JP2016514902A - Super capacitor structure - Google Patents

Abstract

For example, a supercapacitor structure is provided that includes one or more layers of supercapacitors and one or more contact tabs. One or more contact tabs extend outwardly from the supercapacitor structure to allow electrical contact with and connection to the supercapacitor structure, and the one or more contact tabs are multi-contact Includes tabs. Various true supercapacitor structures are provided, including one supercapacitor structure having a common C-shaped current collector and another supercapacitor structure on which supercapacitors are stacked. One or more additional multi-contact tabs also extend from the supercapacitor structure and distribute the same or different capacitor voltages.

Description

  The present invention relates to an energy storage device that includes a supercapacitor, and more particularly to an enhanced supercapacitor structure with one or more layers of the supercapacitor and in electrical contact with the supercapacitor structure. Related to various configurations of contact or dispensing tabs.

CROSS REFERENCE TO RELATED APPLICATIONS This application is a priority from US Provisional Patent Application No. 61 / 801,206, filed Mar. 15, 2013, which is hereby incorporated by reference herein in its entirety. Asserts rights. Additionally, this application is filed concurrently with US Provisional Patent Application No. 61 / 884,338, entitled “Bendable Cell,” which is further incorporated herein by reference in its entirety. ing. Further, this application includes US Patent Application No. 8,514,548B2, issued August 20, 2013, and US Patent Application No. 13 / 417,199, filed March 9, 2012. Both of which are hereby incorporated herein by reference in their entirety.

  Mobile consumer electronic devices such as smartphones, tablet computers, portable media players, etc., have many energy consuming components and subsystems such as displays, wireless transceivers, processors, and camera flash devices, etc. Can have. Each component or subsystem may illustratively have different electrical requirements, including different operating requirements for voltage, current, and power. Meeting these varying requirements within the desired form factor and cost can pose considerable design challenges.

  The weaknesses of the prior art are overcome and an additional advantage is provided by the provision of the device in one aspect, wherein the device is a supercapacitor structure, comprising one or more layers of the supercapacitor A supercapacitor structure including one or more contact tabs that are in electrical contact with the supercapacitor structure and extend outwardly from the supercapacitor structure for easy electrical connection to the supercapacitor structure And one or more contact tabs including multi-contact tabs configured and sized with multiple contact locations disposed externally to the supercapacitor structure.

  In another aspect, a device is provided that includes an electronic structure and a supercapacitor structure. The supercapacitor structure includes one or more layers of the supercapacitor and is configured and sized to be above at least a small portion of the electronic structure and in part to facilitate electromagnetic shielding of the electronic structure. A sheet structure.

  Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are considered a part of the invention described and claimed in detail herein.

One or more aspects of the present invention are specifically pointed out and clearly claimed as examples in the claims at the end of the specification. The foregoing and other objects, features, and advantages of the invention will be apparent from the detailed description that follows, taken in conjunction with the accompanying drawings.
One implementation of an electronic assembly or device having a supercapacitor structure, including a multi-contact tab, with one or more contact tabs extending therefrom, according to one or more aspects of the present invention. It is a figure which illustrates a form. 1B is a block diagram of a more detailed embodiment of the electronic assembly or device of FIG. 1A according to one or more aspects of the present invention. FIG. 1B is a partial cross-sectional elevation view taken along line 1C-1C of one embodiment of the supercapacitor structure of FIG. 1A in accordance with one or more aspects of the present invention. FIG. According to one or more aspects of the present invention, an electronic assembly or device having at least in part a supercapacitor structure encapsulating around a battery and supplying power to one or more components of the electronic assembly. FIG. 6 illustrates another embodiment. 1D illustrates an alternative embodiment of the electronic assembly or device of FIG. 1D having a supercapacitor structure that, at least in part, encloses the periphery of a circuit board assembly, in accordance with one or more aspects of the present invention. Another implementation of an electronic assembly or device having a supercapacitor structure, including a multi-contact tab, with one or more contact tabs extending therefrom, according to one or more aspects of the present invention. It is a figure which illustrates a form. 2B is a partial cross-sectional elevation view taken along line 2B-2B of one embodiment of the supercapacitor structure of FIG. 2A in accordance with one or more aspects of the present invention. FIG. FIG. 6 illustrates a further embodiment of an electronic assembly or device having a supercapacitor structure with multiple multi-contact tabs extending therefrom, according to one or more aspects of the present invention. 3 illustrates supercapacitor structures and multi-contact tabs taken along lines 3B-3B of the electronic assembly of FIG. 3A and over different areas of the circuit board assembly, according to one or more aspects of the present invention. FIG. FIG. 3B is a plan view illustrating one embodiment of the area inside line 3C of the electronic assembly of FIG. 3A in accordance with one or more aspects of the present invention. One of the electronic assemblies or devices having a supercapacitor structure with multi-contact tabs configured and sized to be in close proximity or associated above an associated circuit board assembly in accordance with one or more aspects of the present invention. It is a top view of one embodiment. An electronic assembly or device having a supercapacitor structure with one or more contact tabs that facilitate electrical connection from one or more circuit board assemblies to the supercapacitor structure in accordance with one or more aspects of the present invention. It is a top view of another embodiment. According to one or more aspects of the present invention, the electronic assembly of FIG. 5A is taken along its lines 5B-5B and is in electrical contact with different regions of the one or more circuit board assemblies, or FIG. 3 is a partial cross-sectional elevation view illustrating one or more contact tabs extending into a region. An electronic assembly or device having a supercapacitor structure with one or more contact tabs that facilitate electrical connection from one or more circuit board assemblies to the supercapacitor structure in accordance with one or more aspects of the present invention. FIG. 6 illustrates an alternative embodiment. In accordance with one or more aspects of the present invention, an electronic having a supercapacitor structure residing above a circuit board assembly and having a multi-contact tab extending therefrom to facilitate electrical connection to the supercapacitor structure FIG. 6 is a plan view of a further embodiment of an assembly or device. FIG. 6B is a partial cross-sectional elevation view taken along line 6B-6B of the device of FIG. 6A in accordance with one or more aspects of the present invention. FIG. 6 illustrates another embodiment of an electronic assembly or device having a supercapacitor structure with one or more contact tabs in accordance with one or more aspects of the present invention. FIG. 7B is an internal view of one embodiment of the electronic assembly of FIG. 7A with multiple supercapacitor subassemblies according to one or more aspects of the present invention.

