KR101549812B1 - Ceramic substrate and super capacitor of surface mount type using the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate and a surface mount type super capacitor using the same, and is intended to provide a good airtightness while using a ceramic substrate as a wiring substrate on which cells are mounted. The present invention provides a ceramic substrate including a ceramic substrate body, an electrode mounting pad, a first external connection terminal portion, and a second external connection terminal portion, and a surface mount super capacitor using the ceramic substrate. The substrate body has an upper surface, a lower surface opposite to the upper surface, and a side connecting the upper surface and the lower surface. The electrode mounting pad is formed at the central portion of the upper surface of the substrate body. The first external connection terminal portion is electrically connected to the electrode mounting pad on the first side and the first side connected to the first side is formed on the lower surface of the substrate body through the upper surface and the side surface of the substrate body. The second external connection terminal portion has a second side electrically connected to a lid formed at an edge portion of an upper surface of the substrate body and bonded to an edge of the upper surface of the substrate body, Is formed on the lower surface of the substrate body through the side surface of the substrate body.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate and a super-

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a surface-mounted super capacitor, and more particularly, to a ceramic substrate and a surface mount type super capacitor using the same, which provide good airtightness while using a ceramic substrate as a wiring substrate on which cells are mounted .

In addition to various portable electronic devices, there is a demand for electric power storage devices for electric vehicles and electric energy storage devices for systems for controlling or supplying instantaneous overload. Ni-MH A secondary battery such as a Ni-Cd battery, a lead-acid battery, and a lithium secondary battery, and a super capacitor, an aluminum electrolytic capacitor, and a ceramic capacitor having a high output density and close to unlimited charge / discharge life.

In particular, the super capacitor includes an electric double layer capacitor (EDLC), a pseudo capacitor, and a hybrid capacitor such as a lithium ion capacitor (LIC).

Here, the electric double layer capacitor is a capacitor using an electrostatic charge phenomenon occurring in an electric double layer formed at the interface of different phases, and has a charge / discharge speed faster than that of a battery in which the energy storage mechanism depends on a chemical reaction, And it is widely used as a backup power source, and the potential as an auxiliary power source for electric vehicles in the future is also unlimited.

A pseudocapacitor is a capacitor that converts a chemical reaction into electrical energy using an electrode and an oxidation-reduction reaction of an electrochemical oxide. The pseudocapacitor has a storage capacity about 5 times larger than that of the electric double layer capacitor because the electric double layer capacitor can store the electric charge near the surface of the electrode material as compared with the electric double layer capacitor formed on the surface of the electrochemical double layer type electrode. As the metal oxide electrode material, RuOx, IrOx, MnOx and the like are used.

And the lithium ion capacitor is a new concept secondary battery system which combines the high output and long life characteristics of the existing electric double layer capacitors and the high energy density of the lithium ion battery. Electric double layer capacitors using the physical adsorption reaction of electric charges in the electric double layer have been limited in their application to various applications due to their low energy density despite excellent power characteristics and lifetime characteristics. As a means for solving the problem of such an electric double layer capacitor, a lithium ion capacitor using a carbon-based material capable of inserting and separating lithium ions as a negative electrode active material has been proposed. The lithium ion capacitor has a structure in which lithium ions, And the cell voltage can realize a high voltage of 3.8 V or more, which is much higher than that of the conventional electric double layer capacitor by 2.5 V, and can exhibit a high energy density.

The basic structure of such a supercapacitor is composed of an electrode, an electrolyte, a current collector, and a separator having a relatively large surface area such as a porous electrode. A voltage of several volts is applied to both ends of the unit cell electrode, And the electrochemical mechanism that is generated by adsorbing on the surface of the electrode moving along the electric field is the operating principle. These cells are sealed in upper and lower cases made of metal, and upper and lower terminals are attached to outer surfaces of the upper and lower cases.

However, in the case of the coin type, the conventional supercapacitor requires a gasket and a coating material for insulation and airtightness of the upper and lower cases, as well as a coating and compression process, Which is not only deteriorated but also economically expensive.

Further, since the upper and lower terminals are protruded to the outside of the upper and lower cases, the size of the supercapacitor is increased, and the mounting space occupies a lot of mounting space on the substrate of the electronic apparatus.

And welding and deflection defects frequently occur in the process of attaching the upper and lower terminals.

These problems result in lowering the functionality and usability of the supercapacitor.

In order to solve such a problem, a method is proposed in which a first electrode, a separator and a second electrode are laminated on a wiring board to form a cell, a space of the wiring board on which the cell is mounted is sealed with a lid, A chip type super capacitor capable of being mounted is proposed. A plurality of external connection pads electrically connected to the first and second electrodes of the cell are formed on the lower surface of the wiring board. The external connection pad is electrically connected to the first and second electrodes via vias passing through the wiring board.

