JP2015149137A - light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an extrusion from overlapping a terminal or a light-emitting part, when an adhesive located between a sealing member and a substrate extrudes.SOLUTION: Terminals 112, 132 of a light-emitting device 10 are located in a region of a substrate 100 on the outside of a sealing member 140. The sealing member 140 has a connection part 142. The connection part 142 faces the substrate 100, and surrounds a light-emitting element 102. An adhesive 150 is formed between the substrate 100 and connection part 142. The adhesive 150 connects the connection part 142 to the substrate 100. The connection part 142 has two first regions 144 and second regions 146. The two first regions 144 are arranged in a first direction (e.g., the x direction in the drawing), and the terminal 132 is held therebetween. The second regions 146 connect the two first regions 144, while avoiding the terminal 132.

Description

  The present invention relates to a light emitting device.

  In recent years, development of a light emitting device using an organic EL element as a light source has been advanced. Since an organic EL element uses an organic layer as a light emitting layer, a sealing structure is required. Generally, the organic EL element is sealed using a sealing member formed of glass or metal. And the terminal connected to an organic EL element is arrange | positioned outside this sealing member.

  For example, Patent Document 1 describes that a concave portion is formed on the surface of the sealing member facing the organic EL substrate, and the edge of the sealing member is fixed to the organic EL substrate using an adhesive.

  Patent Document 2 describes sealing between a sealing member and a substrate using a sealing material.

JP 2006-127909 A JP 2007-250508 A

  When fixing the edge of a sealing member to a board | substrate using an adhesive agent, the resin layer used as an adhesive agent may protrude from the edge of a sealing member. In this case, the protruding adhesive may overlap with the terminals and the light emitting part, which may reduce the quality of the light emitting device.

  As an example of the problem to be solved by the present invention, when the adhesive located between the sealing member and the substrate protrudes, the protruding adhesive is prevented from overlapping with the terminal or the light emitting part. It is done.

The invention according to claim 1 is a substrate;
A light emitting device formed on the substrate and having a first electrode, a second electrode, and an organic layer located between the first electrode and the second electrode;
A sealing member for sealing the light emitting element;
Located in a region of the substrate that is outside the sealing member, a terminal connected to the first electrode or the second electrode;
With
The sealing member includes a connection portion facing the substrate and surrounding the light emitting element,
An adhesive is formed between the connection portion and the substrate,
The connecting portion is
Two first regions arranged in a first direction and sandwiching the terminal;
A second region that connects the two first regions while avoiding the terminal;
It is a light-emitting device provided with.

It is a top view of the light-emitting device concerning an embodiment. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is a top view of a board | substrate when manufacturing a light-emitting device. It is a top view of the sealing member when manufacturing a light-emitting device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a plan view of a light emitting device 10 according to the embodiment. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 3 is a cross-sectional view taken along line BB in FIG. 4 is a cross-sectional view taken along the line CC of FIG. FIG. 5 is a sectional view taken along the line DD of FIG.

  The light emitting device 10 according to this embodiment includes a substrate 100, a light emitting element 102, a sealing member 140, and terminals 112 and 132. The light emitting element 102 is formed on the substrate 100 and includes a first electrode 110, a second electrode 130, and an organic layer 120. The organic layer 120 is located between the first electrode 110 and the second electrode 130. The sealing member 140 seals the light emitting element 102. The terminals 112 and 132 are located in a region of the substrate 100 that is outside the sealing member 140. The terminals 112 and 132 are electrically connected to the first electrode 110 or the second electrode 130. The sealing member 140 further has a connection part 142. The connection part 142 faces the substrate 100 and surrounds the light emitting element 102. An adhesive 150 is formed between the substrate 100 and the connection portion 142. The adhesive 150 is, for example, a photocurable resin such as a UV curable epoxy resin or a photocurable acrylic resin, or an adhesive layer such as welded glass, and fixes the connecting portion 142 to the substrate 100. The connection part 142 has two first regions 144 and a second region 146. The two first regions 144 are arranged in the first direction (for example, the x direction in the drawing) and sandwich the terminal 132 (or the terminal 112). The second region 146 connects the two first regions 144 while avoiding the terminal 132 (or the terminal 112). Details will be described below.

  The substrate 100 is a transparent substrate such as a glass substrate or a resin substrate. The substrate 100 may have flexibility. In this case, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. Also in this case, the substrate 100 may be formed of either an inorganic material or an organic material. The substrate 100 is, for example, a polygon such as a rectangle.