  Aspects of the present invention, as well as their determined features, advantages, and details, are more fully described below by reference to the non-limiting examples illustrated in the accompanying drawings. Well-known materials, fabrication tools, processing techniques, and other descriptions have been omitted so as not to unnecessarily obscure the invention in detail. It should be understood, however, that the detailed description and specific examples, while indicating embodiments of the invention, are given by way of illustration only and not by way of limitation. Various substitutions, modifications, additions and / or arrangements within the spirit and / or scope of the underlying inventive concept will become apparent to those skilled in the art from this disclosure. Become.

  Disclosed herein is an electronic assembly or device that includes supercapacitor structures each having one or more supercapacitors. As used herein, a “supercapacitor” illustratively comprises an electrochemical capacitor that includes an electrolyte disposed between electrodes, illustratively integrated with a structure such as a battery in a hybrid supercapacitor configuration. Can be done. An “electrolyte” is a substance through which electricity can pass, usually a liquid. One example of a supercapacitor is an electrochemical double layer capacitor (EDLC), which, for example, is illustratively an interface between the surface of a conductive electrode and an electrolyte, an ion double layer, Store electrical energy by isolation. Another term for supercapacitor is ultracapacitor. In one embodiment, the supercapacitor can be a stacked structure including a first current collector, a first electrode, a separator, a second electrode, and a second current collector, and the electrolyte Is disposed between the electrodes. In another example, the supercapacitor is an asymmetric or hybrid supercapacitor and may have one or more battery type electrodes and one or more capacitor type electrodes. In such an example, the supercapacitor may have one or more electrodes that support Faraday charging and one or more electrodes that support capacitive charging.

  Additionally, as used herein, an energy storage device can be a supercapacitor, a capacitor, a battery, a fuel cell, or any other device or structure capable of storing electrical energy. The energy density (or specific energy) of an energy storage device is defined as the amount of energy stored per unit mass of the device, while the power density is the energy that can be transferred to or from the device (units). Defined as the rate (per mass). As one example, an activated carbon supercapacitor can have, for example, one-tenth the energy density of a conventional lithium ion rechargeable battery, while, for example, a conventional lithium ion rechargeable battery. 10 to 100 times the power density.

  In one aspect, schematically described and provided herein is a reinforced electronic assembly or device that includes a supercapacitor structure and one or more contact tabs. The supercapacitor structure is in electrical contact with one or more layers of the supercapacitor and extends outwardly from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure. One or more electrically conductive contact tabs. The one or more contact tabs include at least one multi-contact tab. The multi-contact tab is configured and sized with multiple contact positions against it disposed external to the supercapacitor structure. In one particular embodiment, the multi-contact tab is illustratively a sheet or membrane tab that is designed to be above (or below) multiple components of one or more circuit board assemblies It is.

  In one embodiment, the electronic assembly or device is associated with (or includes) a circuit board assembly, and the multi-contact tab resides above at least a small portion of the circuit board assembly, and in part Configured and sized to facilitate electromagnetic interference shielding. In this embodiment, multiple contact locations on the multi-contact tab facilitate multiple electrical connections between the circuit board assembly and the supercapacitor structure, such as one or more components mounted on the circuit board assembly. To do. In one embodiment, the circuit board assembly may include one or more components having a major surface area, and the multi-contact tab is a surface area that is at least as large as the major surface area of the one or more components. Membrane tabs can be included. Additionally, the supercapacitor structure may be over one other portion of the circuit board assembly, including over one or more other components, including over one or more other components mounted on the circuit board assembly. It can be arranged to facilitate electromagnetic interference shielding of the elements. In one particular implementation, the multi-contact tab is a membrane or sheet tab with a surface area that is larger than the surface area of the main surface of the supercapacitor structure.

  In another embodiment, the supercapacitor structure resides over at least a small portion of the main surface of the battery and is configured and sized to facilitate electromagnetic interference shielding of the battery. By way of example, the supercapacitor structure is sized to encapsulate around the main surfaces of the battery and at least partially cover the main surfaces to facilitate shielding of the battery's electromagnetic interference And a flexible sheet configured.

  As a further example, a supercapacitor structure may include a shared C-shaped current collector (hereinafter shared C-shaped current collector), such as a bipolar C-shaped current collector, Alternatively, the plurality of layers may include a first supercapacitor and a second supercapacitor. Each of the first and second supercapacitors may include or utilize a shared C-shaped current collector. In one implementation, the shared C-shaped current collector at least partially surrounds the first and second supercapacitors. Illustratively, the first and second supercapacitors can reside within a shared C-shaped current collector of the supercapacitor structure. In one implementation, the multi-contact tab can be in electrical contact with and extend outward from the shared C-shaped current collector of the supercapacitor structure. In another implementation, the first supercapacitor can include another current collector, and the one or more contact tabs can include another multi-contact tab. Another multi-contact tab can be configured and sized with multiple contact locations disposed externally to the supercapacitor structure to further facilitate electrical connection to the supercapacitor structure And another multi-contact tab may be in electrical contact with another current collector. In this embodiment, the multi-contact tab is capable of distributing the first voltage, the other multi-contact tab is capable of distributing the second voltage, and the first and second voltages are super Different voltages provided or distributed from the capacitor structure. In one implementation, the multi-contact tab can be configured and sized in part to provide electromagnetic interference shielding for a majority of the associated circuit board assembly. Illustratively, the multi-contact tab can extend inside the circuit board assembly, or can be above one of the circuit board assemblies, on one or other major surface of the circuit board assembly.

  In one implementation, one or more layers of the supercapacitor may include a first supercapacitor and a second supercapacitor disposed in the stack. The first supercapacitor can include a shared current collector and a negative current collector, and the second supercapacitor can include a shared current collector and a positive current collector. In this embodiment, the shared current collector can be between a negative current collector and a positive current collector, and the multi-contact tab is shared between the first and second supercapacitors in the stack. It can be in electrical contact with the current collector. The one or more contact tabs may further include another multi-contact tab. Another multi-contact tab can be configured and sized with multiple contact locations disposed externally to the supercapacitor structure to facilitate electrical connection to the supercapacitor structure. Yes, another multi-contact tab can be in electrical contact with one of the negative current collector or the positive current collector. By way of example, a multi-contact tab and another multi-contact tab may extend from the same side of the supercapacitor structure or, illustratively, from the opposite side of the supercapacitor structure.

