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JP2016221637A - Blade with base - Google Patents

Blade with base Download PDF

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Publication number
JP2016221637A
JP2016221637A JP2015111433A JP2015111433A JP2016221637A JP 2016221637 A JP2016221637 A JP 2016221637A JP 2015111433 A JP2015111433 A JP 2015111433A JP 2015111433 A JP2015111433 A JP 2015111433A JP 2016221637 A JP2016221637 A JP 2016221637A
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JP
Japan
Prior art keywords
blade
base
convex portion
annular
opening
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Granted
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JP2015111433A
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Japanese (ja)
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JP6494429B2 (en
Inventor
隆 深澤
Takashi Fukazawa
隆 深澤
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2015111433A priority Critical patent/JP6494429B2/en
Priority to TW105113458A priority patent/TWI683735B/en
Priority to CN201610355937.XA priority patent/CN106182476A/en
Priority to KR1020160064820A priority patent/KR102439403B1/en
Publication of JP2016221637A publication Critical patent/JP2016221637A/en
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Publication of JP6494429B2 publication Critical patent/JP6494429B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a blade with a base in which extrusion of an adhesive is prevented.SOLUTION: A blade (2) with a base for cutting, which is mounted on a rotary shaft (32) and used, comprises a disk-like base (4) on which an opening (4c) is formed at a center thereof, and an annular blade (6) which is fixed to a first face (4a) side of the base. The base is provided with an annular first salient (4d) which projects from the first face and a second salient (4e) which projects from the first face on a radial direction inner side with respect to the first salient, and the blade is bonded to the second salient of the base via an adhesive.SELECTED DRAWING: Figure 1

Description

本発明は、回転軸となるスピンドルに装着して使用される切削用の基台付きブレードに関する。   The present invention relates to a blade with a base for cutting used by being mounted on a spindle serving as a rotating shaft.

ＩＣ、ＬＳＩ等の電子回路が形成された半導体ウェーハは、例えば、分割予定ライン（ストリート）に沿って切削され、複数のチップへと分割される。この切削に使用されるブレードとしては、砥粒をニッケル等のメッキで固めた電鋳ハブブレードや、砥粒を樹脂等の結合材（ボンド材）で固めた環状のブレード等が知られている。   A semiconductor wafer on which an electronic circuit such as an IC or LSI is formed is cut along, for example, a division line (street) and divided into a plurality of chips. As a blade used for this cutting, an electroformed hub blade in which abrasive grains are solidified by plating such as nickel, an annular blade in which abrasive grains are solidified by a binder (bond material) such as resin, and the like are known. .

上述した電鋳ハブブレードは、通常、アルミニウム等でなる円盤状の基台とブレードとが一体に形成されており、基台に対応する専用のマウントを介して回転軸となるスピンドルに装着される。一方、基台と一体化されていない環状のブレードは、２つの治具で挟み込まれるようにスピンドルに装着される。   The above-described electroformed hub blade is usually formed by integrally forming a disk-shaped base made of aluminum or the like and a blade, and is attached to a spindle serving as a rotating shaft through a dedicated mount corresponding to the base. . On the other hand, the annular blade not integrated with the base is mounted on the spindle so as to be sandwiched between two jigs.

そのため、例えば、電鋳ハブブレードを環状のブレードに交換する場合等には、スピンドルに固定されているマウント等を併せて交換しなくてはならず、作業性が悪いという問題があった。これに対して、近年では、環状のブレードを円盤状の基台に接着した基台付きブレードが提案されている（例えば、特許文献１参照）。   Therefore, for example, when the electroformed hub blade is replaced with an annular blade, the mount fixed to the spindle must be replaced together, resulting in poor workability. On the other hand, in recent years, a blade with a base in which an annular blade is bonded to a disk-shaped base has been proposed (for example, see Patent Document 1).

特開２０１２−１３５８３３号公報JP 2012-135833 A

しかしながら、上述の基台付きブレードでは、基台とブレードとを接着剤で接着するので、基台の外側に接着剤がはみ出してブレードに付着してしまうことがある。基台から接着剤がはみ出すと、見た目が悪化し、加工精度にも影響を与える恐れがあるので、接着剤がはみ出した基台付きブレードは、そのまま廃棄されていた。このように、従来の基台付きブレードには、歩留まりを十分に高めることができないという問題がある。   However, in the above-mentioned blade with a base, the base and the blade are bonded with an adhesive, so that the adhesive may protrude from the outside of the base and adhere to the blade. If the adhesive protrudes from the base, the appearance deteriorates and the processing accuracy may be affected. Therefore, the blade with the base from which the adhesive protruded has been discarded as it is. Thus, the conventional blade with a base has a problem that the yield cannot be sufficiently increased.