  The light emitting element 102 has a configuration in which the organic layer 120 is sandwiched between the first electrode 110 and the second electrode 130. At least one of the first electrode 110 and the second electrode 130 is a translucent electrode. The remaining electrodes are made of, for example, a metal selected from the first group consisting of Al, Mg, Au, Ag, Pt, Sn, Zn, and In, or an alloy of a metal selected from the first group. Formed by a metal layer. The material of the translucent electrode is, for example, an inorganic material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), a conductive polymer such as a polythiophene derivative, or a network using nanowires made of silver or carbon. Electrode. For example, in the case of the bottom emission type light emitting element 102, the first electrode 110, the organic layer 120, and the second electrode 130 are stacked on the substrate 100 in this order. It is a translucent electrode, and the second electrode 130 is an electrode that reflects light such as Al. Further, in the case of the top emission type light emitting element 102 having a configuration in which the first electrode 110, the organic layer 120, and the second electrode 130 are stacked in this order on the substrate 100, the first electrode 110 is It is an electrode that reflects light, such as Al, and the second electrode 130 is a translucent electrode. Alternatively, both electrodes (the first electrode 110 and the second electrode 130) may be translucent electrodes to form a translucent light emitting device (dual emission type).

  The organic layer 120 has a configuration in which, for example, a hole transport layer, a light emitting layer, and an electron transport layer are stacked in this order. A hole injection layer may be formed between the hole transport layer and the first electrode 110. In addition, an electron injection layer may be formed between the electron transport layer and the second electrode 130. The layer of the organic layer 120 may be formed by a coating method or a vapor deposition method, and a part thereof may be formed by a coating method and the rest may be formed by a vapor deposition method. Note that the organic layer 120 may be formed by a vapor deposition method using a vapor deposition material, or may be formed by an ink jet method, a printing method, or a spray method using a coating material.

  Terminals 112 and 132 are formed on the surface of the substrate 100 where the light emitting element 102 is formed. The terminal 112 is connected to the first electrode 110, and the terminal 132 is connected to the second electrode 130. Specifically, the organic layer 120 is not formed on a part of the first electrode 110 and serves as the terminal 112. The terminal 132 has the same layer as the first electrode 110. Note that an insulating layer 160 is formed on the substrate 100. The insulating layer 160 insulates the light emitting element 102. The insulating layer 160 is formed before the organic layer 120 and the second electrode 130. The insulating layer 160 is formed of a material such as polyimide, silicon oxide, or silicon nitride.

  In the example shown in the figure, the substrate 100 is rectangular. A terminal 112 is formed along each of two opposite sides, and a terminal 132 is formed along each of the remaining two sides.

  Note that a layer (for example, a metal layer) of a material having a lower resistance than that of the first electrode 110 may be formed on the portion of the first electrode 110 that becomes the terminal 112. In this case, a layer of a material having a lower resistance than the first electrode 110 is also formed on the terminal 132.

  The sealing member 140 is made of, for example, glass or metal, and has a recess 141 at a portion facing the light emitting element 102. In other words, the sealing member 140 has a shape in which the entire region excluding the edge is recessed on the opposite side to the substrate 100 on the surface facing the substrate 100. The edge of the sealing member 140 is a connection part 142. As described above, the connection unit 142 includes the first region 144 and the second region 146.

  In the example shown in this drawing, the light emitting device 10 has a terminal 112 on each of one side of the substrate 100. The terminals 112 are arranged side by side in the same direction. The first region 144 of the sealing member 140 is located between the terminals 112 (or the terminals 132), and the second region 146 is provided for each of the terminals 112. In the direction (second direction) orthogonal to the direction in which the first regions 144 are arranged (first direction), a part of the second region 146 is located closer to the light emitting element 102 than the first region 144. Yes. The light emitting device 10 also has a terminal 132. In the example shown in this drawing, the terminal 132 is disposed along a side different from the terminal 112 in the substrate 100. A plurality of terminals 132 are arranged per side, but one terminal 132 may be arranged per side. The connecting portion 142 of the sealing member 140 has a first region 144 and a second region 146 even near the terminal 132.

  The planar layout of the adhesive 150 also has the same planar layout as that of the connecting portion 142. For this reason, the adhesive 150 is not formed between the adjacent second regions 146. A part of the adhesive 150 that protrudes from the connection portion 142 protrudes into the region 104 between the adjacent second regions 146 (that is, the side of the second region 146).

  In the example shown in this figure, the terminals 112 and 132 are formed of a conductive layer. The end surfaces of the terminals 112 and 132 are flush with the end surface of the substrate 100. This is due to the manufacturing method of the light emitting device 10 described later. The first region 144 of the sealing member 140 substantially overlaps the edge of the substrate 100. On the other hand, the second region 146 of the sealing member 140 is separated from the edge of the substrate 100. A terminal 112 or a terminal 132 is located between the edge of the substrate 100 and the second region 146. In other words, the terminals 112 and 132 are located outside the sealing member 140. A conductive member for connecting the light emitting element 102 to the circuit board, for example, a bonding wire 200 is connected to the terminals 112 and 132.

  Next, a method for manufacturing the light emitting device 10 will be described with reference to FIGS. First, the substrate 100 is prepared. In this state, as shown in FIG. 6, the plurality of substrates 100 are connected to each other. Next, the first electrode 110 and the terminals 112 and 132 are formed on each of the plurality of substrates 100. The first electrode 110 and the terminals 112 and 132 are formed using, for example, a sputtering method. At this stage, the terminal 112 and the terminal 132 are formed across the boundary of the adjacent substrates 100.

