JP2015195250A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device that can reduce an effect of heat on electronic components mounted in a package body.SOLUTION: A component mounting device has plural bonding heads 9 having heaters 11b that heat plural electronic components 300 mounted in a package body 100 in advance and are movable in an up-and-down direction, the bonding heads 9 being arranged in a horizontal direction, a moving stage 27 that is movable in the horizontal direction while the package body is mounted thereon, and a bonding stage 37 which is positioned below the plural bonding heads so as to confront the plural bonding heads, has a heating unit and receives the package body from the moving stage when the moving stage is moved and a part of the package body is located just below the plural bonding heads, the part of the package body being mounted on the bonding stage 37. When the package body is received by the bonding stage, the plural bonding heads are moved downwards and pressed against the electronic components, and the electronic components and the package body are heated from the up-and-down sides by the heater and the heating unit.

Description

  The present invention relates to a technical field of a component mounting apparatus that has a plurality of bonding heads and heats electronic components by heaters of the bonding heads to join the electronic components to predetermined positions.

JP 2009-130313 A JP 2012-114382 A

  There is a component mounting apparatus that has a bonding head and mounts an electronic component by bonding it to a predetermined position of a mounting body such as a substrate by soldering or the like.

  In such a component mounting apparatus, a joint portion of an electronic component is pressed against a joint portion of a mounting body such as a substrate or a semiconductor wafer, and the joint body and the electronic component are pressed from above and below by a pair of press heaters. Is configured to be joined (for example, see Patent Document 1).

  In the component mounting apparatus described in Patent Literature 1, heating and pressurization are performed by a pair of press heaters in a state in which the joint portion of the electronic component is pressed against the joint portion of the mounting body. The joining portion that is included is melted, and the electronic component is joined to the mounting body.

  Also, in the component mounting apparatus, a plurality of bonding heads are arranged side by side, and each electronic component is heated by a heater provided at each suction portion of the bonding head so that each electronic component is simultaneously bonded to the mounting body. Some have been configured (see, for example, Patent Document 2).

  In the component mounting apparatus described in Patent Document 2, a plurality of bonding heads are integrally movable in the direction in which the plurality of bonding heads are arranged. A mounting body is placed on the bonding stage, and a heater such as a hot plate is incorporated in the bonding stage.

  A plurality of electronic components are previously placed at predetermined intervals on the mounting body placed on the bonding stage, and when the mounting body is conveyed below the plurality of bonding heads, the plurality of bonding heads are lowered. Each bonding head is pressed against the electronic component, and the electronic component is sucked by each suction portion. At this time, each electronic component placed on the mounting body is heated in advance by a heater incorporated in the bonding stage to be raised to a predetermined temperature. Subsequently, each bonding head that adsorbs each electronic component is slightly moved up and down to adjust the height position of each electronic component, and each electronic component is heated by a heater provided on each bonding head, and the electronic component is mounted. Soldered and mounted on the body connection terminals.

  The electronic component mounting operation by the plurality of suction units as described above is performed by moving the plurality of suction units and the bonding stage intermittently in the front-rear direction and the left-right direction, for example, six units of suction units. In the case where the portion is provided, the mounting operation of six electronic components is repeatedly performed, and the mounting operation is completed when the joining of all the electronic components mounted on the mounting body is completed.

  In the component mounting apparatus described in Patent Document 2, since a mounting operation for mounting a plurality of electronic components at a time is performed by a plurality of bonding heads, the manufacturing time of the product can be shortened. The cost can be reduced.

  However, in a configuration in which a heater is incorporated in the bonding stage and all the electronic components placed on the mounting body are heated by the heater, the electronic component other than the electronic component in which the mounting operation is performed by a plurality of suction units is also applied. The heating by the heater is continued until the mounting operation is completed.

  Therefore, the electronic components that are not mounted are continuously affected by the heat from the heater, so the quality and deterioration of solder (paste) and underfill for joining these electronic components In addition, there is a risk of malfunction of the electronic component due to the effect of heat continuously applied to the electronic component.

  Therefore, an object of the component mounting apparatus of the present invention is to overcome the above-described problems and reduce the influence of heat on the electronic component placed on the mounting body.

  First, a component mounting apparatus according to the present invention includes a plurality of bonding heads that have a heater that heats a plurality of electronic components previously placed on a mounting body and is movable in the vertical direction and is arranged in the horizontal direction. A movable stage on which the mounting body is mounted and movable in the horizontal direction, and a plurality of bonding heads positioned below the bonding heads and facing the bonding heads. A bonding stage on which a part of the mounting body is placed when the mounting body is received from the moving stage when a part of the mounting body is positioned directly below the plurality of bonding heads. When a body is received by the bonding stage, the plurality of bonding heads are moved downward and pressed against the electronic component The mounting member and the electronic component is intended to be heated from above and below by the heater and the heater together with the.

  As a result, in a state where a part of the mounting body is placed on the bonding stage, the plurality of electronic components and a part of the mounting body are heated in the vertical direction by the heaters of the plurality of bonding heads and the heater of the bonding stage. The

  Second, in the above-described component mounting apparatus according to the present invention, it is desirable that a pulse heater is used as the heater.

  As a result, the electronic component is rapidly heated and cooled by the heater while being held down by the suction portion.

  Third, in the above-described component mounting apparatus according to the present invention, it is desirable that a pulse heater is used as the heater.

  As a result, the mounting body and the electronic component are rapidly heated and cooled by the heater.

  Fourth, in the above-described component mounting apparatus according to the present invention, it is preferable that a constant heater is used as the heater.

  Thus, the electronic component is heated and cooled at a constant temperature by the heater while being held down by the suction portion.

  Fifth, in the above-described component mounting apparatus according to the present invention, it is desirable that a constant heater is used as the heater.

  Thus, the mounting body and the electronic component are heated and cooled at a constant temperature by the heater.

  Sixthly, in the above-described component mounting apparatus according to the present invention, it is preferable that a stage portion on which the mounting body is placed is provided on the moving stage, and the stage portion is movable in the vertical direction.

  Thereby, the mounting body is moved up and down as the moving stage moves in the vertical direction.

  Seventhly, in the above-described component mounting apparatus according to the present invention, a part of the mounting body is placed when the mounting body is received by the bonding stage and is spaced apart from the bonding stage in the horizontal direction. It is desirable to provide a holding stage.

  Thereby, when the mounting body is received by the bonding stage, the mounting body is held by the bonding stage and the holding stage.

  Eighth, in the above-described component mounting apparatus according to the present invention, the holding stage is provided with a suction mechanism that holds the mounting body by sucking a part of the mounting body, and the mounting body is attached to the holding stage. In the state of being sucked and held, it is desirable that the holding stage is moved and the position of the mounting body with respect to the bonding stage is changed.

  Thereby, it is not necessary to lift the mounting body from the bonding stage by the moving stage and change the position of the mounting body with respect to the bonding stage.

  Ninthly, in the above-described component mounting apparatus according to the present invention, the holding stage is movable in the same direction as the moving stage in the horizontal direction, and a guide rail for guiding the holding stage and the moving stage is provided. It is desirable.

  Thereby, both the holding stage and the moving stage are guided by the guide rail.

  Tenth, in the above-described component mounting apparatus according to the present invention, it is desirable that two holding stages are provided, and the two holding stages are positioned on the opposite side across the moving stage in the horizontal direction.

  As a result, the mounting body can be held by the first holding stage or the second holding stage regardless of the horizontal movement position of the mounting body.

  11thly, in the component mounting apparatus which concerns on above-mentioned this invention, the holding part in which the said mounting body is mounted in each of the said 2 holding | maintenance stage is provided, and the said holding part can be moved to an up-down direction, respectively. It is desirable.

  As a result, the mounting body is held by the one holding part by the vertical movement of the one holding part according to the moving position in the horizontal direction.