本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、接着剤のはみ出しを防止した基台付きブレードを提供することである。   The present invention has been made in view of such problems, and an object of the present invention is to provide a blade with a base that prevents the adhesive from protruding.

本発明によれば、回転軸に装着して使用される切削用の基台付きブレードであって、中央に開口部が形成された円盤状の基台と、該基台の第１面側に固定される環状のブレードと、を備え、該基台には、該第１面から突出する環状の第１凸部と、該第１凸部よりも径方向内側で該第１面から突出する第２凸部と、が形成されており、該ブレードは、接着剤を介して該基台の該第２凸部に接着されることを特徴とする基台付きブレードが提供される。   According to the present invention, there is provided a blade with a base for cutting that is used by being mounted on a rotating shaft, and a disc-shaped base having an opening formed in the center, and a first surface side of the base. An annular blade that is fixed, and the base has an annular first protrusion protruding from the first surface, and protrudes from the first surface radially inward of the first protrusion. A second convex portion is formed, and the blade is bonded to the second convex portion of the base via an adhesive, to provide a blade with a base.

本発明において、該ブレードの外周縁は、該基台の外周縁よりも径方向外側に位置しており、該ブレードの内周縁の径は、該基台の該開口部の径と同等以上であることが好ましい。   In the present invention, the outer peripheral edge of the blade is located radially outside the outer peripheral edge of the base, and the diameter of the inner peripheral edge of the blade is equal to or greater than the diameter of the opening of the base. Preferably there is.

また、本発明において、該回転軸の端部には、円盤状のフランジ部と、該フランジ部の中央から突出する支持軸部と、を備えるブレードマウントが設けられ、該基台の該開口部を該ブレードマウントの該支持軸部に係合させた状態で、該支持軸部に固定ナットを締結することにより、該ブレードは、該基台の該第１凸部と該ブレードマウントの該フランジ部に形成されている環状の凸部とによって挟持されることが好ましい。   Further, in the present invention, a blade mount including a disk-shaped flange portion and a support shaft portion protruding from the center of the flange portion is provided at an end portion of the rotating shaft, and the opening portion of the base By fastening a fixing nut to the support shaft portion in a state where the blade is engaged with the support shaft portion of the blade mount, the blade has the first convex portion of the base and the flange of the blade mount. It is preferable to be sandwiched by an annular convex portion formed in the portion.

本発明に係る基台付きブレードは、円盤状の基台と、基台の第１面側に固定される環状のブレードと、を備え、基台には、第１面から突出する環状の第１凸部と、第１凸部よりも径方向内側で第１面から突出する第２凸部と、が形成されており、ブレード６は、第１凸部の内側に位置する第２凸部に対して接着されるので、接着剤が第１凸部を超えて基台の外側にまではみ出すことはない。   A blade with a base according to the present invention includes a disk-shaped base and an annular blade fixed to the first surface side of the base, and the base has an annular first protruding from the first surface. 1 convex part and the 2nd convex part which protrudes from a 1st surface in the radial inside rather than a 1st convex part are formed, and the blade 6 is the 2nd convex part located inside a 1st convex part Therefore, the adhesive does not extend beyond the first convex portion to the outside of the base.

基台付きブレードの構成例を模式的に示す分解斜視図である。It is a disassembled perspective view which shows the structural example of the braid | blade with a base typically. 基台付きブレードの構成例を模式的に示す断面図である。It is sectional drawing which shows typically the structural example of the braid | blade with a base. 基台付きブレードが使用される切削装置の構成例を模式的に示す斜視図である。It is a perspective view showing typically an example of composition of a cutting device in which a braid with a base is used. 基台付きブレードが切削ユニットに装着される様子を模式的に示す斜視図である。It is a perspective view which shows a mode that the braid | blade with a base is mounted | worn with a cutting unit. 基台付きブレードが装着された状態の切削ユニットを模式的に示す一部断面側面図である。It is a partial cross section side view which shows typically the cutting unit of the state with which the braid | blade with a base was mounted | worn.