However, when a plastic substrate is used as the wiring substrate, for example, since FR4 absorbs moisture well, the performance of the supercapacitor due to moisture absorption may be deteriorated. Further, due to the hygroscopicity of the wiring board, there may arise a problem that the injected liquid electrolyte in the internal space of the wiring board and the lead is counted through the substrate body of the plastic material forming the wiring board.

In addition, a chip-type super capacitor may have a problem that a via formed in the wiring board may leak due to a pressure generated during driving, thereby causing leakage of the electrolytic solution. That is, since the cells and the electrolyte have a structure in which they are sealed in the internal space formed by the wiring board and the leads, the pressure in the internal space may increase due to gas generated during driving of the chip type super capacitor. At this time, the via located in the inner space has a structure in which the metal is filled in the hole formed through the wiring board, and therefore, the via is more vulnerable to pressure than other wiring board portions. Therefore, if the pressure in the internal space increases, the electrolyte may leak through the relatively weak vias.

Korean Patent No. 10-0881854 (2009.01.29.)

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a ceramic substrate and a surface mount type super capacitor using the same, which provide a good airtightness while using a ceramic substrate as a wiring substrate on which cells are mounted.

It is another object of the present invention to provide a ceramic substrate capable of solving the problem of electrolyte leakage due to vias located in a wiring board, and a surface mount type super capacitor using the ceramic substrate.

In order to achieve the above object, the present invention provides a ceramic substrate for a surface mount type super capacitor, comprising a substrate body of ceramic material, an electrode mounting pad, a first external connection terminal portion and a second external connection terminal portion. The substrate body has an upper surface, a lower surface opposite to the upper surface, and a side connecting the upper surface and the lower surface. The electrode mounting pad is formed at a central portion of the upper surface of the substrate body. A first side of the first external connection terminal portion is electrically connected to the electrode mounting pad and a first side connected to the first side is formed on a lower surface of the substrate body through an upper surface and a side surface of the substrate body . And the second external connection terminal portion is electrically connected to a lid formed on an edge portion of the upper surface of the substrate body and bonded to an edge of the upper surface of the substrate body, A connected second side is formed on a lower surface of the substrate body through a side surface of the substrate body.

In the ceramic substrate according to the present invention, the first external connection terminal portion includes a connection wiring, a first external connection terminal, and a first connection wiring. The connection wiring is connected to the electrode mounting pad and extends to the edge of the upper surface of the substrate body. The first external connection terminal is formed on the lower surface of the substrate body. The first connection wiring electrically connects the connection wiring and the first external connection terminal through a side surface of the substrate body.

In the ceramic substrate according to the present invention, the first external connection terminal portion further includes an insulating layer covering the connection wiring and the first connection wiring.

In the ceramic substrate according to the present invention, the connection wiring extends to an edge point of the substrate body around the electrode mounting pad.

In the ceramic substrate according to the present invention, the first connection wiring may be formed on a surface formed by cutting a side surface of a corner of the substrate body.

In the ceramic substrate according to the present invention, the first connection wiring may be formed by cutting a via formed at a corner of the substrate body.

In the ceramic substrate according to the present invention, the connection wiring includes a first connection wiring and a second connection wiring. The first connection wiring extends to a first corner point of the substrate body around the electrode mounting pad. The second connection wiring extends to a second corner point neighboring the first corner point of the substrate body about the electrode mounting pad.

Wherein the first connection wiring is connected to the first connection wiring and includes a 1-1 connection wiring formed on a side surface of the first corner and a 1-1 connection wiring formed on a side of the second corner, 2 connection wiring.

The first external connection terminal is connected to the 1-1 second connection wiring and is connected to the 1-1 second connection terminal formed on the lower surface of the substrate body, And a second external connection terminal formed on the second external connection terminal.

In the ceramic substrate according to the present invention, the second external connection terminal portion includes a connection pad, a second external connection terminal, and a second connection wiring. The connection pad is formed at an edge portion of an upper surface of the substrate body, and is electrically connected to a lead that is bonded to an edge of the upper surface of the substrate body. And the second external connection terminal is formed on a lower surface of the substrate body. The second connection wiring electrically connects the connection pad and the second external connection terminal through a side surface of the substrate body.

In the ceramic substrate according to the present invention, the connection pad may be formed at a corner of the substrate body opposite to the side where the connection wiring is formed with the electrode mounting pad as a center.