  12thly, in the component mounting apparatus which concerns on this invention mentioned above, the said holding stage is urged | biased in the direction approaching the said moving stage in a horizontal direction, and the said holding stage is urged | biased by the said moving stage. It is desirable to provide an interlocking unit that is contacted from the opposite direction to the moving direction and moves the holding stage as the moving stage moves.

  Accordingly, the holding stage is moved as the moving stage moves in the horizontal direction, and a dedicated drive mechanism for moving the holding stage is not required.

  13thly, in the component mounting apparatus which concerns on above-mentioned this invention, it arrange | positions in the state in which the said bonding stage was fixed, the movement to the direction which approaches the said movement stage of the said holding stage was regulated to the said movement stage, and the said It is desirable that a stop stopper for stopping the holding stage at a predetermined position is provided, and the contact of the interlocking portion with the holding stage is released when the holding stage comes into contact with the stopping stopper.

  As a result, the holding stage is stopped at a predetermined position by the stop stopper, and excessive movement of the holding stage is restricted.

  According to the present invention, in a state where a part of the mounting body is placed on the bonding stage, some electronic components and a part of the mounting body are moved up and down by the heaters of the plurality of bonding heads and the heater of the bonding stage. Since all the electronic components mounted on the mounting body and the entire mounting body are not continuously heated because the heating is performed from the direction, it is possible to reduce the influence of heat on the electronic components mounted on the mounting body. .

2 to 28 show an embodiment of the component mounting apparatus of the present invention, and this figure is a schematic perspective view of the component mounting apparatus. It is a schematic perspective view of the component mounting apparatus shown in the state seen from the direction different from FIG. It is a schematic front view which abbreviate | omits and shows a component mounting apparatus. It is a schematic side view which abbreviate | omits and shows a component mounting apparatus. It is a schematic plan view of a component mounting apparatus. It is an expansion perspective view which shows the state by which the tool was adsorbed and hold | maintained at the adsorption | suction part. It is a disassembled perspective view which shows a part of bonding head, a tool, and a part of tool holder. It is a schematic side view which shows a component mounting apparatus partially in cross section. It is a schematic side view which shows a movement stage, a holding stage, a bonding stage, etc. It is the schematic which shows a component mounting apparatus and each peripheral device. It is a schematic front view which shows the state by which the laminated body was mounted by the temporary placement state on the semiconductor wafer. It is a schematic perspective view which shows the state by which the laminated body was mounted in the temporary placement state on the semiconductor wafer. 14 to 28 show the operation of the component mounting apparatus, and this figure is a schematic enlarged side view showing a state in which the tool holder is moved forward and a predetermined tool is positioned directly under the bonding head. . FIG. 14 is a schematic enlarged side view showing a state where the tool is adsorbed by the adsorbing portion following FIG. 13. FIG. 15 is a schematic enlarged side view showing a state in which the tool recognition camera is positioned directly below the tool held by the suction unit after the moving unit is moved rearward, following FIG. 14. FIG. 16 is a schematic enlarged front view illustrating a state in which tools are sequentially photographed by the tool recognition camera, following FIG. 15. FIG. 16 shows a state in which the moving unit holding the semiconductor wafer is moved rearward, the stack positioned most rearward is located directly below the component recognition camera, and the electronic component is photographed by the component recognition camera. It is a general | schematic expanded side view. FIG. 18 is a schematic side view showing a state where the moving unit holding the semiconductor wafer is moved backward, following FIG. 17. FIG. 19 is a schematic side view illustrating a state in which the moving stage is moved downward and the semiconductor wafer is placed on the first holding stage and the bonding stage, following FIG. 18. Continuing from FIG. 19, the bonding head is adjusted in the left-right direction and the front-rear direction and in the rotation direction of the suction portion, and a part of the state where the tool held on the suction portion is positioned directly above the electronic component FIG. FIG. 21 is a schematic enlarged front view, partly in section, showing a state where the suction part is moved downward and the tool is pressed against the laminated body from above, following FIG. 20. FIG. 22 is a schematic enlarged front view, partially in section, illustrating a state where the solder and the functional material are heated by the heater via the tool and the solder and the functional material are melted. FIG. 23 is a schematic side view showing a state in which the semiconductor wafer is moved backward by the movement of the first holding stage, following FIG. 22. FIG. 24 is a schematic side view showing a state in which the movement of the first holding stage is stopped following FIG. 23. FIG. 25 is a schematic side view showing a state in which the semiconductor wafer is placed on the second holding stage and the bonding stage following FIG. 24. FIG. 26 is a schematic side view showing a state where the semiconductor wafer is moved backward by the movement of the second holding stage, following FIG. 25. FIG. 27 is a schematic side view showing a state where the semiconductor wafer is moved further rearward by the movement of the second holding stage, following FIG. 26. FIG. 28 is a schematic side view showing a state where the stage portion of the moving stage is moved upward and the semiconductor wafer is held on the stage portion, following FIG. 27.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention component mounting apparatus is demonstrated with reference to an accompanying drawing.

  In the component mounting apparatus, a plurality of bonding heads are arranged side by side. Hereinafter, the direction in which the bonding heads are arranged will be described as the left-right direction. Note that the following directions in the up / down / front / back / left / right directions are for convenience of explanation, and the implementation of the present technology is not limited to these directions.

<Configuration of component mounting device>
First, the configuration of the component mounting apparatus 1 will be described.

  The component mounting apparatus 1 includes a base 2 installed on a floor surface and the like, and support frames 3 and 3 disposed above the base 2 (see FIGS. 1 to 5).

  Various control units (not shown) are arranged inside the base 2.

  The support frames 3 and 3 are attached to a position near the rear end on the upper surface of the base 2 so as to be separated from each other on the left and right.

  A connecting plate 4 is attached between the support frames 3 and 3. On the upper surface side of the connecting plate 4, guide protrusions 4a and 4a extending left and right and protruding upward are provided apart from each other in the front-rear direction. On the connecting plate 4, first drive motors 5, 5,... Three first drive motors 5, 5,... Are arranged on the left and right, for example.

  For example, six moving bases 6, 6,... Are arranged on the connecting plate 4 so as to be movable in the left-right direction. On the lower surface side of the moving bases 6, 6,..., Guided projections 6a, 6a extending left and right and projecting downward are provided apart from each other in the front-rear direction. In the moving bases 6, 6,..., The guided protrusions 6a, 6a,... Are guided by the guide protrusions 4a, 4a, and left and right by the first drive motors 5, 5,. It can be moved.

  Guide protrusions 6b, 6b,... Are provided on the upper surface side of the movement bases 6, 6,. On the moving bases 6, 6,..., Second drive motors 7, 7,.

  The moving bases 6, 6,... Are supported so that the moving members 8, 8,. .. Are respectively provided on the lower surface side of the moving members 8, 8,.... The guided members 8a, 8a,... Are guided by the guide protrusions 6b, 6b,. It can be moved in the front-rear direction.

  .. Are attached to the front surfaces of the moving members 8, 8,..., Respectively. As shown in FIG. 6, the bonding head 9 has a mounted base 10 that extends in the vertical direction, and a drive body that is movable with respect to the mounted base 10 in the vertical direction and that can rotate about a shaft S that extends in the vertical direction. 11, and the lower end portion of the driving body 11 is provided as a suction portion 11 a and protrudes downward from the mounted base 10. The driving body 11 is provided with a heater 11b disposed inside the adsorption portion 11a (see FIG. 7). For example, a pulse heater is used as the heater 11b. The lower surface of the heater 11b is substantially coincident with the lower surface of the suction portion 11a in the vertical direction.

  As described above, in the component mounting apparatus 1, since the pulse heater is used as the heater 11b, the temperature rise / fall speed is fast and the temperature uniformity is excellent, and the operation time during heating and cooling is shortened. It is possible to suppress variations in product quality. A constant heater may be used as the heater 11b. When a constant heater is used, heating and cooling at a constant temperature are performed, and heating and cooling are performed by simple control. Therefore, the manufacturing cost of the component mounting apparatus 1 can be reduced.