添付図面を参照して、本発明の実施形態について説明する。図１は、基台付きブレードの構成例を模式的に示す分解斜視図であり、図２は、基台付きブレードの構成例を模式的に示す断面図である。   Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is an exploded perspective view schematically showing a configuration example of a blade with a base, and FIG. 2 is a cross-sectional view schematically showing a configuration example of the blade with a base.

図１及び図２に示すように、本実施形態に係る基台付きブレード２は、アルミニウム等でなる円盤状（円環状）の基台４を備えている。基台４は、互いに平行な第１面４ａ及び第２面４ｂを有し、その中央には、基台４を第１面４ａから第２面４ｂまで貫通する円形の開口部４ｃが形成されている。   As shown in FIG.1 and FIG.2, the braid | blade 2 with a base which concerns on this embodiment is provided with the disk-shaped (annular) base 4 which consists of aluminum etc. As shown in FIG. The base 4 has a first surface 4a and a second surface 4b that are parallel to each other, and a circular opening 4c that penetrates the base 4 from the first surface 4a to the second surface 4b is formed at the center thereof. ing.

基台４の外周縁４ｈの近傍の領域には、第１面４ａから突出する環状の第１凸部４ｄが設けられている。また、第１凸部４ｄよりも径方向内側の領域には、第１面４ａから突出する環状の第２凸部４ｅが設けられている。第１凸部４ｄと第２凸部４ｅとは、開口部４ｃを囲む同心円状に配置されている。   An annular first convex portion 4 d that protrudes from the first surface 4 a is provided in a region in the vicinity of the outer peripheral edge 4 h of the base 4. An annular second convex portion 4e protruding from the first surface 4a is provided in a region radially inward of the first convex portion 4d. The 1st convex part 4d and the 2nd convex part 4e are arrange | positioned concentrically surrounding the opening part 4c.

第１凸部４ｄの先端面４ｆ及び第２凸部４ｅの先端面４ｇは、第１面４ａに対して平行かつ平坦に形成されている。第２凸部４ｅの先端面４ｇには、接着剤等を介してブレード６が接着される。使用できる接着剤に制限はないが、例えば、エポキシ樹脂系の接着剤を用いると良い。また、導電性のペースト等を接着剤として用いることもできる。一方、第１凸部４ｄの先端面４ｆには、ブレード６が接触するのみで接着されない。   The front end surface 4f of the first convex portion 4d and the front end surface 4g of the second convex portion 4e are formed parallel to and flat with respect to the first surface 4a. The blade 6 is bonded to the tip surface 4g of the second convex part 4e via an adhesive or the like. Although there is no restriction | limiting in the adhesive agent which can be used, For example, it is good to use an epoxy resin type adhesive agent. Further, a conductive paste or the like can also be used as an adhesive. On the other hand, the blade 6 only contacts the tip surface 4f of the first convex portion 4d and is not bonded.

ブレード６は、例えば、金属、セラミックス、樹脂等の結合材に、ダイヤモンド、ＣＢＮ（Cubic Boron Nitride）等の砥粒を混合して円盤状（円環状）に形成されている。ただし、ブレード６を構成する結合材や砥粒に制限はなく、結合材及び砥粒は、基台付きブレード２の仕様等に合わせて選択、変更される。   The blade 6 is formed in a disc shape (annular shape) by mixing abrasives such as diamond and CBN (Cubic Boron Nitride) with a binder such as metal, ceramics, and resin. However, there is no limitation on the binding material and abrasive grains constituting the blade 6, and the binding material and abrasive grains are selected and changed according to the specifications of the blade 2 with the base.

ブレード６は、互いに平行且つ平坦な第１面６ａ及び第２面６ｂを有しており、その中央には、ブレード６を第１面６ａから第２面６ｂまで貫通する円形の開口部６ｃが形成されている。本実施形態では、基台４の中心軸とブレード６の中心軸とを重ねるように、基台４の第２凸部４ｅにブレード６の第１面６ａ側を接着する。   The blade 6 has a first surface 6a and a second surface 6b that are parallel and flat to each other, and a circular opening 6c that penetrates the blade 6 from the first surface 6a to the second surface 6b is formed at the center thereof. Is formed. In the present embodiment, the first surface 6a side of the blade 6 is bonded to the second convex portion 4e of the base 4 so that the central axis of the base 4 and the central axis of the blade 6 overlap each other.

