[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JP2013542863A5 - - Google Patents

Download PDF

Info

Publication number
JP2013542863A5
JP2013542863A5 JP2013540037A JP2013540037A JP2013542863A5 JP 2013542863 A5 JP2013542863 A5 JP 2013542863A5 JP 2013540037 A JP2013540037 A JP 2013540037A JP 2013540037 A JP2013540037 A JP 2013540037A JP 2013542863 A5 JP2013542863 A5 JP 2013542863A5
Authority
JP
Japan
Prior art keywords
polishing pad
translucent insert
recess
thermoplastic polymer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013540037A
Other languages
Japanese (ja)
Other versions
JP5918254B2 (en
JP2013542863A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/061312 external-priority patent/WO2012068428A2/en
Publication of JP2013542863A publication Critical patent/JP2013542863A/en
Publication of JP2013542863A5 publication Critical patent/JP2013542863A5/ja
Application granted granted Critical
Publication of JP5918254B2 publication Critical patent/JP5918254B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (20)

光学的透過性領域を含む研磨パッドであって、該研磨パッドが
(a)第一の領域及び第二の領域を含む研磨パッド本体であって、ここで該第一の領域が不透明であり、該第二の領域が光学的透過性であり、該第二の領域がそこに形成された少なくとも１つの凹部を有する、研磨パッド本体、及び
(b)該少なくとも１つの凹部に組み入れられた少なくとも１つの半透明のインサート
を含み、
ここで該研磨パッド本体が第一の多孔質材料を含み、該少なくとも１つの半透明のインサートが該第一の多孔質材料とは異なる第二の多孔質材料を含む、研磨パッド。 A polishing pad comprising an optically transmissive region, the polishing pad comprising
(a) a polishing pad body comprising a first region and a second region, wherein the first region is opaque, the second region is optically transmissive, and the second region A polishing pad body, wherein the region has at least one recess formed therein; and
(b) including at least one translucent insert incorporated in the at least one recess;
Wherein the polishing pad body comprises a first porous material and the at least one translucent insert comprises a second porous material different from the first porous material. 該研磨パッド本体が第一の熱可塑性ポリマーを含み、該少なくとも１つの半透明のインサートが該第一の熱可塑性ポリマーとは異なる第二の熱可塑性ポリマーを含む、請求項１に記載の研磨パッド。   The polishing pad of claim 1, wherein the polishing pad body comprises a first thermoplastic polymer and the at least one translucent insert comprises a second thermoplastic polymer different from the first thermoplastic polymer. . 該半透明のインサートが第一の熱可塑性ポリマー及び第二の熱可塑性ポリマーを含み、該第一の及び第二の熱可塑性ポリマーが不混和性であって該半透明のインサート内で異なる相を形成する、請求項１に記載の研磨パッド。 The translucent insert includes a first thermoplastic polymer and a second thermoplastic polymer, wherein the first and second thermoplastic polymers are immiscible and have different phases within the translucent insert . The polishing pad according to claim 1, which is formed. 該半透明のインサートが該第二の多孔質材料とは異なる材料の粒子をさらに含む、請求項１に記載の研磨パッド。   The polishing pad of claim 1, wherein the translucent insert further comprises particles of a material different from the second porous material. 該粒子が水溶性の材料を含む、請求項４に記載の研磨パッド。   The polishing pad of claim 4, wherein the particles comprise a water soluble material. 該半透明のインサートが0.1%〜10%の空隙容量を有する、請求項１に記載の研磨パッド。   The polishing pad of claim 1, wherein the translucent insert has a void volume of 0.1% to 10%. 該半透明のインサートの研磨表面に模様がついている、請求項１に記載の研磨パッド。   The polishing pad according to claim 1, wherein the polishing surface of the translucent insert has a pattern. 該第二の領域が、そこに形成されている第一の凹部及び第二の凹部を有し、該第一の凹部が、そこに組み入れられた第一の半透明のインサートを有し、該第二の凹部が、そこに組み込まれた第二の半透明のインサートを有する、請求項１に記載の研磨パッド。   The second region has a first recess and a second recess formed therein, the first recess having a first translucent insert incorporated therein; The polishing pad of claim 1, wherein the second recess has a second translucent insert incorporated therein. 該第二の凹部を含む該研磨パッド本体の面が平面を規定し、該第二の半透明のインサートの表面が実質的に該平面と同一平面上にある、請求項８に記載の研磨パッド。   9. The polishing pad of claim 8, wherein the surface of the polishing pad body including the second recess defines a plane and the surface of the second translucent insert is substantially coplanar with the plane. . 該第二の凹部を含む該研磨パッド本体の面が平面を規定し、該第二の半透明のインサートの表面が該平面を超えて伸びている、請求項８に記載の研磨パッド。   The polishing pad according to claim 8, wherein a surface of the polishing pad body including the second recess defines a plane, and a surface of the second translucent insert extends beyond the plane. (a)第一の多孔質の材料を含む研磨パッド本体を提供するステップ、