In the ceramic substrate according to the present invention, the second connection wiring may be formed by cutting a via formed at a corner of the substrate body.

In the ceramic substrate according to the present invention, the connection pad includes a first connection pad and a second connection pad. The first connection pad is formed at a third corner point of the substrate body around the electrode mounting pad. The second connection pad is formed at a fourth corner point adjacent to a third corner point of the substrate body about the electrode mounting pad.

The second connection wiring includes a second-1 connection wiring connected to the first connection pad and formed on a side surface adjacent to the third corner, and a second connection wiring formed on the side surface adjacent to the fourth connection pad, And a 2-2 connection wiring.

The second external connection terminal is connected to the second-1 connection wiring and is connected to the second-1 external connection terminal formed on the lower surface of the substrate body, And a second-2 external connection terminal formed in the second terminal.

The present invention also provides a surface-mounted super capacitor using the above-described ceramic substrate.

The present invention also provides a surface mount super capacitor including a ceramic substrate, a cell, and a lead. The ceramic substrate has an electrode mounting pad formed on an upper surface thereof and first and second external connection terminals formed on a lower surface thereof. The cell includes a first electrode electrically connected to an electrode mounting pad of the ceramic substrate, a separator formed on the first electrode, a second electrode formed on the separator, and an electrolyte impregnated into the first and second electrodes. Respectively. The lead is covered with the cell mounted on the ceramic substrate, the inner side is electrically connected to the second electrode and the edge is bonded to the edge of the upper surface of the ceramic substrate, Suture the cell. At this time, the ceramic substrate includes a ceramic substrate body, an electrode mounting pad, a first external connection terminal, and a second external connection terminal. The substrate body has an upper surface, a lower surface opposite to the upper surface, and a side connecting the upper surface and the lower surface. The electrode mounting pad is formed at a central portion of the upper surface of the substrate body. The first external connection terminal portion is electrically connected to the electrode mounting pad at a first side and the first side connected to the first side is connected to the electrode pad through the upper surface and the side surface of the substrate body, And a first external connection terminal. And the second external connection terminal portion is electrically connected to the lead formed on the edge portion of the upper surface of the substrate body and bonded to the periphery of the upper surface of the substrate body, And the second side has the second external connection terminal formed on the lower surface of the substrate body through the side surface of the substrate body.

The present invention uses a ceramic substrate as a wiring substrate, so that occurrence of problems due to moisture absorption can be suppressed as compared with a wiring substrate made of a plastic material.

Also, since the ceramic substrate has a structure in which connection wirings connected to external connection terminals are formed at the edges of the outer periphery, the surface mount super capacitor according to the present invention does not have a via. Therefore, the surface mount type super capacitor according to the present invention can prevent the problem caused by vias from occurring.

In the surface mount super capacitor according to the present invention, since the shapes of the first and second external connection terminals exposed on the lower surface of the ceramic substrate differ depending on the formation positions of the first and second connection wirings, The first and second external connection terminals can be distinguished. Therefore, when mounting the surface mount type super capacitor on the mother substrate, it is possible to suppress mounting errors caused by failing to distinguish the first and second external connection terminals.

1 is an exploded perspective view showing a surface mount type super capacitor using a ceramic substrate according to an embodiment of the present invention.
2 is a sectional view taken along the line 2-2 in Fig.
3 is a plan view showing an upper surface of a ceramic substrate for a surface-mounted super capacitor according to an embodiment of the present invention.
4 is a cross-sectional view taken along line 4-4 of Fig.
FIG. 5 is a plan view showing the lower surface of the ceramic substrate of FIG. 3. FIG.
6 is a plan view showing a top surface of a ceramic substrate strip having the ceramic substrate of FIG. 3 as a unit substrate.
7 is a plan view showing the lower surface of the ceramic substrate strip of FIG.

In the following description, only parts necessary for understanding embodiments of the present invention will be described, and descriptions of other parts will be omitted to the extent that they do not disturb the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view showing a surface mount type super capacitor using a ceramic substrate according to an embodiment of the present invention. 2 is a sectional view taken along the line 2-2 in Fig.

1 and 2, a surface mount super capacitor 100 according to the present embodiment includes a ceramic substrate 10, a cell 20, and a lead 30. The supercapacitor 100 has a structure in which the cell 20 is mounted on the upper surface 12 of the ceramic substrate 10 and the region where the cell 20 is mounted is sealed with the lead 40. Here, the cell 20 includes a first electrode 21, a separation membrane 23, a second electrode 25, and an electrolyte.