  In one implementation of the above structure, the multi-contact tab is configured and sized to cover a first sub-portion of one or more circuit board assemblies, and the multiple contact positions of the multi-contact tab are 1 Or facilitates multiple electrical connections between the first sub-portion of the plurality of circuit board assemblies and the supercapacitor structure, and another multi-contact tab provides a second sub-portion of the one or more circuit board assemblies. The multiple contact locations of another multi-contact tab are configured and sized to cover multiple electrical connections between the second small portion of one or more circuit board assemblies and the supercapacitor structure To make it easier. In one example, the multi-contact tab can be above the first circuit board assembly and another multi-contact tab can be above the second circuit board assembly. In addition, the multi-contact tab can be electrically connected to the supercapacitor structure to distribute the first voltage, and the second multi-contact tab can be electrically connected to the supercapacitor structure to distribute the second voltage. And the first voltage and the second voltage are different voltages.

  In a further implementation, one or more layers of the supercapacitor structure supercapacitor may comprise a first supercapacitor and a second supercapacitor, wherein the first supercapacitor is internal to the supercapacitor structure. Electrically spaced from the second supercapacitor, the multi-contact tab is in electrical contact with the first supercapacitor. In this embodiment, the multi-contact tab may be a first contact tab, the one or more contact tabs may further include a second contact tab, and the second contact tab is a super Electrically connected to the second supercapacitor of the capacitor structure. In one embodiment, the first contact tab is electrically connected to the first supercapacitor to distribute the first voltage, and the second contact tab is the first contact to distribute the second voltage. The first and second voltages are electrically connected to the two supercapacitors, and are different voltages. In one implementation, the first contact tab electrically connected to the first supercapacitor has a first resistance capacitance (RC) time constant and is electrically connected to the second supercapacitor. A second contact tab connected to the second RC has a second RC time constant, the first RC time constant and the second RC time constant being one or more components or one or more associations Different RC time constants (eg, adjusted to be different RC time constants) depending on the desired distribution characteristics for the supercapacitor voltage to the circuit board assembly being used.

  In another implementation, an electronic assembly or device is provided that includes an electronic structure, such as a battery, circuit board assembly, etc., and a supercapacitor structure. The supercapacitor structure includes one or more layers of supercapacitors and is fabricated and sized to be above at least a small portion of the electronic structure and at least in part to facilitate electromagnetic shielding of the electronic structure. (Or configured as the sheet structure). In one implementation, the sheet structure is configured and sized to be at least partially above, illustratively by enclosing the periphery of the component, opposite the surface of the electronic component. Flexible sheet structure. In this implementation, the one or more contact tabs are in electrical contact with the supercapacitor structure, become part of the supercapacitor structure, or alternatively extend outwardly from the supercapacitor structure, Electrical connection to the supercapacitor structure can be facilitated. Illustratively, one or more contact tabs can extend out from at least one edge of the flexible sheet structure. More specifically, the one or more contact tabs may include multi-contact tabs, which may include multiple electrical contacts to one or more components or one or more circuit board assemblies. To facilitate the connection, it is configured and sized with multiple contact locations arranged externally to the supercapacitor structure.

  Reference is made below to the drawings which are not drawn to scale for ease of understanding, and the same reference numerals used throughout the different figures represent the same or similar components.

  FIG. 1A illustrates one embodiment of an electronic assembly or device 100 in accordance with one or more aspects of the present invention. By way of example, device 100 may comprise portions of mobile consumer electronic devices such as mobile phones, tablet computers, portable media players, digital cameras, etc. In this example, device 100 includes a supercapacitor structure 110 that includes one or more supercapacitors, such as one or more layers of supercapacitors.

  As shown, the one or more contact tabs 120 are in electrical contact with the supercapacitor structure 110 and extend outward from the supercapacitor structure 110, for example, the circuit board assembly 130 and the supercapacitor. Multiplexes disposed externally to the supercapacitor structure 110 to facilitate multiple electrical or mechanical connections to the structure 110, either separately or in combination. One or more multi-contact tabs 122 configured and sized with contact locations 123 may be included. Contact tab 120 may be made of a conductive material such as one or more metals (including aluminum or copper) or graphite, for example, a foil, sheet, single wire, twisted pair of wires, or It can be a coaxial cable. In one example, the multi-contact tab 122 can be a metal film, sheet, foil, etc., and can be partially coated with an insulator material such that multiple contact locations 123 remain exposed. In another example, the multi-contact tab 122 may include one or more layers of material, including one or more layers of conductive material and one or more layers of non-conductive material. Contact location 123 can be any desired connection interface, such as solder bumps, conductive pads, through-hole contacts, lead, depending on the technology used to connect multi-contact tab 122 to circuit board assembly 130. , Adhesives, or other electrical or mechanical interfaces. For example, solder bumps can be used to allow surface connection or mounting, and through holes or posts can be used to facilitate electrical connection in one or more other implementations. . In one example, the contact location 123 may be directly connected to one or more components 140, which may be, for example, a double-sided flip chip package, while in another example, the contact location 123 is in a supercapacitor structure. It may be connected to the circuit board assembly 130 at a location close to the component 140 so that it is electrically connected.

  The circuit board assembly 130 may include, for example, one or more printed circuit boards for mobile electronic devices, including conductive planes such as ground and signal planes, tracks, conductive traces, pads, vias, etc. Can include multiple layers and conductive features, and can include a variety of different types of components 140, such as, for example, ball grid array (BGA) packaging Wireless transceivers, processors, memory, camera devices, etc., which can be surface mounted using, or through mounted using posts. The contact location 123 of the multi-contact tab 122 can be designed to facilitate electrical contact to selected portions of the circuit board assembly 130, including the component 140 of the circuit board assembly 130. Insulator materials (not shown) such as polymers, plastics, glass, ceramics, porcelain, rubber, and other materials may cover a small portion of the contact tab 120 to limit electrical connection to certain areas Thus, for example, the multi-contact tab 122 may be overlying or overlying the circuit board assembly 130 and includes (by way of example) the component 140 as a circuit board assembly. It can facilitate selective electrical contact with 130 while remaining electrically isolated from other underlying components. In one example, as shown, the supercapacitor structure 110 can be placed proximate to the circuit board assembly 130, and in another example, the supercapacitor structure 110 can be placed on the circuit board assembly 130, It can be placed below or inside.

  FIG. 1B is a block diagram of a more detailed embodiment of the device 100 of FIG. 1A, and the power between the supercapacitor 110, the battery 150, the circuit board assembly 130, and one or more components 140. Illustrated is an energy controller 160 that controls, regulates and / or balances the path. Energy controller 160 may be electrically connected to battery 150, supercapacitor structure 110, contact tab 120 (including multi-contact tab 122), circuit board assembly 130, and component 140 by multiple inputs and outputs. Which may include an electronic network, such as any energy storage device, illustratively a supercapacitor 110 or battery 150, using a circuit board (using multiple inputs and outputs). It includes programmable digital logic that is capable of controlling and switching to (by way of example) multiple contact tabs 120 connected to assembly 130 and / or component 140. This controlling and switching may be responsive to energy demands from device components. Additionally, the energy controller 160 may control charging of the energy storage device, including recharging the supercapacitor structure 110 with the battery 150.