  A third drive motor (not shown) is disposed inside each of the mounted bases 10, 10,. The driving bodies 11, 11,... Can be moved in the vertical direction separately from the mounted bases 10, 10,.

  Rotating motors 12, 12,... Are attached to the front surfaces of the mounted bases 10, 10,... (See FIGS. 1 to 5). The driving bodies 11, 11,... Can be rotated individually by rotation motors 12, 12,... With respect to the mounted bases 10, 10,. It is said that.

  The bonding heads 9, 9,... Are movable separately in the left-right direction. The bonding head 9 moves in the left-right direction by moving the moving base 6 and the moving member 8 by moving the moving base 6 and the moving member 8 in the left-right direction with respect to the connecting plate 4 by the first drive motor 5. Accompanied.

  Also, the bonding heads 9, 9,... Can be moved individually in the front-rear direction. The bonding head 9 is moved in the front-rear direction as the moving member 8 is moved by the second drive motor 7 in the front-rear direction relative to the moving base 6.

  A component recognition camera 13 is attached to the front surface of a predetermined attached base 10 among the attached bases 10, 10. Since the component recognition camera 13 is attached to the attached base 10, it is moved in the left-right direction and the front-rear direction as the attached base 10 moves in the left-right direction and the front-rear direction. The component recognition camera 13 has a function of recognizing an object existing below the component recognition camera 13, and recognizes the position of the electronic component described later in the horizontal direction and the direction of the rotation direction in the horizontal direction.

  A support 14 is attached to the connecting plate 4 on the lower surface side (see FIG. 8). The support body has a substantially flat support base 15 facing in the up-down direction and a mounted portion 16 protruding upward from the support base 15, and the mounted portion 16 is mounted on the lower surface of the connecting plate 4. On the lower surface side of the support base 15, guide protrusions 15 a and 15 a that extend in the front-rear direction and protrude downward are provided separately from each other in the left-right direction. A movement motor 17 is attached to the lower surface of the support 14.

  A tool holder 18 is supported on the support base 15 so as to be movable in the front-rear direction. The tool holder 18 includes a flat plate-like holding surface portion 19 that faces in the up-down direction and guided projections 20 and 20 that protrude upward from the rear end portion of the holding surface portion 19. Arrangement recesses 19a, 19a,... Opened upward are formed in the holding surface portion 19 at regular intervals in the front-rear and left-right directions.

  The tool holder 18 is configured such that the guided projections 20 and 20 are guided by the guide projections 15 a and 15 a and can be moved in the front-rear direction by the movement motor 17.

  Tools 21 are held in the tool holder 18 (see FIG. 7). The tool 21 is made of, for example, a high heat conductive material, and is formed by integrally forming an adsorbed surface portion 22 that is formed in a rectangular flat plate shape and faces the up-down direction and a pressing portion 23 that is continuous with the lower surface of the adsorbed surface portion 22. The pressing part 23 is formed in a rectangular parallelepiped shape.

  The pressing portion 23 has an outer shape that is slightly smaller than the outer shape of the attracted surface portion 22, and is continuous with a portion excluding the outer peripheral portion of the attracted surface portion 22.

  The pressing portions 23, 23,... Are inserted into the placement recesses 19a, 19a,.

  A guide portion 24 is provided on the upper surface of the base 2 (see FIGS. 1 to 5). The guide portion 24 includes a base base 24a facing in the vertical direction and a pair of guide rails 24b and 24b protruding upward from the base base 24a. The guide rails 24b and 24b extend in the front-rear direction and are spaced apart from each other on the left and right.

  A drive mechanism 25 is disposed on the base base 24 a of the guide portion 24. The drive mechanism 25 is provided with a drive motor 25a and a lead screw 25b that is rotated by the drive force of the drive motor 25a, and the drive motor 25a is disposed at the rear end of the base base 24a. When the lead screw 25b is rotated by the driving force of the drive motor 25a, the guided portions 28b and 28b are guided by the guide rails 24b and 24b, and the moving portion 26 is moved in the front-rear direction according to the rotation direction of the lead screw 25b. The

  A moving part 26 is supported by the guide part 24 so as to be movable in the front-rear direction. The moving unit 26 includes a moving stage 27 and a moving base 28, and the moving stage 27 and the moving base 28 are integrally movable in the front-rear direction (see FIGS. 4, 8, and 9). The moving unit 26 is moved between a preparation position that is a front moving end and a rear moving end.

  The moving stage 27 has a base end portion 29 positioned on the lower side, a lifting shaft 30 that is movable in the vertical direction with respect to the base end portion 29, and a flat plate shape that is coupled to the upper end portion of the lifting shaft 30 and faces the vertical direction. And a stage part 31.

  The base end portion 29 is provided with a first interlocking portion 29a protruding forward and a second interlocking portion 29b protruding backward.

  The stage portion 31 of the moving stage 27 is provided with a suction mechanism having a plurality of suction holes (not shown) opened upward, and the stage portion 31 has a function of sucking and holding a semiconductor wafer, which will be described later, which is a mounting body. ing.

  The moving stage 27 has a base end portion 29 screwed into the lead screw 25b of the moving mechanism 25, and is moved in the front-rear direction as the lead screw 25b is rotated by the driving force of the driving motor 25a.

  The moving base 28 has a base plate portion 28a formed in a plate shape that faces in the up-down direction and extends in the left-right direction, and guided portions 28b, 28b that protrude downward from the left and right ends of the base plate portion 28a and the left-right direction of the base plate portion 28a And a mounting protrusion 28c protruding rearward from the central portion. In the moving base 28, guided portions 28b and 28b are supported by guide rails 24b and 24b of the guide portion 24 so as to be slidable in the front-rear direction.

  The moving base 28 has a base plate portion 28 a coupled to a base end portion 29 of the moving stage 27. Accordingly, the moving stage 27 and the moving base 28 are moved together in the front-rear direction as the lead screw 25b rotates.

  A tool recognition camera 32 is attached to the rear end portion of the attachment projection 28 c in the movement base 28. Since the tool recognition camera 32 is attached to the movement base 28, the tool recognition camera 32 is moved in the front-rear direction as the movement base 28 moved together with the movement stage 27 moves in the front-rear direction. The tool recognition camera 32 has a function of recognizing an object existing above the tool recognition camera 32, and recognizes the position of the tool 21 in the horizontal direction and the direction of the rotation direction in the horizontal direction.

  A first holding stage 33 is supported on the guide portion 24 so as to be movable in the front-rear direction on the front side of the moving stage 27. The first holding stage 33 has a base portion 33a formed in a plate shape that faces in the vertical direction and extends to the left and right, and guided portions 33b and 33b that protrude downward from the left and right ends of the base portion 33a and the left and right sides of the base plate portion 33a. Columnar portion 33c projecting upward from the central portion in the direction, moving shaft 33d movable up and down relative to columnar portion 33c, and flat plate-shaped holding portion coupled to the upper end portion of moving shaft 33d and facing in the vertical direction 33e.

  In the first holding stage 33, guided portions 33b and 33b are supported by guide rails 24b and 24b of the guide portion 24 so as to be slidable in the front-rear direction.

  The holding part 33e of the first holding stage 33 is provided with a suction mechanism having a plurality of suction holes (not shown) opened upward, and the holding part 33e has a function of sucking and holding a semiconductor wafer as a mounting body. doing.

  The first holding stage 33 is urged rearward by the first urging mechanism 34. The first urging mechanism 34 has a cylinder 34a fixed to the base 2, a piston 34b supported by the cylinder 34a so as to be movable in the front-rear direction, and a connecting shaft 34c whose rear end is connected to the piston 34b. ing. In the first urging mechanism 34, the front end portion of the connecting shaft 34 c is connected to the base portion 33 a of the first holding stage 33.

  In the first urging mechanism 34, a force is applied in a direction in which the piston 34b is moved rearward with respect to the cylinder 34a. Accordingly, the first holding stage 33 connected to the piston 34b via the connecting shaft 34c is urged rearward by the first urging mechanism 34.