また、ブレード６の外周縁６ｄの径は、基台４の外周縁４ｈの径よりも大きくなっている。そのため、ブレード６を基台４に接着すると、ブレード６の外周縁６ｄは、基台４の外周縁４ｈよりも径方向外側に位置する。すなわち、ブレード６の外周部分は、基台４の外周縁４ｈから径方向外向きに突出した状態になる。   Further, the diameter of the outer peripheral edge 6 d of the blade 6 is larger than the diameter of the outer peripheral edge 4 h of the base 4. Therefore, when the blade 6 is bonded to the base 4, the outer peripheral edge 6 d of the blade 6 is positioned on the radially outer side than the outer peripheral edge 4 h of the base 4. That is, the outer peripheral portion of the blade 6 protrudes radially outward from the outer peripheral edge 4 h of the base 4.

なお、ブレード６の開口部６ｃの径（内周縁の径）は、基台４の開口部４ｃの径と同等以上になっている。これにより、回転軸となるスピンドル３２（図４、図５等参照）に対して基台付きブレード２を装着する際に、スピンドル３２とブレード６とが干渉することはない。   Note that the diameter of the opening 6 c of the blade 6 (the diameter of the inner peripheral edge) is equal to or greater than the diameter of the opening 4 c of the base 4. As a result, when the blade 2 with the base is mounted on the spindle 32 (see FIGS. 4 and 5) serving as the rotation shaft, the spindle 32 and the blade 6 do not interfere with each other.

次に、上述した基台付きブレード２が使用される切削装置について説明する。図３は、基台付きブレード２が使用される切削装置の構成例を模式的に示す斜視図である。図３に示すように、切削装置１２は、各構造を支持する基台１４を備えている。基台１４の上方には、基台１４を覆うカバー１６が設けられている。   Next, a cutting apparatus in which the above-described blade 2 with a base is used will be described. FIG. 3 is a perspective view schematically showing a configuration example of a cutting apparatus in which the blade with base 2 is used. As shown in FIG. 3, the cutting device 12 includes a base 14 that supports each structure. A cover 16 that covers the base 14 is provided above the base 14.

カバー１６の内側には、空間が形成されており、上述した基台付きブレード２を含む切削ユニット１８が収容されている。切削ユニット１８は、切削ユニット移動機構（不図示）によって前後方向（Ｙ軸方向、割り出し送り方向）に移動する。   A space is formed inside the cover 16, and the cutting unit 18 including the above-described blade 2 with a base is accommodated. The cutting unit 18 is moved in the front-rear direction (Y-axis direction, index feed direction) by a cutting unit moving mechanism (not shown).

切削ユニット１８の下方には、被加工物１１を保持するチャックテーブル２０が設けられている。チャックテーブル２０は、チャックテーブル移動機構（不図示）によって左右方向（Ｘ軸方向、加工送り方向）に移動し、回転機構（不図示）によって鉛直方向（Ｚ軸方向）に平行な回転軸の周りに回転する。   A chuck table 20 that holds the workpiece 11 is provided below the cutting unit 18. The chuck table 20 is moved in the left-right direction (X-axis direction, machining feed direction) by a chuck table moving mechanism (not shown), and around a rotation axis parallel to the vertical direction (Z-axis direction) by a rotation mechanism (not shown). Rotate to.

被加工物１１は、代表的には、シリコン等の半導体材料でなる円盤状のウェーハである。この被加工物１１の表面は、例えば、格子状に配列された分割予定ライン（ストリート）で複数の領域に区画されており、各領域には、ＩＣ、ＬＳＩ等と呼ばれる電子回路が形成されている。なお、被加工物１１の材質、形状等に制限はなく、例えば、セラミック、樹脂、金属等の材料でなる基板を被加工物１１として用いることもできる。   The workpiece 11 is typically a disk-shaped wafer made of a semiconductor material such as silicon. The surface of the workpiece 11 is divided into a plurality of areas by, for example, scheduled division lines (streets) arranged in a lattice pattern, and an electronic circuit called IC, LSI, or the like is formed in each area. Yes. In addition, there is no restriction | limiting in the material of the workpiece 11, a shape, etc. For example, the board | substrate which consists of materials, such as a ceramic, resin, and a metal, can also be used as the workpiece 11. FIG.