  In one example, the energy controller 160 may allow one component 140 to be alternatively connected to the supercapacitor 110 or the battery 150 depending on its mode of operation. For example, the energy controller 160 may require a ramped current of 1.2 to 2.0 amps (eg, for a duration of 2 to 4 milliseconds), eg, during the delivery of data to a mobile communications network In response to intermittent high power surge requirements, the wireless transceiver can be programmed to connect to the supercapacitor structure 110. Additionally, the energy controller 160 can be sustained (eg, during a standby mode of the radio transceiver) (eg, can require 0.1 to 0.2 amps of current for a duration of 40 or more milliseconds). In response to power requirements, the wireless transceiver may be further configured or programmed to connect to the battery 150. As another example, the energy controller 160 may detect a transient burst of energy and store the energy in the supercapacitor structure 110. By adjusting access to the battery 150 and supercapacitor structure 110, the energy controller 160 decouples power requirements from energy requirements and reduces energy waste, thereby reducing the associated portable electronic device. Makes it easy to optimize battery life.

  Component 140 has different electrical characteristics, including different operating requirements for voltage, current, power, energy, and power supply resistance capacitance (RC) time constants that can best be met in association with different energy storage devices. Can have. In normal operation of the device 100 (such as a consumer electronic device), certain components 140 such as a processor, memory, display screen, etc., can consume power constantly while a wireless transceiver. Or other components 140, such as camera flashes, may consume high power intermittently for a short duration. In such cases, using a combination of a battery 150, such as a lithium ion rechargeable battery, and a supercapacitor structure 110, such as those disclosed herein, optimizes the energy inside the device 100. May be possible for use. Illustratively, the battery 150 can have a higher energy density than the supercapacitor and can provide energy to the component 140 that is constantly consuming power, and the one or more supercapacitors can be It may have a higher power density than the battery 150 and may provide more instantaneous energy to the component 140 that consumes relatively higher power intermittently. In one configuration, the supercapacitor structure 110 can also be continuously charged or recharged by the battery 150 to have supercapacitor energy available when needed. By using a combination of an energy storage device, such as a supercapacitor, and a conventional battery 150, the overall efficiency of energy use within the system can be improved, thereby allowing the consumer electronic device 100 to Enhance battery life and performance.

  In another aspect, electromagnetic interference can be suppressed by the multi-contact tab 122 and supercapacitor structure 110 disclosed herein. Electromagnetic interference (EMI) such as radio frequency interference (RFI) may occur externally or internally within device 100. EMI is a disturbance that can affect the performance of the device 100 including the component 140 and the circuit board assembly 130 when left uncontrolled. As one example, EMI can interfere with the function of the audio circuitry in the smartphone and degrade the quality of the audio signal. Common external sources that can cause EMI include televisions, computer monitors, cordless phones, microwave ovens, etc., and internally generated EMI is, for example, a mobile radio subsystem that communicates with, for example, a cellphone tower Can occur. Advantageously, the multi-contact tab 122 disclosed herein facilitates preventing EMI from reaching the electronic component 140 and / or the circuit board assembly 130 by way of illustration. Can be sized and configured. In one embodiment, the multi-contact tab 122 may comprise any suitable thickness metal sheet or film that acts as a barrier shield against electromagnetic radiation. In yet another embodiment, the multi-contact tabs 122 may further suppress EMI or include one or more additional materials, including conductive or insulating materials, with material properties that may facilitate heat dissipation. Various layers or membranes. Thus, in accordance with one or more aspects of the present invention, the multi-contact tab 122 advantageously facilitates electrical contact between multiple electronic devices and the supercapacitor structure 110, while at the same time EMI is illustrative. As such, it may be easier to prevent reaching multiple electronic components 140 and / or circuit board assembly 130. Similarly, the supercapacitor structure 110 may further be disposed over one or more components 140 and / or one or more regions of the circuit board assembly 130, which may be defined as EMI Will make it easier to block reaching those components or regions of the circuit board assembly 130. In one embodiment, supercapacitor structure 110 includes a layer of supercapacitor, eg, an inverted bipolar supercapacitor layer (FIG. 1C), that will include a current collector made of a conductive material, eg, a metal such as foil. Note that alternatively, it may include stacked layers of bipolar supercapacitors (FIG. 2B). For example, the supercapacitor structure 110 has 3 or 4 layers of conductive material, such as 3 or 4 layers of metal foil, thereby providing EMI shielding without the need for decoupling or bypass capacitors. obtain.

  In one example, resistive and concentrated capacitive elements (not shown) are enhanced in internally generated fields (including harmonic components of current pulses), for example at high frequencies. To provide absorption, it can be included within the supercapacitor structure 110. In a further example, an array of low loss, high frequency capacitive elements (not shown) can be included within the periphery of the supercapacitor structure 110, and a waveguide under cut-off at high frequencies ( a waveguide-bellow-cutoff) structure, or high frequency energy can be bypassed to external circuitry. Such a design may advantageously suppress undesirable antenna-like behavior of supercapacitor structure 110 by localizing current and controlling EMI propagation.

  In another example, the supercapacitor structure 110 may include materials that are selected to enhance magnetic and / or thermal shielding. For example, the supercapacitor structure 110 may include materials selected for their magnetic permeability, such as mu metal. In another example, supercapacitor structure 110 may include an electrolyte material that is designed to absorb EMI or RFI. In a further example, the supercapacitor structure 110 may be surrounded by a protective pouch (not shown) made of a suitable insulator material that may further act as an EMI and / or thermal shield.

  FIG. 1C is a partial cross-sectional elevation view of one embodiment of the supercapacitor structure 110 of FIG. 1A. As shown, in one embodiment, the supercapacitor structure 110 includes one or more layers of supercapacitors 118, 119. One supercapacitor 118, 119 may include, for example, two electrodes 112 that are separated by a separator 113 and electrically connected by ions of an electrolyte 114 disposed between the two electrodes. Electrode 112 is a porous or spongy material (activated carbon, amorphous carbon, carbon aerogel) that can have a specific surface area of 500 to 1000 square meters per gram due to its large specific surface area, illustratively microporosity. , Graphene, or carbon nanotubes), while the electrolyte 114 may include a solvent with dissolved chemicals such as potassium hydroxide (KOH). The electrodes 112 of the supercapacitors 118, 119 may be connected to one or more current collectors 115, which may include a metal, illustratively a conductive material such as aluminum or copper. Current collector 115 may act as a terminal of supercapacitors 118, 119, such as a positively charged anode or a negatively charged cathode.