  A second holding stage 35 is supported on the guide unit 24 at the rear side of the moving stage 27 so as to be movable in the front-rear direction. The second holding stage 35 has a base portion 35a that is formed in a plate shape that faces in the vertical direction and extends to the left and right, and guided portions 35b and 35b that protrude downward from the left and right ends of the base portion 35a and the left and right sides of the base plate portion 35a. Columnar portion 35c protruding upward from the central portion in the direction, moving shaft 35d movable up and down relative to columnar portion 35c, and flat plate-shaped holding portion coupled to the upper end portion of moving shaft 35d and facing in the vertical direction 35e.

  In the second holding stage 35, guided portions 35b and 35b are supported by guide rails 24b and 24b of the guide portion 24 so as to be slidable in the front-rear direction.

  The holding part 35e of the second holding stage 35 is provided with a suction mechanism having a plurality of suction holes (not shown) opened upward, and the holding part 35e has a function of sucking and holding a semiconductor wafer as a mounting body. doing.

  The second holding stage 35 is urged forward by a second urging mechanism 36. The second urging mechanism 36 includes a cylinder 36a fixed to the base 2, a piston 36b supported by the cylinder 36a so as to be movable in the front-rear direction, and a connecting shaft 36c having a front end connected to the piston 36b. Yes. In the second urging mechanism 36, the rear end portion of the connecting shaft 36 c is connected to the base portion 35 a of the second holding stage 35.

  In the second urging mechanism 36, a force is applied in a direction in which the piston 36b is moved forward relative to the cylinder 36a. Accordingly, the second holding stage 35 connected to the piston 36b via the connecting shaft 36c is urged forward by the second urging mechanism 36.

  On the base 2, a bonding stage 37 is arranged between the moving stage 27 and the second holding stage 35. The bonding stage 37 has a mounting base part 38 attached to the base 2 and a heating table 39 arranged on the mounting base part 38.

  The mounting base portion 38 is formed in a U-shape that opens downward, and is disposed in a state of straddling the lead screw 25 b of the moving mechanism 25. The mounting base portion 38 is provided with a first stop stopper 38a protruding forward and a second stop stopper 38b protruding backward.

  The heating table 39 is formed in a horizontally long shape, and is positioned directly below the bonding heads 9, 9,.

  Heaters 40 and 40 are incorporated in the heating table 39. The heaters 40 are, for example, so-called constant heaters that apply a certain amount of heating to the semiconductor wafer placed on the heating table 39. However, the heaters 40 and 40 may be pulse heaters. When a constant heater is used as the heater 40, heating and cooling are performed at a constant temperature, and heating and cooling are performed by simple control. Therefore, the manufacturing cost of the component mounting apparatus 1 can be reduced. become. In addition, when a pulse heater is used as the heater 40, the temperature raising / lowering speed is fast and the temperature uniformity is excellent, the operation time at the time of heating and cooling is shortened, and the variation in the quality of the product is suppressed. Can be planned.

<Configuration of peripheral devices>
Around the component mounting apparatus 1, a component mounting apparatus 500, a mounted body carrying-in apparatus 600, and a mounted body carrying-out apparatus 700 are arranged (see FIG. 10). In addition, the mounting body carrying-in apparatus 600 and the mounting body carrying-out apparatus 700 may be provided as a part of the structure of the component mounting apparatus 1 as a mounting body carrying-in part and a mounting body carrying-out part, respectively.

  As shown in FIG. 11, the component mounting apparatus 500 has a plurality of electronic components 300, 300,... Stacked on a semiconductor wafer 100 used as a mounting body via functional materials 200, 200,. It is an apparatus which mounts the laminated body 400 comprised in a temporary placement state. The functional material 200 is affixed to the lower surface of the electronic component 300, and the bumps 301, 301,... Are exaggerated in FIG. However, since the bumps 301, 301,... Are actually small protrusions, the functional material 200 is attached to the lower surface of the electronic component 300 in a substantially planar state. A large number of stacked bodies 400, 400,... Are placed in a temporarily placed state on the semiconductor wafer 100 in a state of being equally spaced vertically and horizontally by the component mounting apparatus 500 (see FIG. 12).

  In addition, as the functional material 200, for example, a paste-like or film-like material having a function as an adhesive material, a sealing material, or a reinforcing material is used. Specifically, an underfill material, a non-contact film, Various materials called non-contact paste or the like are used.

  The mounting body carrying-in device 600 is positioned between the component mounting device 500 and the component mounting device 1 and has a carrying-in conveyor 601 (see FIG. 10). The carry-in conveyor 601 includes feed rollers 601a and 601a that are spaced apart from each other on the left and right sides and a transport belt 601b that is fed by the feed rollers 601a and 601a.

  The mounting body carrying-out device 700 is located on the opposite side of the mounting body carrying-in device 600 with the component mounting device 1 interposed therebetween, and has a carrying-out conveyor 701. The carry-out conveyor 701 includes feed rollers 701a and 701a that are spaced apart from each other on the left and right sides, and a transport belt 701b that is fed by the feed rollers 701a and 701a.

  The package unloading device 700 may be provided with a heat retention heater (not shown) that retains heat in order to prevent warping of the semiconductor wafer 100 due to rapid cooling.

  The mounting body carrying-in device 600 has a function of carrying the semiconductor wafer 100 from the component mounting device 500 to the stage unit 31 of the moving stage 27 in the moving unit 26, and the mounting body carrying-out device 700 carries out the semiconductor wafer 100 from the stage unit 31. And has a function of conveying to a predetermined position.

  A predetermined circuit pattern is formed on the semiconductor wafer 100, and connection terminals 101, 101,... Are formed at each end of the circuit pattern (see FIG. 11). On the semiconductor wafer 100, laminated bodies 400, 400, which are configured beforehand with functional materials 200, 200,... And electronic components 300, 300,. Are placed in a temporarily placed state by the component mounting device 500 (see FIGS. 11 and 12). Bumps 301, 301,... Are provided on the upper and lower surfaces of electronic components 300, 300,. .. Are applied to the tips of the bumps 301, 301,..., Respectively. Note that the bonding material is not limited to the solder 302, and may be another metal material that can be melted.

  In the laminated body 400, the solders 302, 302,... Are positioned directly above the connection terminals 101, 101,. The solders 302, 302,... Positioned on the upper surface side of 300 are positioned directly below the solders 302, 302,... Positioned on the lower surface side of the upper electronic component 300 via the functional material 200, respectively. ing.

<Operation of component mounting device>
Next, the mounting operation (joining operation) of the component mounting apparatus 1 when the electronic components 300, 300,... Are bonded to each other and the lowermost electronic component 300 is bonded to the semiconductor wafer 100 will be described.

  First, the initial state of each part before the semiconductor wafer 100 is carried into the component mounting apparatus 1 by the mounting body carrying-in apparatus 600 will be described.

  In the initial state, the moving unit 26 is in a preparation position that is a forward moving end (see FIGS. 8 and 9). At this time, the first holding stage 33 urged rearward by the first urging mechanism 34 comes into contact with the first interlocking portion 29a of the moving stage 27 from the front, and the movement is stopped at the front moving end. Yes.

  On the other hand, the second holding stage 35 urged forward by the second urging mechanism 36 comes into contact with the second stop stopper 38b of the bonding stage 37 from the rear, and the movement is stopped at the front moving end. ing.

  In the moving stage 27, the first holding stage 33, and the second holding stage 35 of the moving unit 26, the stage unit 31 of the moving stage 27 is at the highest position when in the initial state, and the first holding stage. The holding part 33e of 33 is in a position lower than the stage part 31, and the holding part 35e of the second holding stage 35 is in a position lower than the holding part 33e.

  The tool holder 18 is held at the rear moving end in the initial state (see FIG. 8).