The ceramic substrate 10 is a wiring board including an insulating substrate body 11 and a circuit wiring pattern 13 formed on the substrate body 11. In this embodiment, since the ceramic substrate 10 is used as a wiring substrate, it is possible to suppress the occurrence of problems caused by moisture absorption as compared with a wiring substrate made of a plastic material.

The substrate body 11 has a top surface 12, a bottom surface 14 opposite the top surface 12 and a side surface 16 connecting the top surface 12 and the bottom surface 14, Of a ceramic material. Such a substrate body 11 can be manufactured in the form of a rectangular plate.

The circuit wiring pattern 13 is a wiring pattern of a metal material having electrical conductivity formed on the substrate body 11. [ As the material of the circuit wiring pattern 13, copper, aluminum, or an alloy material containing them, which have good electrical conductivity, may be used, but the present invention is not limited thereto. The circuit wiring pattern 13 includes an electrode mounting pad 15, a first external connection terminal portion 17, and a second external connection terminal portion 19. [ The electrode mounting pad 15 is formed at the central portion of the upper surface 12 of the substrate body 11. [ One side of the first external connection terminal portion 17 is electrically connected to the electrode mounting pad 15 and the other side of the first external connection terminal portion 17 is electrically connected to the substrate body 11 through the upper surface 12 and the side surface 16 of the substrate body 11. [ (Not shown). The second external connection terminal portion 19 includes a lead 40 formed on one edge of the upper surface 12 of the substrate body 11 and joined to the edge of the upper surface 12 of the substrate body 11, And the other side connected to one side is formed on the lower surface 14 of the substrate body 11 through the side surface 16 of the substrate body 11. [

The first and second external connection terminal portions 17 and 19 are electrically connected to the first and second external connection terminals 53 and 53 on the lower surface 14 of the substrate body 11 through the side surface 16 of the substrate body 11, 63 are formed. Thus, the ceramic substrate 10 does not have vias passing through the substrate body 11. Therefore, the surface mount type supercapacitor 100 according to the present embodiment can fundamentally block the problem caused by vias.

The cell 20 is mounted on the electrode mounting pad 15 and includes a first electrode 21, a separation membrane 23, a second electrode 25 and an electrolyte. The first electrode 21 is electrically connected to the electrode mounting pad 15 via the first bonding member 31. A separation membrane (23) is deposited on the first electrode (21). The second electrode (25) is deposited on the separator (23). Then, the electrolyte is impregnated into the first and second electrodes 21 and 25. Here, the first electrode 21 and the second electrode 25 are either positive or negative and have different polarities. As the first bonding member 31, a carbon paste, a conductive polymer, a silver-epoxy adhesive, or the like may be used as an adhesive having electrical conductivity, but the present invention is not limited thereto. The first joining member 31 may be provided in the form of a liquid or a sheet. Such a cell 20 may be a cell forming a hybrid capacitor such as an electric double layer capacitor, a pseudo capacitor, or a lithium ion capacitor.

The lead 40 covers the cell 20 mounted on the upper surface 12 of the ceramic substrate 10 and seals the region where the cell 20 is mounted. That is, the leads 40 cover the cells 20 mounted on the ceramic substrate 10 and the inner surfaces thereof are electrically connected to the second electrodes 25 via the second bonding members 33. The lead 40 is electrically connected to the connection pad 61 of the second external connection terminal portion 19 formed at the edge portion of the ceramic substrate 10 via the third bonding member 35. The lead 40 is made of a metal material having good electrical conductivity, and may be composed of a cover portion 41 and a bonding portion 43. The lid part 41 is formed with an internal space 45 into which the cell 20 is inserted and the second electrode 25 is attached to the bottom surface 47 of the internal space 45 by the second joining member 33 And are electrically connected. The joining portion 43 is integrally formed with the edge portion of the lid portion 41 and is electrically connected to the connection pad 61 of the second external connection terminal portion 19 via the third joining member 35. [ The joining portion 43 may be formed to be bent outward at an edge portion of the lid portion 41.

The first electrode 21 of the cell 20 is electrically connected to the first external connection terminal portion 17 through the electrode mounting pad 15. The second electrode 25 of the cell 20 is electrically connected to the second external connection terminal portion 19 through the lead 40. [

At this time, the second and third bonding members 33 and 35 may be carbon paste, solder paste, conductive polymer, silver-epoxy adhesive, and the like, but not limited thereto. In particular, the third joining member 35 may be formed at the edge portion of the upper surface of the ceramic substrate 10 by a printing method. The reason for forming the third joining member 35 on the edge portion of the ceramic substrate 10 by the printing method is to standardize the amount of application and the joining area of the third joining member 35 to simplify the joining operation of the lid 40 In order to prevent the third bonding member 35 from spreading to the lower surface 14 of the ceramic substrate 10 in the process of bonding the leads 40 while maintaining the bonding state more stably . The joining portion 43 of the other lead 40 can be joined to the ceramic substrate 10 by a welding method using ultrasonic waves or high-frequency waves.