基台１４の前方の角部には、カセットエレベータ２２が設置されている。カセットエレベータ２２の上面には、複数の被加工物１１を収容可能なカセット２４が載せられる。カセットエレベータ２２は、昇降可能に構成されており、被加工物１１を適切に搬出、搬入できるように、カセット２４の高さ（鉛直方向の位置）を調整する。   A cassette elevator 22 is installed at the front corner of the base 14. A cassette 24 that can accommodate a plurality of workpieces 11 is placed on the upper surface of the cassette elevator 22. The cassette elevator 22 is configured to be movable up and down, and adjusts the height (position in the vertical direction) of the cassette 24 so that the workpiece 11 can be appropriately carried out and carried in.

カバー６の前面６ａには、ユーザインタフェースとなるタッチパネル式のモニタ２６が設けられている。このモニタ２６は、上述した切削ユニット１８、切削ユニット移動機構、チャックテーブル２０、チャックテーブル移動機構、回転機構、カセットエレベータ２２等と共に、切削装置２の各部を制御する制御ユニット（不図示）に接続されている。   A touch panel monitor 26 serving as a user interface is provided on the front surface 6 a of the cover 6. This monitor 26 is connected to a control unit (not shown) for controlling each part of the cutting apparatus 2 together with the cutting unit 18, the cutting unit moving mechanism, the chuck table 20, the chuck table moving mechanism, the rotating mechanism, the cassette elevator 22, and the like. Has been.

図４は、基台付きブレード２が切削ユニット１８に装着される様子を模式的に示す斜視図であり、図５は、基台付きブレード２が装着された状態の切削ユニット１８を模式的に示す一部断面側面図である。図４及び図５に示すように、切削ユニット１８は、Ｙ軸の周りに回転するスピンドル（回転軸）３２を備えている。   FIG. 4 is a perspective view schematically showing how the blade with base 2 is attached to the cutting unit 18, and FIG. 5 schematically shows the cutting unit 18 with the blade 2 with base attached. It is a partial cross section side view shown. As shown in FIGS. 4 and 5, the cutting unit 18 includes a spindle (rotating shaft) 32 that rotates around the Y axis.

このスピンドル３２は、筒状のスピンドルハウジング３４に収容されている。スピンドル３２の先端部（一端部）は、スピンドルハウジング３４の外部に露出しており、このスピンドル３２の先端部には、ワッシャー３６、ボルト３８等を介してブレードマウント４０が取り付けられている。一方、スピンドル３２の他端側（基端側）には、スピンドル３２を回転させるためのモータ（不図示）が連結されている。   The spindle 32 is accommodated in a cylindrical spindle housing 34. The tip end portion (one end portion) of the spindle 32 is exposed to the outside of the spindle housing 34, and a blade mount 40 is attached to the tip end portion of the spindle 32 via a washer 36, a bolt 38, and the like. On the other hand, a motor (not shown) for rotating the spindle 32 is connected to the other end side (base end side) of the spindle 32.

ブレードマウント４０は、径方向外向きに広がるフランジ部４２と、フランジ部４２の第１面４２ａの中央から突出するボス部（支持軸部）４４と、を含む。第１面４２ａの外周縁の近傍の領域には、第１面４２ａから突出する環状の凸部４２ｂが設けられている。この凸部４２ｂは、基台付きブレード２の第１凸部４ｄに対応する位置及び形状に形成されている。また、凸部４２ｂの先端面４２ｃは、第１面４２ａに対して平行かつ平坦に形成されている。   The blade mount 40 includes a flange portion 42 that extends radially outward, and a boss portion (support shaft portion) 44 that protrudes from the center of the first surface 42 a of the flange portion 42. An annular convex portion 42b protruding from the first surface 42a is provided in a region near the outer peripheral edge of the first surface 42a. This convex part 42b is formed in the position and shape corresponding to the 1st convex part 4d of the braid | blade 2 with a base. Moreover, the front end surface 42c of the convex part 42b is formed in parallel and flat with respect to the 1st surface 42a.

ボス部４４は、円筒状に形成されており、その先端側の外周面４４ａには、ネジ山が設けられている。このボス部４４を基台付きブレード２の開口部４ｃ及び開口部６ｃに通す（係合させる）ことで、基台付きブレード２は、ブレードマウント４０に装着される。   The boss portion 44 is formed in a cylindrical shape, and a screw thread is provided on the outer peripheral surface 44a on the tip end side. By passing (engaging) the boss 44 through the opening 4c and the opening 6c of the blade 2 with the base, the blade 2 with the base is mounted on the blade mount 40.