  In the initial state, the bonding heads 9, 9,... Are positioned at the upper moving end, and the pitch, which is the spacing in the left-right direction, is the narrowest. (See FIGS. 1 to 3).

  In the mounting operation, first, a pre-operation before the semiconductor wafer 100 is carried into the component mounting apparatus 1 by the mounting body carrying-in apparatus 600 is performed.

  As a preliminary operation, first, the tool holder 18 is moved forward by the moving motor 17 (see FIG. 13). By moving the tool holder 18 forward, the predetermined tools 21, 21,... Are positioned directly below the bonding heads 9, 9,. The predetermined tools 21, 21,... Are sized according to the stacked bodies 400, 400,.

  Subsequently, the driving bodies 11, 11,... Are moved downward in the bonding heads 9, 9,. At this time, negative pressure is applied to the suction portions 11a, 11a,..., And the tools 21, 21,... Are sucked by the suction portions 11a, 11a,. .. Are moved upward and the tools 21, 21,... Are held by the suction portions 11a, 11a,.

  When the tools 21, 21,... Are taken out from the tool holder 18 by the suction portions 11a, 11a,..., The tool holder 18 is moved to the rear moving end.

  Subsequently, as a preliminary operation, the moving unit 26 is moved rearward, and the tool recognition camera 32 is positioned directly below the tools 21, 21,... Held by the suction units 11a, 11a,. 15). At this time, the first holding stage 33 biased rearward is moved backward together with the moving unit 26. When the tool recognition camera 32 is positioned directly below the tools 21, 21,..., The bonding heads 9, 9,... Are moved in the left-right direction, and the tools 21, 21,. .. Are passed through the recognition camera 32, and the tools 21, 21,... Are photographed in order by the tool recognition camera 32 (see FIG. 16). When the tool recognition camera 32 finishes photographing all the tools 21, 21,... Sucked by the suction portions 11a, 11a,..., The bonding heads 9, 9,. Returning to the initial state where the pitch is the narrowest, the moving unit 26 is moved to the front moving end and returns to the preparation position which is the initial state position. The first holding stage 33 is also pressed by the first interlocking portion 29a of the moving portion 26, is moved forward together with the moving portion 26, and returns to the front moving end.

  When the tool 21 is photographed by the tool recognition camera 32, the position and orientation in the horizontal direction of the tool 21 photographed based on the photographed image data are recognized. The position in the horizontal direction is the position (coordinate) in the front-rear direction and the position (coordinate) in the left-right direction, and the direction in the horizontal direction is the direction (rotation angle) relative to the reference position in the rotation direction with the axis extending in the vertical direction as a fulcrum. .

  When the above-described pre-operation is completed, the semiconductor wafer 100 on which the stacked bodies 400, 400,... Are temporarily placed by the mounting body carrying-in apparatus 600 is carried into the stage unit 31 of the moving stage 27 in the moving unit 26. The The semiconductor wafer 100 carried into the stage unit 31 is sucked and held by the stage unit 31. At this time, the central portion of the semiconductor wafer 100 is sucked and held by the stage portion 31.

  When the semiconductor wafer 100 is held by the stage unit 31 of the moving stage 27, the moving unit 26 is moved rearward, and the stacked body 400 positioned on the rearmost side or the stacked body 400 positioned on the frontmost side is the component recognition camera. 13 (see FIG. 17). At this time, the first holding stage 33 biased rearward is moved backward together with the moving unit 26.

  When the stacked body 400 is positioned directly below the component recognition camera 13, the bonding heads 9, 9,... Are moved in the left-right direction, or the moving unit 26 is moved in the front-rear direction, so that the stacked body 400 sequentially. , 400,... Pass right under the component recognition camera 13, and the electronic components 300, 300,. When photographing of all the electronic components 300, 300,... At the uppermost stage by the component recognition camera 13 is finished, the bonding heads 9, 9,... Are moved in the left-right direction to return to the initial state where the pitch is the narrowest. The moving part 26 is moved to the front moving end and returns to the preparation position which is the initial position. The first holding stage 33 is also pressed by the first interlocking portion 29a of the moving portion 26, is moved forward together with the moving portion 26, and returns to the front moving end.

  When the uppermost electronic component 300 is photographed by the component recognition camera 13, the position and orientation in the horizontal direction of the electronic component 300 photographed based on the photographed image data are recognized. The position in the horizontal direction is the position (coordinate) in the front-rear direction and the position (coordinate) in the left-right direction, and the direction in the horizontal direction is the direction (rotation angle) relative to the reference position in the rotation direction with the axis extending in the vertical direction as a fulcrum. .

  Subsequently, the bonding operation for the stacked bodies 400, 400,... By the bonding heads 9, 9,. When the bonding operation is started, the moving unit 26 is moved rearward, and the first holding stage 33 biased rearward is also moved rearward together with the moving unit 26, and the rear end of the semiconductor wafer 100 is moved. Are positioned directly below the tools 21, 21,..., And the rear end of the semiconductor wafer 100 is heated on the bonding stage 37. It is located directly above the table 39 (see FIG. 18). At this time, for example, the stacked bodies 400, 400,... In the first row are positioned just below the tools 21, 21,.

  When the stacked bodies 400, 400,... Are positioned directly below the tools 21, 21,..., The stage portion 31 of the moving stage 27 is lowered and the rear end portion of the semiconductor wafer 100 is heated. The front end portion of the semiconductor wafer 100 placed on the table 39 is placed on the holding portion 33e of the first holding stage 33 (see FIG. 19). The stage unit 31 is lowered to a position retracted downward from the semiconductor wafer 100, and the semiconductor wafer 100 is transferred from the stage unit 31 to the heating table 39 and the holding unit 33e.

  The semiconductor wafer 100 delivered from the stage unit 31 and received by the heating table 39 and the holding unit 33e is sucked and held by the holding unit 33e. When the semiconductor wafer 100 is placed on the heating table 39 and the holding unit 33e and is held by the holding unit 33e, the rear end portion of the semiconductor wafer 100 and the rear end of the semiconductor wafer 100 are heated by the heaters 40 and 40 incorporated in the heating table 39. The first-layer stacked bodies 400, 400,... Placed on the end are heated from below.

  When the semiconductor wafer 100 is held by the holding unit 33e, it is positioned directly below the recognition result by the tool recognition camera 32 of each tool 21, 21,... Held by the suction units 11a, 11a,. Based on the recognition results of the top electronic components 300, 300,... By the component recognition camera 13, the top electronic components where the positions and orientations of the tools 21, 21,. , 300, 300,... In other words, the bonding heads 9, 9,... Are arranged so that the positions and orientations of the tools 21, 21,... Match the positions and orientations of the uppermost electronic components 300, 300,. Are slightly moved in the left-right direction by the first drive motors 5, 5,... And adjusted by the second drive motors 7, 7,. The suction portions 11a, 11a,... Are slightly adjusted by the rotation motors 12, 12,.

  By adjusting the bonding head 9 in the left-right direction and the front-rear direction and adjusting the rotation direction of the suction portion 11a, the bonding head 9 is positioned directly below the center portion of the tool 21 held by the suction portion 11a. The center portion of the electronic component 300 is aligned in the vertical direction, and the horizontal direction of the tool 21 is aligned with the horizontal direction of the electronic component 300 (see FIG. 20).

  Subsequently, the adsorbing portions 11a, 11a,... Are moved downward, and the tools 21, 21,... Are pressed against the stacked bodies 400, 400,.

  Note that bumps 301, 301,... May also be provided on the upper surface of the electronic component 300 located at the uppermost stage, but in this case, the lower side of the pressing portion 23 in the tool 21 is opened downward. It is desirable that an insertion recess is formed. The insertion recess formed in the tool 21 may be formed so as to be separated in the front-rear and left-right directions, or may be formed in a straight line extending in the front-rear direction or the left-right direction. When the insertion recess is formed in the tool 21, each bump is inserted into the insertion recess when the tool 21 is pressed against the laminate 400 from above.