The ceramic substrate 10 according to this embodiment will now be described with reference to FIGS. 3 to 5. FIG. 3 is a plan view showing a top surface 12 of a ceramic substrate 30 for surface-mounted super-capacitors according to an embodiment of the present invention. 4 is a cross-sectional view taken along line 4-4 of Fig. 5 is a plan view showing the lower surface 14 of the ceramic substrate 10 of Fig.

The ceramic substrate 10 includes the substrate body 11, the electrode mounting pad 15, the first external connection terminal portion 17, and the second external connection terminal portion 19, as described above.

The electrode mounting pad 15 is formed at the central portion of the upper surface 12 of the substrate body 11 and has a smaller size than the first electrode 21 bonded to the electrode mounting pad 15. [ That is, when the first electrode 21 is mounted, the electrode mounting pad 15 is covered by the first electrode 21.

The first external connection terminal portion 17 includes a connection wiring 51, a first external connection terminal 53, and a first connection wiring 55. The connection wiring 51 is connected to the electrode mounting pad 15 and extends to the edge of the upper surface 12 of the substrate body 10. The first external connection terminals 53 are formed on the lower surface 14 of the substrate body 10. The first connection wiring 55 electrically connects the connection wiring 51 and the first external connection terminal 53 through the side surface 16 of the substrate body 10. The first external connection terminal portion 17 further includes an insulating layer 57 covering the connection wiring 51 and the first connection wiring 55.

At this time, the connection wiring 51 extends to the corner point of the substrate body 10 about the electrode mounting pad 15. A portion of the connection wiring 51 extending from the electrode mounting pad 15 is covered by the first electrode 21 and a portion connected to the first connection wiring 55 is covered by the lead 40. [ At this time, since the connection wiring 51 is protected by the insulating layer 57, electrical shorting between the lead 40 and the first electrode 21 is prevented by the connection wiring 51. The connection wiring 51 includes a first connection wiring 51a and a second connection wiring 51b. The first connection wiring 51a extends to the first corner point of the substrate body 10 about the electrode mounting pad 15. The second connection wiring 51b extends to the second corner point adjacent to the first corner point of the substrate body 10 about the electrode mounting pad 15.

In this embodiment, an example in which the substrate body 10 is implemented in a rectangular plate shape and the electrode mounting pad 15 is implemented in a rectangular plate shape is disclosed. The four corners of the electrode mounting pad 15 may be positioned on the diagonal line connecting the four corners of the substrate body 10. The first and second connection wirings 51a and 51b are formed to connect the first and second edges of the substrate body 10 and the first and second edges of the electrode mounting pad 15.

The first connection wiring 55 is formed on the surface formed by cutting the side surface of the edge of the substrate body 10. For example, the first connection wiring 55 may be formed by cutting a via formed at a corner of the substrate body 10. The first connection wiring 55 includes a 1-1 connection wiring 55a and a 1-2 connection wiring 55b. The 1-1 connection wiring 55a is connected to the first connection wiring 51a and is formed on the side surface of the first corner. The first and second connection wirings 55b are connected to the second connection wirings 51b and are formed on the side surfaces of the second corners.

The first external connection terminal 53 includes the 1-1 external connection terminal 53a and the 1-2 external connection terminal 53b. The 1-1 external connection terminal 53a is formed on the lower surface 14 of the substrate body 10 by being connected to the 1-1 connection wiring 55a. The 1-2 external connection terminal 53b is formed on the lower surface 14 of the substrate body 10 by being connected to the 1-2 connection wiring 53b.

The second external connection terminal portion 19 includes a connection pad 61, a second external connection terminal 63, and a second connection wiring 65. The connection pad 61 is formed at the edge portion of the upper surface 12 of the substrate body 10 and is electrically connected to the lead 40 which is bonded around the edge of the upper surface 12 of the substrate body 10 . The second external connection terminal 63 is formed on the lower surface 14 of the substrate body 10. The second connection wiring 65 electrically connects the connection pad 61 and the second external connection terminal 63 through the side surface 16 of the substrate body 10.

At this time, the connection pads 61 are formed at the corner points of the substrate body 10 opposite to the side where the connection wiring 51 is formed with the electrode mounting pad 15 as the center. The connection pad 61 includes a first connection pad 61a and a second connection pad 61b. The first connection pad 61a is formed at the third corner point of the substrate body 10 about the electrode mounting pad 15. The second connection pad 61b is formed at the fourth corner point adjacent to the third corner point of the substrate body 10 about the electrode mounting pad 15.