基台付きブレード２をブレードマウント４０に装着（係合）した状態で、ボス部４４には、固定ナット４６が締結される。固定ナット４６には、ボス部４４の径に対応する円形の開口部４６ａが形成されている。開口部４６ａの内周面には、ボス部４４の外周面４４ａに形成されたネジ山に対応するネジ溝が設けられている。   In a state where the blade 2 with the base is mounted (engaged) with the blade mount 40, a fixing nut 46 is fastened to the boss portion 44. The fixing nut 46 is formed with a circular opening 46 a corresponding to the diameter of the boss portion 44. A screw groove corresponding to a thread formed on the outer peripheral surface 44a of the boss portion 44 is provided on the inner peripheral surface of the opening 46a.

固定ナット４６をボス部４４に締結すると、基台付きブレード２の第２面４ｂに固定ナット４６が接触し、基台付きブレード２はブレードマウント４０のフランジ部４２に押し付けられる。その結果、ブレード６の第２面６ｂはフランジ部４２の先端面４２ｃに接触し、ブレード６は、基台４の第１凸部４ｄとフランジ部４２の凸部４２ｂとで挟持、固定される。   When the fixing nut 46 is fastened to the boss portion 44, the fixing nut 46 comes into contact with the second surface 4 b of the blade 2 with the base, and the blade 2 with the base is pressed against the flange portion 42 of the blade mount 40. As a result, the second surface 6b of the blade 6 comes into contact with the tip surface 42c of the flange portion 42, and the blade 6 is sandwiched and fixed between the first convex portion 4d of the base 4 and the convex portion 42b of the flange portion 42. .

以上のように、本実施形態に係る基台付きブレード２は、円盤状の基台４と、基台４の第１面４ａ側に固定される環状のブレード６と、を備え、基台４には、第１面４ａから突出する環状の第１凸部４ｄと、第１凸部４ｄよりも径方向内側で第１面４ａから突出する環状の第２凸部４ｅと、が形成されており、ブレード６は、第１凸部４ｄの内側に位置する第２凸部４ｅに対して接着されるので、接着剤が第１凸部４ｄを超えて基台４の外側にまではみ出すことはない。   As described above, the blade 2 with the base according to the present embodiment includes the disk-like base 4 and the annular blade 6 fixed to the first surface 4a side of the base 4, and the base 4 Are formed with an annular first convex portion 4d projecting from the first surface 4a and an annular second convex portion 4e projecting from the first surface 4a radially inward of the first convex portion 4d. Since the blade 6 is bonded to the second convex portion 4e located inside the first convex portion 4d, the adhesive does not protrude beyond the first convex portion 4d to the outside of the base 4. Absent.

また、本実施形態に係る基台付きブレード２では、ブレード６の開口部６ｃの径（内周縁の径）が、基台４の開口部４ｃの径と同等以上になっているので、回転軸となるスピンドル３２に対して基台付きブレード２を装着する際に、スピンドル３２とブレード６とが干渉することもない。   In the blade 2 with the base according to the present embodiment, the diameter of the opening 6c of the blade 6 (the diameter of the inner peripheral edge) is equal to or larger than the diameter of the opening 4c of the base 4, so that the rotation axis When the base-equipped blade 2 is attached to the spindle 32, the spindle 32 and the blade 6 do not interfere with each other.

さらに、本実施形態に係る基台付きブレード２では、基台４の第１凸部４ｄとブレードマウント４０（フランジ部４２）の凸部４２ｂとでブレード６を挟持、固定するので、ブレード６の振動等を抑制して加工の精度を高く維持できる。   Furthermore, in the blade 2 with the base according to the present embodiment, the blade 6 is sandwiched and fixed by the first convex portion 4d of the base 4 and the convex portion 42b of the blade mount 40 (flange portion 42). It is possible to maintain high processing accuracy by suppressing vibration and the like.