  In this way, the bumps formed on the upper surface of the electronic component 300 located at the uppermost stage are inserted into the insertion recesses, whereby the solders 302, 302,. Are not in contact with the tools 21, 21,..., And the solders 302, 302,... Are removed from the bumps 301, 301,. Can be prevented.

  When the tools 21, 21,... Are pressed against the laminates 400, 400,... From above, the tools are respectively moved by the heaters 11b, 11b,. .. Are heated through 21, 21,.... Therefore, the solders 302, 302,... And the functional materials 200, 200,... Of the stacked bodies 400, 400,.

  At this time, the heaters 40 and 40 heat the rear end portion of the semiconductor wafer 100 and the stacked bodies 400, 400,... Placed on the rear end portion of the semiconductor wafer 100 from below. The rear end portion of the semiconductor wafer 100 and the stacked bodies 400, 400,... In the first row are heated from above and below by the heaters 11b, 11b,.

  The heated solders 302, 302, ... and the functional materials 200, 200, ... are melted so that the solders 302, 302, ... break through the functional materials 200, 200, .... The connection terminals 101, 101,... Or the solders 302, 302,.

  At this time, since the pulse heater is used as the heater 11b, the laminated body 400 is quickly pressed and heated by the adsorption portion 11a, and the solder 302, 302,... And the functional materials 200, 200,. .. Melting and solidification after melting are performed. Therefore, it is possible to ensure a rapid temperature rising / lowering state with respect to the solders 302, 302,... And the functional material 200, 200,. As a result, variations in the quality of the product can be suppressed.

  Further, when a pulse heater is used as the heaters 40, 40, the semiconductor wafer 100 and the laminates 400, 400,... Are heated by the pulse heater from both the upper and lower sides, and the solders 302, 302,. .. and the quality of the product can be ensured with a more rapid rise and fall state of the temperature with respect to the functional materials 200, 200,... Can be further suppressed.

  Since the functional materials 200, 200,... Are solidified after being melted, the electronic components 300, 300,... Are covered from the surroundings, and the lower surface of the lowermost electronic component 300 and the upper surface of the semiconductor wafer 100 are covered. The electronic component 300 is bonded to the semiconductor wafer 100 by the functional material 200 and the electronic components 300, 300,... Are filled in between the electronic components 300, 300,. , 200,...

  Subsequently, the drive bodies 11, 11,... Are moved upward in a state where the tools 21, 21,. As the drive bodies 11, 11,... Are moved upward, the pressing state by the suction portions 11a, 11a,. The drive bodies 11, 11,... Are moved to the upper moving end, and the pressing state by the suction portions 11a, 11a,. The joining operation to the individual stacked bodies 400, 400,... Is completed.

  When the driving bodies 11, 11,... Are moved to the upper moving end, the bonding heads 9, 9,... Are moved in the left-right direction by one pitch of the stacked bodies 400, 400,. Subsequently, in the same manner as described above, a bonding operation is performed on another stacked body 400, 400,... By the bonding heads 9, 9,. The movement of the bonding heads 9, 9,... By one pitch and the bonding operation with respect to the stacked bodies 400, 400,.

  When the joining operation with respect to the first-row stacked bodies 400, 400,... Located on the rearmost side is completed, the moving unit 26 is moved rearward together with the first holding stage 33, and the second from the rear side. The stacked bodies 400, 400,... In the rows are positioned directly below the tools 21, 21,. At this time, the semiconductor wafer 100 held by the holding portion 33e is slid on the heating table 39.

  When the stacked bodies 400, 400,... In the second row are positioned directly below the tools 21, 21,..., The second row by the bonding heads 9, 9,. A bonding operation is performed on the laminated body 400, 400,. At this time, the portion near the rear end of the semiconductor wafer 100 and the stacked bodies 400, 400,... In the second row are heated from above and below by the heaters 11b, 11b,.

  In the same manner, the joining operation is performed on the stacked bodies 400, 400,.

  When the bonding operation is performed on the stacked bodies 400, 400,..., The semiconductor wafer 100 is intermittently moved along with the backward movement of the first holding stage 33 that is moved together with the moving unit 26. The first holding stage 33 is brought into contact with the first stop stopper 38a of the bonding stage 37 while being moved rearward, and the backward movement is stopped (see FIG. 24). At this time, the central portion of the semiconductor wafer 100 is placed on the heating table 39.

  When the backward movement of the first holding stage 33 is stopped, the holding portion 33e of the first holding stage 33 is lowered and the holding portion 35e of the second holding stage 35 is raised (see FIG. 25). ). Accordingly, the semiconductor wafer 100 is placed on the holding unit 35e with the central part placed on the heating table 39, and is sucked and held by the holding unit 35e, and the semiconductor wafer 100 is held by the first holding stage 33. To the second holding stage 35.

  When the semiconductor wafer 100 is transferred from the first holding stage 33 and received by the second holding stage 35, the moving unit 26 is intermittently moved rearward, and is moved forward by the second interlocking unit 29 b of the moving unit 26. The biased second holding stage 35 is pressed backward, and the second holding stage 35 is moved backward together with the moving unit 26 (see FIG. 26). At this time, the semiconductor wafer 100 held by the holding portion 35e is slid on the heating table 39.

  When the moving unit 26 and the second holding stage 35 are intermittently moved backward and the bonding operation with respect to the frontmost stacked bodies 400, 400,... Placed on the front end of the semiconductor wafer 100 is completed, The bonding operation for all the stacked bodies 400, 400,... Mounted on the semiconductor wafer 100 is completed (see FIG. 27).

  When the bonding operation to all the stacked bodies 400, 400,... Placed on the semiconductor wafer 100 is completed, the stage unit 31 is raised, and the semiconductor wafer 100 is lifted from the heating table 39 and the holding unit 35e, and the semiconductor wafer. 100 is transferred from the bonding stage 37 and the second holding stage 35 to the stage unit 31 (see FIG. 28). When the semiconductor wafer 100 is transferred from the bonding stage 37 and the second holding stage 35 and received by the stage unit 31, the holding unit 35 e of the second holding stage 35 is lowered. At this time, the central portion of the semiconductor wafer 100 is sucked and held by the stage portion 31.

  As described above, in the component mounting apparatus 1, since the central portion is sucked and held when the semiconductor wafer 100 is held on the stage portion 31, the semiconductor wafer 100 is stably held with respect to the stage portion 31. Can be secured.

  Subsequently, in a state where the stage unit 31 holds the semiconductor wafer 100, the moving unit 26 is moved to a preparation position that is a front moving end (see FIG. 9). At this time, the first holding stage 33 urged rearward and stopped by the first stop stopper 38a is pressed by the first interlocking portion 29a and moved forward together with the moving portion 26. Return to the initial state. Further, the second holding stage 35 is moved forward together with the moving portion 26, is brought into contact with the second stop stopper 38b, and the movement is stopped to return to the initial state.

  In the bonding heads 9, 9,..., The driving bodies 11, 11,... Are positioned at the upper moving end, the pitch that is the interval in the left-right direction is made the narrowest, and the initial state is restored.

  When the joining operation is not performed on the stacked bodies 400, 400,... Subsequently placed on the new semiconductor wafer 100, the tool holder 18 is moved forward, and the suction portions 11a, 11a,. .. Are respectively inserted into the arrangement recesses 19a, 19a,... And the drive bodies 11, 11,. The operation of moving to the rear moving end is performed again.

  When the moving unit 26 is moved to the preparation position, the suction of the semiconductor wafer 100 by the moving stage 27 is stopped, and the holding state of the semiconductor wafer 100 is released. When the holding state of the semiconductor wafer 100 by the moving stage 27 is released, the semiconductor wafer 100 is held by the mounting body unloading device 700 and unloaded to a predetermined position by the mounting body unloading device 700.

