfere with the solder tank 10 or the blower body 5, the conveyance conveyor 3 is not stopped or the solder tank 10 is not moved up and down by the elevator mechanism 8. Further, the width of the blowout port 13 only needs to be a width wider than the width of the printed wiring board 1.
In this method, since the printed wiring board 1 is constantly moving in the X-axis direction by the transfer conveyor 3, there is a processing time difference in batch flow soldering of one printed wiring board, but the work transfer unit 200 is stopped. As a result, the number of processing lots is improved.

The other processing procedures are the same as the soldering process for the long lead electronic component, and thus the description thereof is omitted.
In addition, the soldering process of the short lead electronic component is performed using the soldering processing method of the long lead electronic component (blowing body 4) described above without using the present soldering processing method (blowing body 5). You can also.

Lastly, a method for replacing the solder bath 100 will be described with reference to FIG. The solder tank unit 100 is replaced by the moving means 9 of the solder tank transfer unit 400. As an example, a case will be described in which two types of eutectic solder and lead-free solder are replaced.
First, it is assumed that the soldering process is performed using the solder tank 10 in which the molten eutectic solder (molten solder 11) is stored.

It is assumed that all the workpieces to be soldered by eutectic solder are carried out from the carry-out port by the workpiece carrying unit 100.
The batch flow soldering by the eutectic solder is finished, the moving means 9 is slid on the rail provided on the floor surface, and the solder tank unit 100 including the solder tank 10 storing the eutectic solder, and the elevator unit 300. Then, the solder tank transfer unit 400 is moved as a set (hereinafter referred to as a eutectic solder set) from the position where the soldering process is performed to the standby place.
In addition, another set of the same set (hereinafter referred to as a lead-free solder set) including the solder tank 10 storing the molten lead-free solder (molten solder 11) is prepared in advance in a standby place.

Then, after the eutectic solder set is moved, the moving means 9 is slid on the rail to move the lead-free solder set to a position where the soldering process is performed.
In addition, as a replacement method of the solder tank part 100, the solder tank part 100 and the lead-free solder of the eutectic solder are formed by detachably configuring the solder tank part 100 and the elevator part 300 instead of replacing each set. It is good also as a method of replacing | exchanging only the solder tank part 100 of this.

As described above, according to the first embodiment, since the blower bodies 4 and 5 corresponding to the long lead electronic component and the short lead electronic component are provided, the lead length (long lead) is provided by one device. 16, it is possible to perform collective flow soldering according to the short lead 15).
Furthermore, since the solder tank 10 that can be easily replaced is provided, it is possible to perform collective flow soldering according to the type of solder such as eutectic solder or lead-free solder with a single device.

  In addition, although the pump for solder jet wave formation of Embodiment 1 demonstrated the case where the extrusion type was used, you may use a jet type pump.

  In addition, the height adjustment of the solder tank 10 by the elevator mechanism 8 after the long lead electronic component soldering according to the first embodiment may be a manual method, a sequence control in which an operation is set in advance, or the like. Further, the same effect can be obtained with a mechanism that automatically adjusts the position by reading the lead length of the electronic component 2 mounted on the printed wiring board 1 using an image processing apparatus.

It is a side view which shows the soldering apparatus which concerns on Embodiment 1 of this invention. FIG. 2A is a side view of the printed wiring board 1 in FIG. 1, FIG. 2A shows a printed wiring board on which short lead electronic components are mounted, and FIG. 2B is a printed wiring board on which long lead electronic components are mounted. Show. It is principal part sectional drawing which shows the blowing body 4 for long lead electronic components attached to the solder tank 10 in FIG. It is principal part sectional drawing which shows the blower body 5 for short leads attached to the solder tank 10 in FIG. It is a perspective view which shows the case where the blower body 4 for long lead electronic components attached to the solder tank 10 in FIG. 1 is seen from the upper surface a little. It is a perspective view which shows the case where the blower body 5 for short leads attached to the solder tank 10 in FIG. 1 is seen from the upper surface a little.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed wiring board, 2 Electronic components, 3 Conveyor, 4 Blower body, 4a attachment part, 5 Blower body, 6 Pump, 7 Screw, 8 Elevator mechanism, 9 Moving means, 10 Solder tank, 10a Attachment part, 11 Molten solder, 12 outlet, 13 outlet, 15 short lead, 16 long lead, 14 solder supply path, 100 solder tank part, 200 workpiece transfer part, 300 elevator part, 400 solder tank transfer part.

Claims (5)

A workpiece transfer section for transferring a printed wiring board carrying electronic components;
A solder tank having a chamber disposed below the workpiece transfer unit and storing molten solder;
A blower for a long lead that is selected when the lead length of the electronic component mounted on the printed wiring board is long and has a blowout opening of a size that can accommodate the printed wiring board, and is detachable from the chamber. The mouth,
A short having a slot-like outlet that is wider than the width of the printed wiring board and selected when the lead length of the electronic component mounted on the printed wiring board is short, and is detachable from the chamber. The lead mouthpiece,
An elevator part for holding the solder tank part and moving it up and down;
The workpiece transfer unit and the elevator unit are
When the long lead blow body is attached to the chamber,
When the printed wiring board is conveyed, the conveyance is stopped when the printed wiring board is positioned immediately above the blowout port, and the soldered portion of the printed wiring board comes into contact with the molten solder ejected from the blowout port. The solder tank part is raised to perform batch flow soldering, and after the batch flow soldering is finished, the solder tank part is lowered to a position where it does not interfere with the lead of the electronic component, Transport the printed wiring board again,
When the blowout body for the short lead is attached to the chamber,
The printed wiring board is conveyed, and when the printed wiring board reaches directly above the blowout port, the soldered portion of the printed wiring board is brought into contact with the molten solder ejected from the blowout port to perform collective flow soldering. In this case, the soldering apparatus transports the printed wiring board without stopping. While holding the elevator part , and having a moving means movable relative to the ground plane,
The soldering apparatus according to claim 1, further comprising a solder tank transport section that transports the solder tank section and the elevator section.   The soldering apparatus according to claim 2, wherein the solder tank part is detachable from the elevator part.   The solder according to any one of claims 1 to 3, further comprising: a pump that supplies the molten solder from the chamber to the long lead blow body or the short lead blow body. Attachment device.   5. The soldering apparatus according to claim 4, wherein the pump is an extrusion type or jet type pump.

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