The second connection wiring 65 is formed by cutting a via formed at a corner of the substrate body 10. For example, the second connection wiring 65 may be formed by cutting a via formed in the side surface 16 close to the edge of the substrate body 10. The second connection wiring 65 includes the second-first connection wiring 65a and the second-second connection wiring 65b. The second-second connection wiring 65a is connected to the first connection pad 61a and is formed on the side surface 16 adjacent to the third corner. The second-second connection wiring 65b is connected to the second connection pad 61b and is formed on the side surface 16 adjacent to the fourth corner.

The first connection wiring 55 and the second connection wiring 65 can be formed at the same corner positions but at different positions. The first connection wiring 55 is formed at the edge of the substrate body 10 and the second connection wiring 65 is formed at the side surface 16 adjacent to the edge of the substrate body 10. The first external connection terminal 53 and the second external connection terminal 63 have different shapes when viewed from the lower surface 14 of the substrate body 10. [ The reason why the first and second connection wirings 55 and 65 are formed is that the first and second connection wirings 55 and 65 connected to the first and second electrodes 21 and 25 after the operator has manufactured the supercapacitor 100, So that the external connection terminals 53 and 63 can be easily distinguished.

On the other hand, in this embodiment, the first connection wiring 55 is formed at the corner and the second connection wiring 65 is formed at the side surface 16 adjacent to the corner, but they may be formed opposite to each other. That is, the second connection wiring may be formed at the corner, and the first connection wiring may be formed at the side adjacent to the corner.

The second external connection terminal 63 includes the second-first external connection terminal 63a and the second-second external connection terminal 63b. The 2-1 external connection terminal 63a is formed on the lower surface 14 of the substrate body 10 by being connected to the 2-1 connection wiring 65a. The 2-2 external connection terminal 63b is formed on the lower surface 14 of the substrate body 10 by being connected to the 2-2 connection wiring 65b.

That is, the first and second external connection terminals 53 and 63 may be formed at four corner points of the lower surface 14 of the substrate body 10.

6 and 7, the ceramic substrate 10 according to the present embodiment may be formed of a ceramic substrate strip 70 (see FIG. 6) so that the surface-mounted super- ). 6 is a plan view showing an upper surface 72 of the ceramic substrate strip 70 using the ceramic substrate 10 of FIG. 3 as a unit substrate. And FIG. 7 is a plan view showing the lower surface 74 of the ceramic substrate strip 70 of FIG.

The ceramic substrate strip 70 has a structure in which a plurality of ceramic substrates 10 are collectively formed by using the ceramic substrate 10 of Fig. 3 as a unit substrate. That is, the ceramic substrate strips 70 are arranged and arranged in m × n matrices (where m and n are natural numbers) of the ceramic substrate 10 for each supercapacitor, and the plurality of ceramic substrates 10 are divided do.

This ceramic substrate strip 70 has a plurality of vias 73 formed along the cutout region 71. The via 73 includes a first via 75 formed of a first connection wiring 55 and a second via 77 formed of a second connection wiring 65. [

At this time, the first vias 75 are formed through the edges of the neighboring ceramic substrate 10. For example, in the case where four ceramic substrates 10 are formed in a rectangular shape and four ceramic substrates 10 are formed with side faces formed with first and second edges facing each other to form a cut region 71, The first vias 75 are formed so as to pass through the four ceramic substrates 10 so as to share the corners located at the centers of the four ceramic substrates 10. Therefore, when the first vias 75 are circular, the portion of the first vias 75 formed on one ceramic substrate 10 corresponds to 1/4 of the circle. That is, the first connection wiring 55 may be formed in a 1/4 tubular shape.

The second vias 77 are formed so as to penetrate through the side surfaces adjacent to the edges of the neighboring ceramic substrate 10. For example, two ceramic substrates 10 adjacent to each other and two ceramic substrates 10 form third and fourth corners formed side door facing regions 71 facing each other, A second via 77 is formed through the cut region 71 inside the fourth corner. Therefore, when the second vias 77 are circular, the portion of the second vias 77 formed on one ceramic substrate 10 corresponds to 1/2 of the circle. In other words, the second connection wiring 65 may be formed in a half-tubular shape.

The ceramic substrate strip 70 according to the present embodiment cuts the first and second vias 75 and 77 formed along the cut region 71 to form the individual unit ceramic substrate 10 or the individual unit ceramic substrate 10 It is preferable that rows in which the first connection wirings 55 are formed and rows in which the second connection wirings 65 are formed are alternately arranged.