(b)少なくとも１つの凹部を該研磨パッド本体内に形成するステップ、
(c)該第一の多孔質材料とは異なる第二の多孔質材料を有する、少なくとも１つの半透明のインサートを提供するステップ、及び
(d)該少なくとも１つの半透明のインサートを該凹部に接着し、少なくとも１つの光学的透過性領域を有する研磨パッドを提供するステップ、
を含む、光学的透過性領域を有する研磨パッドの製造方法。 (a) providing a polishing pad body comprising a first porous material;
(b) forming at least one recess in the polishing pad body;
(c) providing at least one translucent insert having a second porous material different from the first porous material; and
(d) bonding the at least one translucent insert to the recess to provide a polishing pad having at least one optically transmissive region;
A method for producing a polishing pad having an optically transparent region. 該研磨パッド本体が第一の熱可塑性ポリマーを含み、該少なくとも１つの半透明のインサートが、該第一の熱可塑性ポリマーとは異なる第二の熱可塑性ポリマーを含む、請求項１１に記載の方法。   The method of claim 11, wherein the polishing pad body comprises a first thermoplastic polymer and the at least one translucent insert comprises a second thermoplastic polymer that is different from the first thermoplastic polymer. . 該半透明のインサートが第一の熱可塑性ポリマー及び第二の熱可塑性ポリマーを含み、該第一の及び第二の熱可塑性ポリマーが不混和性であって該半透明のインサート内で異なる相を形成する、請求項１１に記載の方法。   The translucent insert includes a first thermoplastic polymer and a second thermoplastic polymer, wherein the first and second thermoplastic polymers are immiscible and have different phases within the translucent insert. The method of claim 11, which forms. 該半透明のインサートが、該第二の多孔質材料とは異なる材料の粒子をさらに含む、請求項１１に記載の方法。   The method of claim 11, wherein the translucent insert further comprises particles of a material different from the second porous material. 該半透明のインサートが、該半透明のインサートを該凹部に接着するよりも前に形成される、請求項１１に記載の方法。   The method of claim 11, wherein the translucent insert is formed prior to adhering the translucent insert to the recess. 該半透明のインサートが、該半透明のインサートの前駆体を該凹部内に配置し、次に該前駆体を該半透明のインサートに転化することにより形成される、請求項１１に記載の方法。   12. The method of claim 11, wherein the translucent insert is formed by placing the translucent insert precursor in the recess and then converting the precursor to the translucent insert. . 凹部を該研磨パッド本体内に形成するステップが、圧力、熱、高周波放射、超音波溶着、及びそれらの組み合わせから成る群より選択されるエネルギー入力の使用を含む、請求項１１に記載の方法。   The method of claim 11, wherein forming a recess in the polishing pad body includes using an energy input selected from the group consisting of pressure, heat, radio frequency radiation, ultrasonic welding, and combinations thereof. 凹部を該研磨パッド本体内に形成するステップが、ルータ工具の使用を含む、請求項１１に記載の方法。   The method of claim 11, wherein forming a recess in the polishing pad body includes the use of a router tool. 該少なくとも１つの半透明のインサートを該凹部に接着するステップが、溶剤接着、圧力、熱、高周波放射、超音波溶着、及びそれらの組み合わせから成る群より選択されるエネルギー入力の使用を含む、請求項１１に記載の方法。   Bonding the at least one translucent insert to the recess includes using an energy input selected from the group consisting of solvent bonding, pressure, heat, radio frequency radiation, ultrasonic welding, and combinations thereof. Item 12. The method according to Item 11. 該半透明のインサートの研磨表面に模様がついている、請求項１１に記載の方法。   The method according to claim 11, wherein the abrasive surface of the translucent insert is patterned.
JP2013540037A 2010-11-18 2011-11-18 Polishing pad including permeable region Expired - Fee Related JP5918254B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41501510P 2010-11-18 2010-11-18
US61/415,015 2010-11-18
PCT/US2011/061312 WO2012068428A2 (en) 2010-11-18 2011-11-18 Polishing pad comprising transmissive region

Publications (3)

Publication Number Publication Date
JP2013542863A JP2013542863A (en) 2013-11-28
JP2013542863A5 true JP2013542863A5 (en) 2014-06-26
JP5918254B2 JP5918254B2 (en) 2016-05-18