  Next, the insulating layer 160 is formed between the first electrode 110 and the terminal 132. Next, the organic layer 120 is formed on the first electrode 110. Next, the second electrode 130 is formed. The second electrode 130 is formed using, for example, a sputtering method.

  Moreover, the sealing member 140 is prepared. At this stage, as shown in FIG. 7, the plurality of sealing members 140 also have a continuous shape. As described above, the sealing member 140 has the recess 141 at a position overlapping the light emitting element 102. As shown in the figure, in a state where the plurality of sealing members 140 are connected to each other, the plurality of concave portions 141 are arranged in a matrix. A portion located between the plurality of concave portions 141 serves as a connection portion 142. The connection part 142 has a plurality of openings 147 at positions overlapping the boundaries of the adjacent sealing members 140. The opening 147 overlaps the terminals 112 and 132. A portion of the connecting portion 142 located beside the opening 147 is a second region 146, and a portion located between the openings 147 is a first region 144. Note that the portion of the connecting portion 142 where the opening 147 is formed is thicker than the portion of the connecting portion 142 that becomes the first region 144.

  Next, the adhesive 150 is formed on the plurality of substrates 100 connected to each other and at least one of the connection portions 142 of the sealing member 140 connected to each other. The adhesive 150 may be formed in advance in the form of a sheet, may be formed by a printing method such as a screen printing method, or may be formed using a coating method such as inkjet. In particular, when the adhesive 150 is made of a resin, the protruding area becomes wide, and the effect of the present invention is great.

  Thereafter, the sealing member 140 is attached to the substrate 100. At this time, the adhesive 150 protrudes from the region overlapping with the connection portion 142. Here, in the region 104 located next to the second region 146, when the connecting portion 142 is disposed, the protrusion is increased, and the effect of the narrow frame is deteriorated. Accordingly, a part of the protruding portion of the adhesive 150 is accumulated in the region 104. Accordingly, it is possible to suppress the adhesive 150 from overlapping with the terminals 112 and 132 and the light emitting element 102.

  Thereafter, the sealing member 140 and the substrate 100 are divided into a plurality of light emitting devices 10 using, for example, a dicing blade. Therefore, in the light emitting device 10, the end surface of the sealing member 140, the end surfaces of the terminals 112 and 132, and the end surface of the substrate 100 form the same surface. In this way, a plurality of light emitting devices 10 are formed. For this reason, compared with the case where the some sealing member 140 is divided | segmented previously, the manufacturing efficiency of the light-emitting device 10 becomes high. In addition, the manufacturing efficiency of the light emitting device 10 is higher than when the plurality of substrates 100 are divided in advance.

  As described above, according to the present embodiment, the connection portion 142 is not disposed in the region 104 located next to the second region 146. Therefore, even when a part of the adhesive 150 protrudes from the connection portion 142 when the sealing member 140 is attached to the substrate 100, a part of the adhesive 150 that protrudes accumulates in the region 104. Accordingly, it is possible to suppress the adhesive 150 from overlapping with the terminals 112 and 132 and the light emitting element 102.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

DESCRIPTION OF SYMBOLS 10 Light-emitting device 100 Board | substrate 102 Light-emitting element 110 1st electrode 112 Terminal 120 Organic layer 130 2nd electrode 132 Terminal 140 Sealing member 142 Connection part 144 1st area | region 146 2nd area | region 150 Adhesive 200 Bonding wire

Claims (5)

A substrate,
A light emitting device formed on the substrate and having a first electrode, a second electrode, and an organic layer located between the first electrode and the second electrode;
A sealing member for sealing the light emitting element;
Located in a region of the substrate that is outside the sealing member, a terminal connected to the first electrode or the second electrode;
With
The sealing member includes a connection portion facing the substrate and surrounding the light emitting element,
An adhesive is formed between the connection portion and the substrate,
The connecting portion is
Two first regions arranged in a first direction and sandwiching the terminal;
A second region connecting the two first regions while avoiding the terminal;
A light emitting device comprising: The light-emitting device according to claim 1.
A plurality of the terminals arranged on the substrate side by side in the first direction;
The first region is located between each of the plurality of terminals;
A light-emitting device in which the second region is provided for each of the plurality of terminals. The light-emitting device according to claim 2.
The terminal is formed of a conductive layer;
A light-emitting device in which an end surface of the substrate and an end surface of the terminal form the same surface. The light emitting device according to claim 3.
In a second direction orthogonal to the first direction, a part of the second region is located closer to the light emitting element than the first region;
The light emitting device, wherein the adhesive protrudes to the side of the second region in the first direction. The light-emitting device according to claim 4.
A light emitting device comprising a bonding wire connected to the terminal.

Images