It should be noted that the embodiments disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: ceramic substrate 11: substrate body
12: upper surface 13: circuit wiring pattern
14: lower surface 15: electrode mounting pad
16: side surface 17: first external connection terminal portion
19: second external connection terminal portion 20:
21: first electrode 23: separation membrane
25: second electrode 31: first bonding member
33: second joining member 35: third joining member
40: lead 41: lid portion
43: connection part 51: connection wiring
51a: first connection wiring 51b: second connection wiring
53: first external connection terminal 53a: 1-1 external connection terminal
53b: 1-2 external connection terminal 55: first connection wiring
55a: 1-1 connection wiring 55b: 1-2 connection wiring
57: Insulation layer 61: Connection pad
61a: first connection pad 61b: second connection pad
63: second external connection terminal 63a: second external connection terminal
63b: 2-2 external connection terminal 65: second connection wiring
65a: 2-1 connection wiring 65b: 2-2 connection wiring
70: ceramic substrate strip 71: cut region
73: Via 75: 1st Via
77: Second Via 100: Super Capacitor

Claims (22)

delete delete delete A ceramic body substrate body having an upper surface, a lower surface opposite to the upper surface, and a side connecting the upper surface and the lower surface;
An electrode mounting pad formed on a central portion of an upper surface of the substrate body;
A first external connection terminal portion formed on a lower surface of the substrate body through a top surface and a side surface of the substrate body, the first external side connected to the first side being electrically connected to the electrode mounting pad;
The second side of the substrate body is electrically connected to a lid formed on an edge portion of the upper surface of the substrate body and joined to the periphery of the upper surface of the substrate body, And a second external connection terminal portion formed on a lower surface of the substrate body through a side surface,
Wherein the first external connection terminal portion
A connection wiring connected to the electrode mounting pad and extending to an edge of an upper surface of the substrate body, the connection wiring extending to an edge point of the substrate body around the electrode mounting pad;
A first external connection terminal formed on a lower surface of the substrate body;
A first connection wiring electrically connecting the connection wiring and the first external connection terminal through a side surface of the substrate body;
An insulating layer covering the connection wiring and the first connection wiring;
And a second electrode formed on the second surface of the ceramic substrate. 5. The semiconductor device according to claim 4,
Wherein the ceramic substrate is formed on a surface formed by cutting a side surface of an edge of the substrate body. 6. The semiconductor device according to claim 5,
Wherein a via formed at an edge of the substrate body is cut off. The method according to claim 6,
The connection wiring may include:
A first connection wiring extending to a first corner point of the substrate body around the electrode mounting pad;
And a second connection wiring extending to a second corner point neighboring the first corner point of the substrate body about the electrode mounting pad,
Wherein the first connection wiring
A 1-1 connection wiring connected to the first connection wiring and formed on a side surface of the first corner;
And a second connection wiring connected to the second connection wiring and formed on a side surface of the second corner,
Wherein the first external connection terminal
A 1-1 external connection terminal connected to the 1-1 connection wiring and formed on the lower surface of the substrate body;
A 1-2 external connection terminal connected to the 1-2 connection wiring and formed on the lower surface of the substrate body;
And a second surface of the ceramic substrate. The connector according to any one of claims 4 to 7, wherein the second external connection terminal portion
A connection pad formed at an edge portion of an upper surface of the substrate body and electrically connected to a lead which is bonded to an edge of an upper surface of the substrate body;
A second external connection terminal formed on the lower surface of the substrate body;
A second connection wiring electrically connecting the connection pad and the second external connection terminal through a side surface of the substrate body;
And a second electrode formed on the second surface of the ceramic substrate. 9. The method of claim 8,
Wherein the connection pad is formed at an edge of the substrate body opposite to a side where the connection wiring is formed with the electrode mounting pad as a center. 10. The semiconductor device according to claim 9,
Wherein a via formed at an edge of the substrate body is cut off. 11. The method of claim 10,
The connection pad includes:
A first connection pad formed at a third corner point of the substrate body around the electrode mounting pad;
And a second connection pad formed at a fourth corner point adjacent to a third corner point of the substrate body about the electrode mounting pad,
And the second connection wiring,
A second-1 connection wiring connected to the first connection pad and formed on a side surface adjacent to the third edge;
And a second-second connection wiring connected to the second connection pad and formed on a side surface adjacent to the fourth corner,
And the second external connection terminal,
A second-1 external connection terminal connected to the second-1 connection wiring and formed on a lower surface of the substrate body;
A second-second external connection terminal connected to the second-second connection wiring and formed on the lower surface of the substrate body;
And a second surface of the ceramic substrate. delete delete A ceramic substrate on which an electrode mounting pad is formed on an upper surface and first and second external connection terminals are formed on a lower surface;