  In the above description, an example is shown in which the tools 21, 21,... Are photographed by the tool recognition camera 32 as a preliminary preparation before the semiconductor wafer 100 is carried into the moving stage 27. When the moving base 27 is loaded, the moving base 28 is moved rearward and the tools 21, 21,... Are sucked by the sucking portions 11a, 11a,. .. shooting may be performed.

  As described above, in the component mounting apparatus 1, the stage portion 31 of the moving stage 27 on which the semiconductor wafer 100 is placed is movable in the vertical direction. The semiconductor wafer 100 can be inserted between the suction portions 11 a, 11 a,... And the heating table 39 of the bonding stage 37 and can be reliably transferred to the bonding stage 37.

  In addition, the first holding stage 33 and the second holding stage on which a part of the semiconductor wafer 100 is placed when the semiconductor wafer 100 is received by the bonding stage 37 and is separated from the bonding stage 37 in the horizontal direction. 35 is provided.

  Therefore, when the semiconductor wafer 100 is received by the bonding stage 37, the semiconductor wafer 100 is held by the bonding stage 37 and the first holding stage 33 or the bonding stage 37 and the second holding stage 35, and the semiconductor wafer 100 is stabilized. In this state, the electronic components 300, 300,... And the semiconductor wafer 100 can be heated.

  Further, a suction mechanism is provided for holding the semiconductor wafer 100 by sucking a part of the semiconductor wafer 100 to the first holding stage 33 and the second holding stage 35, and the semiconductor wafer 100 is provided with the first holding stage 33 or the second holding stage 33. The first holding stage 33 or the second holding stage 35 is moved while being sucked and held by the second holding stage 35, and the position of the semiconductor wafer 100 relative to the bonding stage 37 is changed.

  Accordingly, there is no need to temporarily lift the semiconductor wafer 100 from the bonding stage 37 by the moving stage 27 and change the position of the semiconductor wafer 100 relative to the bonding stage 37, and the bonding operation can be speeded up.

  Furthermore, the first holding stage 33 and the second holding stage 35 are movable in the same direction as the moving stage 27 in the horizontal direction, and the first holding stage 33, the second holding stage 35, and the moving stage 27 are moved. Guide rails 24b and 24b for guiding are provided.

  Accordingly, since the first holding stage 33, the second holding stage 35, and the moving stage 27 are all guided by the guide rails 24b, 24b, the first holding stage 33, the second holding stage 35, and the moving stage 27 are all guided. Therefore, it is possible to simplify the mechanism and reduce the manufacturing cost by reducing the number of parts.

  The component mounting apparatus 1 is provided with two holding stages, a first holding stage 33 and a second holding stage 35, and the first holding stage 33 and the second holding stage 35 sandwich the moving stage 27. Located on the opposite side.

  Therefore, regardless of the movement position of the semiconductor wafer 100 in the horizontal direction, the end portion of the semiconductor wafer 100 can hold the semiconductor wafer 100 by the first holding stage 33 or the second holding stage 35. , And the semiconductor wafer 100 can be heated in a state in which is held more stably.

  Further, the first holding stage 33 and the second holding stage 35 are respectively provided with a holding part 33e and a holding part 35e on which the semiconductor wafer 100 is placed, and the holding part 33e and the holding part 35e can move in the vertical direction, respectively. It is said that. Accordingly, the semiconductor wafer 100 is held by the holding portion 33e or the holding portion 35e by the movement of the holding portion 33e and the holding portion 35e in the vertical direction according to the moving position in the horizontal direction, and the semiconductor wafer 100 is moved to the first position by a simple operation. It can be reliably transferred between the holding stage 33 and the second holding stage 35.

  Furthermore, the first holding stage 33 and the second holding stage 35 are urged toward the moving stage 27 in the horizontal direction, and the moving stage 27 is moved to the first holding stage 33 and the second holding stage 35. A first interlocking portion 29a and a second interlocking portion 29b are brought into contact with each other in the direction opposite to the biased direction and move the first holding stage 33 and the second holding stage 35 as the moving stage 27 moves. Is provided.

  Accordingly, the first holding stage 33 and the second holding stage 35 are moved in accordance with the movement of the moving stage 27 in the horizontal direction, and dedicated for moving the first holding stage 33 and the second holding stage 35. Therefore, the manufacturing cost can be reduced by simplifying the structure of the component mounting apparatus 1.

  In addition, when the first holding stage 33 comes into contact with the first stop stopper 38a, the contact of the first interlocking portion 29a with the first holding stage 33 is released, and the second holding stage 35 is moved to the second holding stage 35. When the second stop stopper 38b is contacted, the contact of the second interlocking portion 29b with the second holding stage 35 is released.

  Accordingly, the first holding stage 33 is stopped at a predetermined position by the first stop stopper 38a, and the second holding stage 35 is stopped at a predetermined position by the second stop stopper 38b. Excessive movement of the holding stage 33 and the second holding stage 35 is restricted, and the operation can be optimized.

<Summary>
As described above, in the component mounting apparatus 1, when the semiconductor wafer 100 is received by the bonding stage 37, the plurality of suction portions 11 a, 11 a,. , And a part of the stacked body 400, 400,... Placed on the semiconductor wafer 100 and a part of the semiconductor wafer 100 are heated by the heaters 11b, 11b,. 40 is heated from above and below.

  Therefore, since heating is performed by the heaters 40 and 40 only from the lower side of the portion where the electronic components 300, 300,... The influence of heat by the heaters 40, 40 is not easily applied to the electronic components 300, 300,..., And the influence of heat on the electronic components 300, 300,. can do.

  Since the influence of heat by the heaters 40, 40 on the electronic components 300, 300,... That are not joined in this way is reduced, the electronic components 300, 300,. The deterioration and deterioration of the solder 302, 302,... And the functional material 200, 200,... Can be suppressed, and the occurrence of malfunction of the electronic components 300, 300,. it can.

  It should be noted that the electronic components 300, 300,... Are sucked and taken out from the component storage unit by a plurality of suction units to the other component mounting device (conventional component mounting device), and are loaded by the component loading device 600. .. Are moved and placed on the semiconductor wafer 100, and in this state, the electronic components 300, 300,... Therefore, in such a component mounting apparatus, the mounting operation (mounting process) of the electronic components 300, 300,... And the bonding operation (bonding) of the electronic components 300, 300,. Steps) are alternately repeated.

  On the other hand, in the component mounting apparatus 1, the semiconductor wafer 100 is carried in by the mounting body carrying-in device 600, and the electronic components 300, 300,. A joining operation (joining process) is performed. Therefore, it is not necessary to alternately perform the placing operation and the bonding operation, and the bonding operation for the electronic components 300, 300,... Can be performed continuously, and the bonding operation of the electronic components 300, 300,. The production capacity per unit time (UPH: Utility Per Hour) is high, and productivity can be improved.

<Others>
In the above, an example in which a so-called chip-on-chip stacked body 400 in which a plurality of electronic components 300, 300,... Is not limited to the chip-on-chip stack 400, and may be a single electronic component 300.

  In the above description, the bumps 301, 301,... Are provided on the upper and lower surfaces of the electronic component 300. However, for example, when one electronic component is bonded to the semiconductor wafer 100. Bumps need not be provided on both the upper and lower surfaces, and the bumps may be provided only on the lower surface side.

  Further, in the above, the semiconductor wafer 100 is shown as an example of the mounting body on which the stacked bodies 400, 400,... Are arranged, but the mounting body is not limited to the semiconductor wafer 100. It may be. When the mounting body is an electronic component, it is a so-called chip-on-chip in which the electronic component 300 is joined to the electronic component.

  In addition, although the example in which the stacked body 400 is pressed downward by the tool 21 has been described above, for example, the tool 21 is not provided, and the stacked body 400 is pressed downward by the suction portion 11a. Is also possible.

DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus 9 ... Bonding head 11b ... Heater 24b ... Guide rail 27 ... Moving stage 29a ... 1st interlocking | linkage part 29b ... 2nd interlocking | linkage part 31 ... Stage part 33 ... 1st holding | maintenance stage 33e ... Holding | maintenance part 35 ... second holding stage 35e ... holding part 37 ... bonding stage 38a ... first stop stopper 38b ... second stop stopper 40 ... heater 100 ... semiconductor wafer (mounting body)
300 ... Electronic components

First, a component mounting apparatus according to the present invention includes a plurality of bonding heads that have a heater that heats a plurality of electronic components previously placed on a mounting body and is movable in the vertical direction and is arranged in the horizontal direction. A movable stage on which the mounting body is mounted and movable in the horizontal direction, and a plurality of bonding heads positioned below the bonding heads and facing the bonding heads. has been provided with a bonding stage part is placed a part of receiving the mounting member the mounting body from the moving stage when it is positioned directly below the plurality of the bonding head of the mounting body, horizontal The mounting body is positioned at a distance from the bonding stage when the mounting body is received by the bonding stage. Partially holding stage is provided to be placed, the said electronic component mounting with the plurality of the bonding head when the mounting member is received in the bonding stage is pressed against the electronic component is moved downwardly The body is heated from above and below by the heater and the heater.

Sixth , in the above-described component mounting apparatus according to the present invention, a part of the mounting body is placed when the mounting body is received by the bonding stage and is spaced apart from the bonding stage in the horizontal direction. It is desirable to provide a holding stage.

Seventhly , in the above component mounting apparatus according to the present invention, the holding stage is provided with a suction mechanism that holds the mounting body by sucking a part of the mounting body, and the mounting body is attached to the holding stage. In the state of being sucked and held, it is desirable that the holding stage is moved and the position of the mounting body with respect to the bonding stage is changed.

Eighth , in the above-described component mounting apparatus according to the present invention, the holding stage is movable in the same direction as the moving stage in the horizontal direction, and a guide rail for guiding the holding stage and the moving stage is provided. It is desirable.

Ninthly , in the above-described component mounting apparatus according to the present invention, it is desirable that two holding stages are provided, and the two holding stages are positioned on the opposite side across the moving stage in the horizontal direction.

Tenth, in the component mounting apparatus according to the present invention described above, the respective two holding stages the mounting body holding portion which is placed is provided, wherein the holding portion is movable in the upper and lower directions It is desirable.

Eleventhly , in the above-described component mounting apparatus according to the present invention, the holding stage is biased in a direction approaching the moving stage in the horizontal direction, and the holding stage is biased to the moving stage. It is desirable to provide an interlocking unit that is contacted from the opposite direction to the moving direction and moves the holding stage as the moving stage moves.

To 12, in the component mounting apparatus according to the present invention described above, the bonding stage is arranged in a fixed state, to regulate the movement in the direction approaching to the moving stage of the holding stage to said mobile stage the It is desirable that a stop stopper for stopping the holding stage at a predetermined position is provided, and the contact of the interlocking portion with the holding stage is released when the holding stage comes into contact with the stopping stopper.

A support 14 is attached to the connecting plate 4 on the lower surface side (see FIG. 8). The support 14 has a substantially flat support base 15 that faces in the up-down direction and a mounted portion 16 that protrudes upward from the support base 15, and the mounted portion 16 is attached to the lower surface of the connecting plate 4. On the lower surface side of the support base 15, guide protrusions 15 a and 15 a that extend in the front-rear direction and protrude downward are provided separately from each other in the left-right direction. A movement motor 17 is attached to the lower surface of the support 14.

When the bonding operation is performed on the stacked bodies 400, 400,..., The semiconductor wafer 100 is intermittently moved along with the backward movement of the first holding stage 33 that is moved together with the moving unit 26. The first holding stage 33 is brought into contact with or close to the first stop stopper 38a of the bonding stage 37 while being moved rearward (see FIG. 24). At this time, the central portion of the semiconductor wafer 100 is placed on the heating table 39.

Thereafter , the holding portion 33e of the first holding stage 33 is lowered and the holding portion 35e of the second holding stage 35 is raised (see FIG. 25). Accordingly, the semiconductor wafer 100 is placed on the holding unit 35e with the central part placed on the heating table 39, and is sucked and held by the holding unit 35e, and the semiconductor wafer 100 is held by the first holding stage 33. To the second holding stage 35.

When the semiconductor wafer 100 is transferred from the first holding stage 33 and received by the second holding stage 35, the moving unit 26 is intermittently moved rearward, and is moved forward by the second interlocking unit 29 b of the moving unit 26. The biased second holding stage 35 is pressed backward, and the second holding stage 35 is moved backward together with the moving unit 26 (see FIG. 26). At this time, the semiconductor wafer 100 held by the holding portion 35e is slid on the heating table 39. Further, the first holding stage 33 is brought into contact with the first stop stopper 38a of the bonding stage 37, and the backward movement is stopped.

Then , the moving part 26 is moved to the preparation position which is the front moving end (see FIG. 9). At this time, the first holding stage 33 urged rearward and stopped by the first stop stopper 38a is pressed by the first interlocking portion 29a and moved forward together with the moving portion 26. Return to the initial state. Further, the second holding stage 35 is moved forward together with the moving portion 26, is brought into contact with the second stop stopper 38b, and the movement is stopped to return to the initial state.

Claims (13)

A plurality of bonding heads that have a heater that heats a plurality of electronic components previously placed on the mounting body and is movable in the vertical direction and is arranged in the horizontal direction;
A moving stage on which the mounting body is placed and movable in the horizontal direction;
The plurality of bonding heads are positioned below the plurality of bonding heads so as to face the plurality of bonding heads, have a heater, and the moving stage is moved so that a part of the mounting body is positioned directly below the plurality of bonding heads. A bonding stage on which the mounting body is received from the moving stage and a part of the mounting body is placed,
When the mounting body is received by the bonding stage, the plurality of bonding heads are moved downward and pressed against the electronic component, and the electronic component and the mounting body are heated from above and below by the heater and the heater. A component mounting device. The component mounting apparatus according to claim 1, wherein a pulse heater is used as the heater. The component mounting apparatus according to claim 1, wherein a pulse heater is used as the heater. The component mounting apparatus according to claim 1, wherein a constant heater is used as the heater. The component mounting apparatus according to claim 1, wherein a constant heater is used as the heater. A stage portion on which the mounting body is placed on the moving stage is provided,
The component mounting apparatus according to claim 1, wherein the stage unit is movable in a vertical direction. A holding stage on which a part of the mounting body is placed when the mounting body is received by the bonding stage and spaced apart from the bonding stage in the horizontal direction is provided. The component mounting apparatus according to claim 3, claim 4, claim 5, or claim 6. A suction mechanism for sucking a part of the mounting body to hold the mounting body on the holding stage;
The component mounting apparatus according to claim 7, wherein the holding stage is moved and the position of the mounting body with respect to the bonding stage is changed in a state where the mounting body is sucked and held by the holding stage. The holding stage is movable in the same direction as the moving stage in the horizontal direction,
The component mounting apparatus according to claim 7, further comprising a guide rail that guides the holding stage and the moving stage. Two holding stages are provided,
The component mounting apparatus according to claim 7, wherein the two holding stages are positioned on opposite sides of the movable stage in the horizontal direction. A holding part on which the mounting body is placed on each of the two holding stages is provided,
The component mounting apparatus according to claim 10, wherein each of the holding portions is movable in a vertical direction. The holding stage is biased in a direction toward the moving stage in the horizontal direction,
The moving stage is provided with an interlocking unit that is brought into contact with the holding stage from a direction opposite to the direction in which the holding stage is urged to move the holding stage as the moving stage moves. Item mounting apparatus of Claim 8, Claim 9, Claim 10, or Claim 11. The bonding stage is arranged in a fixed state,
A stopper for stopping the holding stage at a predetermined position by restricting movement of the holding stage in a direction approaching the moving stage is provided on the moving stage,
The component mounting apparatus according to claim 12, wherein the contact of the interlocking unit with the holding stage is released when the holding stage comes into contact with the stop stopper.

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