  As illustrated by way of example, in an inverted bipolar configuration, two supercapacitors (such as a first supercapacitor 118 and a second supercapacitor 119) are coupled in series and separated by a dielectric sealer 117. Is done. These supercapacitors may, for example, share a bipolar C-shaped current collector 116 within the supercapacitor structure 110. The inverted bipolar configuration advantageously allows the bipolar C-shaped current collector 116 to be accessed from anywhere on the surface of the supercapacitors 118, 119 because the inverted bipolar In the configuration, the bipolar C-shaped current collector 116 encloses the periphery of the first supercapacitor 118 and the second supercapacitor 119, and at least partially surrounds the supercapacitors 118 and 119. It is. In such an inverted bipolar configuration, the contact tab 120 may be connected to a bipolar C-shaped current collector 116 or to a current collector 115 disposed within the supercapacitors 118, 119 (examples) As) providing access to different voltage levels from the supercapacitor structure 110. Illustratively, if each supercapacitor 118, 119 has a voltage capacity of 2.7 volts (V) and the multi-contact tab 122 'is connected to ground, the bipolar C-shaped current collector 116 is , Because it is connected in series with a single supercapacitor 119, it can deliver 2.7V, while the multi-contact tab 122 is connected in series with both supercapacitors 118, 119 Therefore, 5.4V can be fed.

  FIG. 1D illustrates an exploded view of another embodiment of an electronic assembly or device 100 ′ that may include a supercapacitor structure 110 ′ that encloses the periphery of the battery 150. As shown, the supercapacitor structure 110 ′ can be folded or hinged to enclose the periphery of the battery 150, thereby providing EMI shielding for the battery 150. Can make it easier. In this embodiment, one or more multi-contact tabs 122 'may extend from one or more edges of supercapacitor structure 110'. A contact location 123 'on one multi-contact tab 122' is shown. These contact locations 123 'can be arranged to facilitate electrical connection of the supercapacitor structure 110' to multiple locations on the circuit board assembly 130 ', which can be, for example, the main processing board of a smartphone. As shown, two multi-contact tabs can be provided that fold over or wrap around the circuit board assembly 130 'so that the contact location 123' and the circuit One or more configurations that facilitate electrical connection to (eg, on both major sides of) the board assembly 130 ', and the EMI shielding of the circuit board assembly 130' is implemented in the circuit board assembly. It can be as easy as element 140 '. In one example, the supercapacitor structure 110 ′ absorbs, dissipates, dissipates heat from one or more components 140 ′, or any external or internal source, such as the battery 150, or It can be a reflective thermal shield. For example, the supercapacitor structure 110 ′ may enclose the periphery of the battery 150, facilitate uniform distribution of the heat of the battery 150, eliminate hot spots, and allow the battery 150 to operate more efficiently. The reason for this is that the supercapacitor structure 110 includes, for example, an external pouch (not shown) containing the supercapacitor structure 110 ', an electrode 112 (FIG. 1C), and a separator 113 (FIG. 1C). This is because the material may have desirable thermal properties that allow for thermal convection or conduction. In another embodiment, the supercapacitor structure may be rounded into a cylindrical shape so as to fit at least partially within a housing or chassis of, for example, an electronic assembly or device.

  FIG. 1E illustrates an alternative embodiment of an assembly or device 100 '. As shown, the supercapacitor structure 110 "can be folded or hinged so as to enclose the battery 150 and the circuit board assembly 130 'so that the battery 150 And can provide EMI shielding of the circuit board assembly 130 ', including one or more components 140' mounted on the circuit board assembly 130 '. The supercapacitor structure 110 " To facilitate electricity to multiple locations on both sides of 130 ', an exposed conductive location 123' is disposed over the external conductive surface that is partially coated with a non-conductive material. You can have it installed.

  In another embodiment, the supercapacitor structure can be a foldable rectangular structure with folds or crease lines, or can be configured as two rectangles connected by a bridge structure, Is foldable. In such an example, the folded supercapacitor structure has, for example, power contact tabs that extend from the top small portion of the folded structure and ground contact tabs that extend from the bottom small portion of the folded structure. The EMI or RFI can be reduced, and the ground and power contact tabs are configured to be self-cancelling to cancel the internal or reflected EMI from the supercapacitor structure. In such embodiments, the supercapacitor structure may surround one or more electronic assemblies, such as a battery, circuit board assembly, or component, and may act as a Faraday cage. The advantages of such a configuration may further include enhanced secrecy or security, because blocking EMI emissions from an electronic assembly allows outside observers to This is because by monitoring the known EMI identification characteristics of the element, it can be prevented to detect aspects of operation of the electronic assembly.

  In another embodiment, the supercapacitor structure is connected to the supercapacitor structure and is designed to reduce any EMI emissions from the electron flow from the current collector to the contact tab, one or more impedance matched contacts. Can have tabs. For example, a supercapacitor localizes the field generated by current flow on the inner surface of the supercapacitor structure (or one or more contact tabs) inside the supercapacitor structure (or one or more contact tabs). It can be configured as a paired strip, low impedance transmission line structure. In another example, the supercapacitor structure may be configured as a balanced transmission line structure to minimize external coupling of magnetic fields generated internally by vector cancellation (eg, at low frequencies).

  FIG. 2A illustrates an electronic assembly or device 200 comprising a supercapacitor structure 210 and one or more contact tabs 220 that are in electrical contact with and extend outward from the supercapacitor structure 210. Another embodiment of is illustrated. The contact tabs 220 are, for example, for the supercapacitor structure 210 that facilitates electrical connection between the circuit board assembly 230 or one or more components 240 mounted thereon with the supercapacitor structure 210. A multi-contact tab 222 may be included, which may have multiple external contact locations 223. As shown, the supercapacitor structure 210 may be above the circuit board assembly 230 (in one embodiment). In one example, the contact location 223 may include or be aligned with conductive posts that connect the multi-contact tab 222 illustratively to the circuit board assembly 230 at a particular location. For example, the component 240 may be connected to the multi-contact tab 222 or through a super-capacitor structure 210 by connection through a conductive post that extends through the board and is located close to the component 240. Can be electrically connected.