なお、本発明は上記実施形態の記載に限定されず、種々変更して実施可能である。例えば、上記実施形態に係る基台付きブレード２では、基台４に対してブレード６を接着するための環状の第２凸部４ｅを設けているが、この第２凸部４ｅは、必ずしも環状でなくて良い。第２凸部４ｅは、少なくとも、挟持（固定）用の第１凸部４ｄから内側に離れた位置に形成された凸部であれば良い。   In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the blade 2 with the base according to the above-described embodiment, the annular second convex portion 4e for bonding the blade 6 to the base 4 is provided, but the second convex portion 4e is not necessarily annular. Not necessary. The 2nd convex part 4e should just be a convex part formed in the position away from the 1st convex part 4d for clamping (fixing) at least inside.

その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。   In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

２ 基台付きブレード
４ 基台
４ａ 第１面
４ｂ 第２面
４ｃ 開口部
４ｄ 第１凸部
４ｅ 第２凸部
４ｆ 先端面
４ｇ 先端面
４ｈ 外周縁
６ ブレード
６ａ 第１面
６ｂ 第２面
６ｃ 開口部
６ｄ 外周縁
１２ 切削装置
１４ 基台
１６ カバー
１８ 切削ユニット
２０ チャックテーブル
２２ カセットエレベータ
２４ カセット
２６ モニタ
３２ スピンドル（回転軸）
３４ スピンドルハウジング
３６ ワッシャー
３８ ボルト
４０ ブレードマウント
４２ フランジ部
４２ａ 第１面
４２ｂ 凸部
４２ｃ 先端面
４４ ボス部（支持軸部）
４４ａ 外周面
４６ 固定ナット
４６ａ 開口部
１１ 被加工物 DESCRIPTION OF SYMBOLS 2 Blade with base 4 Base 4a 1st surface 4b 2nd surface 4c Opening part 4d 1st convex part 4e 2nd convex part 4f Front end surface 4g Front end surface 4h Outer peripheral edge 6 Blade 6a 1st surface 6b 2nd surface 6c Opening 6d outer peripheral edge 12 cutting device 14 base 16 cover 18 cutting unit 20 chuck table 22 cassette elevator 24 cassette 26 monitor 32 spindle (rotating shaft)
34 Spindle housing 36 Washer 38 Bolt 40 Blade mount 42 Flange portion 42a First surface 42b Convex portion 42c Tip end surface 44 Boss portion (support shaft portion)
44a Peripheral surface 46 Fixing nut 46a Opening 11 Workpiece

Claims (3)

回転軸に装着して使用される切削用の基台付きブレードであって、
中央に開口部が形成された円盤状の基台と、
該基台の第１面側に固定される環状のブレードと、を備え、
該基台には、該第１面から突出する環状の第１凸部と、該第１凸部よりも径方向内側で該第１面から突出する第２凸部と、が形成されており、
該ブレードは、接着剤を介して該基台の該第２凸部に接着されることを特徴とする基台付きブレード。 A blade with a base for cutting that is used by being mounted on a rotating shaft,
A disk-shaped base with an opening formed in the center;
An annular blade fixed to the first surface side of the base,
The base is formed with an annular first convex portion projecting from the first surface and a second convex portion projecting from the first surface radially inward of the first convex portion. ,
The blade with a base, wherein the blade is bonded to the second convex portion of the base via an adhesive. 該ブレードの外周縁は、該基台の外周縁よりも径方向外側に位置しており、
該ブレードの内周縁の径は、該基台の該開口部の径と同等以上であることを特徴とする請求項１記載の基台付きブレード。 The outer peripheral edge of the blade is located radially outside the outer peripheral edge of the base,
The blade with a base according to claim 1, wherein the diameter of the inner peripheral edge of the blade is equal to or larger than the diameter of the opening of the base. 該回転軸の端部には、円盤状のフランジ部と、該フランジ部の中央から突出する支持軸部と、を備えるブレードマウントが設けられ、
該基台の該開口部を該ブレードマウントの該支持軸部に係合させた状態で、該支持軸部に固定ナットを締結することにより、該ブレードは、該基台の該第１凸部と該ブレードマウントの該フランジ部に形成されている環状の凸部とによって挟持されることを特徴とする請求項１又は請求項２記載の基台付きブレード。 A blade mount including a disk-shaped flange portion and a support shaft portion protruding from the center of the flange portion is provided at the end of the rotating shaft,
With the opening of the base engaged with the support shaft of the blade mount, by fastening a fixing nut to the support shaft, the blade has the first convex portion of the base. The blade with a base according to claim 1 or 2, wherein the blade is sandwiched between an annular convex portion formed on the flange portion of the blade mount.
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