A first electrode electrically connected to the electrode mounting pad of the ceramic substrate, a separator formed on the first electrode, a second electrode formed on the separator, and an electrolyte impregnated in the first and second electrodes, ;
An inner surface of the ceramic substrate is electrically connected to the second electrode, and an edge portion of the ceramic substrate is bonded to an edge of the upper surface of the ceramic substrate to seal the cell together with the ceramic substrate. Lid < / RTI >
The ceramic substrate may include:
A substrate body of ceramic material having an upper surface, a lower surface opposite to the upper surface, and a side connecting the upper surface and the lower surface;
The electrode mounting pad formed at a central portion of an upper surface of the substrate body;
The first side of the substrate body is electrically connected to the electrode mounting pad, and the first side connected to the first side includes the first external connection terminal formed on the lower surface of the substrate body through the upper surface and the side surface of the substrate body. A first external connection terminal portion for connecting the first and second external connection terminals;
The second side of the substrate body is electrically connected to the lead formed on the edge portion of the upper surface of the substrate body and bonded to the periphery of the upper surface of the substrate body and the second side connected to the second side is a side surface of the substrate body And a second external connection terminal formed on the lower surface of the substrate body through the second external connection terminal,
Wherein the first external connection terminal portion
A connection wiring connected to the electrode mounting pad and extending to an edge of an upper surface of the substrate body, the connection wiring extending to an edge point of the substrate body around the electrode mounting pad;
A first external connection terminal formed on a lower surface of the substrate body;
A first connection wiring electrically connecting the connection wiring and the first external connection terminal through a side surface of the substrate body;
An insulating layer covering the connection wiring and the first connection wiring;
Type super-capacitor. 15. The method of claim 14,
Wherein the electrode mounting pad is covered by the first electrode,
Wherein the connection wiring extends to an edge point of the substrate body around the electrode mounting pad, a portion extending from the electrode mounting pad is covered by the first electrode, and a portion connected to the first connecting wiring is connected to the lead Type super capacitor. 2. A surface-mounted super-capacitor as claimed in claim 1, 16. The semiconductor device according to claim 15,
Wherein the surface of the substrate body is formed on a surface formed by cutting a side surface of a corner of the substrate body. 17. The semiconductor device according to claim 16,
Wherein a via formed at a corner of the substrate body is cut off. 18. The method of claim 17,
The connection wiring may include:
A first connection wiring extending to a first corner point of the substrate body around the electrode mounting pad;
And a second connection wiring extending to a second corner point neighboring the first corner point of the substrate body about the electrode mounting pad,
Wherein the first connection wiring
A 1-1 connection wiring connected to the first connection wiring and formed on a side surface of the first corner;
And a second connection wiring connected to the second connection wiring and formed on a side surface of the second corner,
Wherein the first external connection terminal
A 1-1 external connection terminal connected to the 1-1 connection wiring and formed on the lower surface of the substrate body;
A 1-2 external connection terminal connected to the 1-2 connection wiring and formed on the lower surface of the substrate body;
Type super capacitor. The connector according to any one of claims 14 to 18, wherein the second external connection terminal portion
A connection pad formed on an edge portion of an upper surface of the substrate body and electrically connected to a lid which is bonded to an edge of an upper surface of the substrate body;
A second external connection terminal formed on the lower surface of the substrate body;
A second connection wiring connecting the connection pad and the second external connection terminal through a side surface of the substrate body;
Type super-capacitor. 20. The method of claim 19,
Wherein the connection pad is formed at an edge of the substrate body opposite to a side where the connection wiring is formed with the electrode mounting pad as a center. 21. The semiconductor memory device according to claim 20,
Wherein a via formed at a corner of the substrate body is cut off. 22. The method of claim 21,
The connection pad includes:
A first connection pad formed at a third corner point of the substrate body around the electrode mounting pad;
And a second connection pad formed at a third corner point adjacent to a third corner point of the substrate body about the electrode mounting pad,
And the second connection wiring,
A second-1 connection wiring connected to the first connection pad and formed on a side surface adjacent to the third edge;
And a second-second connection wiring connected to the second connection pad and formed on a side surface adjacent to the fourth corner,
And the second external connection terminal,
A second-1 external connection terminal connected to the second-1 connection wiring and formed on a lower surface of the substrate body;
A second-second external connection terminal connected to the second-second connection wiring and formed on the lower surface of the substrate body;
Type super capacitor.

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