  FIG. 2B is a partial cross-sectional elevation view of one embodiment of the supercapacitor structure 210 of FIG. 2A. As shown, in one embodiment, the supercapacitor structure 210 includes one or more stacked supercapacitors 218, 219 arranged in a stacked bipolar configuration. In this configuration, the supercapacitors 218, 219 are coupled in series and share, for example, a bipolar current collector 216 disposed between the supercapacitors 218, 219. The supercapacitor 218 can include a shared bipolar current collector 216 and a negative current collector of the current collector 215, and the supercapacitor 219 can further connect the shared bipolar current collector 216 to the positive current collector 215. Note that it can contain as well as a current collector. Advantageously, the illustrated stacked bipolar configuration allows the bottom surface of supercapacitor structure 210 to be a ground plane, the top surface of which is a combined supercapacitor of 2.7V supercapacitors 218, 219. It may be possible to provide access to a voltage, for example 5.4V, while access to an intermediate voltage (for example 2.7V) is provided on the side of the supercapacitor structure 210 by a current collector 215. Continue to be available.

  FIG. 3A illustrates a supercapacitor structure 310 and electrical contact with the supercapacitor structure 310 and extending outwardly from the supercapacitor structure 310 to facilitate electrical connection to the supercapacitor structure 310. 8 illustrates a further embodiment of an electronic assembly or device 300 comprising a plurality of contact tabs 320. The contact tabs 320 may be configured and sized, for example, with multiple contact locations 323, 323 ′, each disposed externally to the supercapacitor structure 310. It includes one or more multi-contact tabs, such as two multi-contact tabs 322 ′. As shown, the supercapacitor structure 310 may be disposed over a small portion of the circuit board assembly 330, and as one example, the first multi-contact tab 322 and the second multi-contact tab 322 are , Extending from the opposite side of the supercapacitor structure 310 and overlying the second and third sub-portions or regions of the circuit board assembly 330. In one embodiment, the first multi-contact tab 322 illustratively has a first voltage that may be approximately 9V, for example, by electrical contact to a current collector in series with 3 or 4 supercapacitors. Can be electrically connected to the supercapacitor structure 310, while the second multi-contact tab 322 ′ is in series with a single supercapacitor of the supercapacitor structure 310. Can be electrically connected to the supercapacitor structure 310 to provide access to the second voltage, which can be, for example, approximately 2.7 volts.

  FIG. 3B is a partial cross-sectional elevation view of the device 300 of FIG. 3A. As shown, in one embodiment, the circuit board assembly 330 includes one or more components 340 mounted thereon, which can be any of the various components of the electronic device. As shown, the multi-contact tabs 322, 322 'may reside above different small portions of the circuit board assembly 330 and may be configured and sized to facilitate their electromagnetic interference shielding. FIG. 3C is an example described in detail of the circuit board assembly of FIG. 3A, showing its region 3C and illustrating the different components 340 mounted on the board. As illustrated in FIG. 3B, the contact locations 323, 323 'may include posts that electrically connect the multi-contact tab to the component 340, for example.

  FIG. 4 illustrates another embodiment of an electronic assembly or device 400 having a supercapacitor structure 410, a multi-contact tab 422, and a circuit board assembly or component 440 with a major surface. As shown, in one example, the multi-contact tab 422 can be a membrane tab that is above or below the component. The membrane tab may have a surface area that is at least as large as the area of the major surface of the component.

  As noted above, in one embodiment, the multi-contact tab 422 is a film or foil of a conductive material, such as aluminum, which can be configured and sized as required for a particular application, for example. is there. Customizing the multi-contact tab 422 can be accomplished to ensure thorough coverage of the components 440, thereby enhancing the EMI shielding of those components. The multi-contact tab 422 may be electrically connected directly to the component 440 or may be electrically connected to the component 440 through a circuit board assembly on which the component 440 is mounted. As one example, disposing the multi-contact tab 422 over 100-200 micrometers of the component 440 is, for example, for 2.4 gigahertz (GHz) EMI having a wavelength of approximately 0.125 meters. It can provide effective EMI shielding because such EMI will not effectively penetrate any side gap of approximately one thousandth of its wavelength. That's it.

  In another embodiment, the supercapacitor structure includes a shaped small portion, such as a notch, hole, or constriction, to allow for an irregular electronic assembly, such as a battery, circuit board assembly, or component. It can be configured and sized to be above. In one example, the shaped piece can be filled with a material such as metal, pouching, polymer (eg, polyethylene terephthalate), or pressure sensitive adhesive (PSA). In such cases, there may or may not be an electrical connection provided to the shaped subsection, or the shaped subsection may be a contact location. Alternatively, a contact location can be included. In another example, the supercapacitor structure may be a sheet structure having one or more regions that include supercapacitors that are interspersed by one or more regions that do not include supercapacitors.

  FIG. 5A illustrates another embodiment of an electronic assembly or device 500 having a supercapacitor structure 510 and one or more contact tabs 520, which are illustratively shown in FIG. Multi-contact tab 521 and multi-contact tab 522 extending out from opposite sides of supercapacitor structure 510 to facilitate electrical connection to one circuit board assembly 530 and second circuit board assembly 530 ′ including. FIG. 5B is a partial cross-sectional elevation view of one embodiment of the device 500 of FIG. 5A.

  As shown in FIG. 5B, circuit board assemblies 530, 530 'may include printed circuit boards (PCBs) that electrically connect and mechanically support one or more electronic components. The electrical connections of these components that can be surface mounted to the PCB can be achieved by the use of conductive tracks or pads that are etched into one or more layers 532 of the circuit board assembly 530, and conductive Via 534 may electrically interconnect layer 532. In the PCB, one or more layers provide direct current (DC) power planes or ground planes that provide ground or access to different power voltage levels to any component mounted on the circuit board assembly 530, 530 '. It can be. The ground plane and the DC power plane may further provide EMI shielding since the alternating current EMI can be effectively shielded by either the ground plane or the DC power plane. In the illustrated embodiment, two multi-contact tabs 521, 521 ′ extend from the supercapacitor structure 510 in a planar fashion to illustratively form a power and ground plane for the circuit board assembly 530, respectively. Similarly, two multi-contact tabs 522, 522 ′ extend planarly from supercapacitor structure 510 in opposite directions and extend above or within circuit board assembly 530 ′, respectively, and circuit board assembly 530 ′. Power and ground planes may be provided. By way of example, the contact tab 521 can distribute a first voltage to the circuit board assembly 530, the contact tab 522 can distribute a second voltage to the circuit board assembly 530 ′, The first and second voltages can be the same or different voltages.