Family

ID=46084662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013540037A Expired - Fee Related JP5918254B2 (en) 2010-11-18 2011-11-18 Polishing pad including permeable region

Country Status (8)

Country Link
US (1) US20130237136A1 (en)
EP (1) EP2641268A4 (en)
JP (1) JP5918254B2 (en)
KR (1) KR101602544B1 (en)
CN (1) CN103222034B (en)
MY (1) MY166716A (en)
SG (1) SG190249A1 (en)
WO (1) WO2012068428A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013123105A2 (en) * 2012-02-14 2013-08-22 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
CN106853610B (en) 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 Polishing pad and its monitoring method and monitoring system
KR101829542B1 (en) * 2016-07-27 2018-02-23 신우유니온(주) Manufacturing method of buffer for nails
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
US11260495B2 (en) * 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7317440B2 (en) * 2019-04-15 2023-07-31 株式会社ディスコ dressing tool
JP7220130B2 (en) * 2019-07-11 2023-02-09 株式会社クラレ Polishing pad and polishing pad manufacturing method
KR102593117B1 (en) * 2021-07-02 2023-10-24 에스케이엔펄스 주식회사 Polishing pad and preparing method of semiconductor device using the same

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6247998B1 (en) * 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6716085B2 (en) * 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6071177A (en) * 1999-03-30 2000-06-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for determining end point in a polishing process
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
WO2001023141A1 (en) * 1999-09-29 2001-04-05 Rodel Holdings, Inc. Polishing pad
JP2001110762A (en) * 1999-10-04 2001-04-20 Asahi Kasei Corp Polishing pad
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6840843B2 (en) * 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
JP4131632B2 (en) * 2001-06-15 2008-08-13 株式会社荏原製作所 Polishing apparatus and polishing pad
JP2003133270A (en) * 2001-10-26 2003-05-09 Jsr Corp Window material for chemical mechanical polishing and polishing pad
KR100541545B1 (en) * 2003-06-16 2006-01-11 삼성전자주식회사 Polishing table of a chemical mechanical polishing apparatus
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) * 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
US7306507B2 (en) * 2005-08-22 2007-12-11 Applied Materials, Inc. Polishing pad assembly with glass or crystalline window
KR101324644B1 (en) * 2005-08-22 2013-11-01 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US7210980B2 (en) * 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
US7553214B2 (en) * 2006-02-15 2009-06-30 Applied Materials, Inc. Polishing article with integrated window stripe
JP5110677B2 (en) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 Polishing pad
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP2008226911A (en) * 2007-03-08 2008-09-25 Jsr Corp Chemical and mechanical polishing pad, lamination pad for chemical mechanical polishing, and chemical and mechanical polishing method
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US8439994B2 (en) * 2010-09-30 2013-05-14 Nexplanar Corporation Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection

Similar Documents

Publication Publication Date Title
JP2013542863A5 (en)
JP2014050959A5 (en)
WO2011086450A3 (en) Modelling plate for a stereolithography machine, stereolithography machine using said modelling plate and tool for cleaning said modelling plate
JP2016523457A5 (en) Method for manufacturing solar cell module using patterned thin foil, and solar cell module
EP3181333A3 (en) Method of manufacturing three-dimensionally formed object
EP2614803A3 (en) Method of manufacturing a composite superabsorbent core structure
JP2016507090A5 (en)
JP2015509915A5 (en)
JP2014233815A5 (en) Manufacturing method of polishing head
GB201220625D0 (en) Meltfusion bonded absorbent structure comprising fibres and superabsorbent particles and method for manufacturing such structure
WO2011051718A3 (en) Micro-channel structure method and apparatus
CN104107984B (en) A kind of ferrite material laser die cutting tool
JP2013205843A5 (en)
JP2008518807A5 (en)
JP2011135054A5 (en) Method of manufacturing SOI substrate
CN103761001A (en) Composite sapphire screen
CN105268490B (en) A kind of method for packing of micro-fluidic chip
TW201431680A (en) Explosion-proof film of 3D explosion-proof glass and manufacturing method thereof
CN105451150B (en) A kind of manufacturing method of vibrating diaphragm of putting more energy into and the vibrating diaphragm manufactured using this method
CN203665339U (en) Polishing pad
GB2511394A (en) Method and apparatus for joining members for downhole and high temperature applications
CN202264157U (en) Safe net core grinding plate
CN202624861U (en) Protruded-type red envelope
KR101176991B1 (en) A making method of Pearl button
CN204295530U (en) A kind of blade abrasive-cloth wheel