  FIG. 5C is an alternative embodiment of the device of FIG. 5B. As shown, in one example, the supercapacitor structure 510 can be incorporated as part of the circuit board assembly 530, advantageously providing an integrated package with reduced structure and interconnection points. To do. Illustratively, the supercapacitor structure 510 may be disposed within a recess in one or more layers of the circuit board assembly 530. By way of example, the circuit board assembly 530 may have a thickness of 1/32 inch (2.54 cm), or approximately 800 micrometers, and the supercapacitor structure 510 may be 200 to 300 micrometers. Can have a thickness between. The supercapacitor structure 510 is illustratively one or more stacked bipolar supercapacitors (see FIG. 2B) or one or more inverted bipolar supercapacitors (as disclosed herein). See FIG. 1C). The supercapacitor structure 510 is configured, sized, and arranged, for example, as one or more DC power planes or ground planes inside the circuit board assembly 530, and illustratively implemented on the circuit board assembly 530. May be coupled to one or more multi-contact tabs 521, 521 ′ that may be accessed by the component being configured. Depending on the desired circuit architecture, the supercapacitor structure 510 may be located at the edge of the circuit board assembly 530, in the central region of the circuit board assembly 530, or within one or more separate layers of the circuit board assembly 530. Can be placed. In another embodiment, the one or more multi-contact tabs may extend as conductive traces within a layer or metallization of the circuit board assembly, and the supercapacitor structure may be implemented on the circuit board assembly, for example. Or may be proximate to the circuit board assembly.

  FIG. 6A illustrates a further embodiment of an electronic assembly or device 600 having a supercapacitor structure 610 disposed above a circuit board assembly 630 that includes one or more components 640 mounted thereon. To do. FIG. 6B illustrates one embodiment of the device 600 of FIG. 6A taken along line 6B-6B. As illustrated, in one example, the multi-contact tab 622 extends from the superconductor structure 610 and over one or more components 640 and the circuit board assembly above at least a small portion of the circuit board assembly 630. Exist between. In this example, multi-contact tab 622 may extend as a conductive trace on the upper layer of circuit board assembly 630. By so arranging the multi-contact tab 622, the component 640 may have direct access to the energy stored in the supercapacitor structure 610 in one embodiment. Additionally, as discussed above, the multi-contact tab 622 functions as an EMI block or constraining membrane, illustratively radiating downward from one or more components 640 toward the circuit board assembly 630. Or may be sized and configured to suppress EMI propagating through circuit board 630 toward one or more components 640. As in the above embodiment, the multi-contact tab 622 has an insulating film or layer above the tab and illustratively makes electrical contact with the component 640 and the circuit board 630 at the desired location. It may have an exposed contact location that is positioned to facilitate that. Thus, the multi-contact tab 622 electrically connects the supercapacitor structure 610 to various components and circuit board assembly locations, while facilitating suppression of external or internal EMI inside the device at the same time. Can be used to

  FIG. 7A illustrates another embodiment of an electronic assembly or device 700 having a supercapacitor structure 710 with multiple contact tabs 720 extending therefrom. As illustrated, a multi-contact tab 722 with multiple contact locations 723 extends outwardly from one or more sides of the supercapacitor structure 710 in a manner similar to the embodiments described above. .

  FIG. 7B is an internal diagram of one embodiment of a supercapacitor structure 710 that is shown to include a first supercapacitor 712, a second supercapacitor 714, and a third supercapacitor 716. Each supercapacitor 712, 714, and 716 of the supercapacitor structure 710 is, for example, an inverted bipolar configuration (see FIG. 1C) or a stacked bipolar configuration (see FIG. 2B), etc. Can be configured to have the following bipolar configuration. As shown, the first supercapacitor 712, the second supercapacitor 714, and the third supercapacitor 716 are spaced apart to facilitate electrical separation from one to another. It can be at regular intervals and can be charged and discharged independently as needed. The RC time constant of the supercapacitor and / or contact tab determines how fast the supercapacitor can either store or deliver an amount of energy. Some applications, such as random access memory (RAM) refreshing, may require delivery of energy over a period of minutes. However, other applications, such as camera flashes, may require the same amount of energy delivery over milliseconds. Each individual supercapacitor and / or contact tab may be configured to have an appropriate RC time constant that may be different to meet the energy storage and delivery needs of the component to which it can be coupled.

  For example, in one embodiment, the supercapacitor structure 712 can be electrically connected to a wireless transceiver component, and the supercapacitor 714 can be electrically connected to a media player component, 716 may be electrically connected to camera components. In operation, the media player component can be used to play media, while the camera can be used to take flash photos. In such an example, the media player component and the camera component may each require a large amount of energy at the same time. By connecting each component to an electrically separate supercapacitor, each of these simultaneous demands for energy can be met. In addition, at the same time, the electronic device may be receiving data from the data network, and the wireless transceiver component that may be electrically connected to the supercapacitor 712 may produce a surge in energy. In such a manner, some of the supercapacitors 712, 714, or 716 of the supercapacitor structure 710 may cause energy from the components to be delivered at the same time that others deliver energy to different components. , May have stored.

  The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting on the invention. As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural as well unless the context clearly dictates otherwise. The The term "comprising" (and any form of comprising, such as "comprising (third-person singular current form)" and "comprising (current participle form)"), "having" (and "having (third-person singular singular present)" Any form of), including "(and" including (third-person singular single present form) "and" including (current participle form) " ), And “include” (and include, in any form, such as “include (third-person singular single present)” and “include (current participle)”) It will be further understood that is an open-ended linking verb. As a result, a method or device that “comprises”, “haves”, “includes”, or “includes” one or more steps or elements owns those one or more steps or elements, It is not limited to owning only those one or more steps or elements. Similarly, a method step or device element “comprising”, “having”, “including”, or “including” one or more features may possess those one or more features. However, it is not limited to possessing only those one or more features. Further, a device or structure that is configured in a fixed way is configured in at least that way, but may also be configured in ways that are not listed.

  If so, the corresponding structure, material, action, and equivalents of all means plus function or step plus function elements in the claims below shall be It is intended to include any structure, material, or action for performing a function in combination with the claimed elements. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiments are suited to best illustrate the principles of one or more aspects of the invention and practical application, as well as to individual uses contemplated by others skilled in the art. For various embodiments with various modifications, such as have been chosen and described in order to enable one or more aspects of the invention to be understood.

Claims (28)

A supercapacitor structure including one or more layers;
One or more connection tabs extending outwardly from the supercapacitor structure to electrically contact the supercapacitor structure and facilitate electrical connection to the supercapacitor structure;
And a connection tab comprising a multi-contact tab configured and sized with multiple contact locations disposed externally to the supercapacitor structure.   The multi-contact tab is configured and sized to be partially over at least a portion of a circuit board assembly that facilitates electromagnetic shielding, and the multiple contact positions of the multi-contact tab are defined by the circuit board. The device of claim 1, facilitating electromagnetic shielding between an assembly and the supercapacitor structure.   The circuit board assembly includes a component having a major surface in a major surface area, and the multi-contact tab comprises a film tab having a surface area at least as large as the major surface area of the major surface of the component. The device of claim 2, characterized in that:   The supercapacitor structure includes one or more components disposed on the circuit board assembly and mounted on the circuit board assembly to facilitate electromagnetic shielding with the one or more components. 4. A device according to any one of claims 1 to 3, characterized in that:   The supercapacitor structure is configured and sized to lie on at least a portion of a major surface of the battery to partially facilitate electromagnetic shielding with the battery. The device according to any one of 1 to 4.   The device of claim 5, wherein the supercapacitor structure comprises a flexible sheet and is configured and sized to at least partially cover the opposite side of the main surface of the battery.   The device according to claim 1, wherein the multi-contact tab comprises a film tab in a surface area that is larger than a surface area of a main surface of the supercapacitor structure.   The supercapacitor structure comprises a common C-shaped current collector, the one or more layers of the supercapacitor structure comprise a first supercapacitor and a second supercapacitor, wherein the first supercapacitor is , Including the common C-shaped current collector, the second supercapacitor also including the common C-shaped current collector, and the common C-shaped current collector includes the first supercapacitor and the second supercapacitor. 8. A device according to any one of claims 1 to 7, characterized in that it at least partially surrounds the supercapacitor.   9. The device of claim 8, wherein the first supercapacitor and the second supercapacitor are in a common C-shaped current collector of the supercapacitor structure.   The multi-contact tab extends outwardly from the common C-shaped current collector of the supercapacitor structure in electrical contact with the common C-shaped current collector of the supercapacitor structure. The device of claim 9.   The first supercapacitor further comprises another current collector and one or more contact tabs further including another multi-contact tab, the other multi-contact tab being arranged externally to the supercapacitor structure. Configured and sized with multiple contact positions provided, the multi-contact tab is electrically connected to distribute a first voltage, and the other multi-contact tab is electrically connected to a second voltage. The device of claim 8, wherein the first voltage and the second voltage are different voltages.   The device of claim 1, wherein the multi-contact tab is configured and sized to provide a majority of electromagnetic shielding associated with the circuit board assembly.   One or more layers of the supercapacitor structure comprise the first supercapacitor and the second supercapacitor disposed in a stack, the first supercapacitor comprising a common current collector and a negative current A collector is provided, wherein the second supercapacitor comprises a common current collector and a positive current collector, the common current collector being between the negative current collector and the positive current collector. Item 13. The device according to any one of Items 1 to 12.   14. The device of claim 13, wherein the multi-contact tab makes electrical contact with a common current collector of the first and second supercapacitors in the stack.   The one or more contact tabs further comprise a plurality of other multi-contact tabs, wherein the other multi-contact tabs are configured with multiple contact locations disposed externally to the supercapacitor structure and 15. The device of claim 14, wherein the device is sized and the another multi-contact tab is in electrical contact with one of the negative current collector or the positive current collector.   16. The device of claim 15, wherein the multi-contact tab and the another multi-contact tab extend from one of the same side of the supercapacitor structure or a different side of the supercapacitor structure.   The multi-contact tab is configured and sized to cover a first portion of one or more circuit board assemblies, and the multiple contact positions of the multi-contact tab are the plurality of contact positions of the one or more circuit board assemblies. Facilitating a plurality of electrical connections between the first portion and the supercapacitor structure, wherein the further multi-contact tab is configured and sized to cover a second portion of the one or more circuit board assemblies Set and the multiple contact locations of the other multi-contact tab facilitate a plurality of electrical connections between the second portion of the one or more circuit board assemblies and the supercapacitor structure. The device according to claim 13.   The multi-contact tab is connected to the supercapacitor to distribute a first voltage, and the other plurality of contact tabs are connected to the supercapacitor to distribute a second voltage, and the first voltage and The device of claim 13, wherein the second voltage is a different voltage.   The one or more layers of the supercapacitor having the supercapacitor structure include a first supercapacitor and a second supercapacitor, and the first supercapacitor has the second supercapacitor in the supercapacitor structure. The device of claim 1, wherein the device is electrically isolated from a capacitor and the multi-contact tab is electrically connected to the first supercapacitor.   The multi-contact tab is a first contact tab, the one or more contact tabs include a second contact tab, and the second contact tab is electrically connected to the second supercapacitor of the supercapacitor structure. The device of claim 19, wherein the device is connected to the device.   The first contact tab is electrically connected to the first supercapacitor and distributes a first voltage from the supercapacitor structure, and the second connection tab is electrically connected to the second supercapacitor. 21. The device of claim 20, wherein the device distributes a second voltage from the supercapacitor structure, and the first voltage and the second voltage are different voltages.   The first contact tab electrically connected to the first supercapacitor has a first resistance capacitance (RC) time constant and is electrically connected to the first supercapacitor. The two contact tabs have a first resistive capacitance (RC) time constant, and the first resistive capacitance (RC) time constant is different from the second resistive capacitance (RC) time constant. The device of claim 20, wherein the device is a time constant. Electronic structure,
Comprising one or more layers of supercapacitors, wherein the supercapacitor structure comprises at least a portion of the electronic structure and is configured and sized with multiple contact locations disposed externally to the electronic structure A supercapacitor structure having a sheet structure to be set.   24. The device of claim 23, wherein the electronic structure comprises a battery that provides power to one or more components of an electronic assembly.   The seat structure comprises a flexible seat structure configured and sized to at least partially cover the opposite surface of the battery, the main surface of the battery being one surface opposite the battery 25. The device of claim 24, wherein:   And further comprising one or more contact tabs, wherein the one or more contact tabs are in electrical contact with the supercapacitor structure and extend outside the supercapacitor structure to allow electrical contact with the supercapacitor structure. The one or more contact tabs extend from at least one end of the flexible sheet structure, the one or more contact tabs include a plurality of contact tabs, and the multi-contact tab is disposed outside the supercapacitor structure. 26. A device as claimed in any one of claims 23 to 25, wherein the device is configured and sized to have a plurality of contact locations.   27. A device according to any one of claims 23 to 26, wherein the supercapacitor structure is configured and sized to cover the electronic structure.   28. The device of claim 27, wherein the supercapacitor structure at least partially covers a surface opposite the electronic structure, the electronic structure including at least one electronic assembly component.